Vehicle lamp module and vehicle

Abstract

The vehicle lamp module comprises a lamp panel and a lamp body, the lamp panel comprises a metal substrate, an insulating layer and a circuit layer which are sequentially stacked, a reserved groove is formed in one side of the lamp panel in the thickness direction, the reserved groove is located in the side, close to the circuit layer, of the metal substrate, and the reserved groove penetrates through the circuit layer and the insulating layer. A heat conduction layer is arranged in the reserved groove, a heat conduction bonding pad and a conductive bonding pad which are spaced are formed on the bottom face of the lamp body, the heat conduction bonding pad is in heat conduction connection with the metal substrate through the heat conduction layer, and the conductive bonding pad is in conductive connection with the circuit layer. According to the car lamp module, heat generated by the lamp body can be effectively and rapidly transmitted to the metal substrate, so that the effect that the metal substrate rapidly dissipates heat of the lamp body is achieved, thermoelectric separation of the car lamp module can be achieved, and it is ensured that the heat generated by the lamp body is mainly transmitted to the metal substrate through the heat conduction path; risks such as electrical faults caused by high temperature can be reduced, and the reliability of the automobile lamp module can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, and in particular to a vehicle light module and a vehicle. Background Art

[0002] In the related art, the vehicle lamp module includes a lamp board and a lamp body. The lamp board includes a metal substrate, an insulating layer and a circuit layer stacked in sequence. The heat generated by the lamp body can be dissipated through the metal substrate. However, since an insulating layer is provided between the metal substrate and the lamp body, the thermal conductivity of the insulating layer is poor, which affects the heat transfer between the lamp body and the metal substrate, resulting in poor heat dissipation effect. Therefore, this problem needs to be solved. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present invention is to provide a vehicle lamp module, wherein a reserved groove is provided on one side of the lamp board in the thickness direction, the reserved groove is located on the side of the metal substrate close to the circuit layer, and a heat-conducting layer is provided in the reserved groove. The bottom surface of the lamp body is provided with a spaced-apart thermal pad and an electrically conductive pad. The thermal pad is thermally connected to the metal substrate via the thermal conductive layer, which can effectively and quickly transfer the heat generated by the lamp body to the metal substrate, thereby achieving a rapid heat dissipation effect of the metal substrate on the lamp body; and, by spacing the thermal pad and the electrically conductive pad apart, the electrically conductive pad is used to electrically connect to the circuit layer on the lamp board, so as to achieve thermal and electrical separation of the vehicle lamp module, ensure that the heat generated by the lamp body is mainly transferred to the metal substrate through the thermal conductive path, and the lamp body is mainly electrically connected to the circuit layer through the electrically conductive path, which can reduce the risk of electrical failure caused by high temperature, and is conducive to improving the reliability of the vehicle lamp module.

[0004] The utility model also provides a vehicle with the above-mentioned vehicle light module.

[0005] According to the first aspect of the present invention, the vehicle lamp module includes: a lamp board, which includes a metal substrate, an insulating layer and a circuit layer stacked in sequence, a reserved groove is provided on one side of the light board in the thickness direction, and the reserved groove is located on the side of the metal substrate close to the circuit layer, the reserved groove passes through the circuit layer and the insulating layer, and a heat-conducting layer is provided in the reserved groove; a lamp body, the bottom surface of the lamp body is formed with spaced-apart thermal pads and conductive pads, the thermal pads are thermally connected to the metal substrate through the thermal conductive layer, and the conductive pads are conductively connected to the circuit layer.

[0006] According to the vehicle lamp module of the embodiment of the present invention, a reserved groove is provided on one side of the lamp board in the thickness direction, the reserved groove is located on the side of the metal substrate close to the circuit layer, and a heat-conducting layer is provided in the reserved groove, and the bottom surface of the lamp body is provided with a thermally conductive pad and a conductive pad spaced apart. The thermally conductive pad is thermally connected to the metal substrate via the thermally conductive layer, which can effectively and quickly transfer the heat generated by the lamp body to the metal substrate, thereby achieving the effect of rapid heat dissipation of the lamp body by the metal substrate; and, by spacing the thermally conductive pad and the conductive pad apart, the conductive pad is used to conductively connect to the circuit layer on the lamp board, which can achieve thermal and electrical separation of the vehicle lamp module, ensuring that the heat generated by the lamp body is mainly transferred to the metal substrate through the thermal conductive path, and the lamp body is mainly electrically connected to the circuit layer through the conductive path, which can reduce the risk of electrical failure caused by high temperature, etc., which is conducive to improving the reliability of the vehicle lamp module.

[0007] According to some embodiments of the present invention, the heat-conducting layer is a solder layer.

[0008] According to some embodiments of the present invention, a solderable metal layer or a brazing flux layer is provided between the heat-conducting layer and the metal substrate.

[0009] According to some embodiments of the present invention, the solderable metal layer includes at least one of a copper metal layer, a nickel metal layer and a tin metal layer.

[0010] According to some embodiments of the present invention, the heat-conducting layer protrudes from the surface of the lamp board; and / or the bottom surface of the lamp body is spaced apart from the surface of the lamp board.

[0011] According to some embodiments of the present invention, the lamp board also includes a solder resist layer, which is arranged on the side of the circuit layer away from the metal substrate, and the reserved groove passes through the solder resist layer, the circuit layer and the insulating layer. A welding window is also formed on the solder resist layer, and the welding window passes through the solder resist layer. A conductive layer is provided in the welding window, and the conductive pad is connected to the circuit layer through the conductive layer.

[0012] According to some embodiments of the present invention, the metal substrate is an aluminum substrate.

[0013] According to some embodiments of the present invention, the device further includes: a heat sink, wherein the metal substrate is fixed to the heat sink and is thermally connected to the heat sink.

[0014] According to some embodiments of the present invention, a thermal conductive adhesive layer is provided between the metal substrate and the heat sink.

[0015] The vehicle according to the second embodiment of the present invention is characterized by comprising: the vehicle light module according to the first embodiment of the present invention.

[0016] According to the vehicle of the embodiment of the present invention, the above-mentioned headlight module is provided, and a reserved groove is provided on one side of the thickness direction of the light board of the headlight module, the reserved groove is located on the side of the metal substrate close to the circuit layer, and a heat-conducting layer is provided in the reserved groove, and the bottom surface of the lamp body is provided with a thermally conductive pad and a conductive pad spaced apart. The thermally conductive pad is thermally connected to the metal substrate via the thermally conductive layer, which can effectively and quickly transfer the heat generated by the lamp body to the metal substrate, thereby achieving the effect of rapid heat dissipation of the lamp body by the metal substrate; and, by spacing the thermally conductive pad and the conductive pad apart, the conductive pad is used to be conductively connected to the circuit layer on the light board, which can achieve thermal and electrical separation of the headlight module, ensuring that the heat generated by the lamp body is mainly transferred to the metal substrate through the thermal conductive path, and the lamp body is mainly electrically connected to the circuit layer through the conductive path, which can reduce the risk of electrical failure caused by high temperature, etc., which is conducive to improving the reliability of the headlight module.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a cross-sectional view of a vehicle lamp module according to some embodiments of the present invention;

[0020] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0021] Figure 3 yes Figure 1 A simplified schematic diagram of part of the structure of the headlight module in the vehicle.

[0022] Reference numerals:

[0023] 100. Headlight module;

[0024] 1. Light board; 11. Metal substrate; 12. Insulation layer; 13. Circuit layer; 14. Reserved groove; 141. Thermal conductive layer; 15. Solder resist layer; 151. Welding window; 152. Conductive layer;

[0025] 2. Lamp body; 21. Thermal pad; 22. Conductive pad;

[0026] 3. Radiator; 31. Thermal conductive adhesive layer;

[0027] 41. Lens; 42. Mirror. DETAILED DESCRIPTION

[0028] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0029] Reference below Figure 1-Figure 3 A vehicle lamp module 100 and a vehicle according to an embodiment of the present invention are described.

[0030] Reference Figure 1-Figure 3 According to the first embodiment of the present invention, a vehicle lamp module 100 includes a lamp panel 1 and a lamp body 2. The lamp panel 1 includes a metal substrate 11, an insulating layer 12, and a circuit layer 13 stacked in sequence. A reserved groove 14 is provided on one side of the lamp panel 1 in the thickness direction. The reserved groove 14 is located on the side of the metal substrate 11 near the circuit layer 13. The reserved groove 14 passes through the circuit layer 13 and the insulating layer 12. A thermally conductive layer 141 is provided within the reserved groove 14. The bottom surface of the lamp body 2 is formed with spaced-apart thermal pads 21 and conductive pads 22. The thermally conductive pads 21 are thermally connected to the metal substrate 11 via the thermally conductive layer 141, and the conductive pads 22 are electrically connected to the circuit layer 13. The metal substrate 11 supports and secures the insulating layer 12, the circuit layer 13, and the lamp body 2, and helps dissipate heat from the lamp body 2. The insulating layer 12 prevents short circuits between the circuit layer 13 and the metal substrate 11. The circuit layer 13 supplies power to the lamp body 2. A reserved groove 14 is provided on the lamp board 1 and passes through the circuit layer 13 and the insulating layer 12 . The reserved groove 14 can facilitate the arrangement of the heat conducting layer 141 therein and can make the overall structure of the heat conducting layer 141 , the lamp board 1 and the lamp body 2 compact.

[0031] The bottom surface of the lamp body 2 is formed with spaced-apart thermal pads 21 and conductive pads 22. The thermal pads 21 facilitate heat conduction from the lamp body 2 to the metal substrate 11, while the conductive pads 22 provide an electrical connection between the lamp body 2 and the lamp board 1. The thermal pads 21 are thermally connected to the metal substrate 11 via the thermal conductive layer 141, effectively and rapidly transferring heat generated by the lamp body 2 to the metal substrate 11. This allows the metal substrate 11 to quickly dissipate heat from the lamp body 2, reducing or preventing damage to the lamp body 2 due to overheating and extending the life of the lamp body 2.

[0032] The thermal pad 21 is separated from the conductive pad 22, which can achieve thermal and electrical separation of the car light module 100, ensuring that the heat generated by the lamp body 2 is mainly conducted to the metal substrate 11 through the thermal path, and the lamp body 2 is mainly electrically connected to the circuit layer 13 through the conductive path, which can reduce the risk of electrical failure caused by high temperature and is conducive to improving the reliability of the car light module 100.

[0033] According to the vehicle lamp module 100 of the embodiment of the present invention, a reserved groove 14 is provided on one side of the lamp board 1 in the thickness direction, the reserved groove 14 is located on the side of the metal substrate 11 close to the circuit layer 13, and a heat-conducting layer 141 is provided in the reserved groove 14, and the bottom surface of the lamp body 2 is provided with a spaced-apart thermal pad 21 and a conductive pad 22. The thermal pad 21 is thermally connected to the metal substrate 11 via the thermal layer 141, which can effectively and quickly transfer the heat generated by the lamp body 2 to the metal substrate 11, thereby achieving the effect of rapid heat dissipation of the lamp body 2 by the metal substrate 11; and, by spacing the thermal pad 21 and the conductive pad 22 apart, the conductive pad 22 is used to be conductively connected to the circuit layer 13 on the lamp board 1, so as to achieve thermal and electrical separation of the vehicle lamp module 100, ensuring that the heat generated by the lamp body 2 is mainly transferred to the metal substrate 11 through the thermal path, and the lamp body 2 is mainly electrically connected to the circuit layer 13 through the conductive path, which can reduce the risk of electrical failure caused by high temperature, etc., which is conducive to improving the reliability of the vehicle lamp module 100.

[0034] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the thermal conductive layer 141 is a solder layer, so that a welding connection between the thermal conductive layer 141 and the metal substrate 11 can be achieved. At the same time, the good thermal conductivity of the solder layer itself can be utilized to achieve the thermal conductive effect of the solder layer, so as to transfer heat from the lamp body 2 to the metal substrate 11.

[0035] Reference Figure 1-Figure 3 According to some embodiments of the present invention, a solderable metal layer or a brazing flux layer is provided between the thermal conductive layer 141 and the metal substrate 11. The solderable metal layer or the brazing flux layer helps to form a better contact between the thermal conductive layer 141 and the metal substrate 11, so as to realize the heat transfer between the thermal conductive layer 141 and the metal substrate 11. For example, the metal substrate 11 is an aluminum substrate. By providing a solderable metal layer or a brazing flux layer between the thermal conductive layer 141 and the metal substrate 11, at least part of the oxide on the surface of the aluminum substrate can be dissolved, which facilitates the soldering of the solder layer to the metal substrate 11, thereby ensuring good contact between the solder layer and the metal substrate 11, so as to effectively transfer the heat generated by the lamp body 2 to the metal substrate 11.

[0036] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the solderable metal layer includes at least one of a copper metal layer, a nickel metal layer and a tin metal layer, which can enhance the bonding force between the thermal conductive layer 141 and the metal substrate 11, and help enhance the stability of the connection between the thermal conductive layer 141 and the metal substrate 11, so as to facilitate the heat transfer from the thermal conductive layer 141 to the metal substrate 11 through the lamp body 2.

[0037] Reference Figure 1-Figure 3According to some embodiments of the present invention, the heat-conducting layer 141 protrudes from the surface of the lamp board 1. The protruding heat-conducting layer 141 can support and fix the lamp body 2, making it easier for the lamp body 2 to be fixed on the metal substrate 11, and can facilitate direct contact between the lamp body 2 and the heat-conducting layer 141, thereby reducing thermal resistance and improving the heat conduction efficiency between the heat-conducting layer 141 and the lamp body 2. In this way, the heat generated by the lamp body 2 can be more effectively transferred to the metal substrate 11.

[0038] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the bottom surface of the lamp body 2 is spaced apart from the surface of the lamp board 1. The space between the bottom surface of the lamp body 2 and the surface of the lamp board 1 can increase the air gap between the lamp body 2 and the lamp board 1. For example, air can flow between the ground of the lamp body 2 and the surface of the lamp board 1, increasing the effect of air convection between these spaces, helping to take away at least part of the heat generated by the lamp body 2, thereby improving the overall heat dissipation effect of the vehicle lamp module 100; and, the space between the bottom surface of the lamp body 2 and the surface of the lamp board 1 can ensure that the lamp body 2 is spaced apart from the metal substrate 11, so as to prevent the lamp body 2 and the metal substrate 11 from being directly connected and short-circuited.

[0039] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the heat-conducting layer 141 protrudes from the surface of the lamp board 1; and the bottom surface of the lamp body 2 is spaced apart from the surface of the lamp board 1, so that the lamp body 2 is in direct contact with the heat-conducting layer 141, reducing thermal resistance, thereby improving the heat conduction efficiency between the heat-conducting layer 141 and the lamp body 2, so that the heat generated by the lamp body 2 can be more effectively transferred to the metal substrate 11; and it can ensure that the lamp body 2 is spaced apart from the metal substrate 11 to prevent the lamp body 2 from being directly connected to the metal substrate 11 and causing a short circuit.

[0040] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the lamp board 1 further includes a solder resist layer 15. The solder resist layer 15 is disposed on a side of the circuit layer 13 away from the metal substrate 11. A reserved groove 14 penetrates the solder resist layer 15, the circuit layer 13, and the insulating layer 12. A welding window 151 is also formed on the solder resist layer 15. The welding window 151 penetrates the solder resist layer 15. A conductive layer 152 is disposed within the welding window 151. The conductive pad 22 is connected to the circuit layer 13 via the conductive layer 152. The solder resist layer 15 is disposed on a side of the circuit layer 13 away from the metal substrate 11 to protect the circuit layer 13. For example, when the thermal conductive layer 141 is welded, the solder resist layer 15 can reduce the impact of the high temperature during welding on the circuit layer 13 and prevent the thermal conductive layer 141 from flowing to the surface of the circuit layer 13 and causing a short circuit. The welding window 151 facilitates the conductive layer 152 to be disposed therein to achieve electrical connection between the conductive pad 22 and the circuit layer 13, thereby enabling the circuit layer 13 to supply power to the lamp body 2.

[0041] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the metal substrate 11 is an aluminum substrate. The use of an aluminum substrate is conducive to achieving lightweight of the car light module 100. Compared with the metal substrate 11 using a copper substrate or a copper-aluminum composite plate, the aluminum substrate is lighter and has lower cost under the same volume. By using an aluminum substrate as the metal substrate, the light module 100 can be lightweight while meeting the heat dissipation effect of the car light module 100, which also helps to reduce the production cost of the car light module 100.

[0042] Reference Figure 1-Figure 3 According to some embodiments of the present invention, the vehicle lamp module 100 further includes a heat sink 3, the metal substrate 11 is fixed to the heat sink 3, and the metal substrate 11 is thermally connected to the heat sink 3. The heat sink 3 can quickly dissipate the heat transferred from the lamp body 2 to the metal substrate 11 through the thermal pad 21 to the surrounding environment, thereby realizing a process of quickly dissipating the heat generated by the lamp body 2 to the surrounding environment, thereby reducing the possibility of damage to the lamp body 2 due to overheating.

[0043] For example, the metal substrate 11 and the heat sink 3 may be connected by bolts and threads, so that the connection between the metal substrate 11 and the heat sink 3 is simple and has strong stability.

[0044] Reference Figure 1-Figure 3 According to some embodiments of the present invention, a thermally conductive adhesive layer 31 is provided between the metal substrate 11 and the heat sink 3. The thermally conductive adhesive layer 31 can improve the heat conduction efficiency between the metal substrate 11 and the heat sink 3, allowing heat to be transferred from the metal substrate 11 to the heat sink 3 more quickly. For example, the thermally conductive adhesive layer 31 can fill the air gap between the metal substrate 11 and the heat sink 3, thereby providing a more efficient heat conduction path, allowing heat to be transferred from the metal substrate 11 to the heat sink 3 more quickly, thereby improving the overall heat dissipation efficiency of the vehicle lamp module 100.

[0045] In addition, the thermal conductive adhesive layer 31 itself has a certain degree of adhesiveness, which can enhance the stability of the connection between the metal substrate 11 and the heat sink 3 to a certain extent, and reduce or avoid the possibility of the metal substrate 11 or the heat sink 3 becoming loose due to vibration.

[0046] Optionally, refer to Figure 1-Figure 3 The headlight module 100 is installed on the vehicle. The headlight module 100 also includes a lens 41 and a reflector 42. The lens 41 and the reflector 42 are both installed on the radiator 3. The lens 41 and the reflector 42 and the radiator 3 together define a reflective cavity. The light emitted by the lamp body 2 is suitable for passing through the reflective cavity and finally propagating to the external environment of the vehicle, so as to achieve the lighting effect of the light emitted by the lamp body 2 being emitted to the outside of the vehicle through the lens 41.

[0047] For example, the manufacturing process of the vehicle lamp module 100 can be as follows: an insulating layer 12, a circuit layer 13 and a solder resist layer 15 are sequentially covered on the metal substrate 11, a reserved groove 14 is set on the surface of the metal substrate 11 at a position corresponding to the thermal conductive pad 21 of the lamp body 2, the reserved groove 14 passes through the solder resist layer 15, the circuit layer 13 and the insulating layer 12, and a soldering flux layer or a solderable metal layer is applied on the side of the reserved groove 14 close to the metal substrate 11 to dissolve the oxide on the surface of the metal substrate 11, so as to facilitate the soldering of the thermal conductive layer 141. It is connected to the surface of the metal substrate 11, and the thermal conductive layer 141 protrudes from the surface of the lamp board 1, so that the thermal conductive layer 141 is welded to the thermal conductive pad 21; and a welding window 151 is set on the solder resist layer 15 at a position corresponding to the conductive pad 22 of the lamp body 2. The welding window 151 penetrates the solder resist layer 15, and a conductive layer 152 is set in the welding window 151, so that the conductive layer 152 is welded to the conductive pad 22. The reflector 42 and the lens 41 are respectively arranged on the radiator 3 to complete the production process of the car lamp module 100.

[0048] Reference Figure 1-Figure 3 The vehicle according to the second embodiment of the present invention includes the vehicle light module 100 according to the first embodiment of the present invention.

[0049] According to the vehicle of the embodiment of the present utility model, by being provided with the above-mentioned headlight module 100, a reserved groove 14 is provided on one side of the thickness direction of the lamp board 1 of the headlight module 100, the reserved groove 14 is located on the side of the metal substrate 11 close to the circuit layer 13, and a heat-conducting layer 141 is provided in the reserved groove 14, and the bottom surface of the lamp body 2 is provided with a spaced-apart heat-conducting pad 21 and a conductive pad 22, and the heat-conducting pad 21 is thermally connected to the metal substrate 11 through the heat-conducting layer 141, which can effectively and quickly transfer the heat generated by the lamp body 2 to the metal substrate 11. board 11, thereby achieving the effect of rapid heat dissipation of the lamp body 2 by the metal substrate 11; and, by separating the thermal pad 21 from the conductive pad 22, the conductive pad 22 is used to be conductively connected to the circuit layer 13 on the lamp board 1, which can achieve thermal and electrical separation of the vehicle lamp module 100, ensuring that the heat generated by the lamp body 2 is mainly conducted to the metal substrate 11 through the thermal path, and the lamp body 2 is mainly electrically connected to the circuit layer 13 through the conductive path, which can reduce the risk of electrical failures caused by high temperature, and is conducive to improving the reliability of the vehicle lamp module 100.

[0050] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0051] In the description of the present invention, "first feature" and "second feature" may include one or more such features.

[0052] In the description of the present invention, “plurality” means two or more.

[0053] In the description of the present invention, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact via another feature therebetween.

[0054] In the description of the present invention, a first feature “above”, “above” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0055] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0056] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A vehicle light module, characterized in that: include: A light board, comprising a metal substrate, an insulating layer, and a circuit layer stacked in sequence, wherein a reserved groove is provided on one side of the light board in the thickness direction and the reserved groove is located on a side of the metal substrate close to the circuit layer, the reserved groove passes through the circuit layer and the insulating layer, and a heat conductive layer is provided in the reserved groove; A lamp body is provided with spaced-apart thermal pads and conductive pads on the bottom surface of the lamp body. The thermal pads are thermally connected to the metal substrate through the thermal conductive layer, and the conductive pads are conductively connected to the circuit layer.

2. The vehicle light module according to claim 1, characterized in that: The heat conducting layer is a solder layer.

3. The vehicle light module according to claim 2, characterized in that: A solderable metal layer or a brazing flux layer is provided between the heat-conducting layer and the metal substrate.

4. The vehicle light module according to claim 3, characterized in that: The solderable metal layer includes at least one of a copper metal layer, a nickel metal layer and a tin metal layer.

5. The vehicle light module according to claim 1, characterized in that: The heat-conducting layer protrudes from the surface of the lamp board; and / or the bottom surface of the lamp body is spaced apart from the surface of the lamp board.

6. The vehicle light module according to claim 1, characterized in that: The lamp board also includes a solder resist layer, which is arranged on the side of the circuit layer away from the metal substrate. The reserved groove passes through the solder resist layer, the circuit layer and the insulating layer. A welding window is also formed on the solder resist layer, and the welding window passes through the solder resist layer. A conductive layer is provided in the welding window, and the conductive pad is connected to the circuit layer through the conductive layer.

7. The vehicle light module according to any one of claims 1 to 6, characterized in that: The metal substrate is an aluminum substrate.

8. The vehicle light module according to any one of claims 1 to 6, characterized in that: Also includes: The metal substrate is fixed to the heat sink and is thermally connected to the heat sink.

9. The vehicle light module according to claim 8, characterized in that: A heat-conducting adhesive layer is provided between the metal substrate and the radiator.

10. A vehicle, characterized in that: include: The vehicle light module according to any one of claims 1 to 9.

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