Microfluidic control refrigeration chip and refrigeration system

Abstract

The utility model relates to the technical field of microchannels, and particularly discloses a microflow control cooling chip and a cooling system.The chip comprises a cold conduction layer, a pressure relief layer and a cover plate layer which are sequentially connected from bottom to top; a first H-shaped flow channel and four second H-shaped flow channels are arranged on the front face of the pressure relief layer, the four second H-shaped flow channels are distributed on the front face of the pressure relief layer in a rectangular mode, the four tail ends of the first H-shaped flow channel communicate with the middles of the four second H-shaped flow channels correspondingly, a refrigerant flows into the first H-shaped flow channel from the middle of the first H-shaped flow channel, and a plurality of evaporation grooves are formed in the back face of the pressure relief layer. At least one tail end of the second H-shaped flow channel is communicated with at least one evaporation tank; the chip can effectively solve the problems that the molar masses of refrigerants flowing into different evaporation grooves are different and the heat exchange efficiencies of the refrigerants in the different evaporation grooves are different due to the fact that the lengths of different micro flow channels are different, and therefore the heat exchange efficiency of the micro-flow control cold chip and the refrigeration efficiency of a refrigeration system are effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of microchannels, and in particular relates to a microfluidic control cold chip and a refrigeration system. Background Art

[0002] Microfluidic cooling chips utilize microchannels for heat transfer. Due to their high heat transfer efficiency, compact structure, and energy-saving and environmentally friendly features, they are widely used in electronics cooling, refrigeration and air conditioning, and biomedical applications. However, the distance the refrigerant must travel from the inlet of the microfluidic cooling chip to each evaporation tank varies—in other words, the lengths of the microchannels vary. As the refrigerant gradually vaporizes during flow, the degree of vaporization is positively correlated with the length of the microchannels. Since the volume per unit mass of gas is greater than the volume per unit mass of liquid, the ratio of gaseous refrigerant to liquid refrigerant is negatively correlated with the length of the microchannels. Because these microfluidic cooling chips distribute the refrigerant to each evaporation tank at the same diversion pressure, the varying molar masses of the refrigerant flowing into each evaporation tank vary due to the varying lengths of the microchannels, leading to varying heat exchange efficiencies within the different evaporation tanks. This results in low heat exchange efficiency for the microfluidic cooling chip and the cooling system.

[0003] Therefore, the existing technology needs to be improved and developed. Utility Model Content

[0004] The purpose of this application is to provide a microfluidic controlled cold chip and a refrigeration system, which can effectively solve the problem of different molar masses of refrigerants flowing into different evaporation tanks and different heat exchange efficiencies of refrigerants in different evaporation tanks due to the different lengths of different micro-flow channels, thereby effectively improving the heat exchange efficiency of the microfluidic controlled cold chip and the refrigeration efficiency of the refrigeration system.

[0005] In a first aspect, the present application provides a microfluidic control cold chip, comprising:

[0006] The cooling layer, pressure relief layer and cover layer are connected sequentially from bottom to top;

[0007] A first H-shaped flow channel and four second H-shaped flow channels are provided on the front of the pressure release layer. The four second H-shaped flow channels are rectangularly distributed on the front of the pressure release layer. The four ends of the first H-shaped flow channel are respectively connected to the middle parts of the four second H-shaped flow channels. The refrigerant flows into the first H-shaped flow channel from the middle part of the first H-shaped flow channel. A plurality of evaporation grooves are provided on the back of the pressure release layer. At least one end of the second H-shaped flow channel is connected to at least one evaporation groove. The pressure release layer has a first through hole connecting the evaporation groove and its front. A plurality of second through holes are provided on the cover layer, and each second through hole corresponds to a first through hole.

[0008] The present application provides a microfluidic control cold chip, which utilizes a first H-shaped flow channel and a second H-shaped flow channel to precisely divert the refrigerant so that the molar mass of the refrigerant flowing into each evaporation tank is the same, thereby balancing the cooling effect of each part of the microfluidic control cold chip. Therefore, the present application can effectively solve the problem of different molar masses of refrigerants flowing into different evaporation tanks and different heat exchange efficiencies of the refrigerants in different evaporation tanks due to the different lengths of different micro-flow channels, thereby effectively improving the heat exchange efficiency of the microfluidic control cold chip and the refrigeration efficiency of the refrigeration system.

[0009] Furthermore, a plurality of X-shaped diverter grooves are provided on the back of the pressure release layer, and the pressure release layer also has a third through hole connecting the X-shaped diverter groove and one end of the second H-shaped flow channel. The four ends of each X-shaped diverter groove are respectively connected to the four evaporation grooves.

[0010] This technical solution is equivalent to accurately and evenly diverting the refrigerant into four evaporation tanks by setting an X-shaped diversion groove and a third through hole. Since this implementation can increase the evaporation area of the refrigerant by evenly diverting the refrigerant entering one end of the second H-shaped flow channel into the four evaporation tanks, this technical solution can effectively improve the heat exchange and evaporation effects of the refrigerant.

[0011] Furthermore, the four ends of the second H-shaped flow channel are connected to the four evaporation tanks through the third through hole and the X-shaped diverter groove.

[0012] Furthermore, the microfluidic control cold chip further includes a first sealing component, which is arranged between the back side of the pressure release layer and the cold conduction layer and is located outside all the evaporation tanks.

[0013] Since the first sealing component of this technical solution is arranged between the back side of the pressure release layer and the cooling layer and is located outside all evaporation tanks, this technical solution can effectively prevent the refrigerant flowing to the back side of the pressure release layer from leaking through the gap between the pressure release layer and the cooling layer.

[0014] Furthermore, the microfluidic control cold chip also includes an adhesive layer and a semipermeable membrane. The two sides of the adhesive layer are respectively connected to the front side of the cover layer and the semipermeable membrane. The adhesive layer is provided with a plurality of fourth through holes, and each fourth through hole is directly opposite to a second through hole.

[0015] The semipermeable membrane of this technical solution can allow gas to pass through and prevent liquid from passing through. Therefore, this implementation can avoid the situation where external condensed water flows into the microfluidic control cold chip and unevaporated refrigerant flows out of the microfluidic control cold chip by arranging an adhesive layer and a semipermeable membrane on the cover layer in sequence.

[0016] Furthermore, the microfluidic control cold chip also includes a valve nozzle, which is threadedly connected to the cover layer and communicates with the first H-shaped flow channel.

[0017] Furthermore, a refrigerant delivery channel is provided on the front side of the pressure release layer, and both ends of the refrigerant delivery channel are respectively connected to the valve nozzle and the middle part of the first H-shaped channel.

[0018] Furthermore, the microfluidic control cold chip further includes a second sealing component, which is arranged between the cover layer and the valve nozzle.

[0019] Furthermore, the cooling layer is made of metal, the pressure release layer is made of organic glass, and the cover layer is made of a material with a thermal conductivity coefficient less than 0.045 W / (K×m).

[0020] This technical solution sets the material of the pressure release layer to organic glass and the material of the cover layer to low thermal conductivity material. Since the density of organic glass and low thermal conductivity material is less than that of metal material, this technical solution can effectively reduce the weight of the pressure release layer and the cover layer, thereby effectively reducing the weight of the microfluidic control cold chip.

[0021] In a second aspect, the present invention provides a refrigeration system, which includes a microfluidic control cold chip provided in the first aspect.

[0022] The present application provides a refrigeration system that utilizes a first H-shaped flow channel and a second H-shaped flow channel to precisely divert the refrigerant so that the molar mass of the refrigerant flowing into each evaporation tank is the same, thereby balancing the cooling effect of each part of the microfluidic control cold chip. Therefore, the present application can effectively solve the problem of different molar masses of the refrigerants flowing into different evaporation tanks and different heat exchange efficiencies of the refrigerants in different evaporation tanks due to the different lengths of different micro-flow channels, thereby effectively improving the heat exchange efficiency of the microfluidic control cold chip and the refrigeration efficiency of the refrigeration system.

[0023] From the above, it can be seen that the microfluidic control cold chip and refrigeration system provided by the present invention utilize the first H-type flow channel and the second H-type flow channel to accurately divert the refrigerant so that the molar mass of the refrigerant flowing into each evaporation tank is the same, so as to balance the cooling effect of each part of the microfluidic control cold chip. Therefore, the present application can effectively solve the problem that the molar mass of the refrigerant flowing into different evaporation tanks is different due to the different lengths of different micro-flow channels, and the heat exchange efficiency of the refrigerant in different evaporation tanks is different, thereby effectively improving the heat exchange efficiency of the microfluidic control cold chip and the refrigeration efficiency of the refrigeration system. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic structural diagram of a microfluidic control cold chip provided in an embodiment of the present application.

[0025] Figure 2 A schematic diagram of the exploded structure of a microfluidic control cold chip provided in an embodiment of the present application.

[0026] Figure 3 This is a schematic structural diagram of the front side of the pressure release layer provided in an embodiment of the present application.

[0027] Figure 4 This is a schematic structural diagram of the back side of the pressure release layer provided in an embodiment of the present application.

[0028] Explanation of the reference numbers: 1. Cooling conduction layer; 2. Pressure release layer; 3. Cover layer; 4. First H-type flow channel; 5. Second H-type flow channel; 6. Evaporation tank; 7. First through hole; 8. Second through hole; 9. X-type diverter groove; 10. First sealing component; 11. Adhesive layer; 12. Semipermeable membrane; 13. Third through hole; 14. Valve; 15. Refrigerant delivery channel; 16. Second sealing component; 17. Temperature measuring tank; 18. Fourth through hole. DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0030] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

[0031] First, as Figure 1-Figure 4 As shown, the present application provides a microfluidic control cold chip, which includes:

[0032] The cooling layer 1, the pressure release layer 2 and the cover layer 3 are connected sequentially from bottom to top;

[0033] A first H-shaped flow channel 4 and four second H-shaped flow channels 5 are provided on the front of the pressure release layer 2. The four second H-shaped flow channels 5 are rectangularly distributed on the front of the pressure release layer 2. The four ends of the first H-shaped flow channel 4 are respectively connected to the middle of the four second H-shaped flow channels 5. The refrigerant flows into the first H-shaped flow channel 4 from the middle of the first H-shaped flow channel 4. A plurality of evaporation grooves 6 are provided on the back of the pressure release layer 2. At least one end of the second H-shaped flow channel 5 is connected to at least one evaporation groove 6. The pressure release layer 2 has a first through hole 7 connecting the evaporation groove 6 and its front. A plurality of second through holes 8 are provided on the cover layer 3. Each second through hole 8 corresponds to a first through hole 7.

[0034] The microfluidic control cold chip of this embodiment includes a cooling layer 1, a pressure release layer 2, and a cover layer 3 connected in sequence from bottom to top. The cooling layer 1 of this embodiment can conduct heat. The front of the pressure release layer 2 of this embodiment is the side close to the cover layer 3, and the back of the pressure release layer 2 of this embodiment is the side close to the cooling layer 1. The front of the pressure release layer 2 of this embodiment is provided with a first H-shaped flow channel 4 and four second H-shaped flow channels 5. The four second H-shaped flow channels 5 are rectangularly distributed on the front of the pressure release layer 2. The four ends of the first H-shaped flow channel 4 are respectively connected to the middle of the four second H-shaped flow channels 5. The refrigerant flows into the first H-shaped flow channel 4 from the middle of the first H-shaped flow channel 4. A plurality of evaporation grooves 6 are provided on the back of the pressure release layer 2. At least one end of the second H-shaped flow channel 5 is connected to at least one evaporation groove 6 through a third through hole 13. The refrigerant flows to the back of the pressure release layer 2 through the first H-shaped flow channel 4, the second H-shaped flow channel 5, and the third through hole 13 and flows into the evaporation groove 6. Since the external heat can be transferred to the refrigerant flowing to the back of the pressure release layer 2 through the cooling layer 1, the refrigerant will absorb the heat and evaporate into gas. Therefore, the microfluidic control cold chip of this embodiment can play a cooling role. Since the pressure release layer 2 has a first through hole 7 connecting the evaporation groove 6 and its front side, the cover layer 3 is provided with multiple second through holes 8, and each second through hole 8 corresponds to a first through hole 7. Therefore, the gas obtained by the evaporation of the refrigerant will flow out of the pressure release layer 2 through the second through hole 8 and the first through hole 7. That is, this embodiment is equivalent to using the second through hole 8 and the first through hole 7 to guide out the gas obtained by the evaporation of the refrigerant. It should be understood that, since the four second H-shaped flow channels 5 of this embodiment are rectangularly distributed on the front surface of the pressure release layer 2, the four ends of the first H-shaped flow channel 4 are respectively connected to the middle portions of the four second H-shaped flow channels 5, and the refrigerant flows into the first H-shaped flow channel 4 from the middle portion thereof. That is, the distance from the refrigerant flowing into the first H-shaped flow channel 4 to the end of each second H-shaped flow channel 5 (equivalent to the same length of different micro-flow channels) and the number of turns are the same, thus, this embodiment is equivalent to using the first H-shaped flow channel 4 and the second H-shaped flow channel 5 to precisely divert the refrigerant, so that the refrigerant flow rate of each diversion to each tributary is the same, thereby making the molar mass of the refrigerant flowing into each evaporation tank 6 the same, thereby balancing the cooling effect of each location of the microfluidic control cold chip. That is, this embodiment can ensure that the flow rate of each diversion of the refrigerant in each micro-flow channel is the same. Preferably, the first through hole 7 of this embodiment is located in the middle portion of the evaporation tank 6.

[0035] The present application provides a microfluidic control cold chip, which utilizes the first H-type flow channel 4 and the second H-type flow channel 5 to accurately divert the refrigerant so that the molar mass of the refrigerant flowing into each evaporation tank 6 is the same, so as to balance the cooling effect of each part of the microfluidic control cold chip. Therefore, the present application can effectively solve the problem that the molar mass of the refrigerant flowing into different evaporation tanks 6 is different due to the different lengths of different micro-flow channels, and the heat exchange efficiency of the refrigerant in different evaporation tanks 6 is different, thereby resulting in low heat exchange efficiency of the microfluidic control cold chip and low refrigeration efficiency of the refrigeration system. In addition, since the present application can make the flow of the refrigerant evenly distributed in the microfluidic control cold chip, the present application can make the heat exchange efficiency of different areas of the microfluidic control cold chip the same, thereby effectively improving the heat exchange efficiency of the microfluidic control cold chip and the refrigeration efficiency of the refrigeration system.

[0036] In some preferred embodiments, the cross-sectional shape of the evaporation tank 6 is a rotationally symmetrical shape. The cross-sectional shape of the evaporation tank 6 in this embodiment is preferably a shape that overlaps with the original shape when rotated 90°, 180°, or 270°, such as a square or a circle.

[0037] In some preferred embodiments, a plurality of X-shaped diverter grooves 9 are further provided on the back side of the pressure release layer 2, and the pressure release layer 2 also has a third through hole 13 connecting the X-shaped diverter groove 9 and one end of the second H-shaped flow channel 5, and the four ends of each X-shaped diverter groove 9 are respectively connected to four evaporation grooves 6. Since this embodiment is equivalent to connecting the end of a second H-shaped flow channel 5 with four evaporation grooves 6 through the third through hole 13 and the X-shaped diverter groove 9, and the distance between the refrigerant entering the X-shaped diverter groove 9 and the four evaporation grooves 6 connected to the X-shaped diverter groove 9 is the same, this embodiment is equivalent to accurately and evenly diverting the refrigerant into the four evaporation grooves 6 by providing the X-shaped diverter groove 9 and the third through hole 13. Since this implementation can increase the evaporation area of the refrigerant by evenly diverting the refrigerant entering one end of the second H-shaped flow channel 5 into the four evaporation grooves 6, this embodiment can effectively improve the heat exchange effect and evaporation effect of the refrigerant. It should be understood that this embodiment is equivalent to first using the first H-shaped flow channel 4 and the second H-shaped flow channel 5 to uniformly divert the refrigerant for the first time, and then using the X-shaped diversion groove 9 to uniformly divert the refrigerant for the second time.

[0038] In some preferred embodiments, the four ends of the second H-shaped flow channel 5 are connected to the four evaporation slots 6 via the third through-holes 13 and the X-shaped diverter slots 9. Specifically, in this embodiment, there are four second H-shaped flow channels 5, and the four ends of the second H-shaped flow channel 5 are connected to the four evaporation slots 6 via the third through-holes 13 and the X-shaped diverter slots 9. That is, 64 evaporation slots 6 are provided on the back side of the pressure release layer 2 of this embodiment. Because the four ends of the second H-shaped flow channel 5 of this embodiment are connected to the four evaporation slots 6 via the third through-holes 13 and the X-shaped diverter slots 9, this embodiment can further increase the evaporation area of the refrigerant, thereby further improving the heat exchange and evaporation effects of the refrigerant.

[0039] In some preferred embodiments, the microfluidic control cold chip further includes a first sealing component 10, which is disposed between the back surface of the pressure-releasing layer 2 and the cooling layer 1 and is located outside all evaporation slots 6. The first sealing component 10 of this embodiment is preferably a sealing ring. Since the first sealing component 10 of this embodiment is disposed between the back surface of the pressure-releasing layer 2 and the cooling layer 1 and is located outside all evaporation slots 6, this embodiment can effectively prevent the refrigerant flowing to the back surface of the pressure-releasing layer 2 from leaking through the gap between the pressure-releasing layer 2 and the cooling layer 1.

[0040] In some preferred embodiments, the microfluidic control cold chip further includes an adhesive layer 11 and a semipermeable membrane 12. The two sides of the adhesive layer 11 are respectively connected to the front surface of the cover layer 3 and the semipermeable membrane 12. The adhesive layer 11 is provided with a plurality of fourth through holes 18, and each fourth through hole 18 is directly opposite to a second through hole 8. The adhesive layer 11 of this embodiment is preferably a double-sided tape. This embodiment is equivalent to using the adhesive layer 11 to bond and fix the semipermeable membrane 12 to the front surface of the cover layer 3. The semipermeable membrane 12 of this embodiment can play a role in allowing gas to pass through and preventing liquid from passing through. Therefore, this implementation can avoid the situation where external condensed water flows into the microfluidic control cold chip and unevaporated refrigerant flows out of the microfluidic control cold chip by sequentially arranging the adhesive layer 11 and the semipermeable membrane 12 on the cover layer 3.

[0041] In some preferred embodiments, the microfluidic control cold chip further includes a valve 14, which is threadedly connected to the cover layer 3 and communicates with the middle portion of the first H-shaped flow channel 4. The valve 14 of this embodiment can be located directly above the middle portion of the first H-shaped flow channel 4 to allow the refrigerant to be input into the middle portion of the first H-shaped flow channel 4 through the valve 14. That is, this embodiment is equivalent to using the valve 14 to input the refrigerant into the front surface of the pressure release layer 2.

[0042] In some preferred embodiments, a refrigerant delivery channel 15 is further provided on the front surface of the pressure release layer 2. The two ends of the refrigerant delivery channel 15 are respectively connected to the valve 14 and the middle of the first H-shaped channel 4. In this embodiment, the refrigerant output from the valve 14 first flows into the refrigerant delivery channel 15 and then into the first H-shaped channel 4.

[0043] In some preferred embodiments, the microfluidic control cold chip further includes a second sealing component 16, which is disposed between the cover layer 3 and the valve 14. The second sealing component 16 of this embodiment can be a sealing ring or a sealing strip, etc., which can improve airtightness. Since the second sealing component 16 of this embodiment is disposed between the cover layer 3 and the valve 14, this embodiment can effectively prevent the refrigerant from leaking from the threads of the cover layer 3 and the valve 14.

[0044] In some preferred embodiments, the cooling layer 1 is made of metal, the pressure release layer 2 is made of organic glass, and the cover layer 3 is made of a material with a thermal conductivity of less than 0.045 W / (K×m). In this embodiment, the cooling layer 1 can be made of copper, aluminum, or iron. Organic glass is selected as the material for the pressure release layer 2, which has excellent low-temperature resistance. The cover layer 3 is made of a material with a thermal conductivity of less than 0.045 W / (K×m) (such as aerogel), which is equivalent to selecting a low-thermal-conductivity material for the cover layer 3. In the prior art, the cooling layer 1, pressure release layer 2, and cover layer 3 are preferably all made of metal. In this embodiment, the pressure release layer 2 is made of organic glass, and the cover layer 3 is made of a low-thermal-conductivity material. Because the density of both organic glass and the low-thermal-conductivity material is lower than that of metal, this embodiment effectively reduces the weight of the pressure release layer 2 and cover layer 3, thereby effectively reducing the weight of the microfluidic cooling chip.

[0045] In some preferred embodiments, a temperature measuring groove 17 for placing a temperature sensor is provided on the side of the cooling layer 1. In this embodiment, the temperature of the cooling layer 1 can be measured using the temperature sensor placed in the temperature measuring groove 17.

[0046] From the above, it can be seen that the microfluidic control cold chip provided by the present application utilizes the first H-type flow channel 4 and the second H-type flow channel 5 to accurately divert the refrigerant so that the molar mass of the refrigerant flowing into each evaporation tank 6 is the same, so as to balance the cooling effect of each part of the microfluidic control cold chip. Therefore, the present application can effectively solve the problem that the molar mass of the refrigerant flowing into different evaporation tanks 6 is different due to the different lengths of different micro-flow channels, and the heat exchange efficiency of the refrigerant in different evaporation tanks 6 is different, thereby effectively improving the heat exchange efficiency of the microfluidic control cold chip and the refrigeration efficiency of the refrigeration system.

[0047] In a second aspect, the present invention provides a refrigeration system, which includes a microfluidic control cold chip provided in the first aspect.

[0048] An embodiment of the present application provides a refrigeration system, which includes a microfluidic control cold chip provided by the first aspect above. The principle of the refrigeration system provided by this embodiment is the same as the principle of the microfluidic control cold chip provided by the first aspect above, and will not be discussed in detail here.

[0049] From the above, it can be seen that the present invention provides a microfluidic control cold chip and a refrigeration system, which utilize the first H-type flow channel 4 and the second H-type flow channel 5 to accurately divert the refrigerant so that the molar mass of the refrigerant flowing into each evaporation tank 6 is the same, so as to balance the cooling effect of each part of the microfluidic control cold chip. Therefore, the present application can effectively solve the problem that the molar mass of the refrigerant flowing into different evaporation tanks 6 is different due to the different lengths of different micro-flow channels, and the heat exchange efficiency of the refrigerant in different evaporation tanks 6 is different, thereby effectively improving the heat exchange efficiency of the microfluidic control cold chip and the refrigeration efficiency of the refrigeration system.

[0050] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0051] The above descriptions are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A microfluidic control cold chip, characterized in that: The microfluidic control cold chip comprises: The cooling layer, pressure relief layer and cover layer are connected sequentially from bottom to top; The front of the pressure release layer is provided with a first H-shaped flow channel and four second H-shaped flow channels, and the four second H-shaped flow channels are rectangularly distributed on the front of the pressure release layer. The four ends of the first H-shaped flow channel are respectively connected to the middle parts of the four second H-shaped flow channels, and the refrigerant flows into the first H-shaped flow channel from the middle part of the first H-shaped flow channel. The back of the pressure release layer is provided with a plurality of evaporation grooves, and at least one end of the second H-shaped flow channel is connected to at least one of the evaporation grooves. The pressure release layer has a first through hole connecting the evaporation groove and its front, and the cover layer is provided with a plurality of second through holes, and each of the second through holes corresponds to one of the first through holes.

2. The microfluidic control cold chip according to claim 1, characterized in that: The back of the pressure release layer is also provided with a plurality of X-shaped diverter grooves, and the pressure release layer also has a third through hole connecting the X-shaped diverter groove and one end of the second H-shaped flow channel. The four ends of each X-shaped diverter groove are respectively connected to the four evaporation grooves.

3. The microfluidic control cold chip according to claim 2, characterized in that: The four ends of the second H-shaped flow channel are connected to the four evaporation tanks through the third through hole and the X-shaped diverter tank.

4. The microfluidic control cold chip according to claim 1, characterized in that: The microfluidic control cold chip further includes a first sealing component, which is arranged between the back surface of the pressure release layer and the cold conduction layer and is located outside all the evaporation slots.

5. The microfluidic control cold chip according to claim 1, characterized in that: The microfluidic control cold chip also includes an adhesive layer and a semipermeable membrane. The two sides of the adhesive layer are respectively connected to the front surface of the cover layer and the semipermeable membrane. The adhesive layer is provided with a plurality of fourth through holes, and each of the fourth through holes is directly opposite to one of the second through holes.

6. The microfluidic control cold chip according to claim 1, characterized in that: The microfluidic control cold chip further includes an air valve, which is threadedly connected to the cover layer and communicates with the middle portion of the first H-shaped flow channel.

7. The microfluidic control cold chip according to claim 6, characterized in that: A refrigerant delivery channel is further provided on the front surface of the pressure release layer, and both ends of the refrigerant delivery channel are respectively connected to the valve nozzle and the middle part of the first H-shaped channel.

8. The microfluidic control cold chip according to claim 6, characterized in that: The microfluidic control cold chip further includes a second sealing component, which is arranged between the cover layer and the valve nozzle.

9. The microfluidic control cold chip according to claim 1, characterized in that: The material of the cooling layer is a metal material, the material of the pressure release layer is organic glass, and the material of the cover layer is a material with a thermal conductivity coefficient less than 0.045 W / (K×m).

10. A refrigeration system, characterized in that: The refrigeration system includes the microfluidic control cold chip according to any one of claims 1 to 9.

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