Wafer detection structure and wafer detection equipment

Abstract

The utility model relates to the technical field of semiconductor detection, and provides a wafer detection structure and wafer detection equipment. The wafer detection structure comprises a test box, an ion wind bar and an air inducing piece, the test box comprises a box body with a cavity and a bearing table arranged in the cavity, an air passing channel is arranged between the box body and the bearing table and / or the bearing table, and the box body is provided with a box body air outlet which is communicated with the air passing channel and located below the bearing table; the ion wind bar is installed on the box body and corresponds to the bearing table. The air inducing piece is installed on the box body and located below the bearing table, and the air inducing piece is used for guiding ion wind sent out by the ion wind bar to flow out of the box body air outlet along the air passing channel. According to the wafer detection structure provided by the invention, the static elimination effect is improved on the basis of meeting wafer detection.

Description

Technical Field

[0001] The present application relates to the field of semiconductor detection technology, and in particular to a wafer detection structure and wafer detection equipment. Background Art

[0002] In semiconductor device testing, structures such as ion wind bars or ion wind knives are usually set up to generate a large amount of airflow with positive and negative charges to act on the semiconductor devices, neutralize the charges carried by the semiconductor devices, and achieve the purpose of eliminating static electricity.

[0003] In related technologies, semiconductor device testing involves spaced-apart loading and testing stations. To ensure test accuracy and minimize interference with the testing structure, ion wind bars are often placed at the loading station. This creates a risk of semiconductor devices picking up surrounding charges during transfer to the testing station, leading to poor static elimination. Utility Model Content

[0004] Based on this, it is necessary to provide a wafer detection structure that improves the static elimination effect while meeting the requirements of wafer detection.

[0005] A wafer detection structure includes a test box, an ion wind rod and an air induction member; the test box includes a box body with a cavity and a supporting platform arranged on the cavity, an air passage is provided between the box body and the supporting platform and / or the supporting platform, and the box body is constructed with a box air outlet connected to the air passage and located below the supporting platform; the ion wind rod is installed on the box body and corresponding to the supporting platform; the air induction member is installed on the box body and located below the supporting platform, and the air induction member is used to guide the ion wind sent out by the ion wind rod to flow out from the box air outlet along the air passage.

[0006] It is understandable that the ion wind rod can blow ion wind toward the wafer supported on the support platform, neutralizing the charge on the semiconductor device and achieving the effect of eliminating static electricity. At the same time, in conjunction with the setting of the air induction member, the neutralized ion wind is guided from the air passage to the air outlet of the box body and discharged. In this process, precisely because the air induction member is located below the support platform, it is equivalent to generating a top-down airflow within the box body, which ensures the discharge of the neutralized ion wind while improving the support stability of the wafer. Moreover, the setting of the air passage facilitates the orderly discharge of the airflow, preventing the neutralized airflow from flowing arbitrarily to other locations and causing static electricity or wear and scratches.

[0007] In some embodiments, the ion wind rods and the air inducing members are staggered in the horizontal direction. This arrangement increases the flow path of the ion wind, ensures more complete contact between the ion wind and the wafer, and improves the neutralization effect.

[0008] In some embodiments, the air passage is at least provided on one side close to the air inducing member in the horizontal direction, so as to further guide the air flow to fully flow through the wafers on the carrier, thereby improving the neutralization effect.

[0009] In some embodiments, the ion wind bar is positioned obliquely above the carrier platform, with the ion wind port of the ion wind bar facing the carrier surface of the carrier platform. This arrangement allows the ion wind bar to be tilted relative to the carrier surface, causing the ion wind delivered through the ion wind port to have a certain angle relative to the carrier surface, which is more conducive to fully affecting the wafer.

[0010] In some embodiments, the box body is configured with a box air inlet connected to the cavity near the ion wind bar. The box air inlet is used to send fresh air into the cavity to mix with the ion wind and blow it over the wafers, and then it is discharged from the box air outlet to maintain the air pressure balance in the box.

[0011] In some embodiments, the housing includes at least one partition disposed within the cavity, the partition separating the cavity into an inner cavity and an outer cavity communicating with the external environment; the support platform is disposed within the inner cavity, the partition is configured with an air vent communicating with the inner and outer cavities, and the air induction member is disposed corresponding to the air vent. It is understood that the partition is used to separate the support platform from the housing's air outlet to maintain stability at the support platform; and the air vent facilitates the discharge of neutralized ion air within the inner cavity to the outer cavity, thereby discharging it from the housing's air outlet.

[0012] In some embodiments, the air vents and the ion wind rods are horizontally staggered, and the air inlet is positioned within the outer cavity, with the air inlet of the air inlet facing the air vents. This arrangement also helps increase the flow path of the ion wind, guiding the ion wind to fully contact the wafers, improving the neutralization effect; and also prevents interference between the air inlet and other structures within the inner cavity.

[0013] In some embodiments, the box body further includes a bottom plate spaced apart from the bottom of the partition, the bottom plate and the partition together defining the outer cavity, and the box body air outlet is located on the bottom plate. This arrangement is equivalent to placing the box body air outlet at the very bottom of the box body, which not only allows the neutralized ion air to be discharged, but also can be used to dissipate heat from other structures within the cavity.

[0014] In some embodiments, the inner cavity includes an optical detection cavity and an electrical structure cavity that are connected vertically. The optical detection cavity houses the support platform, the ion wind rod, and the optical components, while the electrical structure cavity houses the electrical components. This arrangement minimizes the risk of impurities or heat from the electrical structure cavity entering the optical detection cavity and affecting the detection performance of the optical components.

[0015] In some embodiments, the optical components within the optical detection chamber include a light source and a reflector. The light source is used to emit illumination light collected by the reflector toward the wafer under test. An image collector is also installed within the electrical structure chamber. The optical fiber receiving end of the image collector is connected to the end of the reflector facing away from the support platform, and is used to receive imaging light from the wafer under test to form an image. This improves imaging quality and, in turn, detection accuracy.

[0016] The present application also provides a wafer detection device, including the above-mentioned wafer detection structure.

[0017] The wafer inspection equipment can be used to inspect the appearance of the back side of the wafer, while ensuring the wafer inspection accuracy, improving the static elimination effect, and improving the fixation stability of the wafer during the static elimination process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A cross-sectional view of a wafer inspection structure provided in one embodiment of the present application;

[0020] Figure 2 A partial schematic diagram of a wafer inspection structure provided in one embodiment of the present application;

[0021] Figure 3 for Figure 2 A partial enlarged view of point A in the middle.

[0022] Figure numerals: 10, test box; 11, box body; 12, supporting platform; 13, extension section; 20, ion wind rod; 21, wind rod body; 22, mounting frame; 30, air induction piece; 40, optical component; 41, support plate; 42, reflective bowl; 43, light source; 44, support arm; 50, image collector; 110, cavity; 112, box air outlet; 113, box air inlet; 114, partition; 115, bottom plate; 201, ion air outlet; 1101, inner cavity; 1101a, optical detection cavity; 1101b, electrical structure cavity; 1102, outer cavity; 1120, air outlet; 1140, air outlet; 1301, extension cavity. DETAILED DESCRIPTION

[0023] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0024] It should be noted that when a component is referred to as being "fixed to" or "provided on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0026] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0028] See also Figure 1 and Figure 2An embodiment of the present application provides a wafer detection structure, including a test box 10, an ion wind rod 20 and an air induction member 30. The test box 10 includes a box body 11 having a cavity 110 and a carrier platform 12 arranged on the cavity 110. There is an air passage (not shown in the figure) between the box body 11 and the carrier platform 12, and the box body 11 is constructed with a box air outlet 112 connected to the air passage and located below the carrier platform 12. The ion wind rod 20 is installed on the box body 11 and is arranged corresponding to the carrier platform 12. The air induction member 30 is installed on the box body 11 and is located below the carrier platform 12. The air induction member 30 is used to guide the ion wind sent out by the ion wind rod 20 to flow out from the box air outlet 112 along the air passage.

[0029] It can be understood that the box body 11 is provided with a support frame (not shown in the figure) in the cavity 110, and the carrier 12 is supported on the support frame. The side of the carrier 12 along its own thickness direction (i.e., the Z-axis direction) away from the support frame serves as a support surface for supporting and positioning the wafer. The ion wind rod 20 is connected to the box body 11 and is located in the cavity 110 to blow ion wind toward the wafer supported on the carrier 12, neutralize the charge on the wafer, and achieve the effect of eliminating static electricity. At the same time, in conjunction with the setting of the air induction member 30, the neutralized ion wind can be guided from the wind channel to the box air outlet 112 and discharged. In this process, precisely because the air-inducing member 30 is located below the supporting platform 12, it is equivalent to generating an airflow from top to bottom in the box body 11, and positive pressure can be used to act on the wafer to ensure the discharge of the neutralized ion wind while stabilizing the support of the wafer and improving the support stability of the wafer; and, combined with the setting of the air passage, it is conducive to the orderly discharge of the airflow, avoiding the problem of the neutralized ion wind flowing to other locations indiscriminately and causing static electricity or wear, or even scratching the wafer.

[0030] like Figure 1 As shown, in some specific embodiments, the ion wind rod 20 is located above the carrier 12, so that the blown ion wind can fully act on the wafer on the carrier 12, ensuring the range and effect of eliminating static electricity. Among them, the ion wind rod 20 includes a wind rod body 21 and a mounting bracket 22, the mounting bracket 22 is connected to the box body 11, and the wind rod body 21 is connected to the mounting bracket 22. The mounting bracket 22 is constructed with a plurality of waist-shaped holes (not shown in the figure) arranged at intervals, which is convenient for fine-tuning the installation angle and position of the mounting bracket 22 relative to the box body 11, and then adjusting the installation angle of the wind rod body 21 relative to the carrier 12 to match the best state as much as possible.

[0031] Please continue reading Figure 1 and Figure 2Optionally, the ion wind rod 20 and the air induction member 30 are staggered in the horizontal direction. With this arrangement, the ion wind sent out by the ion wind rod 20 needs to flow at least in the horizontal direction before it can flow out from the air induction member 30, that is, the flow path of the ion wind is increased, ensuring that the ion wind has more sufficient contact with the wafer, thereby improving the neutralization effect. Figure 1 For example, the ion wind bar 20 is located above and to the left of the carrier 12, and the air induction member 30 is located below and to the right of the carrier 12. Therefore, the ion wind sent by the ion wind bar 20 must flow to the right after it hits the wafer before it can be discharged through the air induction member 30.

[0032] Furthermore, the air passage is at least provided on one side close to the air inducing member 30 in the horizontal direction. With such a setting, the air flow can be further guided to fully flow through the wafers on the carrier 12, thereby improving the neutralization effect. Among them, the ion wind rod 20 and the air inducing member 30 are staggered along the X-axis direction, and the aforementioned support frame is supported on both sides of the carrier 12 along the Y-axis direction. A gap is left between the side of the carrier 12 close to the air inducing member 30 along the X-axis direction and the box body 11 to form an air passage. Alternatively, a gap may be left between both sides of the carrier 12 along the X-axis direction and the box body 11, so that both sides have air passages, thereby improving the discharge effect of the ion wind after neutralization and avoiding residue.

[0033] Alternatively, the support platform 12 may be constructed with a through hole extending along its own thickness direction (i.e., the Z-axis direction), and the through hole forms an air passage. The through hole may be a long hole extending along the Y-axis direction, or a circular hole, an elliptical hole, etc.; or, the through hole may be located at the edge of the support platform 12, that is, so that the support platform 12 forms a notch that is recessed along its own radial direction. Another alternative is that a gap is left between the side of the support platform 12 close to the air inducing member 30 along the X-axis direction and the box body 11 to form one of the air passages, and the side of the support platform 12 away from the air inducing member 30 along the X-axis direction is constructed with a through hole to form another air passage. This is just an example.

[0034] like Figure 2 As shown, in some specific embodiments, the air inducing member 30 can be a fan. In actual use, the ion wind bar 20 has an axial direction (for example, the Y-axis direction). There are at least two air inducing members 30, which are arranged at intervals along the axial direction of the ion wind bar 20 to improve the air inducing efficiency and exhaust performance.

[0035] See also Figure 1, for example, the ion wind rod 20 is arranged obliquely above the carrier platform 12, and the ion air outlet 201 of the ion wind rod 20 faces the bearing surface of the carrier platform 12. Among them, take the staggered arrangement of the ion wind rod 20 and the air inducing member 30 along the X-axis direction as an example. Such an arrangement makes the ion wind rod 20 tilted relative to the bearing surface of the carrier platform 12, so that the ion wind sent through the ion air outlet 201 has a certain angle relative to the bearing surface, which is more conducive to acting on the rear flow of the wafer through the wind channel. Specifically, the carrier platform 12 is arranged horizontally, and the ion wind rod 20 has an angle with the bearing surface of the carrier platform 12. The angle is an acute angle and can be between 20°-70°, such as 20°, 35°, 45°, 58°, 65° or 70°. This is just an example.

[0036] Furthermore, the box body 11 is constructed with a box air inlet 113 connected to the cavity 110 near the ion wind rod 20. The setting of the box air inlet 113 facilitates the maintenance of air pressure balance in the box. The box air inlet 113 sends in fresh air flow to mix with the ion wind and then discharge it from the box air outlet 112 under the action of the air induction member 30. For example, the box body 11 is constructed with a through opening on the side wall near the ion wind rod 20 along the X-axis direction to form the box air inlet 113. In some specific embodiments, an extension section 13 is provided on one side of the box body 11 near the ion wind rod 20 along the X-axis direction, and the extension section 13 extends upward along the Z-axis direction. The extension section 13 is surrounded by an extension cavity 1301, and an opening is left at the top of the extension section 13 to form the box air inlet 113, and the ion wind rod 20 is located between the extension cavity 1301 and the cavity 110. The opening is communicated with the extension cavity 1301 , and the extension cavity 1301 is communicated with the cavity 110 of the box body 11 , thereby enabling the introduction of fresh airflow.

[0037] like Figure 2 and Figure 3 As shown, further, a bottom plate 115 is provided at the bottom of the box body 11, and a plurality of air outlet holes 1120 are arranged at intervals on the bottom plate 115. The plurality of air outlet holes 1120 together form the box body air outlet 112. Alternatively, the box body 11 may be provided with a plurality of air outlet holes 1120 at a lower position along the Z-axis direction to form the box body air outlet 112. Any method that can achieve air discharge is sufficient, and this is exemplified here.

[0038] See also Figures 1 to 3In some optional embodiments, the box body 11 includes at least a partition 114 provided in the cavity 110, and the partition 114 divides the cavity 110 into an inner cavity 1101 and an outer cavity 1102 connected to the external environment. The supporting platform 12 is provided in the inner cavity 1101, and the partition 114 is constructed with an air outlet 1140 connecting the inner cavity 1101 and the outer cavity 1102, and the air induction member 30 is provided corresponding to the air outlet 1140. Specifically, the outer cavity 1102 is connected to the external environment through the box body air outlet 112, which facilitates the discharge of the neutralized ion wind out of the box body 11; the inner cavity 1101 is connected to the external environment through the box body air inlet 113, which facilitates the introduction of fresh air. The setting of the partition 114 can also be used to support the air induction member 30. The provision of the air vents 1140 facilitates the discharge of the ion wind after neutralization of the charge on the wafers within the inner cavity 1101 to the outer cavity 1102, and then out of the box body 11 through the box body air outlet 112. Furthermore, it can guide the flow of the neutralized ion wind in an orderly manner and ensure that the portion of the partition 114 other than the air vents 1140 can still be used for assembly of other structures within the box body 11. When at least two air induction members 30 are provided, each air induction member 30 corresponds to an air vent 1140.

[0039] The aforementioned bottom plate 115 is disposed below the partition 114. The bottom plate 115 and the partition 114 together define an outer cavity 1102. The box air outlet 112 is disposed on the bottom plate 115 to ensure communication between the outer cavity 1102 and the external environment for exhaust. The side of the partition 114 facing away from the bottom plate 115 can also be used to mount electrical components, etc.

[0040] like Figure 3 As shown, further, the air outlet 1140 is composed of a plurality of air holes arranged at intervals, and the plurality of air holes are arranged in a rectangular array or a circular array, and each air hole can be used for gas circulation.

[0041] like Figure 1 As shown, further, the air outlet 1140 and the ion wind rod 20 are staggered in the horizontal direction (for example, the X-axis direction), and the air inlet of the air-inducing member 30 is arranged toward the air outlet 1140. Such a setting is also conducive to increasing the flow path of the ion wind, guiding the ion wind to fully contact the wafer, and improving the neutralization effect. Among them, the air-inducing member 30 is arranged in the outer cavity 1102 and is installed on the partition 114 to avoid interference with other structures in the inner cavity 1101 as much as possible. The air flow flowing through the air outlet 1140 can be directly discharged from the air outlet 112 of the box body via the air-inducing member 30. Alternatively, the air-inducing member 30 can also be arranged in the inner cavity 1101, and the air outlet of the air-inducing member 30 is arranged toward the air outlet 1140, which can mainly realize the discharge of the neutralized ion wind.

[0042] Please continue reading Figure 1 and Figure 2Exemplarily, the inner cavity 1101 includes an optical inspection cavity 1101a and an electrical structure cavity 1101b, which are connected vertically. That is, the optical inspection cavity 1101a is located above the electrical structure cavity 1101b, and the two are connected. The optical inspection cavity 1101a is equipped with a carrier 12, an ion wind rod 20, and an optical assembly 40. The wafer is supported on the carrier 12, and the appearance of the wafer is inspected via the optical assembly 40. The ion wind rod 20 is used to eliminate static electricity on the wafer before inspection. The electrical structure cavity 1101b is equipped with an electrical structure, which is electrically connected to the ion wind rod 20. Fresh air is introduced through the air inlet 113 of the housing and flows into the optical detection chamber 1101a. It mixes with the ionized air and acts on the wafers within the optical detection chamber 1101a, neutralizing the charge on the wafers. The neutralized ionized air then flows through the optical detection chamber 1101a to the electrical structure chamber 1101b, then through the air outlet 1140 to the external chamber 1102, and finally out of the housing air outlet 112. This arrangement minimizes the risk of impurities or heat from the electrical structure chamber 1101b entering the optical detection chamber 1101a and affecting the detection performance of the optical assembly 40.

[0043] In actual use, the electrical structure is mounted on the upper surface of the partition 114, and the air vent 1140 is located on the side of the partition 114 away from the ion wind bar 20 along the X-axis direction. That is, the air vent 1140 is offset to fully avoid the electrical structure and ensure that the electrical structure has sufficient assembly space. Moreover, the offset of the air vent can guide the airflow to minimize contact with the electrical structure, while ensuring the exhaust is safe. In addition, because the bottom plate 115 is located below the partition 114, the heat of the electrical structure on the upper surface of the partition 114 can be fully dissipated to the bottom plate 115 through the partition 114 and dissipated through the air outlet 112 of the box.

[0044] Please continue reading Figure 1 and Figure 2 Specifically, the optical component 40 is arranged below the carrier 12, and the carrier 12 is constructed with a detection window that penetrates along its own thickness direction, so that the back of the wafer is fully exposed to the illumination range of the optical component 40. The optical component 40 includes a light source 43 and a reflective bowl 42. The light source 43 is used to emit illumination light collected by the reflective bowl 42 to the wafer to be tested. At the same time, an image collector 50 is also installed in the electrical structure cavity 1101b. The light receiving end of the image collector 50 is connected to the end of the reflective bowl 42 away from the carrier 12, and is used to receive imaging light from the wafer to be tested for imaging. Among them, the light source 43 can be a ring light source 43 to minimize the lighting blind spot; the reflective bowl 42 is used to reflect the illumination light and increase the lighting range; the image collector 50 uses a camera to capture image information on the back of the wafer to achieve appearance inspection of the back of the wafer. In this way, the imaging effect can be improved, thereby improving the detection accuracy.

[0045] In actual use, the optical assembly 40 also includes a support plate 41 connected to the box body 11, and the reflective bowl 42 is supported on the support plate 41. The support plate 41 is connected to a support arm 44 extending downward into the electrical structure cavity 1101b for connecting to the image collector 50 to achieve assembly and support of the image collector 50. Among them, the lower part of the reflective bowl 42 can also be located in the electrical structure cavity 1101b to ensure that the image collector 50 has sufficient focal length. The support plate 41 divides the inner cavity 1101 into an optical detection cavity 1101a and an electrical structure cavity 1101b. The box body 11 includes a support frame and a box shell (not shown in the figure) installed on the outside of the installation frame. The box shell can be made of sheet metal splicing, and a sealing strip is pressed at the splicing. The support frame is used to support and connect the aforementioned support platform 12 and the support plate 41 of the optical assembly 40, and the partition 114 can also be installed on the support frame. The support frame includes multiple horizontal beams and multiple vertical beams, which are spliced into a quadrangular prism shape.

[0046] The wafer detection structure further includes a moving roller (not shown in the figure) connected to the bottom of the box body 11 to facilitate the transportation of the wafer detection structure.

[0047] Another embodiment of the present application provides a wafer inspection device including the above-mentioned wafer inspection structure. The wafer inspection device can be used to inspect the appearance of the back side of a wafer, while ensuring wafer inspection accuracy, improving the static elimination effect, and improving the stability of the wafer during the static elimination process.

[0048] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A wafer detection structure, characterized in that: The wafer detection structure includes: A test box (10) comprises a box body (11) having a cavity (110) and a carrying platform (12) arranged on the cavity (110); an air passage is provided between the box body (11) and the carrying platform (12) and / or on the carrying platform (12); and the box body (11) is configured with a box air outlet (112) connected to the air passage and located below the carrying platform (12); An ion wind rod (20) is mounted on the box body (11) and is arranged corresponding to the supporting platform (12); An air induction member (30) is installed on the box body (11) and is located below the support platform (12). The air induction member (30) is used to guide the ion wind sent out by the ion wind rod (20) to flow out from the box body air outlet (112) along the air passage.

2. The wafer detection structure according to claim 1, characterized in that: The ion wind rod (20) and the air inducing member (30) are staggered in the horizontal direction.

3. The wafer detection structure according to claim 1, characterized in that: The air passage is at least arranged on a side close to the air inducing member (30) in the horizontal direction.

4. The wafer detection structure according to claim 2, characterized in that: The ion wind rod (20) is arranged obliquely above the supporting platform (12), and the ion wind port (201) of the ion wind rod (20) faces the supporting surface of the supporting platform (12).

5. The wafer detection structure according to claim 1, characterized in that: The box body (11) is provided with a box air inlet (113) near the ion wind rod (20) and connected to the cavity (110).

6. The wafer detection structure according to claim 1, characterized in that: The box body (11) at least includes a partition (114) provided in the cavity (110), wherein the partition (114) divides the cavity (110) into an inner cavity (1101) and an outer cavity (1102) communicating with the external environment; The supporting platform (12) is arranged in the inner cavity (1101), the partition (114) is constructed with an air outlet (1140) connecting the inner cavity (1101) and the outer cavity (1102), and the air inducing member (30) is arranged corresponding to the air outlet (1140).

7. The wafer detection structure according to claim 6, characterized in that: The air outlet (1140) and the ion wind rod (20) are staggered in the horizontal direction, the air induction member (30) is arranged in the outer cavity (1102), and the air inlet of the air induction member (30) is arranged toward the air outlet (1140).

8. The wafer detection structure according to claim 6, characterized in that: The box body (11) further includes a bottom plate (115) disposed below the partition (114), wherein the bottom plate (115) and the partition (114) jointly define the outer cavity (1102), and the box air outlet (112) is disposed on the bottom plate (115).

9. The wafer detection structure according to claim 6, characterized in that: The inner cavity (1101) comprises an optical detection cavity (1101a) and an electrical structure cavity (1101b) which are connected to each other in an upper and lower manner; The supporting platform (12), the ion wind rod (20) and the optical component (40) are installed in the optical detection cavity (1101a), and the electrical structure is installed in the electrical structure cavity (1101b).

10. The wafer detection structure according to claim 9, characterized in that: The optical component (40) in the optical detection cavity (1101a) comprises a light source (43) and a reflective bowl (42), wherein the light source (43) is used to emit illumination light collected by the reflective bowl (42) toward the wafer to be tested; An image collector (50) is also installed in the electrical structure cavity (1101b), and a light receiving end of the image collector (50) is connected to the end of the reflective bowl (42) away from the supporting platform (12) for receiving imaging light from the wafer to be tested for imaging.

11. A wafer inspection device, characterized in that: The wafer detection structure comprises the wafer detection structure according to any one of claims 1 to 10.

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