Remote control interface circuit and system applied to magnetic suspension molecular pump system

Abstract

The utility model relates to the technical field of control circuits, and discloses a remote control interface circuit and system applied to a magnetic suspension molecular pump system. The circuit comprises a power supply module, an I / O control input module, a main chip and an I / O control output module, and the power supply module is connected with the I / O control input module, the main chip and the I / O control output module; the I / O control input module is connected with the main chip and is suitable for providing an input signal to the main chip after optical coupling isolation processing; the I / O control output module is connected with the main chip, the I / O control output module comprises a driving unit, a plurality of multi-channel isolation optocouplers and a conditioning unit, and the driving unit is suitable for driving the plurality of multi-channel isolation optocouplers under the control of the main chip, so that an output level signal of the conditioning unit is kept consistent with an output level signal of the main chip. In this way, isolated input and output of signals are achieved through optocoupler isolation, and signal output can be achieved through the conditioning unit without external power supply.

Description

Technical Field

[0001] The present application relates to the field of control circuit technology, and in particular to a remote control interface circuit and system for a magnetic levitation molecular pump system. Background Art

[0002] Magnetic levitation molecular pumps utilize magnetic levitation technology to achieve efficient vacuum extraction. Magnetic levitation molecular pump systems offer a variety of control methods, including remote control, where they are controlled by a control circuit in an external host device. However, when using control circuits in related technologies to output control signals, external power is required to achieve this output. Utility Model Content

[0003] The present application provides a remote control interface circuit and system for a magnetic levitation molecular pump system, which achieves the technical effect of isolated output of a main chip, that is, the high and low states of the output level of the main chip are consistent with the high and low states of the output level of the conditioning unit. To achieve the above purpose, the main technical solutions adopted in this application include:

[0004] In a first aspect, an embodiment of the present application provides a remote control interface circuit for a magnetic levitation molecular pump system, comprising: a power supply module, an I / O control input module, a main chip, and an I / O control output module, wherein:

[0005] The power supply module is respectively connected to the I / O control input module, the main chip and the I / O control output module to supply power to the I / O control input module, the main chip and the I / O control output module;

[0006] The I / O control input module is connected to the main chip and is suitable for performing optical coupling isolation processing on the input signal and then providing it to the main chip;

[0007] The I / O control output module is connected to the main chip, and the I / O control output module includes a driving unit, multiple multi-channel isolation optocouplers and a conditioning unit. The driving unit is suitable for driving the multiple multi-channel isolation optocouplers under the control of the main chip so that the output level signal of the conditioning unit is consistent with the output level signal of the main chip.

[0008] The remote control interface circuit of the embodiment of the present application realizes isolated signal input by performing optical coupling isolation processing on the input signal through the I / O control input module and then providing it to the main chip; the driving unit in the I / O control output module drives multiple multi-channel isolation optical couplers under the control of the main chip, so that the output level signal of the conditioning unit is consistent with the output level signal of the main chip, thereby realizing isolated signal output and being able to realize signal output without external power supply.

[0009] The control pin of the main chip controls the drive unit to drive the isolated optocoupler. When the control pin of the main chip outputs a high level, the isolated optocoupler turns on, thereby controlling the conditioning unit to turn on the output voltage. The high and low states of the output levels of the main chip are consistent with the high and low states of the output levels of the conditioning unit, but the output level range of the conditioning unit is larger than the output level range of the main chip. The output low level of the conditioning unit and the output low level of the main chip are both 1 volt, and the output high level of the conditioning unit is larger than the output high level of the main chip. This achieves I / O isolated output control with low power consumption and fast response, effectively reducing the risk of pin burnout caused by direct connection of external high-voltage signals to the main chip pins.

[0010] Optionally, the power supply module includes:

[0011] An input slow start unit, configured to perform a slow start based on the input power of the power interface to provide a first power supply;

[0012] a first isolation conversion unit, wherein an input end of the first isolation conversion unit is connected to an output end of the input slow start unit, and the first isolation conversion unit is configured to perform isolation conversion on the first power supply to supply power to the main chip;

[0013] A second isolation conversion unit, wherein the input end of the second isolation conversion unit is connected to the output end of the input soft start unit, and the second isolation conversion unit is configured to perform isolation conversion on the first power supply to supply power to the I / O control input module and the I / O control output module.

[0014] The main chip is powered by the first isolation conversion unit, and the I / O control input module and the I / O control output module are powered by the second isolation conversion unit to isolate pump interference.

[0015] Optionally, the input slow start unit includes:

[0016] a first diode, wherein a cathode of the first diode is adapted to be connected to a first pin of the power interface, and an anode of the first diode is adapted to be connected to a second pin of the power interface and then grounded;

[0017] a first MOS transistor, wherein a source of the first MOS transistor is connected to a cathode of the first diode, and a drain of the first MOS transistor serves as an output end of the input slow-start unit;

[0018] a first resistor connected between the source and the drain of the first MOS transistor;

[0019] a second resistor, one end of the second resistor being connected to the source of the first MOS transistor, and the other end of the second resistor being connected to the gate of the first MOS transistor;

[0020] a first capacitor, the first capacitor being connected in parallel with the second resistor;

[0021] A third resistor, one end of the third resistor is connected to the gate of the first MOS transistor, and the other end of the third resistor is grounded.

[0022] The first diode is used to prevent the input power from being reversed, thereby protecting the subsequent circuits. The first MOS tube and its peripheral circuits are used to achieve a slow start-up of the input power, thereby optimizing the problem of excessive current at the moment of power-on and protecting the subsequent circuits.

[0023] Optionally, the remote control interface circuit for the magnetic levitation molecular pump system further includes an isolated analog output module connected to the main chip, configured to isolate and convert the first output control signal of the main chip to output an analog control signal. This allows the remote control interface circuit to output analog control signals, and further enables the remote control interface circuit to output multiple control signals, including digital control signals (i.e., level signals) and analog control signals, thereby increasing the applicability of the remote control interface circuit.

[0024] This circuit has a multiplexing function: according to different output requirements: output 0-20mA current control signal or 0-10V voltage control signal to switch the analog chip and peripheral circuits.

[0025] Optionally, the isolated analog output module includes:

[0026] a fourth resistor, one end of the fourth resistor being adapted to receive the first output control signal;

[0027] a first optocoupler, wherein an anode of the first optocoupler is connected to the other end of the fourth resistor, and a cathode of the first optocoupler is grounded;

[0028] a first transistor, wherein the emitter of the first transistor is connected to the collector of the first optocoupler, and the collector of the first transistor is suitable for being connected to a first reference power supply;

[0029] a fifth resistor, one end of the fifth resistor being connected to the emitter of the first optocoupler, and the other end of the fifth resistor being connected to a reference ground;

[0030] a first conversion chip, wherein a PWM pin of the first conversion chip is connected to the emitter of the first optocoupler, and a control pin of the first conversion chip is connected to the base of the first transistor and then to a control power supply;

[0031] a second transistor, wherein the base of the second transistor is connected to the first output pin of the first conversion chip, the collector of the second transistor is connected to the first reference power supply, and the emitter of the second transistor serves as the positive output terminal of the isolated analog output module;

[0032] a sixth resistor, one end of the sixth resistor being connected to the second output pin of the first conversion chip, and the other end of the sixth resistor serving as a negative output end of the isolated analog output module;

[0033] A first voltage-stabilizing diode, wherein an anode of the first voltage-stabilizing diode is connected to a reference ground, and a cathode of the first voltage-stabilizing diode is connected to the other end of the sixth resistor.

[0034] In this way, a current-type analog control signal can be output.

[0035] Optionally, the isolated analog output module includes:

[0036] a seventh resistor, one end of the seventh resistor being adapted to receive the first output control signal;

[0037] a second optical coupler, wherein an anode of the second optical coupler is connected to the other end of the seventh resistor, and a cathode of the second optical coupler is grounded;

[0038] a third triode, wherein the emitter of the third triode is connected to the collector of the second optocoupler, and the collector of the third triode is suitable for being connected to a first reference power supply;

[0039] an eighth resistor, one end of the eighth resistor being connected to the emitter of the second optocoupler, and the other end of the eighth resistor being connected to a reference ground;

[0040] a second conversion chip, wherein a PWM pin of the second conversion chip is connected to the emitter of the second optocoupler, a control pin of the second conversion chip is connected to the base of the third transistor and then connected to a control power supply, a first output pin of the second conversion chip is connected to the control power supply, and a second output pin of the second conversion chip serves as a negative output terminal of the isolated analog output module;

[0041] a second voltage-stabilizing diode, wherein an anode of the second voltage-stabilizing diode is connected to a reference ground, and a cathode of the second voltage-stabilizing diode is connected to a second output pin of the second conversion chip;

[0042] A third voltage-stabilizing tube, wherein the cathode of the third voltage-stabilizing tube is connected to the first reference power supply, and the anode of the third voltage-stabilizing tube is connected to the second output pin of the second conversion chip.

[0043] In this way, a voltage-type analog control signal can be output. Optionally, the I / O control output module further includes: an isolated optical coupler output control chip, the isolated optical coupler output control chip being connected to the main chip;

[0044] The driving unit includes a plurality of driving sub-circuits, each of which includes:

[0045] A second MOS transistor, wherein the drain of the second MOS transistor is suitable for connecting to the input pin of the corresponding multi-channel isolation optocoupler, the source of the second MOS transistor is grounded, and the gate of the second MOS transistor is connected to the corresponding output pin of the isolation optocoupler output control chip through a ninth resistor and is grounded through a tenth resistor.

[0046] In this way, the use of the main chip pins can be reduced by isolating the optocoupler output control chip.

[0047] Optionally, the conditioning unit includes a plurality of conditioning sub-circuits, each of the conditioning sub-circuits including:

[0048] an eleventh resistor, one end of the eleventh resistor being adapted to be connected to a second reference power supply;

[0049] a third MOS transistor, wherein the source of the third MOS transistor is connected to the other end of the eleventh resistor, and the drain of the third MOS transistor serves as the output end of the conditioning sub-circuit;

[0050] a twelfth resistor, one end of the twelfth resistor being connected to one end of the eleventh resistor, and the other end of the twelfth resistor being adapted to be connected to a positive output pin of a corresponding multi-channel isolation optocoupler;

[0051] a thirteenth resistor, one end of the thirteenth resistor being adapted to be connected to the positive output pin of the corresponding multi-channel isolation optocoupler, and the other end of the thirteenth resistor being connected to the gate of the third MOS transistor;

[0052] a second capacitor connected between the gate and source of the third MOS transistor;

[0053] A fourteenth resistor, one end of the fourteenth resistor is suitable for being connected to the negative output pin of the corresponding multi-channel isolation optocoupler, and the other end of the fourteenth resistor is connected to the reference ground.

[0054] In this way, the output of the level signal is achieved, and the current is limited by the eleventh resistor.

[0055] Optionally, the remote control interface circuit applied to the magnetic levitation molecular pump system further includes: a debugging interface module, the debugging interface module is connected to the main chip, and the debugging interface module is suitable for isolating debugging information sent and received by the main chip.

[0056] In a second aspect, an embodiment of the present application provides a magnetic levitation molecular pump system, comprising any one of the above-mentioned remote control interface circuits applied to the magnetic levitation molecular pump system. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0058] Figure 1 Schematic diagram of a remote control interface circuit applied to a magnetic levitation molecular pump system in an embodiment of the present application;

[0059] Figure 2 Schematic diagram of a power supply module in an embodiment of the present application;

[0060] Figure 3 A circuit diagram of a soft start unit input in an embodiment of the present application;

[0061] Figure 4 This is a circuit diagram of a first isolation conversion unit in an embodiment of the present application;

[0062] Figure 5 This is a circuit diagram of another first isolation conversion unit in an embodiment of the present application;

[0063] Figure 6 This is a circuit diagram of a second isolation conversion unit in an embodiment of the present application;

[0064] Figure 7 This is a circuit diagram of another first isolation conversion unit in an embodiment of the present application;

[0065] Figure 8 This is a circuit diagram of another first isolation conversion unit in an embodiment of the present application;

[0066] Figure 9 This is a circuit diagram of the I / O control input module in an embodiment of the present application;

[0067] Figure 10 Schematic diagram of another remote control interface circuit applied to a magnetic levitation molecular pump system in an embodiment of the present application;

[0068] Figure 11 is a circuit diagram of a driving sub-circuit in an embodiment of the present application;

[0069] Figure 12 This is a circuit diagram of the isolated optocoupler output control chip in an embodiment of the present application;

[0070] Figure 13 This is a circuit diagram of a multi-channel isolated optocoupler in an embodiment of the present application;

[0071] Figure 14 1 is a circuit diagram of a conditioning sub-circuit in an embodiment of the present application;

[0072] Figure 15 This is a circuit diagram of an I / O control output module in an embodiment of the present application;

[0073] Figure 16 Schematic diagram of another remote control interface circuit applied to a magnetic levitation molecular pump system in an embodiment of the present application;

[0074] Figure 17 This is a circuit diagram of an isolated analog output module in an embodiment of the present application;

[0075] Figure 18 This is a circuit diagram of another isolated analog output module in an embodiment of the present application;

[0076] Figure 19 Schematic diagram of another remote control interface circuit applied to a magnetic levitation molecular pump system in an embodiment of the present application;

[0077] Figure 20 This is a circuit diagram of the debugging interface module in an embodiment of the present application. DETAILED DESCRIPTION

[0078] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0079] Magnetic levitation molecular pumps utilize magnetic levitation technology to achieve efficient vacuum extraction. Magnetic levitation molecular pump systems offer a variety of control methods, including remote control, where they are controlled by a control circuit in an external host device. However, when using control circuits in related technologies to output control signals, external power is required to achieve this output.

[0080] Figure 1 This is a schematic diagram of a remote control interface circuit for a magnetic levitation molecular pump system according to an embodiment of the present application, with reference to Figure 1 The remote control interface circuit 100 applied to the magnetic levitation molecular pump system includes: a power supply module 110, an I / O control input module 120, a main chip 130 and an I / O control output module 140.

[0081] The power supply module is connected to the I / O control input module, the main chip and the I / O control output module respectively to supply power to the I / O control input module, the main chip and the I / O control output module.

[0082] The I / O control input module 120 is connected to the main chip 130 and is adapted to provide input signals to the main chip 130 after optically isolating them. The I / O control output module 140 is also connected to the main chip 130 and includes a driver unit 141, multiple multi-channel isolation optocouplers 142, and a conditioning unit 143. The driver unit 141 is adapted to drive the multiple multi-channel isolation optocouplers 142 under the control of the main chip 130 so that the output level signal of the conditioning unit 143 is consistent with the output level signal of the main chip 130.

[0083] It should be noted that the output level signal of the conditioning unit 143 is consistent with the output level signal of the main chip 130, which means that both are at the same high level or low level. For example, when the voltage range of the output level signal of the main chip 130 is 0~3.3V, the voltage range of the output level signal of the conditioning unit 143 is 0~24V. The voltage ranges of the two are inconsistent, but the level signals of the two are consistent. For example, when the voltage output by the main chip 130 is 3.3V, the voltage output by the conditioning unit 143 is 24V, and both are high-level signals; when the voltage output by the main chip 130 is 0V, the voltage output by the conditioning unit 143 is 0V, and both are low-level signals. In this way, although the voltage ranges of the two are inconsistent, the level signals of the two are consistent, ensuring the correct transmission of the signal.

[0084] Specifically, the main chip 130 can obtain signals sent by the magnetic levitation molecular pump system through the I / O control input module 120. For example, the magnetic levitation molecular pump system sends the corresponding signal to the I / O control input module 120, which then performs optical coupling isolation and transmits it to the main chip 130. In this way, the I / O control input module 120 achieves isolated signal input, reducing interference from the magnetic levitation molecular pump system on the input signal.

[0085] The main chip 130 can send control signals to the magnetic levitation molecular pump system through the I / O control output module 140. For example, the main chip 130 outputs a corresponding level signal (i.e., a digital signal) to the I / O control output module 140. Under the action of the level signal, the driving unit 141 in the I / O control output module 140 drives the multi-channel isolation optocoupler 142 to conduct or disconnect, thereby causing the conditioning unit 143 to output the corresponding level signal to the magnetic levitation molecular pump system. In this way, the isolated output of the signal is achieved through the multi-channel isolation optocoupler 142, and the output of the signal is achieved through the conditioning unit 143.

[0086] The power supply module 110 provides corresponding working power to the I / O control input module 120 , the main chip 130 and the I / O control output module 140 to ensure the normal operation of each module.

[0087] In the above embodiment, isolated input and output of signals are achieved through optical coupling isolation, and signal output can be achieved without external power supply through the conditioning unit.

[0088] As an embodiment of this application, refer to Figure 2 The power supply module 110 includes: an input soft start unit 111 , a first isolation conversion unit 112 and a second isolation conversion unit 113 .

[0089] The input slow-start unit 111 is configured to perform a slow start based on the input power of the power interface to provide a first power supply. The input end of the first isolation conversion unit 112 is connected to the output end of the input slow-start unit 111. The first isolation conversion unit 112 is configured to perform isolation conversion on the first power supply to supply power to the main chip 130. The input end of the second isolation conversion unit 113 is connected to the output end of the input slow-start unit 111. The second isolation conversion unit 113 is configured to perform isolation conversion on the first power supply to supply power to the I / O control input module 120 and the I / O control output module 130.

[0090] That is, a first power supply can be provided by the input slow-start unit 111, and then the first isolation conversion unit 112 performs isolation conversion on the first power supply to obtain a corresponding power supply voltage, such as 3.3V, to power the main chip 130. The second isolation conversion unit 113 also performs isolation conversion on the first power supply to obtain a corresponding power supply voltage, such as 24V, to power the I / O control input module 120 and the I / O control output module 130. In this example, the input slow-start unit 111 has a slow-start function, thereby avoiding excessive current at the moment of power-on, thereby effectively protecting subsequent circuits.

[0091] As an embodiment of this application, refer to Figure 3 The input slow start unit 111 includes: a first diode D1, a first MOS transistor M1, a first resistor R1, a second resistor R2, a first capacitor C1 and a third resistor R3.

[0092] The cathode of the first diode D1 is suitable for being connected to the first pin of the power interface J1, and the anode of the first diode D1 is suitable for being connected to the second pin of the power interface J1 and then grounded to GND+48V;

[0093] A first MOS transistor M1, wherein the source of the first MOS transistor M1 is connected to the cathode of the first diode D1, and the drain of the first MOS transistor M1 serves as the output end of the input slow start unit 111;

[0094] The first resistor R1 is connected between the source and the drain of the first MOS transistor M1;

[0095] One end of the second resistor R2 is connected to the source of the first MOS transistor M1, and the other end of the second resistor R2 is connected to the gate of the first MOS transistor M1; the first capacitor C1 is connected in parallel with the second resistor R2;

[0096] One end of the third resistor R3 is connected to the gate of the first MOS transistor M1 , and the other end of the third resistor R3 is grounded to GND_+48V.

[0097] Specifically, when the input power supply (the input power supply in this example is a 48V DC power supply) is supplied through the power interface J1, if the input power supply is reversed, that is, the first pin of the power interface J1 is connected to the negative pole of the input power supply and the second pin is connected to the positive pole of the input power supply, then the first diode D1 will be turned on. At this time, the fuse F1 connected between the first pin of the power interface J1 and the cathode of the first diode D1 will burn due to overcurrent, thereby disconnecting the first pin of the power interface J1 from the back-end circuit, thereby achieving protection for subsequent circuits.

[0098] If the input power supply is not reversed, the first diode D1 will not conduct. At this time, the input power charges the first capacitor C1. Since the voltage of the first capacitor C1 is low when charging, the first MOS transistor M1 is in the off state. The input power supplies power to the back-end circuit through the first resistor R1. The current limiting effect of the first resistor R1 can avoid the high current at the moment of power-on. After a period of time, if the first capacitor C1 is fully charged, the first MOS transistor M1 will conduct, the first resistor R1 will be short-circuited, and the input power will directly supply power to the back-end circuit. This can reduce the power loss caused by the first resistor R1 being connected in series with the circuit during normal operation, thereby achieving energy saving.

[0099] It should be noted that Figure 3 TP2 and TP3 are connection terminals for connecting to the back-end circuit.

[0100] In the above embodiment, the first diode is used to prevent the input power from being reversely connected, thereby protecting the subsequent circuits. The first MOS tube and its peripheral circuits are used to achieve a slow start-up of the input power, thereby optimizing the problem of excessive current at the moment of power-on and protecting the subsequent circuits.

[0101] As an embodiment of this application, refer to Figure 4The first isolation conversion unit 112 includes a first voltage conversion chip U5 and its corresponding peripheral circuits. The first voltage conversion chip U5 converts a first power supply, such as +48V, to 5V to power the main chip 130 (which requires a 5V power supply). The model of the first voltage conversion chip U5 can be URB4805YMD.

[0102] It should be noted that, referring to Figure 5 The first isolation conversion unit 112 may further include a second voltage conversion chip U6 and its corresponding peripheral circuits. The second voltage conversion chip U6 converts the 5V voltage into a 3.3V voltage to power a corresponding device. This device may be the main chip 130 (which requires a 3.3V power supply) or another device, such as the I / O control input module 120 and the I / O control output module 130, as described in the following examples. The second voltage conversion chip U6 may be AMS1117.

[0103] As an embodiment of this application, refer to Figure 6 The second isolation conversion unit 113 includes a third voltage conversion chip U7 and its corresponding peripheral circuits. The third voltage conversion chip U7 converts the first power supply, such as +48V, into 24V to supply power to the I / O control input module 120 and the I / O control output module 130. The model of the third voltage conversion chip U7 can be URB4824YMD.

[0104] It should be noted that, referring to Figure 7 The second isolation conversion unit 113 may further include a fourth voltage conversion chip U8 and its corresponding peripheral circuits. The fourth voltage conversion chip U8 converts the 24V voltage into a 12V voltage to power corresponding components, such as components in the I / O control output module 130, as described in the following examples. The fourth voltage conversion chip U8 may be a CJ78M12.

[0105] Further, refer to Figure 8 The second isolation conversion unit 113 may further include a fifth voltage conversion chip U9 and its corresponding peripheral circuits. The fifth voltage conversion chip U9 converts the 12V voltage into a 3.3V voltage to power corresponding devices, such as those in the debug interface module, as described in the following examples. The fifth voltage conversion chip U9 may be AMS1117.

[0106] As an embodiment of this application, refer to Figure 9The I / O control input module 120 may include a dual-channel isolation optocoupler 121 and its corresponding peripheral circuits, and the isolated input of the input signal can be achieved through the dual-channel isolation optocoupler 121. The model of the dual-channel isolation optocoupler 121 may be MOCD213M.

[0107] As an embodiment of this application, refer to Figure 10 , the I / O control output module 140 further includes: an isolated optocoupler output control chip 144, the isolated optocoupler output control chip 144 is connected to the main chip 130; the driving unit 141 includes a plurality of driving sub-circuits 1411, Figure 11 Each driving sub-circuit 1411 includes: a second MOS transistor M2, the drain of the second MOS transistor M2 is suitable for connecting to the input pin of the corresponding multi-channel isolation optocoupler 142, such as IS_KOUT1, the source of the second MOS transistor M2 is grounded GND, and the gate of the second MOS transistor M2 is connected to the corresponding output pin of the isolation optocoupler output control chip 144, such as IS_K1, through a ninth resistor R9, and is grounded GND through a tenth resistor R10.

[0108] For example, refer to Figure 12 The model of the isolated optocoupler output control chip 144 can be 74HC595D, which communicates with the main chip 130 through the serial digital interface SDI to receive the control signal sent by the main chip 130, and then outputs the corresponding control signal to the corresponding driver unit 1411 according to the control signal to drive the corresponding driver unit 1411 to be turned on or off. The driver unit 1411 is connected to the corresponding channel of the multi-channel isolated optocoupler 142, thereby controlling the corresponding channel to be turned on or off. Figure 13 The model of the multi-channel isolation optocoupler 142 may be IS2801-4. The multi-channel isolation optocoupler 142 has four channels to achieve signal isolation output of the four channels.

[0109] In this example, an isolated optocoupler output control chip 144 is set between the main chip 130 and multiple driving sub-units 1411, so that the main chip 130 can control multiple driving sub-units 1411 through one interface, effectively reducing the pin usage of the main chip 130; at the same time, the isolated output of the signal is realized through the isolated optocoupler output control chip 144.

[0110] As an embodiment of this application, refer to Figure 10 , the conditioning unit 143 includes a plurality of conditioning sub-circuits 1431, referring to Figure 14 , each conditioning sub-circuit 1431 includes:

[0111] an eleventh resistor R11 , a third MOS transistor Q3 , a twelfth resistor R12 , a thirteenth resistor R13 , a second capacitor C2 and a fourteenth resistor R14 .

[0112] One end of the eleventh resistor R11 is suitable for being connected to the second reference power supply +24V.

[0113] The source of the third MOS transistor M3 is connected to the other end of the eleventh resistor R11 , and the drain of the third MOS transistor Q3-MOS serves as the output end of the conditioning sub-circuit 1431 , such as IS_OUT1 ;

[0114] One end of the twelfth resistor R12 is connected to one end of the eleventh resistor R11 , and the other end of the twelfth resistor R12 is suitable for being connected to the positive output pin of the corresponding multi-channel isolation optocoupler 142 , such as IS_OUT1+;

[0115] One end of the thirteenth resistor R13 is suitable for being connected to the positive output pin of the corresponding multi-channel isolation optocoupler 142, such as IS_OUT1+, and the other end of the thirteenth resistor R13 is connected to the gate of the third MOS transistor M3;

[0116] The second capacitor C2 is connected between the gate and the source of the third MOS transistor M3.

[0117] One end of the fourteenth resistor R14 is suitable for being connected to the negative output pin, such as IS_OUT1−, of the corresponding multi-channel isolation optocoupler 142 , and the other end of the fourteenth resistor R14 is connected to the reference ground GND_SN.

[0118] Specifically, when the corresponding channel of the multi-channel isolation optocoupler 142 is not conducting, such as when the negative output pin such as IS_OUT1- and the positive output pin such as IS_OUT1+ of the multi-channel isolation optocoupler 142 are not conducting, the second reference power supply +24V provides a driving voltage to the third MOS transistor M3 through the twelfth resistor R12 and the thirteenth resistor R13. Since the low level of the third MOS transistor M3 is valid, the third MOS transistor is disconnected. At this time, the output end of the conditioning sub-circuit 1431, such as IS_OUT1, outputs a low-level signal; when the corresponding channel of the multi-channel isolation optocoupler 142 is conducting, such as when the negative output pin such as IS_OUT1- and the positive output pin such as IS_OUT1+ of the multi-channel isolation optocoupler 142 are conducting, the gate of the third MOS transistor M3 is grounded, and the third MOS transistor M3 is conducting. At this time, the output end of the conditioning sub-circuit 1431, such as IS_OUT1, outputs a high-level signal of +24V, and current is limited by the eleventh resistor R11.

[0119] For example, Figure 15 The main chip 130 is connected to the I / O control output module 140 through a serial digital interface. Figure 12The isolated optocoupler output control chip 144 communicates with the serial digital interface SDI to send the corresponding control signal. The isolated optocoupler output control chip 144 outputs the corresponding control signal to the Figure 12 The corresponding driver subcircuit 1411 controls whether the driver subcircuit 1411 is turned on or off, which in turn drives the corresponding channel of the multi-channel isolation optocoupler 142 to turn on or off, thereby achieving isolated signal transmission. The conditioning subunit 1431 then turns on or off based on the level signal of the corresponding channel to output the corresponding control signal. This achieves isolated output of the level signal without the need for external power supply and also provides current limiting.

[0120] As an embodiment of this application, refer to Figure 16 The remote control interface circuit 100 further includes: an isolated analog output module 150, which is connected to the main chip 130. The isolated analog output module 150 is configured to perform isolation conversion on the first output control signal of the main chip 130 to output an analog control signal.

[0121] In this embodiment, the remote control interface circuit can output analog control signals by isolating the analog output module, and thus the remote control interface circuit can output multiple control signals, including digital control signals (i.e., the aforementioned level signals) and analog control signals, thereby improving the applicability of the remote control interface circuit.

[0122] As an embodiment of this application, refer to Figure 17The isolated analog output module 150 includes: a fourth resistor R4, a first optocoupler U1, a first transistor Q1, a fifth resistor R5, a first conversion chip U2, a second transistor Q2, a sixth resistor R6 and a first voltage regulator DZ1. Among them, one end of the fourth resistor R4 is suitable for receiving the first output control signal SN_PWM1; the anode of the first optocoupler U1 is connected to the other end of the fourth resistor R4, and the cathode of the first optocoupler U1 is grounded GND; the emitter of the first transistor Q1 is connected to the collector of the first optocoupler U1, and the collector of the first transistor Q1 is suitable for connecting to the first reference power supply +12V_SN; one end of the fifth resistor R5 is connected to the emitter of the first optocoupler U1, and the other end of the fifth resistor R5 is connected to the reference ground GND_SN; the PWM pin of the first conversion chip U1 is connected to the emitter of the first optocoupler U1, and the control pin of the first conversion chip U1 is connected to the base of the first transistor Q1 Then it is connected to the control power supply V5V; the base of the second transistor Q2 is connected to the first output pin of the first conversion chip U2, the collector of the second transistor Q2 is connected to the first reference power supply +12V_SN, and the emitter of the second transistor Q2 serves as the positive output terminal DAC_OUT+ of the isolated analog output module 150; one end of the sixth resistor R6 is connected to the second output pin of the first conversion chip U2, and the other end of the sixth resistor R6 serves as the negative output terminal DAC_OUT- of the isolated analog output module 150; the anode of the first voltage regulator tube DZ1 is connected to the reference ground GND_SN, and the cathode of the first voltage regulator tube DZ1 is connected to the other end of the sixth resistor R6.

[0123] It should be noted that the circuit can output 4-20mA analog control signal.

[0124] Exemplarily, the first conversion chip U2 can be a GP8102S-TC50-HW chip. When working, the main chip 130 outputs the first output control signal SN_PWM1 to the isolated analog output module 150, wherein, when the first output control signal SN_PWM1 is a high-level signal, the first optocoupler U1 is turned on, and since the first transistor Q1 is in the on state, the PWM pin of the first conversion chip U1 is a high-level signal; when the first output control signal SN_PWM1 is a low-level signal, the first optocoupler U1 is disconnected, so the PWM pin of the first conversion chip U1 is a low-level signal, thereby inputting a PWM signal with a certain duty cycle into the GP8102S-TC50-HW chip, and the GP8102S-TC50-HW chip linearly converts the PWM signal into a 4-20mA analog control signal, and finally outputs it through the positive and negative output terminals DAC_OUT+ and DAC_OUT- of the isolated analog output module 150.

[0125] In this embodiment, by selecting a suitable conversion chip and its corresponding peripheral circuit, a 4-20 mA analog control signal can be output.

[0126] As an embodiment of this application, refer to Figure 18 The isolated analog output module 150 includes: a seventh resistor R7, a second optical coupler U3, a third transistor Q3, an eighth resistor R8, a second conversion chip U4, a second voltage regulator DZ2, and a third voltage regulator DZ3. Among them, one end of the seventh resistor R7 is suitable for receiving the first output control signal SN_PWM1; the anode of the second optical coupler U3 is connected to the other end of the seventh resistor R7, and the cathode of the second optical coupler U3 is grounded GND; the emitter of the third transistor Q3 is connected to the collector of the second optical coupler U3, and the collector of the third transistor Q3 is suitable for connecting to the first reference power supply +12V_SN; one end of the eighth resistor R8 is connected to the emitter of the second optical coupler U3, and the other end of the eighth resistor R8 is connected to the reference ground GND_SN; the PWM pin of the second conversion chip U4 is connected to the emitter of the second optical coupler U3, and the control pin of the second conversion chip U4 is connected to the first reference power supply +12V_SN. The pin is connected to the base of the third transistor Q3 and then to the control power supply 5V5. The first output pin of the second conversion chip U4 is connected to the control power supply 5V5. The second output pin of the second conversion chip U4 serves as the negative output terminal DAC_OUT- of the isolated analog output module 150; the anode of the second voltage regulator tube DZ2 is connected to the reference ground GND_SN, and the cathode of the second voltage regulator tube DZ2 is connected to the second output pin of the second conversion chip U4; the cathode of the third voltage regulator tube DZ3 is connected to the first reference power supply +12V_SN, and the anode of the third voltage regulator tube DZ3 is connected to the second output pin of the second conversion chip U4.

[0127] It should be noted that the circuit can output an analog control signal of 0 to 10V.

[0128] Exemplarily, the second conversion chip U4 can be a GP8101S-TC50-EH chip. When working, the main chip 130 outputs the first output control signal SN_PWM1 to the isolated analog output module 150, wherein, when the first output control signal SN_PWM1 is a high-level signal, the second optocoupler U3 is turned on, and since the third transistor Q3 is in the on state, the PWM pin of the second conversion chip U4 is a high-level signal; when the first output control signal SN_PWM1 is a low-level signal, the second optocoupler U3 is disconnected, so the PWM pin of the second conversion chip U4 is a low-level signal, thereby inputting a PWM signal with a certain duty cycle into the GP8101S-TC50-EH chip, and the GP8101S-TC50-EH chip linearly converts the PWM signal into an analog control signal of 0~10V, and finally outputs it through the negative output terminal DAC_OUT- of the isolated analog output module 150.

[0129] In this embodiment, by selecting a suitable conversion chip and its corresponding peripheral circuit, an analog control signal of 0 to 10V can be output.

[0130] As an embodiment of this application, refer to Figure 19 The remote control interface circuit also includes a debug interface module 160, which is connected to the main chip 130 and is adapted to isolate debug information sent and received by the main chip 130. This allows the debug interface module to not only debug the main chip 130 and send and receive programs, but also effectively prevent external interference with the main chip 130 through isolation.

[0131] As an embodiment of this application, refer to Figure 20 The debug interface module 160 includes a debug isolation chip 161 and a single-channel isolation optocoupler 162, wherein the debug isolation chip 161 is connected to the debug interface of the main chip 130 and the single-channel isolation optocoupler 162 respectively for sending and receiving debug information and performing program burning.

[0132] Among them, the model of the debug isolation chip 161 can be ISO6741DWR, which provides digital signal isolation and is mainly used to protect the circuit from high voltage interference, while ensuring the integrity of the signal and ensuring that the transmission of high-frequency digital signals is not interfered with. The EN2 pin on the ISO6741DWR is an enable pin used to start or disable the chip function. When EN2 is floating and not connected to any signal, the chip usually enables OUTA and OUTC by default; when EN2 is pulled up to a high level, OUTA and OUTC outputs are enabled, and pulling down is not enabled. The ISO6741DWR is used to connect to the debug interface of the main chip 130 to send and receive debug information or burn programs. The debug interface of the main chip 130 includes BOOT0, NRST_1, USART1_RX and USART1_TX.

[0133] Debug interface module 160 also includes a pin header connector J2, which is used to connect to the interface terminals required by the customer, such as a DB25 (25-pin D-type connector) or a DB15 (15-pin D-type connector). J2 can be a PHD2*12 socket, a 12-pin socket used to connect and disconnect external devices or modules in the circuit. PHD2 typically indicates a 2mm pin pitch (2.54mm standard) to ensure compatibility and reliability.

[0134] In summary, the remote control interface circuit of the embodiment of the present application realizes isolated signal input by performing optical coupling isolation processing on the input signal through the I / O control input module and then providing it to the main chip; the driving unit in the I / O control output module drives multiple multi-channel isolated optical couplers under the control of the main chip, so that the output level signal of the conditioning unit is consistent with the output level signal of the main chip, thereby realizing isolated signal output, and being able to realize signal output without external power supply.

[0135] An embodiment of the present application further provides a magnetic levitation molecular pump system, comprising the aforementioned remote control interface circuit for the magnetic levitation molecular pump system.

[0136] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

[0137] Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A remote control interface circuit for a magnetic levitation molecular pump system, characterized in that: include: Power supply module, I / O control input module, main chip and I / O control output module, among which, The power supply module is respectively connected to the I / O control input module, the main chip and the I / O control output module to supply power to the I / O control input module, the main chip and the I / O control output module; The I / O control input module is connected to the main chip and is suitable for performing optical coupling isolation processing on the input signal and then providing it to the main chip; The I / O control output module is connected to the main chip, and the I / O control output module includes a driving unit, multiple multi-channel isolation optocouplers and a conditioning unit. The driving unit is suitable for driving the multiple multi-channel isolation optocouplers under the control of the main chip so that the output level signal of the conditioning unit is consistent with the output level signal of the main chip.

2. The remote control interface circuit for a magnetic levitation molecular pump system according to claim 1, characterized in that: The power supply module includes: An input slow start unit, configured to perform a slow start based on the input power of the power interface to provide a first power supply; a first isolation conversion unit, wherein an input end of the first isolation conversion unit is connected to an output end of the input slow start unit, and the first isolation conversion unit is configured to perform isolation conversion on the first power supply to supply power to the main chip; A second isolation conversion unit, wherein the input end of the second isolation conversion unit is connected to the output end of the input soft start unit, and the second isolation conversion unit is configured to perform isolation conversion on the first power supply to supply power to the I / O control input module and the I / O control output module.

3. The remote control interface circuit for a magnetic levitation molecular pump system according to claim 2, characterized in that: The input slow start unit includes: a first diode, wherein a cathode of the first diode is adapted to be connected to a first pin of the power interface, and an anode of the first diode is adapted to be connected to a second pin of the power interface and then grounded; a first MOS transistor, wherein a source of the first MOS transistor is connected to a cathode of the first diode, and a drain of the first MOS transistor serves as an output end of the input slow-start unit; a first resistor connected between the source and the drain of the first MOS transistor; a second resistor, one end of the second resistor being connected to the source of the first MOS transistor, and the other end of the second resistor being connected to the gate of the first MOS transistor; a first capacitor, the first capacitor being connected in parallel with the second resistor; A third resistor, one end of the third resistor is connected to the gate of the first MOS transistor, and the other end of the third resistor is grounded.

4. The remote control interface circuit for a magnetic levitation molecular pump system according to any one of claims 1 to 3, characterized in that: Also includes: An isolated analog output module is connected to the main chip and is configured to perform isolation conversion on a first output control signal of the main chip to output an analog control signal.

5. The remote control interface circuit for a magnetic levitation molecular pump system according to claim 4, characterized in that: The isolated analog output module includes: a fourth resistor, one end of the fourth resistor being adapted to receive the first output control signal; a first optocoupler, wherein an anode of the first optocoupler is connected to the other end of the fourth resistor, and a cathode of the first optocoupler is grounded; a first transistor, wherein the emitter of the first transistor is connected to the collector of the first optocoupler, and the collector of the first transistor is suitable for being connected to a first reference power supply; a fifth resistor, one end of the fifth resistor being connected to the emitter of the first optocoupler, and the other end of the fifth resistor being connected to a reference ground; a first conversion chip, wherein a PWM pin of the first conversion chip is connected to the emitter of the first optocoupler, and a control pin of the first conversion chip is connected to the base of the first transistor and then to a control power supply; a second transistor, wherein the base of the second transistor is connected to the first output pin of the first conversion chip, the collector of the second transistor is connected to the first reference power supply, and the emitter of the second transistor serves as the positive output terminal of the isolated analog output module; a sixth resistor, one end of the sixth resistor being connected to the second output pin of the first conversion chip, and the other end of the sixth resistor serving as a negative output end of the isolated analog output module; A first voltage-stabilizing diode, wherein an anode of the first voltage-stabilizing diode is connected to a reference ground, and a cathode of the first voltage-stabilizing diode is connected to the other end of the sixth resistor.

6. The remote control interface circuit for a magnetic levitation molecular pump system according to claim 4, characterized in that: The isolated analog output module includes: a seventh resistor, one end of the seventh resistor being adapted to receive the first output control signal; a second optical coupler, wherein an anode of the second optical coupler is connected to the other end of the seventh resistor, and a cathode of the second optical coupler is grounded; a third triode, wherein the emitter of the third triode is connected to the collector of the second optocoupler, and the collector of the third triode is suitable for being connected to a first reference power supply; an eighth resistor, one end of the eighth resistor being connected to the emitter of the second optocoupler, and the other end of the eighth resistor being connected to a reference ground; a second conversion chip, wherein a PWM pin of the second conversion chip is connected to the emitter of the second optocoupler, a control pin of the second conversion chip is connected to the base of the third transistor and then connected to a control power supply, a first output pin of the second conversion chip is connected to the control power supply, and a second output pin of the second conversion chip serves as a negative output terminal of the isolated analog output module; a second voltage-stabilizing diode, wherein an anode of the second voltage-stabilizing diode is connected to a reference ground, and a cathode of the second voltage-stabilizing diode is connected to a second output pin of the second conversion chip; A third voltage-stabilizing tube, wherein the cathode of the third voltage-stabilizing tube is connected to the first reference power supply, and the anode of the third voltage-stabilizing tube is connected to the second output pin of the second conversion chip.

7. The remote control interface circuit for a magnetic levitation molecular pump system according to any one of claims 1 to 3, characterized in that: The I / O control output module further includes: an isolated optocoupler output control chip, wherein the isolated optocoupler output control chip is connected to the main chip; The driving unit includes a plurality of driving sub-circuits, each of which includes: A second MOS transistor, wherein the drain of the second MOS transistor is suitable for connecting to the input pin of the corresponding multi-channel isolation optocoupler, the source of the second MOS transistor is grounded, and the gate of the second MOS transistor is connected to the corresponding output pin of the isolation optocoupler output control chip through a ninth resistor and is grounded through a tenth resistor.

8. The remote control interface circuit for a magnetic levitation molecular pump system according to any one of claims 1 to 3, characterized in that: The conditioning unit includes a plurality of conditioning sub-circuits, each of which includes: an eleventh resistor, one end of the eleventh resistor being adapted to be connected to a second reference power supply; a third MOS transistor, wherein the source of the third MOS transistor is connected to the other end of the eleventh resistor, and the drain of the third MOS transistor serves as the output end of the conditioning sub-circuit; a twelfth resistor, one end of the twelfth resistor being connected to one end of the eleventh resistor, and the other end of the twelfth resistor being adapted to be connected to a positive output pin of a corresponding multi-channel isolation optocoupler; a thirteenth resistor, one end of the thirteenth resistor being adapted to be connected to the positive output pin of the corresponding multi-channel isolation optocoupler, and the other end of the thirteenth resistor being connected to the gate of the third MOS transistor; a second capacitor connected between the gate and source of the third MOS transistor; A fourteenth resistor, one end of the fourteenth resistor is suitable for being connected to the negative output pin of the corresponding multi-channel isolation optocoupler, and the other end of the fourteenth resistor is connected to the reference ground.

9. The remote control interface circuit for a magnetic levitation molecular pump system according to any one of claims 1 to 3, characterized in that: Also includes: A debugging interface module is connected to the main chip, and the debugging interface module is suitable for isolating the debugging information sent and received by the main chip.

10. A magnetic levitation molecular pump system, characterized in that: The invention comprises a remote control interface circuit applied to a magnetic levitation molecular pump system as claimed in any one of claims 1 to 9.

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