SMD magnetic element
By designing tapered wire joints and set acute angle pressing surfaces, combined with functional grooves and hot press welding technology, the problem of easy breakage between the wire and the metallized electrode is solved, and the stability and durability of the patch magnetic components in harsh environments are achieved.
Patent Information
- Application Number
- CN202422031631.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-21
AI Technical Summary
In the long-term frequent vibration, temperature and humidity impact, high reliability requirements, and aerospace application environment with severe high and low temperature impact and strong electromagnetic radiation, existing patch magnetic components are prone to fracture at the connection between the wire and the metallized electrode, resulting in unstable structural structure.
The wire joints of the designed wire coil are tapered from one end toward the boss, forming the first and second pressing surfaces with a set acute angle, and are embedded in the metallized electrode. Combined with functional grooves and hot press welding technology, we ensure a stable connection between the wire joints and the metallized electrode.
Improves the overall structural strength and stability of the patch magnetic components, ensuring long-term reliability and durability in harsh environments.
Smart Images
Figure CN223245381U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic components, and in particular to a patch magnetic component. Background Art
[0002] Chip magnetic components typically connect the ends of the wire coils to the metallized electrodes on the magnetic core to form an electrical connection. This connection method is simple in structure and easy to automate during production, making it widely used in chip magnetic components. In related technologies, the top surface of the metallized electrode is perpendicular to the side of the magnetic core / ceramic core. The wire connection of the wire coil is flattened on this top surface (the internal structure of the conductor is destroyed), and there is a risk of breakage at the connection between the wire and the metallized electrode. This is not conducive to operation in harsh automotive application environments with long-term frequent vibration, temperature and humidity shock, high reliability requirements, and aerospace application environments with severe high and low temperature shocks and strong electromagnetic radiation. This situation needs to change. Utility Model Content
[0003] In view of this, the present application provides a patch magnetic component to solve the above-mentioned technical problems.
[0004] In order to achieve the above objectives, the technical solutions adopted are:
[0005] A chip magnetic component, comprising:
[0006] a core body, the core body comprising a winding portion and a boss portion connected to the winding portion;
[0007] a metallized electrode, the metallized electrode being disposed on the boss portion;
[0008] a wire coil connected to the wire winding portion;
[0009] A wire connector is led out from the end of the wire coil, which is connected to the boss portion and embedded in the metallized electrode. The wire connector tapers from one end of the wire coil toward one end of the boss portion. The wire connector has a first pressing surface facing the boss portion and a second pressing surface facing away from the boss portion. The first pressing surface and the second pressing surface have a set acute angle.
[0010] The present application is further configured as follows: the boss portion is provided with a functional groove, the metallized electrode covers the functional groove, the wire connector is located in the functional groove, the functional groove has a set groove body width, and the set groove body width includes 1.1 times to 3 times the wire diameter.
[0011] The present application is further configured such that: an end of the wire connector away from the wire coil maintains a distance from a side of the boss portion away from the winding portion; the end of the wire connector away from the wire coil has a hot-pressed cross-sectional thickness, and the hot-pressed cross-sectional thickness is ≤0.6 times the wire diameter.
[0012] The present application is further configured as follows: the functional groove is inclined downward from one end of the boss portion toward one end of the wire coil, the first pressing surface of the wire connector is parallel to the bottom surface of the functional groove, and the second pressing surface of the wire connector and the top surface of the metallized electrode are parallel to the horizontal plane.
[0013] The present application is further configured such that: the first pressing surface of the wire connector and the bottom surface of the functional groove are parallel to the horizontal plane, and the second pressing surface of the wire connector is inclined downward from one end of the wire coil toward one end of the boss portion.
[0014] The present application is further configured as follows: the functional groove and the side of the boss portion close to the wire coil have a set fillet, the metallized electrode covers the set fillet, and the radius of the set fillet ranges from 0.03 mm to 0.6 mm.
[0015] The present application is further configured as follows: it also includes a cover plate, which is connected to the end of the boss portion facing away from the metallized electrode, wherein when the cover plate is a magnetic cover plate, the core is a ferrite core, and when the cover plate is a rubber cover plate, the core is a porcelain core.
[0016] The present application is further configured as follows: the wire joint is hot-pressed and welded in the metallized electrode by a hot-pressing welding head, the hot-pressing welding head and the top surface of the metallized electrode form a solder joint area, the width of the solder joint area ranges from 1.5 times to 5 times the wire diameter, and the width of the solder joint area is ≤2mm.
[0017] The present application is further configured as follows: a hot pressing deformation point is provided at the connection between the second pressing surface and the wire connector, and a hot pressing deformation distance is provided between the hot pressing deformation point and the side surface of the boss portion close to the wire coil, and the range of the hot pressing deformation distance includes -2 times to 3 times the wire diameter.
[0018] The present application is further configured as follows: the angle range of the set acute angle includes 1° to 8°.
[0019] To sum up, compared with the prior art, the present application discloses a patch magnetic element, including a core, a metallized electrode and a wire coil, the metallized electrode is connected to the boss portion of the core, the wire coil is connected to the winding portion of the core, the wire connector of the wire coil is connected to the boss portion and embedded in the metallized electrode, and gradually shrinks from the wire coil toward the boss portion, wherein the wire connector has a first pressing surface facing the boss portion and a second pressing surface away from the boss portion, and the first pressing surface and the second pressing surface have a set acute angle, that is, through the above setting, the risk of wire breakage at the connection between the wire connector and the metallized electrode is avoided, and the overall structural strength and stability of the patch magnetic element are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 Schematic diagram of the overall structure of the patch magnetic component of this embodiment;
[0022] Figure 2 1 is a schematic diagram of a top view of the magnetic patch component of this embodiment;
[0023] Figure 3 yes Figure 2 The first AA cross-sectional structural diagram;
[0024] Figure 4 yes Figure 3 A magnified view of the local structure;
[0025] Figure 5 yes Figure 2 The second AA cross-sectional structure diagram;
[0026] Figure 6 yes Figure 5 A magnified view of the local structure. DETAILED DESCRIPTION
[0027] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
[0028] It should be noted that, in this document, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanation in the specific embodiment or further combined with the context of the specific embodiment.
[0029] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.
[0030] In the subsequent description, the use of suffixes such as "module", "component" or "unit" to represent elements is only for the purpose of facilitating the description of the present application and has no specific meaning. Therefore, "module", "component" or "unit" can be used interchangeably.
[0031] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0032] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments does not limit the priority order of the embodiments.
[0033] Please refer to Figure 1 and Figure 2 The patch magnetic element of this embodiment includes a core 1, a metallized electrode 2 and a wire coil 3. The core 1 has a winding portion 11 and a boss portion 12 connected to the winding portion 11. The metallized electrode 2 is arranged on the boss portion 12, and the wire coil 3 is connected to the winding portion 11. A wire connector 4 is led out from the end of the wire coil 3. The wire connector 4 is connected to the boss portion 12 and embedded in the metallized electrode 2, thereby ensuring a stable electrical connection between the wire connector 4 and the metallized electrode 2.
[0034] In the specific implementation process, combined with Figure 3or Figure 5 The wire connector 4 gradually shrinks from one end of the wire coil 3 toward one end of the boss portion 12. Specifically, the wire connector 4 has a first pressing surface 41 facing the boss portion 12 and a second pressing surface 42 away from the boss portion 12. The first pressing surface 41 and the second pressing surface 42 have a set acute angle. Based on the connection method in which the wire connector 4 is embedded in the metallized electrode 2, the internal structural damage of the wire connector 4 gradually decreases from one end of the boss portion 12 toward one end of the wire coil 3 until there is no damage. This ensures that after the wire connector 4 of the wire coil 3 enters the metallized electrode 2, the structure of the bending part of the wire connector 4 or the thermal deformation part of the wire connector 4 remains strong and firm, ensuring a stable connection between the wire connector 4 and the metallized electrode 2. In the harsh vehicle application environment with long-term frequent vibration, temperature and humidity shock, high reliability requirements, and the aerospace application environment with harsh high and low temperature shock and strong electromagnetic radiation, the patch magnetic component of this embodiment has sufficient stability and durability.
[0035] The boss portion 12 of this embodiment is provided with a functional groove 5, the metallized electrode 2 covers the functional groove 5, and the wire connector 4 is located in the functional groove 5, that is, the functional groove 5 on the boss portion 12 provides a housing position for the wire connector 4, ensuring that the wire connector 4 is pressed into the metallized electrode 2 on the functional groove 5 and stably electrically connected to the metallized electrode 2, thereby enhancing the fixity and protection of the wire connector 4, and preventing the wire connector 4 from being damaged by external stress during welding or operation, thereby improving the stability and long-term reliability of the overall structure.
[0036] It should be noted that the wire diameter of the wire coil 3 can be selected according to environmental requirements. For example, when the wire diameter of the wire coil 3 is ≤0.06 mm, the functional groove 5 may not be provided in this embodiment; in the process of connecting the wire joint 4 to the boss portion 12 and the metallized electrode 2, a hot pressing welding head can be used to hot press the wire joint 4 into the metallized electrode 2.
[0037] The functional slot 5 has a set slot width E, and the set slot width E is 1.1 to 3 times the wire diameter, so as to reserve space for deformation of the wire connector 4 during the pressing process.
[0038] In one embodiment, reference Figure 3 and Figure 4The functional slot 5 is inclined downward from one end of the boss portion 12 toward one end of the wire coil 3, that is, the functional slot 5 can be designed as an oblique slot structure, wherein the first pressing surface 41 of the wire joint 4 is parallel to the bottom surface of the functional slot 5, and the second pressing surface 42 of the wire joint 4 and the top surface of the metallized electrode 2 are parallel to the horizontal plane. Thus, the first pressing surface 41 and the second pressing surface 42 of the wire joint 4 form a set acute angle a, and the damage to the internal structure of the wire joint 4 is gradually reduced from one end of the boss portion 12 toward one end of the wire coil 3 until there is no damage, thereby ensuring that the wire joint 4 of the wire coil 3 has a sufficiently strong overall structure after entering the metallized electrode 2, thereby ensuring a stable electrical connection between the wire joint 4 and the metallized electrode 2.
[0039] Among them, based on the above-mentioned technical means of using a hot pressing welding head to hot press the wire joint 4 into the metallized electrode 2, the working surface of the hot pressing welding head facing the wire joint 4 and the second pressing surface 42 and the top surface of the metallized electrode 2 are parallel to the horizontal plane, so that when the wire joint 4 is embedded in the metallized electrode 2, the first pressing surface 41 of the wire joint 4 that is compressed and deformed is ensured to be parallel to the bottom surface of the functional groove 5.
[0040] It should be noted that the functional groove 5 and the boss portion 12 have set rounded corners on the sides close to the wire coil 3, and the metallized electrode 2 covers the set rounded corners, thereby ensuring a smooth deformation transition when the wire connector 4 is connected to the metallized electrode 2, protecting the wire connector 4 from damage at this set rounded corner.
[0041] The radius of the fillet is set to range from 0.03 mm to 0.6 mm.
[0042] In one embodiment, reference Figure 5 and Figure 6 The functional groove 5 can be a flat-bottomed groove, that is, the first pressing surface 41 of the wire connector 4 and the bottom surface of the functional groove 5 are parallel to the horizontal plane, and the second pressing surface 42 of the wire connector 4 is inclined downward from the end of the wire coil 3 toward the end of the boss portion 12. Therefore, the first pressing surface 41 and the second pressing surface 42 of the wire connector 4 form a set acute angle a, so the damage to the internal structure of the wire connector 4 gradually decreases from the end of the boss portion 12 toward the end of the wire coil 3 until there is no damage, thereby ensuring that the overall structure of the wire connector 4 is strong enough after the wire connector 4 of the wire coil 3 enters the metallized electrode 2, thereby ensuring a stable electrical connection between the wire connector 4 and the metallized electrode 2.
[0043] Based on the aforementioned technical means of using a hot pressing welding head to hot press weld the wire joint 4 into the metallized electrode 2, the working surface of the hot pressing welding head facing the wire joint 4 is parallel to the second pressing surface 42, that is, the working surface of the hot pressing welding head facing the wire joint 4 is designed to be an inclined surface, so that when the wire joint 4 is embedded in the metallized electrode 2, the second pressing surface 42 of the compressively deformed wire joint 4 is ensured to be inclined downward from one end of the wire coil 3 toward one end of the boss portion 12, and the pits in the metallized electrode 2 caused by hot pressing welding with the hot pressing welding head and the inclined second pressing surface 42 can be filled with solder subsequently.
[0044] In one embodiment, the end of the wire joint 4 away from the wire coil 3 is kept at a distance from the side of the boss portion 12 away from the winding portion 11, which allows the metallized electrode 2 to cover the wire joint 4 and also provides a buffer space for the hot pressing deformation of the wire joint 4. Among them, the end of the wire joint 4 away from the wire coil 3 has a hot pressing section thickness C, and the hot pressing section thickness C is ≤0.6 times the wire diameter. That is, through this setting, the hot pressing welding strength of the hot pressing welding head can be limited, the wire joint 4 can be prevented from being excessively compressed, and the structural strength of the wire joint 4 can be ensured.
[0045] In one embodiment, the wire joint 4 is hot-pressed and welded to the metallized electrode 2 by a hot-pressing welding head, and a solder joint area 7 can be formed between the hot-pressing welding head and the top surface of the metallized electrode 2. The width D of the solder joint area 7 ranges from 1.5 times to 5 times the wire diameter, and D≤2mm. Through this setting, the problem of decreased strength of subsequent surface mount (SMT) of chip magnetic components can be avoided.
[0046] It should be noted that the connection between the second pressing surface 42 and the wire joint 4 has a hot pressing deformation point 8, and the hot pressing deformation point 8 and the side of the boss portion 12 close to the wire coil 3 have a hot pressing deformation distance B. The range of the hot pressing deformation distance B includes -2 times to 3 times the wire diameter. Based on the aforementioned hot pressing welding method, the second pressing surface 42 is formed by hot pressing of the hot pressing welding head. Then, when the hot pressing deformation distance B is a negative value, the hot pressing deformation point 8 is within the soldering point area 7. When the hot pressing deformation distance B is a positive value, the hot pressing deformation point 8 is outside the soldering point area 7, so as to ensure a stable electrical connection between the wire joint 4 and the metallized electrode 2.
[0047] The patch magnetic component of this embodiment also includes a cover plate 6, which is connected to the end of the boss portion 12 facing away from the metallized electrode 2, and is used to shield magnetic field interference, concentrate magnetic flux and reduce leakage magnetic flux. When the cover plate 6 is a magnetic cover plate 6 and the core 1 is a ferrite core, the patch magnetic component of this embodiment may include a POC (Power Over Chip) inductor; when the cover plate 6 is a plastic cover plate 6 and the core 1 is a ceramic core, the patch magnetic component of this embodiment may include a high-frequency winding inductor.
[0048] As in any of the aforementioned embodiments, the wire connector 4 tapers from one end of the wire coil 3 toward one end of the boss portion 12, and the wire connector 4 has a first pressing surface 41 facing the boss portion 12 and a second pressing surface 42 away from the boss portion 12, and the first pressing surface 41 and the second pressing surface 42 have a set acute angle a, wherein the angle range of the set acute angle a includes 1° to 8°. Through this limitation, the thermal compression deformation amplitude of the wire connector 4 is guaranteed, and the internal structure thereof is avoided from being excessively damaged, thereby ensuring a stable connection between the wire connector 4 and the metallized electrode 2. Therefore, the chip magnetic component of this embodiment has sufficient stability and durability in harsh vehicle application environments with long-term frequent vibration, temperature and humidity shocks, and high reliability requirements, and in aerospace application environments with harsh high and low temperature shocks and strong electromagnetic radiation.
[0049] The above is a detailed introduction to the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the core idea of the present application. At the same time, for those skilled in the art, based on the idea of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A chip magnetic component, characterized in that: include: a core body, the core body comprising a winding portion and a boss portion connected to the winding portion; a metallized electrode, the metallized electrode being disposed on the boss portion; a wire coil connected to the wire winding portion; A wire connector is led out from the end of the wire coil, which is connected to the boss portion and embedded in the metallized electrode. The wire connector tapers from one end of the wire coil toward one end of the boss portion. The wire connector has a first pressing surface facing the boss portion and a second pressing surface facing away from the boss portion. The first pressing surface and the second pressing surface have a set acute angle.
2. The patch magnetic component according to claim 1, wherein: The boss portion is provided with a functional groove, the metallized electrode covers the functional groove, the wire connector is located in the functional groove, and the functional groove has a set groove width, which is 1.1 to 3 times the wire diameter.
3. The chip magnetic component according to claim 1, wherein: The end of the wire connector away from the wire coil maintains a distance from the side of the boss away from the winding part, and the end of the wire connector away from the wire coil has a hot-pressed section thickness, which is ≤0.6 times the wire diameter.
4. The chip magnetic component according to claim 2, wherein: The functional groove is inclined downward from one end of the boss portion toward one end of the wire coil, the first pressing surface of the wire connector is parallel to the bottom surface of the functional groove, and the second pressing surface of the wire connector and the top surface of the metallized electrode are parallel to the horizontal plane.
5. The patch magnetic component according to claim 2, wherein: The first pressing surface of the wire connector and the bottom surface of the functional groove are parallel to a horizontal plane, and the second pressing surface of the wire connector is inclined downward from one end of the wire coil toward one end of the boss portion.
6. The chip magnetic component according to claim 2, wherein: The functional groove and the side of the boss portion close to the wire coil have a set fillet, the metallized electrode covers the set fillet, and the radius of the set fillet ranges from 0.03 mm to 0.6 mm.
7. The chip magnetic component according to claim 1, wherein: It also includes a cover plate, which is connected to the end of the boss portion away from the metallized electrode. When the cover plate is a magnetic cover plate, the core is a ferrite core; when the cover plate is a plastic cover plate, the core is a porcelain core.
8. The chip magnetic component according to claim 1, wherein: The wire joint is hot-pressed and welded to the metallized electrode by a hot-pressing welding head. The hot-pressing welding head and the top surface of the metallized electrode form a welding spot area. The width of the welding spot area ranges from 1.5 times to 5 times the wire diameter, and the width of the welding spot area is ≤2mm.
9. The chip magnetic component according to any one of claims 1 to 8, characterized in that: A thermal deformation point is provided at the connection between the second pressing surface and the wire connector. A thermal deformation distance is provided between the thermal deformation point and the side of the boss portion close to the wire coil. The thermal deformation distance ranges from -2 times to 3 times the wire diameter.
10. The chip magnetic component according to any one of claims 1 to 8, characterized in that: The angle range of the set acute angle includes 1° to 8°.