SIP (Session Initiation Protocol) module mounting structure

Abstract

The utility model relates to an SIP module surface mounting structure, which comprises a bearing plate and a chip module, the surface of the chip module is provided with a plurality of bonding pads used for being welded with the bearing plate, the area of the surface of the chip module, which is not provided with the bonding pads, forms a non-welding area, the non-welding area is provided with an ink block, the ink block has a thickness, and the thickness of the ink block is larger than that of the bearing plate. When the chip module is welded with the bearing plate, the ink block is clamped between the chip module and the bearing plate to support the chip module. According to the utility model, the risk of tin bead generation during module mounting can be effectively reduced, and the mounting quality and the product reliability are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, and in particular to a SIP module mounting structure. Background Art

[0002] With the development of technology, fast charging for mobile phones has become a mainstream trend, and the corresponding battery protection boards also require higher reliability. Currently, the battery BMU (Battery Management Unit) is usually encapsulated and injection molded after the components are mounted on the PCB surface, then cut into individual BMUs, and then mounted on the circuit board used for support using SMT technology.

[0003] Due to the large size and heavy weight of BMU modules, their own weight can easily squeeze the solder paste on the pads during assembly, causing it to squeeze out of the pads and form tin beads, which can affect product performance. Currently, the industry generally uses two methods to control tin beading: one is to reduce the amount of printed tin, but this method can easily lead to incomplete tin application, insufficient soldering, and cold solder joints; the other is to increase the etching grooves, that is, to increase the solder mask window in the pads. This method is not effective for pads on large copper sheets, and the tin beads are still easily squeezed out with the rosin. Utility Model Content

[0004] The purpose of the utility model is to provide a SIP module mounting structure, which has a wide range of applications, can effectively reduce the risk of tin balls generated during module mounting, and improve mounting quality and product reliability.

[0005] A SIP module mounting structure includes a carrier board and a chip module. The surfaces of the carrier board and / or the chip module are provided with a plurality of solder pads for soldering. The areas on the surfaces of the carrier board and / or the chip module where no solder pads are provided are formed as non-soldering areas. The non-soldering areas are provided with ink blocks. The ink blocks have a thickness. When the chip module is soldered to the carrier board, the ink blocks are sandwiched between the chip module and the carrier board to support the chip module.

[0006] In the above technical solution, an ink block is provided in the non-welding area of the carrier plate and / or chip module. The thickness of the ink block provides support for the chip module during mounting, thereby increasing the gap between the carrier plate and the chip module and providing ample space for solder paste, thereby preventing the solder paste from being squeezed by the chip module to the outside of the pad to form solder beads, thereby effectively improving the quality of mounting. Printing ink on the surface of the carrier plate and chip module is an existing process in their production process, so this solution does not require additional processes, maintaining production efficiency and cost. Printing the ink block on the chip module can achieve an improved effect when mounting it with different carrier plates, thereby increasing its scope of application.

[0007] Furthermore, the chip module includes a first plate body, a first copper layer, and a first solder resist layer that are stacked, and the ink block is arranged on the surface of the first solder resist layer.

[0008] In the above technical solution, the first solder resist layer plays the role of solder resistance and insulation. During mounting, the first solder resist layer faces the carrier board. The ink block is arranged on the surface of the first solder resist layer, which can be against the carrier board during mounting to support the chip module.

[0009] Furthermore, the carrier board includes a second board body, a second copper layer, and a second solder resist layer that are stacked, and the ink block is arranged on the surface of the second solder resist layer.

[0010] In the above technical solution, the second solder resist layer faces the chip module during mounting, and the ink block can abut against the chip module, thereby supporting the chip module.

[0011] Furthermore, a plurality of the pads are arranged in a row to form a pad group, and the ink blocks are arranged at both ends of the pad group.

[0012] In the above technical solution, the ink blocks are arranged at both ends of the pad group, which can form supports at both ends of the welding part, so that the force of the chip module is more uniform, and the mounting effect is further improved.

[0013] Furthermore, the ink block is arranged between two adjacent pad groups.

[0014] In the above technical solution, an ink block is provided between the two pad groups, which can form a support between the welding areas and further ensure the stability of the structure.

[0015] Furthermore, the ink block is a printed white oil layer.

[0016] In the above technical solution, printing ink is an existing process in the production process of the carrier board and the chip module. The ink block can be formed into the required thickness through multiple printings. Therefore, selecting the ink block as the white oil layer does not require additional processes and can be easily identified.

[0017] Furthermore, the chip module is a battery management unit.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: an ink block is provided in the non-welding area of the carrier plate and / or chip module, and the thickness of the ink block forms a support for the chip module during mounting, thereby increasing the gap between the carrier plate and the chip module, providing sufficient space for the solder paste, thereby preventing the solder paste from being squeezed by the chip module to the outside of the pad to form solder beads, and effectively improving the quality of mounting. Printing ink on the surface of the carrier plate and / or chip module is an original process in its production process, so this solution does not require additional processes, maintaining production efficiency and cost. Printing the ink block on the chip module can achieve an improved effect when it is mounted on different carrier plates, thereby increasing the scope of application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural schematic diagram of the SIP module mounting structure before welding according to an embodiment of the present invention.

[0020] Figure 2 This is a structural schematic diagram of the SIP module mounting structure after welding according to an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the surface structure of a chip module with a SIP module mounting structure according to an embodiment of the present invention.

[0022] Description of Figure Numbers:

[0023] Carrier board 1, second board 11, second copper layer 12, second solder resist layer 13, chip module 2, first board 21, first copper layer 22, first solder resist layer 23, ink block 24, solder pad 3, solder paste 4, solder pad group 5. DETAILED DESCRIPTION

[0024] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0025] Please refer to Figures 1 to 3 In a preferred embodiment, the utility model provides a SIP module mounting structure mainly including a carrier board 1 and a chip module 2. The surface of the carrier board 1 and / or the chip module 2 is provided with a plurality of pads 3 for welding. The area on the surface of the carrier board 1 and / or the chip module 2 where the pads 3 are not provided is formed as a non-welding area. The non-welding area is provided with an ink block 24. The ink block 24 has a thickness. When the chip module 2 is welded to the carrier board 1, the ink block 24 is sandwiched between the chip module 2 and the carrier board 1 to support the chip module 2.

[0026] For example, the chip module 2 can be an existing module using a SIP (System-in-Package) package. In this embodiment, the chip module 2 is a BMU (Battery Management Unit). The carrier board 1 can be an existing rigid circuit board or a flexible circuit board. The solder pads 3 are exposed on the surface of the carrier board 1 and / or the chip module 2 and are used for soldering. The ink block 24 is a thick block or layer structure formed by silk-screen ink. The ink block 24 supports the chip module 2 during placement.

[0027] As can be seen from the above technical solution, ink blocks 24 are placed in the non-soldering areas of the carrier board 1 and / or chip module 2. The thickness of the ink blocks 24 provides support for the chip module 2 during placement, increasing the gap between the carrier board 1 and the chip module 2. This provides ample space for solder paste 4, preventing the solder paste 4 from being squeezed by the chip module 2 onto the outside of the pads 3 and forming solder beads, effectively improving placement quality. Printing ink on the surfaces of the carrier board 1 and chip module 2 is an existing step in their production process, so this solution does not require an additional step, maintaining production efficiency and costs.

[0028] It is understood that in this embodiment, the ink block 24 is printed on the chip module 2, so that it can achieve improved results when mounted on different carrier boards 1, thereby increasing the scope of application. In other embodiments, the ink block 24 can be printed on the carrier board 1, or printed on both the carrier board 1 and the chip module 2.

[0029] In this embodiment, the chip module 2 includes a first plate body 21, a first copper layer 22, and a first solder resist layer 23, which are stacked together. The ink block 24 is disposed on the surface of the first solder resist layer 23. The first plate body 21 can be an existing rigid circuit board. The first copper layer 22 is disposed within the first plate body 21. The first solder resist layer 23 is disposed on the surface of the first copper layer 22 to function as a solder resist and an insulator. The first solder resist layer 23 has an opening, which exposes the first copper layer 22 to form a solder pad 3. During mounting, the first solder resist layer 23 faces the carrier board 1. The ink block 24 is disposed on the surface of the first solder resist layer 23 so that it can abut against the carrier board 1 during mounting, thereby supporting the chip module 2.

[0030] The carrier board 1 includes a stacked second board 11, a second copper layer 12, and a second solder resist layer 13. An ink block 24 is disposed on the surface of the second solder resist layer 13. When the chip module 2 is soldered to the carrier board 1, the second solder resist layer 13 faces the chip module 2 during placement, and the ink block 24 can abut against the chip module 2, thereby supporting the chip module 2.

[0031] In this embodiment, a plurality of pads 3 are arranged in a row to form a pad group 5, and ink blocks 24 are provided at both ends of the pad group 5. It is understandable that the chip module 2 needs to be welded to the carrier board 1 via a plurality of pads 3. The plurality of pads 3 are arranged in a row to form a pad group 5, and the pad group 5 can be arranged in multiple rows. By providing the ink blocks 24 at both ends of the pad group 5, support can be formed at both ends of the welding part, making the force on the chip module 2 more uniform, and further improving the mounting effect.

[0032] The ink block 24 is disposed between two adjacent pad groups 5. Providing the ink block 24 between the two pad groups 5 can form support between the welding areas, further ensuring the stability of the structure.

[0033] In this embodiment, the ink block 24 is a printed layer of white ink. Printing ink is an integral process in the production of the carrier plate 1 and chip module 2. The ink block 24 can be printed multiple times to achieve the desired thickness. Therefore, using the white ink block 24 as the ink block 24 eliminates the need for additional steps and facilitates identification. It should be noted that the ink block 24 is printed in a thickness of 15 to 30 μm per print. Multiple printing steps can be performed to achieve the desired thickness, ensuring effective soldering while providing effective support for the chip module 2.

[0034] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SIP module mounting structure, characterized in that: It includes a carrier plate and a chip module, wherein the surface of the carrier plate and / or the chip module is provided with a plurality of pads for welding, and the area on the surface of the carrier plate and / or the chip module where no pads are provided is formed as a non-welding area, and the non-welding area is provided with an ink block, and the ink block has a thickness. When the chip module is welded to the carrier plate, the ink block is sandwiched between the chip module and the carrier plate to support the chip module.

2. The SIP module mounting structure according to claim 1, characterized in that: The chip module includes a first plate body, a first copper layer, and a first solder resist layer which are stacked together. The ink block is arranged on the surface of the first solder resist layer.

3. The SIP module mounting structure according to claim 1, characterized in that: The carrier plate includes a second plate body, a second copper layer, and a second solder resist layer which are stacked together. The ink block is arranged on the surface of the second solder resist layer.

4. The SIP module mounting structure according to claim 1, characterized in that: A plurality of the pads are arranged in a row to form a pad group, and the ink blocks are arranged at both ends of the pad group.

5. The SIP module mounting structure according to claim 4, characterized in that: The ink block is arranged between two adjacent pad groups.

6. The SIP module mounting structure according to claim 1, characterized in that: The ink block is a printed white oil layer.

7. The SIP module mounting structure according to claim 1, characterized in that: The chip module is a battery management unit.

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