Electronic package
By using bridging components to pad high-photon components in electronic packages, the problems of traditional copper channel signal attenuation and performance limitations of pluggable devices are solved, and efficient optical communication transmission and cost reduction effects are achieved.
Patent Information
- Application Number
- CN202422346401.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-16
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-09-25
AI Technical Summary
In the prior art, traditional copper data channels have severe signal attenuation and crosstalk under high bandwidth requirements, and pluggable optical communication devices have limited performance at high transmission rates, resulting in increased transmission delay and power consumption, which cannot meet the high bandwidth requirements of future data centers.
The electronic package structure is adopted, including a carrier structure, electronic components, bridge components and photonic components. The photonic components are padded with the bridge components to avoid the cladding covering the light emitter and light receiver. Combined with the existing semiconductor packaging process, the integrity of the photonic components is ensured and efficient electrical connection is achieved through conductive connections.
It improves the transmission bandwidth of optical communication, reduces transmission delay and power consumption, reduces production costs, and avoids contamination and damage of photonic components.
Smart Images
Figure CN223245603U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a packaging structure, and more particularly to an electronic packaging component. Background Art
[0002] With the ever-increasing demand for data network bandwidth, the shortcomings of traditional copper data channels, such as signal attenuation and crosstalk caused by radiated electromagnetic energy, have gradually emerged. Optical communications have been seen as the successor to copper links. Especially in the 21st century, technological advancements such as the post-PC era, mobile communications, and artificial intelligence have driven changes in lifestyles and cultures, including mobile internet access, online shopping, video streaming, and online gaming. The resulting increase in bandwidth demand has finally reached a point where copper cables are no longer sufficient.
[0003] Furthermore, the application of high-performance computing (HPC) technology in today's lives is becoming increasingly important and widespread, with applications such as medical technology development, such as cancer drug development, and autonomous vehicle sensing and detection computing. Data center traffic is also increasing due to its application in these technological fields.
[0004] To increase data network bandwidth and address the demand pressure of data centers, silicon photonic solutions combining various advanced packaging technologies have emerged.
[0005] Currently, optical communications within data centers primarily rely on pluggable components as fiber optic connection interfaces to achieve optical-to-electrical or electro-optical conversion between the transmitter and receiver. Within the data center architecture, virtually all switches, routers, and nodes require pluggable components. For large data centers, the sheer number of pluggable components required creates a significant burden, increasing transmission latency and power consumption. Furthermore, with future transmission rates reaching 1.6Tb / s, 3.2Tb / s, or even higher, pluggable components will face performance limitations. Therefore, applying optical communication principles and modifying packaging structures to increase transmission bandwidth are pressing challenges for the industry. Utility Model Content
[0006] To address the above-mentioned issues, the present application provides an electronic package comprising a supporting structure, an electronic component, a bridging element, a coating layer, and a photonic element. The supporting structure has a first surface and a second surface facing each other. The electronic component is disposed on the second surface of the supporting structure to be electrically connected to the supporting structure. The bridging element is disposed on the second surface of the supporting structure to be electrically connected to the supporting structure. The coating layer coats the electronic component and the bridging element. The photonic element is disposed on a surface of the coating layer and is electrically connected to the bridging element.
[0007] The present application also provides a method for manufacturing an electronic package, comprising: placing a supporting structure on a supporting member, wherein the supporting structure has a first surface and a second surface relative to each other; arranging an electronic component on the second surface of the supporting structure to electrically connect the supporting structure; arranging a bridging element on the second surface of the supporting structure to electrically connect the supporting structure; forming a coating layer to cover the electronic component and the bridging element; and arranging a photonic element on a surface of the coating layer to electrically connect the bridging element.
[0008] The electronic package and its manufacturing method of the present application arrange the photon element after the formation and grinding of the cladding layer is completed, so as to prevent the cladding layer from covering the photon element, thereby avoiding contamination or damage to the light emitter and light receiver of the photon element. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figures 1 to 6 Schematic cross-sectional view of the electronic package and its manufacturing method of the present application.
[0010] Description of Reference Numerals
[0011] 1 Electronic packaging
[0012] 11 Load-bearing structure
[0013] 11a First surface
[0014] 11b Second surface
[0015] 111 insulation layer
[0016] 112 circuit layer
[0017] 12 Conductors
[0018] 13. Viscose
[0019] 14 bearing parts
[0020] 15 Electronic components
[0021] 15a Active surface
[0022] 15b Non-active surface
[0023] 16 first conductive element
[0024] 21 Bridging Components
[0025] 21a First surface
[0026] 21b Second surface
[0027] 211 second conductive element
[0028] 212 conductive contacts
[0029] 2121 upper surface
[0030] 213 conductive vias
[0031] 22 First primer
[0032] 31 cladding
[0033] 311 upper surface
[0034] 51 Photonic Components
[0035] 51a first surface
[0036] 51b Second surface
[0037] 511 Optical transmitter or optical receiver
[0038] 52 third conductive element
[0039] 53 Second primer. DETAILED DESCRIPTION
[0040] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.
[0041] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "upper", "lower", "one", "first" and "second" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.
[0042] Figures 1 to 6 FIG1 is a schematic cross-sectional view of a method for manufacturing an electronic package according to an embodiment of the present application.
[0043] First, if Figure 1 As shown, the supporting structure 11 is placed on the supporting member 14. Specifically, the supporting structure 11 has a first surface 11a and a second surface 11b opposite to each other. A plurality of conductive bodies 12 are provided on the first surface 11a. Each of the conductive bodies 12 is, for example, a conductive pillar or a conductive bump. The supporting structure 11 is placed on the supporting member 14 via the conductive bodies 12 and the adhesive 13.
[0044] The carrier structure 11 can be a package substrate, an interposer, or a circuit structure, and includes at least one insulating layer 111 and at least one circuit layer 112 bonded to the at least one insulating layer 111. For example, the circuit layer 112 can be made of copper, while the insulating layer 111 can be made of polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric materials.
[0045] Due to the requirement of reducing line width, line spacing and thickness in product applications, the supporting structure 11 can be a coreless package substrate, interposer or circuit structure.
[0046] In addition, the electronic component 15 is disposed on the second surface 11 b of the supporting structure 11 to be electrically connected to the supporting structure 11 .
[0047] The electronic component 15 may be an active component, a passive component, or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.
[0048] The electronic component 15 has an active surface 15a and an inactive surface 15b opposite to each other, and is flip-chip bonded to the second surface 11b of the carrier structure 11 via a plurality of first conductive elements 16 to electrically connect to the carrier structure 11. Each of the first conductive elements 16 can be formed of solder or a conductive metal material.
[0049] like Figure 2 As shown, the bridging element 21 is disposed on the second surface 11 b of the supporting structure 11 to electrically connect the supporting structure 11 .
[0050] Specifically, the bridging element 21 can be an interposer or other circuit structure. The bridging element 21 has a first surface 21a and a second surface 21b that oppose each other. The bridging element 21 includes a plurality of second conductive elements 211 disposed on the first surface 21a, a plurality of conductive contacts 212 disposed on the second surface 21b, and a plurality of conductive vias 213 disposed within the bridging element 21. The plurality of conductive vias 213 electrically connect the plurality of second conductive elements 211 and the plurality of conductive contacts 212.
[0051] Each of the second conductive elements 211 can be formed of solder material or a conductive metal material. Each of the conductive contacts 212 and each of the conductive through holes 213 can be made of copper or other conductive materials.
[0052] Then, the first underfill 22 is used to cover the first conductive elements 16 and the second conductive elements 211 .
[0053] like Figure 3As shown, a coating layer 31 is formed on the supporting structure 11 to cover the electronic component 15 and the bridge element 21. The coating layer 31 is made of an insulating material, such as a polyimide (PI) or epoxy encapsulant or packaging material. The coating layer 31 can be formed by molding, lamination, or coating.
[0054] like Figure 4 As shown, the coating layer 31 is ground to make a surface of the coating layer 31 (eg Figure 4 and Figure 5 The upper surface 311 shown is flush with a surface of each conductive contact 212 (eg Figure 4 The upper surface 2121 is shown as shown, and the plurality of conductive contacts 212 are exposed.
[0055] like Figure 5 As shown, the photonic element 51 is disposed on a surface (eg, upper surface 311) of the cladding layer 31 to electrically connect to the bridge element 21. For example, the photonic element 51 may be a light emitting die (LED).
[0056] The photonic element 51 has a first surface 51a and a second surface 51b opposite to each other. The first surface 51a is electrically connected to the bridge element 21 through a plurality of third conductive elements 52. A plurality of light emitters / light receivers 511 are disposed on the second surface 51b. In other words, each element 511 can be a light emitter or a light receiver.
[0057] Each of the third conductive elements 52 can be formed of solder material or a conductive metal material. The plurality of light emitters / light receivers 511 can be the transmitting end and the receiving end of the photonic element 51 respectively.
[0058] In addition, the plurality of third conductive elements 52 may be coated with a second primer 53 .
[0059] like Figure 6 As shown, the adhesive 13 and the carrier 14 are removed to complete the electronic package 1 .
[0060] The electronic package 1 includes a conductor 12 , a supporting structure 11 , an electronic component 15 , a first conductive element 16 , a bridge element 21 , a second conductive element 211 , a first underfill 22 , a coating layer 31 , a photonic element 51 , a third conductive element 52 , and a second underfill 53 .
[0061] The bridging element 21 is electrically connected to the circuit layer 112 of the supporting structure 11 via a plurality of second conductive elements 211, and is electrically connected to the photonic element 51 via a plurality of conductive contacts 212 and a plurality of third conductive elements 52. The circuit layer 112 of the supporting structure 11 is electrically connected to the electronic element 15, the bridging element 21, and the plurality of conductive bodies 12. Therefore, the plurality of conductive bodies 12 are electrically connected to the electronic element 15 via the circuit layer 112 of the supporting structure 11 and the first conductive elements 16, and are electrically connected to the photonic element 51 via the circuit layer 112 of the supporting structure 11, the bridging element 21, and the third conductive elements 52.
[0062] Because the photonic element 51 is provided with multiple light emitters / receivers 511, and the light emitters / receivers 511 must not be contaminated or damaged, a bridge element 21 is provided between the supporting structure 11 and the photonic element 51. This allows the photonic element 51 to be positioned above the cladding layer 31 without being covered by the cladding layer 31, thereby preventing contamination or damage to the light emitters / receivers 511. In contrast, if the photonic element 51 is directly positioned on the supporting structure 11 and then molded, the cladding layer 31 will cover the light emitters / receivers 511. Subsequently, grinding the cladding layer 31 to remove the cladding layer 31 from the light emitters / receivers 511 would damage the light emitters / receivers 511.
[0063] In summary, the electronic package 1 and its manufacturing method of the present application utilize the bridge element 21 to elevate the photonic element 51. The photonic element 51 is then positioned after the cladding layer 31 has been formed and polished. This prevents the cladding layer 31 from covering the photonic element 51 and thereby contaminating or damaging the light emitter / light receiver 511. Furthermore, the electronic package 1 of the present application can be manufactured using existing semiconductor packaging processes, eliminating the need for developing specialized processes or purchasing specialized equipment, thereby reducing production costs.
[0064] The above embodiments are intended only to illustrate the principles and effects of this application and are not intended to limit this application. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.
Claims
1. An electronic package, characterized in that: include: A bearing structure having a first surface and a second surface opposite to each other; an electronic component disposed on the second surface of the supporting structure to be electrically connected to the supporting structure; a bridging element disposed on the second surface of the supporting structure to electrically connect the supporting structure; a covering layer formed on the second surface of the supporting structure to cover the electronic component and the bridge component; as well as The photon element is disposed on a surface of the cladding layer and is electrically connected to the bridge element.
2. The electronic package according to claim 1, wherein: The supporting structure is a packaging substrate, an intermediate board or a circuit structure in a form without a core layer.
3. The electronic package according to claim 1, wherein: The electronic package further comprises: A plurality of conductors are arranged on the first surface of the supporting structure to electrically connect the electronic component through the supporting structure and to electrically connect the photon component through the supporting structure and the bridge component.
4. The electronic package according to claim 3, wherein: The supporting structure includes at least one insulating layer and at least one circuit layer combined with the at least one insulating layer, and the at least one circuit layer is electrically connected to the electronic element, the bridge element and the plurality of conductors.
5. The electronic package according to claim 1, wherein: The electronic component has an active surface and an inactive surface opposite to each other, and the electronic component is combined with the second surface of the supporting structure through a plurality of first conductive elements in a flip chip manner to be electrically connected to the supporting structure.
6. The electronic package according to claim 1, wherein: The bridge element has a first surface and a second surface opposite to each other. A plurality of second conductive elements are provided on the first surface, and a plurality of conductive contacts are provided on the second surface. A plurality of conductive through holes are provided in the bridge element, and the plurality of conductive through holes electrically connect the plurality of second conductive elements and the plurality of conductive contacts.
7. The electronic package according to claim 6, wherein: The bridge element is electrically connected to the supporting structure through the plurality of second conductive elements, and is electrically connected to the photonic element through the plurality of conductive contacts.
8. The electronic package according to claim 6, wherein: The surface of the cladding layer is flush with a surface of each of the conductive contacts, exposing the plurality of conductive contacts.
9. The electronic package according to claim 1, wherein: The photon element has a first surface and a second surface opposite to each other, and is electrically connected to the bridge element through the first surface and a plurality of third conductive elements. A plurality of light emitters and a plurality of light receivers are disposed on the second surface.