Frequency source packaging structure

Abstract

The utility model discloses a frequency source packaging structure, and relates to the technical field of packaging structures. Comprising a mounting plate, a fixing cover is arranged on a first plane of the mounting plate, a heat dissipation plate is arranged on the outer side of the fixing cover, a heat conduction pad is arranged in the fixing cover, and the first plane is a contact surface of the mounting plate and the fixing cover; the heat dissipation mechanism is arranged in the fixing cover and used for cooling the chip, the heat dissipation mechanism comprises a heat conduction piece and a circulation piece, the heat conduction piece is arranged in the fixing cover and used for absorbing heat of the chip, and the circulation piece is arranged in the fixing cover and used for driving heat dissipation liquid to flow. According to the utility model, through the arrangement of the mounting plate and the heat conduction piece, the fixing cover, the heat dissipation plate, the partition plate, the fixing plate, the through hole, the first flow guide pipe and the second flow guide pipe are matched, so that the fixing plate can be in direct contact with the chip, and the heat dissipation effect of the cooling liquid is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging structures, in particular to a frequency source packaging structure. Background Art

[0002] Frequency source is the basic signal source for electronic radar, communication, measurement and control, and navigation. It mainly includes two types: fixed-point frequency source and synthetic frequency source. Synthetic frequency source is also called frequency synthesizer or frequency synthesizer. According to its structure, it can be divided into direct and indirect types. Indirect frequency synthesizer uses phase-locked loop technology and is currently the most widely used. The circuit used in this synthesis method is a closed-loop system that realizes phase feedback control through phase detection to achieve frequency tracking. The additional noise of the analog phase-locked loop is very low. With the development of semiconductor technology, frequency source generators are also constantly developing.

[0003] During use, the frequency source needs to be used in combination with a variety of chips with different functions. In order to ensure the stability of the chip during use, a packaging structure is needed to protect the chip. In order to ensure the use effect of the chip during use, the existing packaging structure needs to install an additional heat dissipation structure on the outside of the packaging structure. In actual use, the heat dissipation structure cannot directly contact the chip, resulting in low heat dissipation efficiency. For this reason, a frequency source packaging structure is proposed. Utility Model Content

[0004] The purpose of the present invention is to solve the problem that the heat dissipation structure cannot be in direct contact with the chip, resulting in low heat dissipation efficiency. The present invention provides a frequency source packaging structure.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0006] A frequency source packaging structure, comprising:

[0007] A mounting plate, wherein a fixing cover is provided on the first plane of the mounting plate, a heat dissipation plate is provided on the outside of the fixing cover, a thermal pad is provided on the inside of the fixing cover, and the first plane is the contact surface between the mounting plate and the fixing cover;

[0008] The heat dissipation mechanism is arranged inside the fixed cover and is used to cool the chip. The heat dissipation mechanism includes a heat conductive part and a circulation part. The heat conductive part is arranged inside the fixed cover and is used to absorb the heat of the chip. The circulation part is arranged inside the fixed cover and is used to drive the heat dissipation liquid to flow. The heat conductive part cooperates with the circulation part to drive the heat dissipation liquid to circulate and cool the chip.

[0009] Furthermore, a groove is provided inside the fixed cover, a baffle is provided inside the groove, a first rotating plate and a second rotating plate are respectively provided on both sides of the baffle, and the first rotating plate is connected to the fixed cover, and the second rotating plate is connected to the baffle, and the outer sides of the first rotating plate and the second rotating plate are respectively abutted against a first limit block and a second limit block, and the first limit block is connected to the baffle, and the second limit block is connected to the fixed cover.

[0010] Furthermore, the heat conducting member includes a fixing plate, which is connected to the fixing cover and abuts against the thermal pad. The fixing plate is provided with a second flow guide tube, a partition and a first flow guide tube in sequence relative to the fixing cover. A through hole is opened inside the partition, and the through hole connects the second flow guide tube and the first flow guide tube, and the second flow guide tube and the first flow guide tube are both connected to the groove.

[0011] Furthermore, the circulating part includes a rotating disk, which is arranged inside the fixed cover and rotates relative to the fixed cover. A connecting rod is provided at the edge of one side of the rotating disk, and a control rod is provided on the outside of the connecting rod. The control rod slides inside the groove, and a sliding groove is opened inside the control rod, and the connecting rod slides inside the sliding groove. A sliding plate is provided on the outside of the control rod, and the sliding plate slides inside the groove.

[0012] Furthermore, a sealing gasket is provided on the outer side of the sliding plate, and the sealing gasket is slidably connected to the groove.

[0013] Furthermore, a plurality of heat dissipation fins are provided on the outer side of the heat dissipation plate.

[0014] The beneficial effects of the utility model are as follows:

[0015] The utility model realizes the coordination of the fixed cover, the heat dissipation plate, the partition, the fixed plate, the through hole, the first guide tube and the second guide tube through the arrangement of the mounting plate and the heat conducting member, so that the fixed plate can directly contact the chip, thereby improving the heat dissipation effect of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0017] Figure 2 It is the main sectional view of the utility model;

[0018] Figure 3 It is a partial cross-sectional view of the utility model;

[0019] Figure 4 This is an exploded view of the heat conducting element of the utility model;

[0020] Figure 5 This is a partial cross-sectional view of the fixed cover of the utility model;

[0021] Figure 6 This utility model Figure 5 Enlarged view of part A in the middle;

[0022] Figure 7 This is the principle diagram of the frequency source of the utility model;

[0023] Figure numerals: 1. Mounting plate; 101. Fixed cover; 102. Heat dissipation plate; 103. Thermal pad; 104. Groove; 105. Baffle; 106. First rotating plate; 107. Second rotating plate; 108. First limit block; 109. Second limit block; 2. Heat conducting member; 201. Partition; 202. Fixed plate; 203. Through hole; 204. First air guide tube; 205. Second air guide tube; 3. Circulation member; 301. Rotating disk; 302. Connecting rod; 303. Sliding groove; 304. Control rod; 305. Sliding plate. DETAILED DESCRIPTION

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0027] The electrical components mentioned in this article are all connected to an external main controller and 220V AC power, and the main controller can be a conventional known device that performs control such as a computer.

[0028] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.

[0029] like Figures 1 to 7 As shown, a frequency source packaging structure includes: a mounting plate 1, a fixed cover 101 is provided on the first plane of the mounting plate 1, a heat sink 102 is provided on the outside of the fixed cover 101, a thermal pad 103 is provided inside the fixed cover 101, and the first plane is the contact surface between the mounting plate 1 and the fixed cover 101; a heat dissipation mechanism is arranged inside the fixed cover 101 for cooling the chip, and the heat dissipation mechanism includes a heat conducting member 2 and a circulation member 3, the heat conducting member 2 is arranged inside the fixed cover 101 for absorbing the heat of the chip, and the circulation member 3 is arranged inside the fixed cover 101 for driving the heat dissipation liquid to flow, and the heat conducting member 2 cooperates with the circulation member 3 to drive the heat dissipation liquid to circulate and cool the chip. Specifically, during the use of the frequency source, the mounting plate 1 provides support for multiple chips, and the mounting plate 1 conducts between the multiple chips, and then the fixed cover 101 and the mounting plate 1 are connected. The cooperation of the heat conducting member 2 and the circulating member 3 protects the chip and prevents the chip from being bumped during use. Then, during use, the heat dissipation of the chip during use is continuously carried out through the cooperation of the heat conducting member 2 and the circulating member 3, thereby ensuring the efficiency of the chip during use. The heat dissipation plate 102 is made of a material with good heat dissipation effect, such as aluminum alloy or copper alloy. The fixing cover 101 and the mounting plate 1 can be connected by welding or snapping. The thermal pad 103 can seal the gap between the chip and the fixing cover 101 during use to ensure that the fixing cover 101 can fully contact the chip, thereby increasing the heat dissipation effect of the chip during use. The thermal pad 103 is made of a flexible heat-conducting material, thereby ensuring the contact area while avoiding damage to the chip. The chip can meet the use requirements of the frequency source during use. The chip is a prior art and will not be explained in detail here.

[0030] like Figures 1 to 7As shown, the fixed cover 101 is further provided with a groove 104, the groove 104 is provided with a baffle 105, the baffle 105 is provided with a first rotating plate 106 and a second rotating plate 107 on both sides, and the first rotating plate 106 is connected to the fixed cover 101, and the second rotating plate 107 is connected to the baffle 105. The first and second rotating plates 106 and 107 are respectively abutted against a first limit block 108 and a second limit block 109 on the outside, and the first limit block 108 is connected to the baffle 105, and the second limit block 109 is connected to the fixed cover 101. During use, the first rotating plate 106 and the second rotating plate 107 with different rotation directions are used to guide the flow direction of the coolant to ensure that the coolant can fully cool the chip. The second limit block 109 and the first limit block 108 are set to limit the rotation direction of the first rotating plate 106 and the second rotating plate 107 to ensure the accuracy of the coolant flow direction. The baffle 105 blocks the coolant entering and discharging the inside of the groove 104 to avoid interference between coolants in different directions, thereby ensuring the heat absorption effect of the coolant.

[0031] like Figures 1 to 7 As shown, the heat conducting member 2 includes a fixing plate 202, which is connected to the fixing cover 101 and abuts against the thermal pad 103. The fixing plate 202 is provided with a second guide tube 205, a partition 201 and a first guide tube 204 in sequence relative to the fixing cover 101. A through hole 203 is opened inside the partition 201, and the through hole 203 connects the second guide tube 205 and the first guide tube 204, and the second guide tube 205 and the first guide tube 204 are both connected to the groove 104. Specifically, when the chip is cooled, the heat conducting member 2 is cooled by the fixing plate 202 and the partition 201. The cooperation guides the coolant, thereby realizing the circulation of the coolant. The second guide pipe 205 guides the cooling flow path so that the coolant can fully absorb and dissipate heat. The coolant inside the first guide pipe 204 is cooled by the heat sink 102, thereby ensuring the cooling effect of the coolant during use. The second guide pipe 205 and the first guide pipe 204 can be serpentine or spiral to further ensure the heat exchange effect of the coolant. The through hole 203 connects the first guide pipe 204 and the second guide pipe 205, so that the coolant can circulate.

[0032] like Figures 1 to 7As shown, the circulation member 3 includes a rotating disk 301, which is arranged inside the fixed cover 101 and rotates relative to the fixed cover 101. A connecting rod 302 is provided on the edge of one side of the rotating disk 301, and a control rod 304 is provided on the outside of the connecting rod 302. The control rod 304 slides inside the groove 104, and a sliding groove 303 is provided inside the control rod 304, and the connecting rod 302 slides inside the sliding groove 303. A sliding plate 305 is provided on the outside of the control rod 304, and the sliding plate 305 slides inside the groove 104. Specifically, a motor is provided on the outside of the rotating disk 301, and the motor is connected to the fixed cover 101. During use In the process, the cooperation between the rotating disk 301 and the connecting rod 302 drives the control rod 304 and the sliding plate 305 to move back and forth in a straight line. During the linear reciprocating movement of the sliding plate 305, the circulation of the coolant is achieved through the alternating rotation of the second rotating plate 107 and the first rotating plate 106. The connecting rod 302 arranged at the edge of the rotating disk 301 can cooperate with the sliding groove 303 to drive the sliding plate 305 and the control rod 304 to move back and forth in a straight line during use. A rotating sleeve is also provided on the outside of the connecting rod 302, which connects the connecting rod 302 and the control rod 304, thereby reducing the friction between the connecting rod 302 and the control rod 304.

[0033] like Figures 1 to 7 As shown, a sealing gasket is further provided on the outside of the sliding plate 305, and the sealing gasket is slidably connected to the groove 104. Specifically, the sealing gasket seals the gap between the sliding plate 305 and the groove 104 to prevent leakage of the coolant during use, thereby ensuring the stability of the coolant during use.

[0034] like Figures 1 to 7 As shown, a plurality of heat dissipation fins are provided on the outside of the heat dissipation plate 102. Specifically, the plurality of heat dissipation fins can increase the contact area between the heat dissipation plate 102 and the air during use, thereby further ensuring the heat dissipation effect during the use of the coolant.

[0035] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and improvements are possible without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed for the present invention is defined by the appended claims and their equivalents.

Claims

1. A frequency source packaging structure, characterized in that: include: A mounting plate (1), wherein a first plane of the mounting plate (1) is provided with a fixing cover (101), a heat dissipation plate (102) is provided on the outside of the fixing cover (101), and a thermal pad (103) is provided on the inside of the fixing cover (101), and the first plane is a contact surface between the mounting plate (1) and the fixing cover (101); A heat dissipation mechanism is arranged inside the fixed cover (101) and is used to cool the chip. The heat dissipation mechanism includes a heat conducting member (2) and a circulation member (3). The heat conducting member (2) is arranged inside the fixed cover (101) and is used to absorb the heat of the chip. The circulation member (3) is arranged inside the fixed cover (101) and is used to drive the heat dissipation liquid to flow. The heat conducting member (2) cooperates with the circulation member (3) to drive the heat dissipation liquid to circulate and cool the chip.

2. A frequency source packaging structure according to claim 1, characterized in that: A groove (104) is further provided inside the fixed cover (101), and a baffle (105) is provided inside the groove (104). A first rotating plate (106) and a second rotating plate (107) are respectively provided on both sides of the baffle (105), and the first rotating plate (106) is connected to the fixed cover (101), and the second rotating plate (107) is connected to the baffle (105). The outer sides of the first rotating plate (106) and the second rotating plate (107) are respectively abutted against a first limiting block (108) and a second limiting block (109), and the first limiting block (108) is connected to the baffle (105), and the second limiting block (109) is connected to the fixed cover (101).

3. The frequency source packaging structure according to claim 2, characterized in that: The heat conducting member (2) comprises a fixing plate (202), the fixing plate (202) being connected to the fixing cover (101), and the fixing plate (202) being in contact with the heat conducting pad (103), and the fixing plate (202) being provided with a second flow guide tube (205), a partition (201) and a first flow guide tube (204) in sequence on the side of the fixing plate (202) relative to the fixing cover (101), a through hole (203) being provided inside the partition (201), the through hole (203) being connected to the second flow guide tube (205) and the first flow guide tube (204), and both the second flow guide tube (205) and the first flow guide tube (204) being connected to the groove (104).

4. The frequency source packaging structure according to claim 2, characterized in that: The circulating member (3) comprises a rotating disk (301), the rotating disk (301) being arranged inside the fixed cover (101) and rotating relative to the fixed cover (101), a connecting rod (302) being provided at one edge of the rotating disk (301), a control rod (304) being provided outside the connecting rod (302), the control rod (304) sliding inside the groove (104), a sliding groove (303) being provided inside the control rod (304), the connecting rod (302) sliding inside the sliding groove (303), a sliding plate (305) being provided outside the control rod (304), and the sliding plate (305) sliding inside the groove (104).

5. The frequency source packaging structure according to claim 4, characterized in that: A sealing gasket is also provided on the outside of the sliding plate (305), and the sealing gasket is slidably connected to the groove (104).

6. The frequency source packaging structure according to claim 1, characterized in that: A plurality of heat dissipation fins are provided on the outside of the heat dissipation plate (102).

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