Multipurpose SOT23 packaging structure

Abstract

The utility model discloses a multipurpose SOT23 packaging structure. The multipurpose SOT23 packaging structure comprises a lead frame and a packaging body structure. The lead frame comprises a base island, pins and connecting ribs; the packaging body structure comprises an integrated circuit chip, a lead frame base island and a cooling fin. The lead frame comprises a base island, pins and connecting ribs; the packaging body structure comprises an integrated circuit chip, a lead frame base island and a cooling fin. The connecting ribs are connected with the base islands and the pins; the integrated circuit chip is fixed above the lead frame base island; and through sinking of the lead frame base island, the other surface of the lead frame base island is exposed out of the packaging body, so that the cooling fin is formed. The connecting ribs are additionally arranged on the lead frame, so that plastic package overflow can be effectively prevented, and the pin number, the pin width and the pin spacing of a chip can be conveniently changed on the premise that a plastic package mold is not changed; the heat dissipation fins can enhance the heat dissipation performance of the packaging body and improve the output power of the integrated circuit.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit packaging, in particular to a multi-purpose SOT23 packaging structure. Background Art

[0002] The SOT23 package is currently widely used for small-outline transistors. Its original design goal was to provide a compact, cost-effective, and adaptable packaging solution. With its simple structure and mature manufacturing process, the SOT23 package has gained widespread adoption in the electronics industry, particularly in applications where space is a premium. However, with the continued advancement of integrated circuit technology, the industry's demand for smaller package sizes has led to a shift towards the SOT23 package for many products. However, the fixed pinout of the existing SOT23 package and its insufficient heat dissipation capabilities have limited product selection. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a multi-purpose SOT23 packaging structure, which is better suitable for modern electronic equipment.

[0004] In order to solve the above technical problems, the utility model provides a multi-purpose SOT23 packaging structure, including a lead frame and a packaging body structure;

[0005] The lead frame includes a base island, pins and connecting ribs; the package structure includes an integrated circuit chip, a lead frame base island and a heat sink;

[0006] The connecting ribs are connected to the base island and the pins; the integrated circuit chip is fixed above the lead frame base island; by sinking the lead frame base island, the side of the lead frame base island that does not fix the integrated circuit chip is exposed outside the package, thereby forming the heat sink.

[0007] Furthermore, the connecting ribs on both sides are connected to the pins, and the upper and lower connecting ribs are connected to the base island.

[0008] Compared with the prior art, the present invention has at least the following beneficial effects:

[0009] The utility model adds connecting ribs to the lead frame, which can prevent plastic packaging overflow and eliminate the need for pin grooves in the plastic packaging mold. When the number of pins, pin width and pin spacing of the lead frame are changed, the plastic packaging mold does not need to be changed.

[0010] In addition, since the integrated circuit chip is bonded above the lead frame instead of below the lead frame, the base island of the lead frame can be sunk so that the back side of the base island is exposed outside the package to form a heat sink. The heat generated by the integrated circuit chip is dissipated through the base island, thereby improving the power of the integrated circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic structural diagram of a SOT23-6 lead frame in one embodiment of the present invention;

[0012] Figure 2a It is a schematic diagram of the front structure of SOT23-6 in the prior art;

[0013] Figure 2b It is a schematic diagram of the side structure of SOT23-6 in the prior art;

[0014] Figure 2c This is a schematic diagram of the rear structure of SOT23-6 in the prior art;

[0015] Figure 3a This is a schematic diagram of the front structure of SOT23-6 in one embodiment of the present utility model;

[0016] Figure 3b This is a schematic side view of the structure of SOT23-6 in one embodiment of the present invention;

[0017] Figure 3c This is a schematic diagram of the rear structure of SOT23-6 in one embodiment of the present utility model;

[0018] Figure 4a This is a schematic diagram of the front structure of SOT23-4 in one embodiment of the present utility model;

[0019] Figure 4b This is a schematic diagram of the rear structure of SOT23-4 in one embodiment of the present utility model;

[0020] Figure 5 This is a schematic diagram of the front structure of SOT23-8 in one embodiment of the present invention.

[0021] Figure numbers: 1. Pin; 2. Base island; 3. Connecting rib; 4. Integrated circuit chip; 5. Lead frame; 6. Lead frame base island; 7. Heat sink; 8. Package body. DETAILED DESCRIPTION

[0022] The following is a more detailed description of a multi-purpose SOT23 package structure of the present invention, with reference to schematic diagrams, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art may modify the present invention described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as a general guide for those skilled in the art and not as a limitation of the present invention.

[0023] The following paragraphs describe the present invention in more detail by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are greatly simplified and not to exact scale, and are intended solely to facilitate and clearly illustrate the embodiments of the present invention.

[0024] like Figures 1 to 5 As shown, the embodiment of the present invention provides a multi-purpose SOT23 packaging structure, including a lead frame 5 and a packaging body structure.

[0025] Specifically, the lead frame 5 includes a lead 1 , a base island 2 and a connecting rib 3 , and the connecting rib 3 is connected to the base island 2 and the lead 1 .

[0026] In a specific embodiment, Figure 1 As shown, the lead frame 5 is specifically described by taking SOT23-6 as an example. The pins 1 on the left and right sides of the lead frame 5 are connected by the connecting ribs 3, and the connecting ribs 3 on the upper and lower sides of the frame 5 are connected to the base island 2 to provide necessary electrical connections.

[0027] In this embodiment, if Figures 3a-3c As shown, the package structure includes an integrated circuit chip 4, a lead frame base island 6, and a heat sink 7. The integrated circuit chip 4 is bonded to the top of the lead frame base island 6. By sinking the lead frame base island 6, the side of the lead frame base island 6 where the integrated circuit chip 4 is not mounted is exposed outside the package body 8, thereby forming the heat sink 7.

[0028] In a specific embodiment, the width and spacing of the pins 1 can be arbitrarily varied within the scope of the package body 8 .

[0029] like Figures 2a-2c As shown, the ESOT23-6 model includes six pins 1, the width of each pin 1 can be set to 0.35 mm, the pitch between each pin 1 can be set to 0.60 mm, and the package body 8 adopts the dimensions of an existing package body 8. The heat sink 7 is set to 1.9 mm in length and 0.7 mm in width. The integrated circuit chip 4 can transfer heat to the circuit board through the heat sink 7, thereby reducing the temperature of the integrated circuit chip 4.

[0030] like Figure 4a-4b As shown, the ESOT23-4 model includes four pins 1, and the widths and spacings of the four pins 1 are different. According to actual needs, the width of the pins 1 can be designed to be 0.65mm, 0.9mm, or 0.3mm.

[0031] like Figure 5 As shown, the SOT23-8 model includes eight pins 1 , the width of the pins 1 can be set to 0.30 mm, and the pitch between the pins 1 can be set to 0.40 mm.

[0032] In summary, the utility model arranges the integrated circuit chip 4 above the lead frame 5, that is, changes the packaging form from inverted packaging to upright packaging, and introduces a heat sink 7, thereby effectively enhancing the heat dissipation performance of the package and improving the output power of the integrated circuit; adding connecting ribs to the lead frame 5 can prevent plastic packaging overflow while making the plastic packaging mold unnecessary for pin grooves, and when changing the number of pins, pin width and pin spacing of the lead frame 5, there is no need to change the plastic packaging mold, so that the user can arbitrarily change the number of pins 1 and adjust the width and spacing of the pins 1 within the range of the package body 8 according to actual needs.

[0033] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A multi-purpose SOT23 package structure, characterized in that: Including lead frame and package structure; The lead frame includes a base island, pins and connecting ribs; the package structure includes an integrated circuit chip, a lead frame base island and a heat sink; The connecting ribs are connected to the base island and the pins; the integrated circuit chip is fixed above the lead frame base island; by sinking the lead frame base island, the side of the lead frame base island that does not fix the integrated circuit chip is exposed outside the package, thereby forming the heat sink.

2. The SOT23 package structure according to claim 1, wherein: The connecting ribs on both sides are connected to the pins, and the upper and lower connecting ribs are connected to the base island.

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