Board card assembly and semiconductor testing machine

Abstract

The utility model relates to a board card assembly and a semiconductor testing machine. The board card assembly comprises a first circuit board, a second circuit board, a third circuit board, a first water cooling board and a second water cooling board, the first circuit board, the second circuit board and the third circuit board are electrically connected, the first water cooling board and the second water cooling board are used for heat dissipation, the first water cooling board is clamped between the first circuit board and the second circuit board so as to dissipate heat of the first circuit board and the second circuit board, and the second water cooling board is clamped between the second circuit board and the second circuit board. And the second water cooling plate is arranged between the second circuit board and the third circuit board so as to at least cool the third circuit board. According to the board card assembly and the semiconductor testing machine, the integration level of the board card can be improved, and the heat dissipation problem of the board card can be solved. The semiconductor testing machine provided by the utility model comprises the board card assembly.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a board assembly and a semiconductor testing machine. Background Art

[0002] The components on tester boards generate a lot of heat and often require cooling. One method is to use a water cooling plate. To address this, existing tester boards typically support a maximum of two PCBs, each covered by a water cooling plate or sandwiched between two PCBs. This allows the components to dissipate heat through contact with the cooling plate. This makes it difficult to further increase the integration density of existing tester boards, limiting performance improvements.

[0003] In view of this, it is necessary to propose a new technical solution to overcome the shortcomings of the existing technology. Utility Model Content

[0004] Based on this, the present application provides a board assembly and a semiconductor testing machine, aiming to improve the integration of the board and solve its heat dissipation problem.

[0005] To this end, the present application adopts the following technical solution: a board assembly, which includes a first circuit board, a second circuit board and a third circuit board that are electrically connected, and a first water-cooling plate and a second water-cooling plate for heat dissipation, wherein the first water-cooling plate is clamped between the first circuit board and the second circuit board to dissipate heat to the first circuit board and the second circuit board, and the second water-cooling plate is arranged between the second circuit board and the third circuit board to dissipate heat to at least the third circuit board.

[0006] In one embodiment, the components on the first circuit board and the components on the second circuit board are in contact with two opposite surfaces of the first water-cooling plate for heat dissipation, respectively, and the components on the third circuit board are in contact with the second water-cooling plate for heat dissipation.

[0007] In one embodiment, the first circuit board and the second circuit board are connected at one end through an electrical connector to form a business board module, and the third circuit board constitutes a main control board module. The main control board module is electrically connected to the business board module and connected to the power supply and / or output signal through an adapter board.

[0008] In one embodiment, the board assembly includes a fixing bar connected to the first water-cooling plate and the second water-cooling plate to connect and fix the first water-cooling plate and the second water-cooling plate.

[0009] In one embodiment, the board assembly includes a circulating flow component for circulating the coolant in the first water-cooling plate and the second water-cooling plate, and the circulating flow component is configured to connect the first water-cooling plate and the second water-cooling plate in series.

[0010] In one embodiment, the first water-cooling plate has a first liquid inlet and a first liquid outlet, and the second water-cooling plate has a second liquid inlet and a second liquid outlet; wherein,

[0011] The first liquid outlet is connected to the second liquid inlet, and the coolant is transported from the first liquid inlet to the first water-cooled plate through the input pipe, and flows out of the second water-cooled plate from the second liquid outlet through the output pipe;

[0012] Alternatively, the second liquid outlet is connected to the first liquid inlet, and the cooling liquid is transported from the second liquid inlet to the second water-cooled plate through the input pipe, and flows out of the first water-cooled plate from the first liquid outlet through the output pipe.

[0013] In one embodiment, the input pipe and the output pipe are respectively connected to the first water-cooling plate or the second water-cooling plate through a docking plug and an adapter that cooperates with the docking plug. The adapter has a first interface that is plugged into the docking plug and a second interface that is connected to the first water-cooling plate or the second water-cooling plate. The first interface and the second interface are non-coaxially arranged.

[0014] In one embodiment, the board assembly includes a circulating flow component for circulating the coolant in the first water-cooling plate and the second water-cooling plate, and the circulating flow component is configured to connect the first water-cooling plate and the second water-cooling plate in parallel.

[0015] In one embodiment, the first water-cooled plate has a first liquid inlet and a first liquid outlet, the second water-cooled plate has a second liquid inlet and a second liquid outlet, and the circulating flow component includes a liquid inlet three-way valve and a liquid outlet three-way valve, the liquid inlet three-way valve is connected to the first liquid inlet and the second liquid inlet, respectively, and the liquid outlet three-way valve is connected to the first liquid outlet and the second liquid outlet, respectively.

[0016] The present application also adopts the following technical solution: a semiconductor tester, which includes the board assembly as described above.

[0017] The board assembly provided in the present application includes three circuit boards and two water-cooling plates. The first water-cooling plate is clamped between the first circuit board and the second circuit board to dissipate heat for the first circuit board and the second circuit board. The second water-cooling plate is arranged between the second circuit board and the third circuit board to dissipate heat for at least the third circuit board, thereby improving the board integration and solving the heat dissipation problem of multiple circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a three-dimensional assembly diagram of an embodiment of the board card assembly of the present application.

[0020] Figure 2 This is a three-dimensional exploded view of an embodiment of the board assembly of the present application.

[0021] Figure 3 This is a three-dimensional exploded view from another perspective of an embodiment of the board card assembly of the present application.

[0022] Figure 4 For the Figure 1 Sectional view along line AA.

[0023] Figure 5 for Figure 4 A partial enlarged view of point B in the middle.

[0024] Figure 6 This is a partial enlarged view of the circulating flow component in one embodiment of the board assembly of this application.

[0025] Figure 7 This is a cross-sectional view of an adapter in one embodiment of the board assembly of the present application.

[0026] Figure 8 This is a three-dimensional assembly diagram of another embodiment of the board assembly of the present application.

[0027] The components are numbered as follows: 100, board assembly; 11, first circuit board; 111, first electrical connector; 12, second circuit board; 121, second electrical connector; 13, third circuit board; 14, adapter board; 21, first water-cooled plate; 211, first plate cover; 212, first plate seat; 213, first liquid inlet; 214, first liquid outlet; 22, second water-cooled plate; 221, second plate cover; 222, second plate seat; 223, second liquid outlet; 224, second liquid inlet; 23, circulating flow component; 231, docking plug; 232, adapter; 2321, first interface; 2322, second interface; 234, liquid inlet three-way valve; 235, liquid outlet three-way valve; 3, fixing bar. DETAILED DESCRIPTION

[0028] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0029] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise expressly specified or limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact through an intermediate medium. Furthermore, a first feature being “above,” “above,” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below,” “below,” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0033] See also Figures 1 to 8As shown, the present application provides a board assembly 100, which includes a first circuit board 11, a second circuit board 12, and a third circuit board 13 that are electrically connected, and a first water-cooling plate 21 and a second water-cooling plate 22 for heat dissipation. The first water-cooling plate 21 is clamped between the first circuit board 11 and the second circuit board 12 to dissipate heat from the first circuit board 11 and the second circuit board 12, and the second water-cooling plate 22 is disposed between the second circuit board 12 and the third circuit board 13 to dissipate heat from at least the third circuit board 13.

[0034] The board assembly 100 provided in the present application includes three circuit boards and two water-cooling plates. The first water-cooling plate 21 is clamped between the first circuit board 11 and the second circuit board 12 to dissipate heat for the first circuit board 11 and the second circuit board 12. The second water-cooling plate 22 is arranged between the second circuit board 12 and the third circuit board 13 to dissipate heat for at least the third circuit board 13. This improves the board integration and solves the heat dissipation problem of multiple circuit boards.

[0035] See also Figures 1 to 3 As shown, in this embodiment, the two opposite surfaces of the first water-cooling plate 21 are configured to be suitable for contacting components on the circuit board. The components on the first circuit board 11 and the components on the second circuit board 12 are respectively in contact with the two opposite surfaces of the first water-cooling plate 21 for heat dissipation. Figure 4 and Figure 5 As shown, the first water-cooled plate 21 includes a first plate cover 211 and a first plate seat 212. The first plate cover 211 and the first plate seat 212 are sealed and connected by welding or other means, and a chamber for containing coolant is formed between the two. A raised groove structure is provided on the outer surface of the first plate cover 211 and the first plate seat 212, which is used to contact and dissipate heat for the components on the first circuit board 11 and the second circuit board 12. The components contact the raised groove structure through heat-conducting parts such as thermal pads or thermal grease to achieve good heat exchange and improve heat dissipation performance. The components on the first circuit board 11 and the second circuit board 12 are mainly arranged on the front side of the circuit board, and the welding pins of the components are passed through the back side of the circuit board for welding. The first circuit board 11 and the second circuit board 12 are arranged on both sides of the first water-cooled plate 21 in a front-to-face manner.

[0036] The structure of the second water-cooled plate 22 is roughly similar to that of the first water-cooled plate 21. Specifically, the second water-cooled plate 22 includes a second plate cover 221 and a second plate seat 222. The second plate cover 221 and the second plate seat 222 are sealed and connected by welding or other means, and a chamber for containing coolant is formed between the two. In this embodiment, the second water-cooled plate 22 only dissipates heat to the third circuit board 13. The third circuit board 13 is arranged on the lower side of the second water-cooled plate 22, that is, on the side of the second plate seat 222 of the second water-cooled plate 22. Therefore, the outer surface of the second plate seat 222 is provided with a raised groove structure suitable for contacting the components on the third circuit board 13 to dissipate heat by contacting the components on the third circuit board 13; the components contact the above-mentioned raised groove structure through heat-conducting parts such as thermal pads or thermal grease to achieve good heat exchange and improve heat dissipation performance. The second plate cover 221 is arranged close to the back of the second circuit board 12 and does not dissipate heat to the components on the circuit board. Therefore, the outer surface of the second plate cover 221 is flat and no raised groove structure is provided. Of course, in other embodiments, for example, components are also provided on the back of the second circuit board 12, and the second water-cooling plate 22 can also dissipate heat for the second circuit board 12, then the second plate cover 221 of the second water-cooling plate 22 can be provided with a protrusion and groove structure adapted to the components.

[0037] See also Figures 2 to 5 As shown, in this embodiment, the first circuit board 11 and the second circuit board 12 are connected at one end by an electrical connector to form a business board module, and the third circuit board 13 constitutes a main control board module. The main control board module is electrically connected to the business board module and is connected to the power supply and transmission signal through the adapter board 14. Specifically, the first circuit board 11 includes a first electrical connector 111, and the second circuit board 12 is provided with a second electrical connector 121 that is plugged in and matched with the first electrical connector 111. One of the first electrical connector 111 and the second electrical connector 121 is a male connector and the other is a female connector, and the two are plugged in to achieve electrical connection. The main control board module can be electrically connected to the business board module through the adapter board 14, and can also be directly plugged in and connected to the business board module through a separately provided electrical connector.

[0038] The board assembly 100 also includes a fixing bar 3, which is connected to the first water-cooled plate 21 and the second water-cooled plate 22 to connect and fix the first water-cooled plate 21 and the second water-cooled plate 22. In this embodiment, the first circuit board 11, the first water-cooled plate 21, the second circuit board 12, the second water-cooled plate 22 and the third circuit board 13 are stacked and arranged in sequence from top to bottom, so that the first water-cooled plate 21 and the second water-cooled plate 22 not only achieve heat dissipation for the circuit boards, but also can form a gap between the two circuit boards to improve electrical safety. The first circuit board 11 and the second circuit board 12 are fixed to the first water-cooled plate 21, and the third circuit board 13 is fixed to the second water-cooled plate 22. There are two fixing bars 3, which connect and fix the first water-cooled plate 21 and the second water-cooled plate 22 on opposite sides, so that each circuit board and the water-cooled plate are fixed as a whole.

[0039] See also Figures 1 to 3 and Figure 6 As shown, the board assembly 100 includes a circulating flow component 23 for the flow of coolant in the first water-cooled plate 21 and the second water-cooled plate 22. The circulating flow component 23 includes a pump, pipes and related joints, etc., which are used to realize the flow of coolant into and out of the water-cooled plate.

[0040] exist Figures 1 to 7 In the embodiment shown, the circulation flow component 23 is configured to connect the first water cooling plate 21 and the second water cooling plate 22 in series. For the case where the heat generation of the main control card module and the business card module is similar and the mutual heat dissipation effect between the two is small, a series connection can be adopted. Figure 6 As shown, the first water-cooled plate 21 has a first liquid inlet 213 and a first liquid outlet 214, and the second water-cooled plate 22 has a second liquid inlet 224 and a second liquid outlet 223. The first liquid outlet 214 and the second liquid inlet 224 are connected, and the coolant is transported from the first liquid inlet 213 to the first water-cooled plate 21 through an inlet pipe and flows out of the second water-cooled plate 22 through the second liquid outlet 223 through an outlet pipe. In this way, the coolant flows from the first water-cooled plate 21 to the second water-cooled plate 22. Alternatively, the second liquid outlet 223 is connected to the first liquid inlet 213, and the coolant is transported from the second liquid inlet 224 to the second water-cooled plate 22 through an inlet pipe and flows out of the first water-cooled plate 21 through the first liquid outlet 214 through an outlet pipe. In this way, the coolant flows from the second water-cooled plate 22 to the first water-cooled plate 21.

[0041] See also Figure 7As shown, in this embodiment, the input and output pipes are connected to the first or second water-cooling plate 21 or 22 respectively via a docking plug 231 and an adapter 232 that mates with the docking plug 231. The adapter 232 has a first interface 2321 that plugs into the docking plug 231 and a second interface 2322 that connects to the first or second water-cooling plate 21 or 22. The first interface 2321 and the second interface 2322 are non-coaxially arranged. That is, the interfaces at both ends of the adapter 232 are eccentric. When the second interface 2322 is connected to the water-cooling plate, the first interface 2321 can be positioned lower than the second interface 2322. This prevents the profile of the docking plug 231 that mates with the first interface 2321 from protruding above the upper surface of the water-cooling plate, thereby exceeding the dimensional constraints of the board assembly 100 in the thickness direction. In this embodiment, the first interface 2321 is an internally threaded interface, and the second interface 2322 is an externally threaded interface. The externally threaded interface connects to the water-cooling plate, while the docking plug 231 connected to the internally threaded interface is a self-locking male connector. In this embodiment, the input pipe, the output pipe and the pipe connected between the two water-cooling plates can be PU (Polyurethane) hoses. At the same time, to facilitate the connection of the pipes, the circulation flow component 23 also includes a plurality of right-angle joints.

[0042] See also Figure 8 As shown, it is another embodiment of the present application. Figures 1 to 7The circuit boards and water-cooled plates in the illustrated embodiment have similar structures, with the main difference being the connection method between the first water-cooled plate 21 and the second water-cooled plate 22. In this embodiment, the board assembly 100 includes a circulating flow component 23 for circulating coolant in the first water-cooled plate 21 and the second water-cooled plate 22. The circulating flow component 23 is configured to connect the first water-cooled plate 21 and the second water-cooled plate 22 in parallel. Specifically, the first water-cooled plate 21 has a first liquid inlet 213 and a first liquid outlet 214, and the second water-cooled plate 22 has a second liquid inlet 224 and a second liquid outlet 223. The circulating flow component 23 includes a liquid inlet three-way valve 234 and a liquid outlet three-way valve 235. The liquid inlet three-way valve 234 connects the first liquid inlet 213 and the second liquid inlet 224, respectively, and the liquid outlet three-way valve 235 connects the first liquid outlet 214 and the second liquid outlet 223, respectively. The first water-cooled plate 21 and the second water-cooled plate 22 are connected in parallel, so the heat dissipation of the two water-cooled plates does not affect each other, and the flow resistance of the entire plate is low. In some embodiments, the opening of the three-way valve is set to be adjustable, so that the flow rate of the coolant flowing to the first water-cooled plate 21 and the second water-cooled plate 22 can be distributed according to the different heat dissipation requirements of the two water-cooled plates. In this embodiment, the inlet and outlet of the first water-cooled plate 21 and the second water-cooled plate 22 are respectively installed with straight-through connectors, and then connected to the PU hose. The other end of the PU hose is connected to the same straight-through connector, and then the two straight-through connectors are installed on a three-way valve through threads. The other end of the three-way valve is installed with a self-locking quick-plug male connector, which is connected to the liquid cooling pipeline of the test machine. In this embodiment, the three-way valve includes a main body and a cover plate, and the two are welded into an integral structure by friction welding. Parts or structures not described in this embodiment can be referred to. Figures 1 to 6 The configuration of the embodiment shown will not be described in detail here.

[0043] The present application also provides a semiconductor tester, which includes the above board assembly 100.

[0044] From the above description of the specific embodiments, it can be seen that the board assembly 100 provided in this application is designed with two water-cooling plates, which can support the heat dissipation of three circuit boards, improve the board integration and solve the heat dissipation problem of components on each circuit board; the two water-cooling plates are further set up in parallel and series connection modes to meet different connection and heat dissipation scenarios.

[0045] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A board assembly, characterized in that: The board assembly includes a first circuit board, a second circuit board, and a third circuit board that are electrically connected, and a first water-cooling plate and a second water-cooling plate for heat dissipation, wherein the first water-cooling plate is clamped between the first circuit board and the second circuit board to dissipate heat for the first circuit board and the second circuit board, and the second water-cooling plate is arranged between the second circuit board and the third circuit board to dissipate heat for at least the third circuit board.

2. The board assembly according to claim 1, wherein: The components on the first circuit board and the components on the second circuit board are respectively in contact with two opposite surfaces of the first water-cooling plate for heat dissipation, and the components on the third circuit board are in contact with the second water-cooling plate for heat dissipation.

3. The board assembly according to claim 2, wherein: The first circuit board and the second circuit board are connected at one end through an electrical connector to form a business board module, and the third circuit board constitutes a main control board module. The main control board module is electrically connected to the business board module and connected to the power supply and / or output signal through the adapter board.

4. The board assembly according to claim 1, wherein: The board assembly includes a fixing bar connected to the first water-cooling plate and the second water-cooling plate to connect and fix the first water-cooling plate and the second water-cooling plate.

5. The board assembly according to any one of claims 1 to 4, characterized in that: The board assembly includes a circulation flow component for flowing the coolant in the first water-cooling plate and the second water-cooling plate, and the circulation flow component is configured to connect the first water-cooling plate and the second water-cooling plate in series.

6. The board assembly according to claim 5, wherein: The first water-cooling plate has a first liquid inlet and a first liquid outlet, and the second water-cooling plate has a second liquid inlet and a second liquid outlet; wherein, The first liquid outlet is connected to the second liquid inlet, and the coolant is transported from the first liquid inlet to the first water-cooled plate through the input pipe, and flows out of the second water-cooled plate from the second liquid outlet through the output pipe; Alternatively, the second liquid outlet is connected to the first liquid inlet, and the cooling liquid is transported from the second liquid inlet to the second water-cooled plate through the input pipe, and flows out of the first water-cooled plate from the first liquid outlet through the output pipe.

7. The board assembly according to claim 6, wherein: The input pipe and the output pipe are respectively connected to the first water-cooling plate or the second water-cooling plate through a docking plug and an adapter that cooperates with the docking plug. The adapter has a first interface that is plugged into the docking plug and a second interface that is connected to the first water-cooling plate or the second water-cooling plate. The first interface and the second interface are non-coaxially arranged.

8. The board assembly according to any one of claims 1 to 4, characterized in that: The board assembly includes a circulating flow component for circulating the coolant in the first water-cooling plate and the second water-cooling plate, and the circulating flow component is configured to connect the first water-cooling plate and the second water-cooling plate in parallel.

9. The board assembly according to claim 8, wherein: The first water-cooled plate has a first liquid inlet and a first liquid outlet, the second water-cooled plate has a second liquid inlet and a second liquid outlet, and the circulating flow component includes a liquid inlet three-way valve and a liquid outlet three-way valve, the liquid inlet three-way valve is connected to the first liquid inlet and the second liquid inlet respectively, and the liquid outlet three-way valve is connected to the first liquid outlet and the second liquid outlet respectively.

10. A semiconductor testing machine, characterized in that: The semiconductor testing machine includes the board assembly according to any one of claims 1 to 9.

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