Circuit driving board integrated with heat dissipation function

Abstract

The utility model discloses a circuit driving board integrated with a heat dissipation function, which comprises a main board, a device module and a heat dissipation module, and the device module and the heat dissipation module are both installed on the main board. A first supporting column, a second supporting column, a third supporting column and a fourth supporting column are arranged on the periphery of the main plate, and the first supporting column, the second supporting column, the third supporting column and the fourth supporting column face the second side of the main plate; the main board is further provided with a first heat dissipation mounting hole, a second heat dissipation mounting hole, a third heat dissipation mounting hole and a fourth heat dissipation mounting hole. According to the circuit driving board integrated with the heat dissipation function, the mainboard, the device module and the heat dissipation module are linked, and the heat dissipation module is directly integrated on the mainboard, so that heat generated when the device module works is quickly and effectively dissipated, and the circuit driving board has the advantages of being stable in structure, good in heat dissipation effect, high in practicability and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit driving boards, and in particular relates to a circuit driving board with integrated heat dissipation function. Background Art

[0002] A driver circuit board is an electronic device that receives control signals and converts them into power signals capable of driving other electronic devices or mechanical devices. These boards typically include components such as power amplifiers, control logic, and protection circuits. They are used in a variety of applications, such as motor driving, LED driving, and power conversion.

[0003] When the driver circuit board is working, it often generates a lot of heat, which increases the working environment temperature. If the heat is not dissipated in time, it will affect the service life and working condition. Many existing heat dissipation methods are to add external fans or heat dissipation structures. On the one hand, they cannot directly contact the circuit board, resulting in poor heat dissipation effect, and on the other hand, they increase the occupied space.

[0004] Therefore, further improvements are made to the above problems. Utility Model Content

[0005] The main purpose of the utility model is to provide a circuit driving board with integrated heat dissipation function, which is linked by a mainboard, a device module and a heat dissipation module, and the heat dissipation module is directly integrated into the mainboard, so as to quickly and effectively dissipate the heat generated by the device module when it is working. It has the advantages of stable structure, good heat dissipation effect and high practicality.

[0006] To achieve the above objectives, the present invention provides a circuit driver board with integrated heat dissipation function, comprising a mainboard, a device module and a heat dissipation module, wherein the device module and the heat dissipation module are both mounted on the mainboard, wherein:

[0007] The mainboard is provided with a first support column, a second support column, a third support column and a fourth support column around it, and the first support column, the second support column, the third support column and the fourth support column face the second side of the mainboard, and the mainboard is further provided with a first heat dissipation mounting hole, a second heat dissipation mounting hole, a third heat dissipation mounting hole and a fourth heat dissipation mounting hole;

[0008] The device module includes a main controller, a first connection terminal, a second connection terminal, a third connection terminal, a fourth connection terminal, a fifth connection terminal, a sixth connection terminal, a seventh connection terminal, an eighth connection terminal, a ninth connection terminal, and a plurality of tenth connection terminals installed on a first side of the mainboard; the device module also includes a first processor and a second processor installed on a second side of the mainboard;

[0009] The heat dissipation module includes a main body, a first extension end, a second extension end, a first mounting column, a second mounting column and a plurality of heat sinks, the first extension end and the second extension end are located on one side of the main body, the first extension end is provided with a third mounting column and the second extension end is provided with a fourth mounting column, the first mounting column and the second mounting column are located on the other side of the main body, the first mounting column is installed in the first heat dissipation mounting hole and the second mounting column is installed in the second heat dissipation mounting hole, the third mounting column is installed in the third heat dissipation mounting hole and the fourth mounting column is installed in the fourth heat dissipation mounting hole, and the heat sink is located on a side of the main body away from the main board.

[0010] As a further preferred technical solution of the above technical solution, the heat sink is provided with a wave-shaped structure (to improve the heat dissipation effect).

[0011] As a further preferred technical solution of the above technical solution, the mainboard is provided with a first card slot and a second card slot.

[0012] As a further preferred technical solution of the above technical solution, the first support column, the second support column, the third support column and the fourth support column are all provided with foot pads.

[0013] As a further preferred technical solution of the above technical solution, the main controller is located between the main board and the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a structural diagram of a circuit driving board with integrated heat dissipation function of the utility model.

[0015] Figure 2 This is a structural diagram of a circuit driving board with integrated heat dissipation function of the utility model.

[0016] Figure 3 This is a structural diagram of a circuit driving board with integrated heat dissipation function of the utility model.

[0017] Figure 4 The utility model is a structural schematic diagram of a heat dissipation module of a circuit driving board with integrated heat dissipation function.

[0018] Reference numerals include: 100, mainboard; 101, first support column; 102, second support column; 103, third support column; 104, fourth support column; 105, first heat dissipation mounting hole; 106, second heat dissipation mounting hole; 107, third heat dissipation mounting hole; 108, fourth heat dissipation mounting hole; 109, first card slot; 110, second card slot; 200, device module; 201, main controller; 202, first connection terminal; 203, second connection terminal; 204, third connection terminal; 205 , fourth connection end; 206, fifth connection end; 207, sixth connection end; 208, seventh connection end; 209, eighth connection end; 210, ninth connection end; 211, tenth connection end; 212, first processor; 213, second processor; 300, heat dissipation module; 310, main body; 320, first extension end; 321, third mounting column; 330, second extension end; 331, fourth mounting column; 340, first mounting column; 350, second mounting column; 360, heat sink. DETAILED DESCRIPTION

[0019] The following description is intended to disclose the present invention and enable those skilled in the art to implement the present invention. The preferred embodiments described below are provided for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention as defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0020] The utility model discloses a circuit driving board with integrated heat dissipation function. The specific embodiments of the utility model will be further described below in conjunction with preferred embodiments.

[0021] In the embodiments of the present invention, those skilled in the art will note that the motherboard and the like involved in the present invention may be regarded as prior art.

[0022] Preferred embodiment.

[0023] like Figure 1-4 As shown, the utility model discloses a circuit driving board with integrated heat dissipation function, including a mainboard 100, a device module 200 and a heat dissipation module 300, wherein the device module 200 and the heat dissipation module 300 are both installed on the mainboard 100, wherein:

[0024] The mainboard 100 is provided with a first support column 101, a second support column 102, a third support column 103 and a fourth support column 104 around it, and the first support column 101, the second support column 102, the third support column 103 and the fourth support column 104 face the second side of the mainboard 100. The mainboard 100 is also provided with a first heat dissipation mounting hole 105, a second heat dissipation mounting hole 106, a third heat dissipation mounting hole 107 and a fourth heat dissipation mounting hole 108.

[0025] The device module 200 includes a main controller 201 installed on a first side of the motherboard 100, a first connection terminal 202, a second connection terminal 203, a third connection terminal 204, a fourth connection terminal 205, a fifth connection terminal 206, a sixth connection terminal 207, a seventh connection terminal 208, an eighth connection terminal 209, a ninth connection terminal 210, and a plurality of tenth connection terminals 211; the device module 200 also includes a first processor 212 and a second processor 213 installed on a second side of the motherboard 100;

[0026] The heat dissipation module 300 includes a main body 310, a first extension end 320, a second extension end 330, a first mounting column 340, a second mounting column 350 and a plurality of heat sinks 360. The first extension end 320 and the second extension end 330 are located on one side of the main body 310. The first extension end 320 is provided with a third mounting column 321 and the second extension end 330 is provided with a fourth mounting column 331. The first mounting column 340 and the second mounting column 340 are located on the other side of the main body 310. The first mounting column 340 is installed in the first heat dissipation mounting hole 105 and the second mounting column 350 is installed in the second heat dissipation mounting hole 106. The third mounting column 321 is installed in the third heat dissipation mounting hole 107 and the fourth mounting column 331 is installed in the fourth heat dissipation mounting hole 108. The heat sink 360 is located on a side of the main body 310 away from the motherboard 100.

[0027] Specifically, the heat sink 360 is provided with a wave-shaped structure (not shown, to improve the heat dissipation effect).

[0028] More specifically, the mainboard 100 is provided with a first card slot 109 and a second card slot 110 .

[0029] Furthermore, the first support column 101 , the second support column 102 , the third support column 103 and the fourth support column 104 are all provided with foot pads.

[0030] Furthermore, the main controller 201 is located between the mainboard 100 and the main body 310 .

[0031] It is worth mentioning that the technical features such as the main board involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial layout method of these technical features can be selected by conventional options in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated.

[0032] For those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned embodiments, or to replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. A circuit driver board with integrated heat dissipation function, characterized in that: It includes a mainboard, a device module and a heat dissipation module, wherein the device module and the heat dissipation module are both installed on the mainboard, wherein: The mainboard is provided with a first support column, a second support column, a third support column and a fourth support column around it, and the first support column, the second support column, the third support column and the fourth support column face the second side of the mainboard, and the mainboard is further provided with a first heat dissipation mounting hole, a second heat dissipation mounting hole, a third heat dissipation mounting hole and a fourth heat dissipation mounting hole; The device module includes a main controller, a first connection terminal, a second connection terminal, a third connection terminal, a fourth connection terminal, a fifth connection terminal, a sixth connection terminal, a seventh connection terminal, an eighth connection terminal, a ninth connection terminal, and a plurality of tenth connection terminals installed on a first side of the mainboard; the device module also includes a first processor and a second processor installed on a second side of the mainboard; The heat dissipation module includes a main body, a first extension end, a second extension end, a first mounting column, a second mounting column and a plurality of heat sinks, the first extension end and the second extension end are located on one side of the main body, the first extension end is provided with a third mounting column and the second extension end is provided with a fourth mounting column, the first mounting column and the second mounting column are located on the other side of the main body, the first mounting column is installed in the first heat dissipation mounting hole and the second mounting column is installed in the second heat dissipation mounting hole, the third mounting column is installed in the third heat dissipation mounting hole and the fourth mounting column is installed in the fourth heat dissipation mounting hole, and the heat sink is located on a side of the main body away from the main board.

2. The circuit driving board with integrated heat dissipation function according to claim 1, characterized in that: The heat sink is provided with a wave-shaped structure.

3. The circuit driving board with integrated heat dissipation function according to claim 2, characterized in that: The mainboard is provided with a first card slot and a second card slot.

4. The circuit driving board with integrated heat dissipation function according to claim 3, characterized in that: The first support column, the second support column, the third support column and the fourth support column are all provided with foot pads.

5. The circuit driving board with integrated heat dissipation function according to claim 4, characterized in that: The main controller is located between the main board and the body.

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