Cooling structure of cold conduction module with insertion module

Abstract

The cold conduction module heat dissipation structure comprises a cold plate used for heat dissipation, a rear cover plate, an insertion type PCB, a bottom plate PCB and a VPX connector, screws are arranged at the four corners of the rear cover plate, the cold plate is located above the rear cover plate, the rear cover plate is connected with the cold plate through the screws at the four corners, and the insertion type PCB is connected with the bottom plate PCB through the VPX connector. The bottom plate PCB is arranged between the rear cover plate and the cold plate according to the length direction of the rear cover plate, the insertion type PCB is arranged above the bottom plate PCB and located on one side of the bottom plate, screws at the four corners of the rear cover plate penetrate through the bottom plate PCB and the insertion type PCB to be connected with the cold plate, the VPX connector is arranged on one side of the cold plate according to the width direction of the cold plate, and the VPX connector is connected with the bottom plate PCB. By cutting the thickness of other parts of the cold plate, the effect of reducing the overall weight is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of conduction cooling and heat dissipation, in particular to a conduction cooling module heat dissipation structure with a plug-in module group. Background Art

[0002] In some specialized applications, modules require conductive cooling, as reliable and stable operation is often paramount. High-density modules generate significant heat, and dissipating this heat through conductive cooling presents a major challenge in thermal design.

[0003] In typical cooling structures, the cavity height limit is 6.5mm, and the cold plate thickness is 2.5mm. Excess thickness is cut off to reduce overall weight. However, in some special modules, the components are extremely tall, requiring a partial increase in the cavity height limit. This new design utilizes a special-shaped structure to partially elevate the extra-tall components and embed heat pipes inside to meet heat dissipation and weight requirements. Utility Model Content

[0004] The present invention aims to overcome the disadvantages of the prior art that the cavity height limit of the general cooling structure design is 6.5mm, the cold plate thickness is 2.5mm, and the excess thickness is cut off to reduce the weight of the overall structure. However, in some special modules, the components are extremely high and the cavity height limit needs to be partially raised.

[0005] A heat dissipation structure of a cold-conducting module with a plug-in module is proposed, comprising a cold plate, a rear cover, a plug-in PCB, a base PCB and a VPX connector for heat dissipation, wherein screws are provided at the four corners of the rear cover, the cold plate is located above the rear cover, and the rear cover is connected to the cold plate through the screws at the four corners, the base PCB is arranged in the middle position between the rear cover and the cold plate along the length direction of the rear cover, the plug-in PCB is arranged above the base PCB and on one side of the base, the screws at the four corners of the rear cover pass through the base PCB and the plug-in PCB to be connected to the cold plate, the VPX connector is arranged on one side of the cold plate along the width direction of the cold plate, and the VPX connector is connected to the base PCB.

[0006] In the technical solution of the present invention, a cold plate is arranged above the plug-in PCB, CPU, FPGA and PCIE bridge chip of the heat-generating components. The inner wall of the cold plate is tightly attached to the plug-in PCB, CPU, FPGA and PCIE bridge chip, and a square hole is opened inside the cold plate. A heat pipe is arranged inside the square hole. The two ends of the heat pipe are connected to the liquid cooling chassis. Therefore, the heat generated by the plug-in PCB, CPU, FPGA and PCIE bridge chip during operation will be absorbed by the inner wall of the cold plate, and then transmitted to the heat pipe through the cold plate and absorbed by the coolant inside the heat pipe. The plug-in PCB, CPU, FPGA and PCIE bridge chip are cooled by liquid cooling. Therefore, the weight of the device will not exceed the standard while meeting the heat dissipation requirements. It is used to solve the problem mentioned in the technical background that the cavity height limit of the general cooling structure design is 6.5mm, the cold plate thickness is 2.5mm, and the excess thickness is cut off to reduce the weight of the overall structure. However, in some special modules, the device is too high and the cavity height limit needs to be partially raised.

[0007] In the preferred embodiment of the technical solution of the present invention, a gap is left between the rear cover and the base PCB, and the heat on the top of the base PCB will be absorbed by the heat pipe to avoid excessive temperature. There are no heat-generating components on the bottom of the base PCB, so the heat on the top of the base PCB can be dissipated by air cooling when it is transferred to the bottom of the base PCB.

[0008] In a preferred embodiment of the present invention, the bottom surface of the plug-in PCB contacts the top surface of the base PCB, and the inner wall of the cold plate contacts the top surface of the plug-in PCB. Heat generated by the plug-in PCB during operation is absorbed by the heat pipes within the cold plate, and then dissipated from the plug-in PCB via liquid cooling, thereby preventing overheating of the plug-in PCB.

[0009] In the preferred embodiment of the technical solution of the present invention, the plug-in PCB and the base PCB are connected by a COM-E connector. The connection of the COM-E connector is more secure, and it has the design safety and comfort of a standard motherboard and good flexibility.

[0010] In the preferred embodiment of the technical solution of the present invention, multiple groups of square holes are opened inside the cold plate, and heat pipes are buried inside each group of square holes. The two ends of the heat pipes are connected to the liquid cooling chassis. The heat pipes have extremely high thermal conductivity, so the heat generated by the heating components can be quickly absorbed by the heat pipes to avoid local overheating. The heat pipes can transfer heat and control the temperature over a long distance, and due to their efficient thermal conductivity, precise temperature control can be performed, so the heating components can be quickly and accurately cooled when needed.

[0011] According to the preferred technical solution of the present invention, the plug-in PCB is provided with a CPU, an FPGA and a PCIE bridge chip. The FPGA and the PCIE bridge chip are located on one side of the plug-in PCB and are arranged above the base PCB. The CPU is located on one side of the PCIE bridge chip, and the CPU, FPGA and PCIE bridge chip are all soldered on the base PCB.

[0012] In the preferred technical solution of the present invention, the top surfaces of the CPU, FPGA and PCIE bridge chip are all in contact with the inner wall of the cold plate. Therefore, the heat generated by the CPU, FPGA and PCIE bridge chip can be quickly absorbed by the heat pipe inside the cold plate, thereby quickly reducing the temperature of the CPU, FPGA and PCIE bridge chip, and avoiding overheating of the CPU, FPGA and PCIE bridge chip.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The above technical solution can achieve heat dissipation by increasing the internal height and reducing the external cutting depth under the condition of limited longitudinal space, and pre-embed the heat pipe in the cold plate. By cutting the thickness of other parts of the cold plate, the overall weight can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the three-dimensional structure of a cooling module heat dissipation structure with a plug-in module;

[0016] Figure 2 A schematic diagram of the internal structure of a cold plate with a cooling module heat dissipation structure with a plug-in module;

[0017] Figure 3 This is a schematic diagram of the base PCB structure of a cooling module heat dissipation structure with a plug-in module;

[0018] Figure 4 A schematic diagram of the heat pipe arrangement of a cooling module heat dissipation structure with a plug-in module;

[0019] Figure 5 This is a schematic diagram of the overall structure of a module with a cooling module heat dissipation structure with a plug-in module;

[0020] In the figure: 1-cold plate, 11-heat pipe, 2-back cover, 3-plug-in PCB, 31-CPU, 32-FPGA, 33-PCIE bridge, 4-base PCB, 5-VPX connector, 6-square hole. DETAILED DESCRIPTION

[0021] The following is a combination of the appended examples of the present invention Figure 1-5 , the technical solutions in the embodiments of the present utility model are described in detail.

[0022] like Figure 1-5 As shown, a heat dissipation structure of a cold conduction module with a plug-in module includes a cold plate 1 for heat dissipation, a rear cover 2, a plug-in PCB 3, a base PCB 4 and a VPX connector 5. Through holes are provided at the four corners of the rear cover 2, and screws are vertically arranged inside each through hole. Threaded holes are provided on the inner wall of the cold plate 1 at positions corresponding to the four groups of screws. The rear cover 2 is connected to the cold plate 1 through the screws and threaded holes. The cold plate 1 is located above the rear cover 2, and the inner wall of the cold plate 1 is in contact with the plug-in PCB 3, CPU 31, FPGA 32 and PCIe bridge 34 on the base PCB 4.

[0023] like Figure 1-5 As shown, the heat generated by the plug-in PCB3, CPU31, FPGA32 and PCIE bridge 34 during operation will be absorbed by the cold plate 1. The cold plate 1 can be made of copper plate, so the heat-generating components can be dissipated in this way. The base plate PCB4 is inserted and arranged in the middle position of the back cover 2 and the cold plate 1 according to the length direction of the back cover. The plug-in PCB3 is arranged above the base plate PCB4 and is located on one side of the plug-in PCB3. The plug-in PCB3 and the base plate PCB4 are connected with a COM-E connector, and the connection of the COM-E connector is more secure.

[0024] like Figure 1-5 As shown, when the base plate PCB4 is moved, the base plate PCB4 will drive the plug-in PCB3 to move together, and because there is direct contact between the base plate PCB4 and the plug-in PCB3, the heat generated by the base plate PCB4 will be transmitted to the cold plate 1 by the plug-in PCB3. Therefore, the cold plate 1 can dissipate heat to the base plate PCB4 at the corresponding position of the plug-in PCB3 through the plug-in PCB3 to avoid local overheating of the base plate PCB4. Through holes are provided at the four corners of the base plate PCB4 and at positions corresponding to the screws on the rear cover 2. Therefore, the screws on the rear cover 2 will pass through the through holes at the four corners of the base plate PCB4 and then be threadedly connected to the cold plate 1.

[0025] like Figure 1-5As shown, this prevents the base plate PCB4 from being displaced inside the rear cover 2 and the cold plate 1. The VPX connector 5 is arranged on one side of the cold plate 1 along the width direction of the cold plate 1, and the VPX connection is crimped on the base plate PCB4. A plurality of protrusions are provided on the inner wall of the cold plate 1 to ensure that the inner wall of the cold plate 1 can be in complete contact with the CPU 31, FPGA 32 and PCIe bridge 34 on the base plate PCB4, thereby ensuring that the heat generated by the CPU 31, FPGA 32 and PCIe bridge 34 can be directly transmitted to the cold plate 1, thereby preventing the CPU 31, FPGA 32 and PCIe bridge 34 from being unable to be cooled immediately, thereby causing local overheating of the CPU 31, FPGA 32 and PCIe bridge 34.

[0026] like Figure 1-5 As shown, the plug-in PCB3, CPU31, FPGA32 and PCIE bridge piece 34 are all arranged above the base plate PCB4, the FPGA32 and PCIE bridge piece 34 are located on one side of the plug-in PCB3, the CPU31 is located on one side of the PCIE bridge piece 34 and is arranged below the plug-in PCB3, and the CPU31, FPGA32 and PCIE bridge piece 34 are all welded on the base plate PCB4, and a gap is left between the back cover plate 2 and the base plate PCB4. Therefore, part of the heat generated by the CPU31, FPGA32 and PCIE bridge piece 34 during operation will be absorbed by the cold plate 1, and part will be absorbed by the base plate PCB4 and dissipated by air cooling through the through-hole gaps to ensure that the base plate PCB4 will not overheat.

[0027] like Figure 1-5 As shown, the interior of the cold plate 1 is provided with a plurality of groups of square holes along the width direction of the cold plate 1, and a heat pipe 11 is buried inside each group of square holes, and both ends of the heat pipe 11 are connected to the liquid cooling chassis. The heat pipe 11 has extremely high thermal conductivity. Therefore, when the heat generated by the CPU 31, FPGA 32 and PCIE bridge chip 34 during operation is absorbed by the cold plate 1, the heat pipe 11 will immediately absorb the heat absorbed by the cold plate 1. After the heat pipe 11 absorbs the heat, the coolant inside the heat pipe 11 will dissipate the heat from the heat pipe 11 in a liquid cooling manner.

[0028] like Figure 1-5 As shown, when the heat pipe 11 absorbs the heat of the plug-in PCB3, CPU31, FPGA32 and PCIE bridge piece 34 for a long time during operation, causing the temperature of the coolant inside the heat pipe 11 to rise and failing to dissipate heat for the plug-in PCB3, CPU31, FPGA32 and PCIE bridge piece 34, the temperature of the coolant inside the heat pipe 11 can be lowered by the liquid cooling chassis to ensure that the heat pipe 11 can dissipate heat for the plug-in PCB3, CPU31, FPGA32 and PCIE bridge piece 34 in a timely manner.

[0029] The movement process of this embodiment: After placing the base plate PCB4 on top of the rear cover 2, the cold plate 1 can be placed on the base plate PCB4 along the length direction of the rear cover 2. When placing the base plate PCB4, a gap should be left between the base plate PCB4 and the rear cover 2. When placing the cold plate 1, it is necessary to ensure that the inner wall of the cold plate 1 is in contact with the plug-in PCB3, CPU31, FPGA32 and PCIE bridge 34 on the base plate PCB4. Then, screws can be passed through the through holes at the four corners of the rear cover 2 and the base plate PCB4, and then the threaded holes on the inner wall of the cold plate 1 can be connected with screws. After that, the heat pipe 11 inside the cold plate 1 is connected to the liquid cooling chassis, and then the plug-in PCB3, CPU31, FPGA32 and PCIE bridge 34 can be started to work.

[0030] The above embodiments are only for illustrating the technical idea of the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the present invention.

Claims

1. A heat dissipation structure of a cooling module with a plug-in module, characterized in that: The invention comprises a cold plate (1), a rear cover (2), a plug-in PCB (3), a base PCB (4) and a VPX connector (5) for heat dissipation, wherein screws are provided at the four corners of the rear cover (2), the cold plate (1) is located above the rear cover (2), and the rear cover (2) is connected to the cold plate (1) through the screws at the four corners, the base PCB (4) is arranged at a middle position between the rear cover (2) and the cold plate (1) in the length direction of the rear cover (2), the plug-in PCB (3) is arranged above the base PCB (4) and located on one side of the base PCB (4), the screws at the four corners of the rear cover (2) pass through the base PCB (4) and the plug-in PCB (3) to be connected to the cold plate (1), the VPX connector (5) is arranged on one side of the cold plate (1) in the width direction of the cold plate (1), and the VPX connector (5) is connected to the base PCB (4).

2. The heat dissipation structure of a cooling module with a plug-in module according to claim 1, characterized in that: A gap is left between the rear cover (2) and the bottom PCB (4).

3. The heat dissipation structure of a cooling module with a plug-in module according to claim 1, characterized in that: The bottom surface of the plug-in PCB (3) contacts the top surface of the base PCB (4), and the inner wall of the cold plate (1) contacts the top surface of the plug-in PCB (3).

4. The heat dissipation structure of a cooling module with a plug-in module according to claim 3, characterized in that: The plug-in PCB (3) and the bottom plate PCB (4) are connected using a COM-E connector.

5. The heat dissipation structure of a cooling module with a plug-in module according to claim 3, characterized in that: The cold plate (1) has multiple groups of square holes (6) formed inside, and a heat pipe (11) is buried inside each group of square holes (6). Both ends of the heat pipe (11) are connected to the liquid cooling chassis.

6. The heat dissipation structure of a cooling module with a plug-in module according to claim 1, characterized in that: The plug-in PCB (3) is provided with a CPU (31), an FPGA (32) and a PCIe bridge chip (33); the FPGA (32) and the PCIe bridge chip (33) are located on one side of the plug-in PCB (3) and are arranged above the base PCB (4); the CPU (31) is located on one side of the PCIe bridge chip (33); and the CPU (31), the FPGA (32) and the PCIe bridge chip (33) are all soldered on the base PCB (4).

7. The heat dissipation structure of a cooling module with a plug-in module according to claim 6, characterized in that: The top surfaces of the CPU (31), FPGA (32) and PCIE bridge (33) are all in contact with the inner wall of the cold plate (1).

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