Cooking equipment

Abstract

The utility model relates to the technical field of kitchen appliances, and discloses cooking equipment which comprises an inner container and a shell, the inner container is located in the shell, an installation cavity is formed between the inner container and the shell, and the cooking equipment further comprises a semiconductor chilling plate, a cooling fan and a part to be cooled. The cold end of the semiconductor chilling plate, the cooling fan and the to-be-cooled part are all located in the mounting cavity, and the cooling fan is used for driving air to sequentially flow through the cold end of the semiconductor chilling plate and the to-be-cooled part in the mounting cavity. The cooling fan blows cold air at the cold end of the semiconductor chilling plate to the to-be-cooled part in the mounting cavity between the inner container and the shell, the cooling effect of the to-be-cooled part between the inner container and the shell is improved, and normal and stable operation of the to-be-cooled part is guaranteed. The requirement of the whole machine for the air inflow of outside air is lowered, and the situation that the appearance of the whole machine is affected due to the overlarge size of the air inlet is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of kitchen appliances, in particular to a cooking device. Background Art

[0002] In recent years, as people continue to pursue a higher quality of life, the rational use of kitchen space has become a new demand. Combination steam ovens combine the functions of a steamer and an oven, achieving product diversification. Combination steam ovens are popular with consumers because they integrate the functions of a steamer and an oven, effectively reducing the kitchen space occupied by separate steamers and ovens.

[0003] At present, when cooking equipment such as steam ovens are heated, the heat in the inner pot is relatively concentrated. Although the inner pot is covered with an insulation layer, a lot of heat is still dissipated, affecting the heat dissipation effect of components between the inner pot and the outer shell that need heat dissipation (such as motors). Utility Model Content

[0004] In view of the above problems, the purpose of the present invention is to provide a cooking device that can improve the heat dissipation effect of the components to be cooled between the inner pot and the outer shell.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A cooking device includes an inner pot and a shell, wherein the inner pot is located in the shell, and an installation cavity is formed between the inner pot and the shell. The cooking device also includes a semiconductor refrigeration plate, a heat dissipation fan and a component to be cooled. The cold end of the semiconductor refrigeration plate, the heat dissipation fan and the component to be cooled are all located in the installation cavity, and the heat dissipation fan is used to drive air to flow through the cold end of the semiconductor refrigeration plate and the component to be cooled in the installation cavity in sequence.

[0007] As an optional solution for the cooking device of the present invention, the hot end of the semiconductor refrigeration plate contacts the cavity bottom plate of the inner pot to heat the cavity bottom plate of the inner pot, and the air inlet of the mounting cavity is formed between the cavity bottom plate of the inner pot and the shell bottom plate of the shell.

[0008] As an optional solution of the cooking device of the present invention, an electric potential difference is formed between the hot end and the cold end of the semiconductor refrigeration plate to drive the heat dissipation fan to rotate.

[0009] As an optional solution for the cooking device of the present invention, the hot end of the semiconductor refrigeration plate contacts the cavity bottom plate of the inner pot to heat the cavity bottom plate of the inner pot, the air inlet of the mounting cavity is formed between the cavity bottom plate of the inner pot and the shell bottom plate of the shell, and the heat dissipation fan is located below the cavity bottom plate of the inner pot.

[0010] As an optional solution of the cooking device of the present invention, the cooking device also includes a relay fan, which is located in the installation cavity and above the cavity top plate of the inner pot. The air in the installation cavity flows through the heat dissipation fan and the relay fan in sequence.

[0011] As an optional solution of the cooking device of the present invention, the component to be cooled is located behind the rear plate of the cavity of the inner pot, and the air in the installation cavity flows through the cooling fan, the component to be cooled and the relay fan in sequence.

[0012] As an optional solution of the cooking device of the present invention, the air outlet of the mounting cavity is formed between the cavity top plate of the inner pot and the shell top plate of the shell.

[0013] As an optional solution of the cooking device of the present invention, the cooking device also includes a door body, an air intake channel is provided in the door body, the air intake channel is connected to the installation cavity, and the heat dissipation fan drives air from the air intake channel to flow into the installation cavity.

[0014] As an optional solution for the cooking device of the present invention, the hot end of the semiconductor refrigeration plate contacts the cavity bottom plate of the inner pot to heat the cavity bottom plate of the inner pot, the air inlet of the mounting cavity is formed between the cavity bottom plate of the inner pot and the shell bottom plate of the shell, the inlet of the air inlet channel is located at the top of the door body, and the outlet of the air inlet channel is located at the bottom of the door body.

[0015] As an optional solution of the cooking device of the present invention, along the flow direction of air in the installation cavity, the cold end of the semiconductor refrigeration plate is located between the air inlet of the installation cavity and the heat dissipation fan.

[0016] The beneficial effects of the utility model are:

[0017] The cooking device provided by the present invention has a heat dissipation fan that blows cold air from the cold end of the semiconductor refrigeration plate to the components to be dissipated in the installation cavity between the inner tank and the shell during the operation of the semiconductor refrigeration plate, thereby dissipating heat from the components to be dissipated, improving the heat dissipation effect of the components to be dissipated between the inner tank and the shell, and ensuring the normal and stable operation of the components to be dissipated. The cooking device adopts an efficient heat dissipation method of direct blowing of cold air, which reduces the whole machine's demand for external air intake and avoids the air inlet hole being too large to affect the appearance of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0019] Figure 1 This is a schematic structural diagram of a cooking device provided by a specific embodiment of the present invention from a first viewing angle;

[0020] Figure 2 This is a schematic structural diagram of a cooking device provided by a specific embodiment of the present invention at a second viewing angle;

[0021] Figure 3 This is a schematic structural diagram of a cooking device provided by a specific embodiment of the present invention from a third perspective;

[0022] Figure 4 It is a structural schematic diagram of the cooking device provided by the specific embodiment of the present invention under the fourth viewing angle.

[0023] In the picture:

[0024] 1. Cooling fan; 2. Semiconductor cooling plate; 3. Relay fan;

[0025] 100, liner; 101, cavity bottom plate; 102, cavity top plate; 200, shell; 201, air inlet; 202, air outlet; 300, door; 301, air inlet channel. DETAILED DESCRIPTION

[0026] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of the present invention.

[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0028] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed or detachable connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0029] like Figures 1 to 4 As shown, this embodiment provides a cooking device, which includes an inner pot 100 and a shell 200. The inner pot 100 is located in the shell 200, and an installation cavity is formed between the inner pot 100 and the shell 200. The cooking device also includes a semiconductor refrigeration plate 2, a heat dissipation fan 1 and a component to be cooled. The cold end of the semiconductor refrigeration plate 2, the heat dissipation fan 1 and the component to be cooled are all located in the installation cavity. The heat dissipation fan 1 is used to drive air to flow through the cold end of the semiconductor refrigeration plate 2 and the component to be cooled in the installation cavity in sequence.

[0030] During the operation of the semiconductor refrigeration plate 2, the heat dissipation fan 1 blows the cold air from the cold end of the semiconductor refrigeration plate 2 to the heat dissipation components in the installation cavity between the inner tank 100 and the shell 200, thereby dissipating the heat of the heat dissipation components, improving the heat dissipation effect of the heat dissipation components between the inner tank 100 and the shell 200, and ensuring the normal and stable operation of the heat dissipation components. The cooking equipment adopts an efficient heat dissipation method of direct blowing of cold air, which reduces the whole machine's demand for external air intake and avoids the air inlet hole being too large to affect the appearance of the whole machine.

[0031] Optionally, the hot end of the semiconductor refrigeration chip 2 contacts the cavity bottom plate 101 of the inner liner 100 to heat the cavity bottom plate 101 of the inner liner 100, and the air inlet 201 of the mounting cavity is formed between the cavity bottom plate 101 of the inner liner 100 and the shell bottom plate of the shell 200. The hot end of the semiconductor refrigeration chip 2 and the cavity bottom plate 101 of the inner liner 100 adopt a contact heating method, which can improve the heating efficiency of the hot end of the semiconductor refrigeration chip 2. The hot end of the semiconductor refrigeration chip 2 can heat the steam condensate at the bottom of the inner liner 100. Compared with the existing heating tube heating and water removal method, the semiconductor refrigeration chip 2 heats up quickly and can quickly process the condensate at the bottom of the inner liner 100, thereby improving the water removal efficiency. The outside air enters between the shell bottom plate and the cavity bottom plate 101 of the shell 200 through the air inlet 201, and forms cold air under the action of the cold end. Under the negative pressure of the heat dissipation fan 1, the cold air is blown to the back of the whole machine, effectively dissipating the heat to be dissipated on the back of the whole machine, thereby improving the heat dissipation condition of the whole machine.

[0032] Optionally, an electric potential difference is formed between the hot end and the cold end of the semiconductor refrigeration plate 2 to drive the heat dissipation fan 1 to rotate. It is understandable that the semiconductor refrigeration plate 2 uses the thermoelectric effect to convert thermal energy into electrical energy, generating a thermoelectric electromotive force. Specifically, when direct current passes through the galvanic couple formed by two different semiconductor materials in series in the semiconductor refrigeration plate 2, heat can be absorbed and released at both ends of the galvanic couple respectively, and the purpose of cooling can be achieved. When the thermoelectric electromotive force between the hot end and the cold end increases with the temperature difference, the speed of the heat dissipation fan 1 will become faster and faster. When the thermoelectric electromotive force between the hot end and the cold end decreases, the speed of the heat dissipation fan 1 will become slower and slower, forming a linkage energy-saving effect of water removal and heat dissipation, which can effectively treat the condensed water at the bottom of the cavity, and at the same time, it can blow the cold air from the cold end to the back of the whole machine, effectively dissipating the heat from the back of the whole machine and improving the heat dissipation condition of the whole machine.

[0033] In some embodiments, the hot end of the semiconductor cooling chip 2 contacts the cavity bottom plate 101 of the inner liner 100 to heat the cavity bottom plate 101 of the inner liner 100. The air inlet 201 of the mounting cavity is formed between the cavity bottom plate 101 of the inner liner 100 and the shell bottom plate of the shell 200. The heat dissipation fan 1 is located below the cavity bottom plate 101 of the inner liner 100. The hot end of the semiconductor cooling chip 2 can heat the steam condensate in the inner liner 100. Compared with the existing heating tube heating dehydration method, the semiconductor cooling chip 2 heats up quickly and can quickly process the condensate at the bottom of the inner liner 100, thereby improving the dehydration efficiency. The heat dissipation fan 1 can be arranged at the bottom of the inner tank 100, the hot end of the semiconductor refrigeration plate 2 can be located on the inner side of the cavity bottom plate 101 of the inner tank 100, and the cold end can be located on the outside of the cavity bottom plate 101. The hot end can heat the steam condensate water in the inner tank 100 and generate an electric potential difference with the cold end to drive the heat dissipation fan 1 to rotate. The heat dissipation fan 1 blows the cold air from the cold end to the components to be cooled in the installation cavity between the inner tank 100 and the shell 200, dissipates the heat to the components to be cooled, and effectively dissipates the heat on the back of the entire machine, thereby improving the heat dissipation efficiency of the entire machine and improving the heat dissipation condition of the entire machine.

[0034] Optionally, the cooking device further includes a relay fan 3 located within the mounting cavity and above the cavity top plate 102 of the inner pot 100. Air within the mounting cavity flows sequentially through the heat dissipation fan 1 and the relay fan 3. Under the action of the relay fan 3, air within the mounting cavity flows sequentially through the heat dissipation fan 1 and the relay fan 3, forming an air flow cycle, cooling the entire device with effective cooling and high heat dissipation efficiency. The relay fan 3 can be an existing cooking device fan or a newly installed fan, without limitation herein.

[0035] To effectively dissipate heat from the components on the back of the entire device, the components to be cooled are optionally located behind the cavity rear panel of the liner 100, and the air in the cavity is installed to flow sequentially through the cooling fan 1, the components to be cooled, and the relay fan 3. The cooling fan 1 can be located at the corner between the cavity floor 101 and the cavity rear panel to change the flow direction of the cold air, directing the cold air from the bottom of the cavity floor 101 to between the cavity rear panel and the housing 200, effectively dissipating heat from the back of the entire device.

[0036] Optionally, the air outlet 202 of the mounting cavity is formed between the cavity top plate 102 of the inner tank 100 and the shell top plate of the shell 200. The air outlet 202 can be located on the front side of the shell 200 and below the control panel. It can be understood that the front side of the shell 200 refers to the side facing the user. The relay fan 3 blows the air between the cavity back plate and the shell 200 to the air outlet 202, forming a complete air flow cycle. A condensation assembly can be provided on the top of the inner tank 100, and the condensation assembly is located between the relay fan 3 and the air outlet 202. The condensation assembly can be a component of an existing cooking device, and the relay fan 3 can provide air to the condensation tube of the condensation assembly for heat exchange.

[0037] Optionally, the cooking device further comprises a door 300, wherein an air inlet passage 301 is provided in the door 300, the air inlet passage 301 being in communication with the installation cavity, and the heat dissipation fan 1 drives air from the air inlet passage 301 into the installation cavity. The door 300 can be rotatably mounted on the housing 200, and the door 300 is used to open or close the inner pot 100. When the door 300 is opened, the steam in the inner pot 100 is pre-cooled and converted into condensed water, which accumulates at the bottom of the inner pot 100 under the action of gravity. At this time, the condensed water at the bottom of the cavity can be processed by the hot end of the semiconductor cooling plate 2, thereby improving the water removal efficiency. At the same time, air enters the air inlet 201 through the air inlet passage 301 of the door 300, and then enters between the cavity bottom plate 101 and the housing 200. Under the action of the cold end of the semiconductor cooling plate 2, cold air is formed. Under the negative pressure of the heat dissipation fan 1, the cold air is blown toward the back of the entire machine, effectively dissipating heat from the back of the entire machine and improving the heat dissipation condition of the entire machine.

[0038] In some embodiments, the hot end of the semiconductor cooling plate 2 contacts the cavity bottom plate 101 of the inner liner 100 to heat the cavity bottom plate 101 of the inner liner 100. The air inlet 201 of the mounting cavity is formed between the cavity bottom plate 101 of the inner liner 100 and the shell bottom plate of the shell 200. The inlet of the air inlet channel 301 is located at the top of the door body 300, and the outlet of the air inlet channel 301 is located at the bottom of the door body 300. The inlet of the air inlet channel 301 is located at the top of the door body 300. At this time, the flow of air also has a significant cooling effect on the door body 300. Of course, in other embodiments, the inlet of the air inlet channel 301 can also be located on the side of the door body 300, which can be determined according to different application scenarios. The outlet of the air inlet duct 301 is located at the bottom of the door body 300. Air passes through the inlet at the top of the door body 300, covers the entire door body 300, and then passes through the outlet at the bottom of the door body 300. This can maximize the cooling of the door body 300 and prevent the door body 300 from being hot and affecting the user's experience. Of course, in other embodiments, the outlet of the air inlet duct 301 can be located on the side of the door body 300, as long as the air inlet duct 301 can be connected to the air inlet 201.

[0039] Optionally, along the air flow direction in the installation cavity, the cold end of the semiconductor cooling plate 2 is located between the air inlet 201 of the installation cavity and the heat dissipation fan 1. External air enters between the housing 200 and the cavity bottom plate 101 through the air inlet 201. Under the action of the cold end, it forms cold air. Under the negative pressure of the heat dissipation fan 1, the cold air is blown toward the back of the entire machine, effectively dissipating the heat to be dissipated on the back of the entire machine, thereby improving the heat dissipation condition of the entire machine.

[0040] The cooking device can be a steam-bake combination machine. In the steaming mode, the moisture released from the food causes condensed water to be generated in the cavity. The semiconductor refrigeration sheet 2 can place a temperature sensing component at the cold end to achieve effective water removal. When the cold end temperature reaches T1, the semiconductor refrigeration sheet 2 is turned on to quickly remove the condensed water at the bottom, and is turned off when the cold end temperature reaches T2. In the baking mode, if the bottom external heating tube is involved, in order to protect the semiconductor refrigeration sheet 2, when the temperature sensing component detects that the temperature has reached T3, the bottom external heating tube is turned off and the semiconductor refrigeration sheet 2 is turned on. At this time, the hot end of the semiconductor refrigeration sheet 2 can continue to supply heat to the cavity, while reducing the impact of the heat of the bottom external heating tube on the semiconductor refrigeration sheet 2.

[0041] Note that the above are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions are readily apparent to those skilled in the art without departing from the scope of protection of the present invention. Therefore, while the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the appended claims.

Claims

1. A cooking device, comprising an inner pot (100) and a shell (200), wherein the inner pot (100) is located in the shell (200), and an installation cavity is formed between the inner pot (100) and the shell (200), characterized in that: The cooking device further comprises a semiconductor refrigeration plate (2), a heat dissipation fan (1) and a component to be cooled. The cold end of the semiconductor refrigeration plate (2), the heat dissipation fan (1) and the component to be cooled are all located in the installation cavity. The heat dissipation fan (1) is used to drive air to flow through the cold end of the semiconductor refrigeration plate (2) and the component to be cooled in sequence in the installation cavity.

2. The cooking device according to claim 1, wherein The hot end of the semiconductor refrigeration plate (2) contacts the cavity bottom plate (101) of the inner liner (100) to heat the cavity bottom plate (101) of the inner liner (100), and the air inlet (201) of the installation cavity is formed between the cavity bottom plate (101) of the inner liner (100) and the shell bottom plate of the shell (200).

3. The cooking device according to claim 1, wherein An electric potential difference is formed between the hot end and the cold end of the semiconductor refrigeration plate (2) to drive the heat dissipation fan (1) to rotate.

4. The cooking device according to claim 3, characterized in that The hot end of the semiconductor refrigeration plate (2) contacts the cavity bottom plate (101) of the inner liner (100) to heat the cavity bottom plate (101) of the inner liner (100); the air inlet (201) of the mounting cavity is formed between the cavity bottom plate (101) of the inner liner (100) and the shell bottom plate of the shell (200); and the heat dissipation fan (1) is located below the cavity bottom plate (101) of the inner liner (100).

5. The cooking device according to claim 4, characterized in that The cooking device further comprises a relay fan (3), wherein the relay fan (3) is located in the installation cavity and above the cavity top plate (102) of the inner pot (100), and the air in the installation cavity flows through the heat dissipation fan (1) and the relay fan (3) in sequence.

6. The cooking device according to claim 5, characterized in that The component to be cooled is located behind the rear plate of the cavity of the inner liner (100), and the air in the installation cavity flows through the cooling fan (1), the component to be cooled, and the relay fan (3) in sequence.

7. The cooking device according to claim 2, wherein: The air outlet (202) of the installation cavity is formed between the cavity top plate (102) of the inner container (100) and the shell top plate of the shell (200).

8. The cooking device according to claim 1, wherein The cooking device further comprises a door body (300), an air inlet channel (301) is provided in the door body (300), the air inlet channel (301) is communicated with the installation cavity, and the heat dissipation fan (1) drives air to flow from the air inlet channel (301) into the installation cavity.

9. The cooking device according to claim 8, characterized in that The hot end of the semiconductor refrigeration plate (2) contacts the cavity bottom plate (101) of the inner liner (100) to heat the cavity bottom plate (101) of the inner liner (100); the air inlet (201) of the mounting cavity is formed between the cavity bottom plate (101) of the inner liner (100) and the shell bottom plate of the shell (200); the inlet of the air inlet channel (301) is located at the top of the door body (300); and the outlet of the air inlet channel (301) is located at the bottom of the door body (300).

10. The cooking device according to claim 2, wherein Along the flow direction of air in the installation cavity, the cold end of the semiconductor refrigeration plate (2) is located between the air inlet (201) of the installation cavity and the heat dissipation fan (1).

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