Package structure

Abstract

The utility model provides a packaging structure. The packaging structure comprises a lower substrate; the upper substrate is positioned above the lower substrate; the light emitter and the light receiver are located between the upper substrate and the lower substrate side by side, and the upper substrate is provided with openings corresponding to the light emitter and the light receiver; and the light blocking structure is in contact with the upper substrate and the lower substrate, is positioned between the light emitter and the light receiver, comprises an electronic element, and is used for supporting the upper substrate and blocking light between the light emitter and the light receiver. The utility model aims to provide a packaging structure so as to at least improve the space utilization rate of the packaging structure.

Description

Technical Field

[0001] The utility model relates to a packaging structure. Background Art

[0002] Figure 1 The figure shows a distance sensor of the prior art, which limits the light path by adding a circle of walls 3 around the light-emitting diode (LD) 1 and the photodiode (PD) 2 to shield the light source, thereby confirming that the laser is reflected back to the photodiode 2 by the object to be measured, and then confirming the distance of the object to be measured. This method requires the additional setting of the wall 3 to shield the light source, so more light-shielding structures must be designed, resulting in low utilization of the substrate 4. Utility Model Content

[0003] In view of the problems existing in the related art, the purpose of the present invention is to provide a packaging structure to at least improve the space utilization of the packaging structure.

[0004] To achieve the above-mentioned objectives, the present invention provides a packaging structure, including: a lower substrate; an upper substrate located above the lower substrate; a light emitter and a light receiver located side by side between the upper substrate and the lower substrate, the upper substrate having openings corresponding to the light emitter and the light receiver; a light-blocking structure in contact with the upper substrate and the lower substrate and located between the light emitter and the light receiver, the light-blocking structure including electronic components, and used to support the upper substrate and to block light between the light emitter and the light receiver.

[0005] In some embodiments, the electronic components are passive devices.

[0006] In some embodiments, the light-blocking structure includes a plurality of electronic components arranged in an array.

[0007] In some embodiments, signals of a plurality of electronic components are connected in series.

[0008] In some embodiments, the light-blocking structure further includes a packaging layer encapsulating the electronic components.

[0009] In some embodiments, the encapsulation layer covers portions of side surfaces of the upper substrate and the lower substrate.

[0010] In some embodiments, the opening extends into the encapsulation layer.

[0011] In some embodiments, the encapsulation layer contacts sidewalls of the light emitters and light receivers.

[0012] In some embodiments, the opening is aligned with the top surfaces of the light emitter and the light receiver.

[0013] In some embodiments, the size of the opening is larger than the size of the top surface of the light emitter and the light receiver.

[0014] In some embodiments, the height of the electronic component is greater than the height of the light emitter and the light receiver.

[0015] In some embodiments, the light emitted by the light emitter reaches the object under test, and the light receiver receives the light from the object under test.

[0016] In some embodiments, the light emitter is a laser diode.

[0017] In some embodiments, the light receiver is a photodiode.

[0018] In some embodiments, the package structure includes a plurality of light emitters and a plurality of light receivers, and the light emitters and the light receivers are arranged alternately.

[0019] In some embodiments, a plurality of electronic components are located between a pair of light emitters and light receivers.

[0020] An embodiment of the present application also provides a packaging structure, including: a lower substrate; an upper substrate located above the lower substrate; a light emitter and a light receiver located side by side between the upper substrate and the lower substrate, the upper substrate having openings corresponding to the light emitter and the light receiver; an electronic component in contact with the upper substrate and the lower substrate and located between the light emitter and the light receiver, the size of the surface of the electronic component facing the light emitter and the surface facing the light receiver being larger than the sizes of other surfaces.

[0021] In some embodiments, a plurality of electronic components arranged in an array are located between a pair of light emitters and light receivers.

[0022] In some embodiments, along the direction from the light emitter to the light receiver, the projection of the light emitter completely falls on the plurality of electronic components.

[0023] In some embodiments, along a direction from the light receiver to the light emitter, a projection of the light receiver completely falls on the plurality of electronic components.

[0024] The beneficial technical effects of the present utility model are:

[0025] The embodiments of the present application use the electronic components in the 3D stacked structure as support structures for the upper and lower substrates, and as light-blocking structures between adjacent light emitters and light receivers, thereby improving the utilization of the upper and lower substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without inventive work. It is worth noting that, according to standard industry practices, the various components are not drawn to scale and are for illustrative purposes only. In fact, for the clarity of discussion, the sizes of the various components can be arbitrarily increased or decreased.

[0027] Figure 1 A prior art distance sensor is shown.

[0028] Figure 2 Providing a lower substrate is shown.

[0029] Figure 3 The bonding of electronic components, light emitters, and light receivers to a lower substrate is shown.

[0030] Figure 4 Shown is the corresponding Figure 3 Top view of the steps shown.

[0031] Figure 5 A second solder is shown pre-formed on the upper substrate.

[0032] Figure 6 An opening is shown.

[0033] Figure 7 Shown is the corresponding Figure 6 Bottom view of the steps shown.

[0034] Figure 8 Shows the Figure 7 The structure shown is inverted and stacked on Figure 3 On the structure shown.

[0035] Figure 9 The application of tape is shown.

[0036] Figure 10 The package structure according to the embodiment of the present application is shown.

[0037] Figure 11 Shown is the corresponding Figure 10 Top view of the steps shown.

[0038] Figure 12 The diagram shows the signal connections between the electronic components, optical transmitter and optical receiver, and the integrated circuit (IC). DETAILED DESCRIPTION

[0039] In order to better understand the spirit of the embodiments of the present application, some preferred embodiments of the present application are further described below.

[0040] The embodiments of the present application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are represented by similar reference numerals. The embodiments described herein with respect to the accompanying drawings are illustrative and diagrammatic and are intended to provide a basic understanding of the present application. The embodiments of the present application should not be construed as limiting the present application.

[0041] As used herein, the terms "substantially," "substantially," and "approximately" are used to describe and illustrate small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance occurred precisely as well as instances where the event or circumstance occurred very approximately.

[0042] In this specification, unless otherwise specified or limited, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivatives (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or depicted in the drawings. These relative terms are only used for convenience of description and do not require that the present application be constructed or operated in a specific orientation.

[0043] For ease of description, “first,” “second,” “third,” etc. may be used herein to distinguish different components in a figure or a series of figures. “First,” “second,” “third,” etc. are not intended to describe the corresponding components.

[0044] Figures 2 to 11 The diagram shows a process of forming the package structure 100 according to an embodiment of the present application.

[0045] Figure 2 The provision of a lower substrate 10 is shown.

[0046] Figure 3 The electronic component 50, the light emitter 30, and the light receiver 40 are bonded to the lower substrate 10, wherein the electronic component 50 is bonded to the lower substrate 10 via a first solder 71, the light emitter 30 and the light receiver 40 are directly bonded to the lower substrate 10, and the height of the electronic component 50 is greater than the heights of the light emitter 30 and the light receiver 40. In some embodiments, the electronic component 50 is a passive device, the light emitter 30 is a laser diode, and the light receiver 40 is a photodiode.

[0047] Figure 4 Shown is the corresponding Figure 3The top view of the step shown, wherein a plurality of electronic components 50 arranged in an array are located between a pair of light emitters 30 and light receivers 40, and serve as a light shielding structure for light emitters 30 and light receivers 40, along the direction from the light emitter 30 to the light receiver 40, i.e., along Figure 4 In the horizontal direction, the projection of the light emitter 30 completely falls on the plurality of electronic components 50; along the direction from the light receiver 40 to the light emitter 30, the projection of the light receiver 40 completely falls on the plurality of electronic components 50, and the plurality of electronic components 50 completely shield the mutually facing parts of the light emitter 30 and the light receiver 40 to block the light between the light emitter 30 and the light receiver 40 as much as possible. The sizes of the surfaces of the electronic components 50 facing the light emitter 30 and the surface facing the light receiver 40 are larger than the sizes of other surfaces.

[0048] Figure 5 It is shown that the second solder 72 is pre-formed on the upper substrate 20 , and the first solder 71 and the second solder 72 are, for example, solder paste.

[0049] Figure 6 It is shown that openings 22 are opened in the upper substrate 20 , for example by cutting, and the openings 22 subsequently correspond to the light emitters 30 and the light receivers 40 .

[0050] Figure 7 Shown is the corresponding Figure 6 Bottom view of the steps shown.

[0051] Figure 8 Shows the Figure 7 The structure shown is inverted and stacked on Figure 3 In the illustrated structure, the second solder 72 is bonded to the electronic component 50, the light emitter 30 and the light receiver 40 are positioned side by side between the upper substrate 20 and the lower substrate 10, the opening 22 of the upper substrate 10 corresponds to the light emitter 30 and the light receiver 40, and the electronic component 50 contacts and electrically connects the upper substrate 20 and the lower substrate 10. In the first embodiment, the electronic component 50 is positioned between the light emitter 30 and the light receiver 40 to form a light-blocking structure between the light emitter 30 and the light receiver 40. The light-blocking structure is used to support the upper substrate 20 and to block light between the light emitter 30 and the light receiver 40.

[0052] Figure 9The embodiment shows the use of surface mounting technology (SMT) to attach tape 80 to the light emitter 30 and the light receiver 40, and to form an encapsulation layer 60 located between the upper substrate 20 and the lower substrate 10. The tape 80 protects the light emitter 30 and the light receiver 40 during encapsulation. The encapsulation layer 60 contacts the sidewalls of the light emitter 30 and the light receiver 40 and covers portions of the side surfaces of the upper substrate 20 and the lower substrate 10. In the second embodiment, the light-blocking structure between the light emitter 30 and the light receiver 40 further includes the encapsulation layer 60 that encapsulates the electronic component 50, thereby improving light-shielding properties.

[0053] Figure 10 It shows that the tape 80 is removed, and the opening 22 extends into the packaging layer 60, obtaining the packaging structure 100 according to the embodiment of the present application, the packaging structure 100 includes: a lower substrate 10; an upper substrate 20, located above the lower substrate 10; a light emitter 30 and a light receiver 40, located side by side between the upper substrate 20 and the lower substrate 10, the upper substrate 20 has an opening 22 corresponding to the light emitter 30 and the light receiver 40; a light blocking structure, in contact with the upper substrate 20 and the lower substrate 10 and located between the light emitter 30 and the light receiver 40, the light blocking structure includes an electronic component 50, the light emitted by the light emitter 30 reaches the object to be tested, and the light receiver 40 receives the light from the object to be tested.

[0054] Figure 11 Shown is the corresponding Figure 10 In the top view of the step shown, the opening 22 can be as Figure 10 As shown, the opening 22 is aligned with the top surface of the light emitter 30 and the light receiver 40, and the size of the opening 22 can also be as follows: Figure 11 The dimensions shown are larger than the top surfaces of the light emitters 30 and the light receivers 40. The package structure 100 includes a plurality of light emitters 30 and a plurality of light receivers 40, and the light emitters 30 and the light receivers 40 are alternately arranged.

[0055] Figure 12 The diagram shows the signal connections between the electronic components 50, the optical transmitter 30, the optical receiver 40, and the integrated circuit (IC) 90, wherein the integrated circuit 90 is disposed in the lower substrate 10 or the upper substrate 20. The signals of the plurality of electronic components 50 are connected in series with each other. The upper and lower ends of the electronic components 50 are respectively connected to the upper substrate 20 and the lower substrate 10 to vertically transmit the signals to other components of the upper substrate 20 and the lower substrate 10. Some electronic components 50 are not connected to the integrated circuit 90.

[0056] The embodiments of the present application are used for assembly processes, involving a 3D system-in-a-package (SIP) structure and an optical sensor. The electronic component 50 in the 3D stacked structure is used as a support structure for the upper substrate 20 and the lower substrate 10, and is used as a light-blocking structure between adjacent light emitters 30 and light receivers 40 to limit the path of the laser to ensure that the laser can only be transmitted through the opening 22 of the upper substrate 20. There is no need to set up additional walls in the prior art to miniaturize the lateral dimensions of the upper substrate 20 and the lower substrate 10, thereby improving the utilization rate of the upper substrate 20 and the lower substrate 10. In the future, when other components are SiP integrated, the embodiments of the present application can be applied to the SiP integrated structure to increase the functional application range of the SiP.

[0057] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A packaging structure, characterized in that: include: lower substrate; an upper substrate, located above the lower substrate; A light emitter and a light receiver are located between the upper substrate and the lower substrate, and the upper substrate has openings corresponding to the light emitter and the light receiver; a light-blocking structure, contacting the upper substrate and the lower substrate and located between the light emitter and the light receiver, the light-blocking structure including electronic components, The light blocking structure is used to support the upper substrate and to block light between the light emitter and the light receiver.

2. The packaging structure according to claim 1, wherein: The electronic components are passive devices.

3. The packaging structure according to claim 1, wherein: The light-shielding structure includes a plurality of electronic components arranged in an array.

4. The packaging structure according to claim 1, wherein: The light-blocking structure further includes a packaging layer covering the electronic component.

5. The packaging structure according to claim 4, wherein: The encapsulation layer covers part of side surfaces of the upper substrate and the lower substrate.

6. The packaging structure according to claim 4, wherein: The opening extends into the encapsulation layer.

7. The packaging structure according to claim 4, wherein: The encapsulation layer contacts sidewalls of the light emitter and the light receiver.

8. The packaging structure according to claim 1, wherein: The opening is aligned with top surfaces of the light emitter and the light receiver.

9. The packaging structure according to claim 1, wherein: The height of the electronic component is greater than that of the light emitter and the light receiver.

10. The packaging structure according to claim 1, wherein: The plurality of electronic components are located between a pair of the light emitter and the light receiver.

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