Multilayer and ultra-thick printed circuit board with blind hole structure

Abstract

The utility model relates to the technical field of circuit boards, and discloses a multilayer super-thick printed circuit board with a blind hole structure, which comprises a board body assembly, a through hole assembly and a blind hole assembly, the board body assembly comprises a circuit board, an insulating layer fixed at the bottom of the circuit board, a heat conduction layer fixed on the insulating layer, and a resin filling layer fixed on the heat conduction layer, meanwhile, through holes penetrating through the bottoms of the circuit boards and blind holes not penetrating through the bottoms of the circuit boards are formed in the circuit boards, a heat conduction layer is fixed to the top of the resin filling layer, an insulating layer is fixed to the outer side of the heat conduction layer, and the circuit boards are fixed to the outer side of the insulating layer. The heat conduction layer corresponds to the circulation grooves formed in the protection layer, heat sources generated by the circuit board are discharged from the circulation grooves after being absorbed by the heat conduction plate, and therefore the temperature in the interlayer of the circuit board can be quickly and effectively dispersed, and the practicability of the circuit board is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer, ultra-thick printed circuit board with a blind hole structure. Background Art

[0002] Multi-layer, extra-thick printed circuit boards with blind via structures are typically used in applications requiring higher-density layouts and complex connections. Multi-layer and extra-thick PCBs allow for more electronic components and connection lines to be accommodated in a smaller space. Blind and buried via structures allow for signal and power transfer between different layers of the circuit board while reducing the need for connections on the PCB surface, thereby achieving a higher layout density. Furthermore, blind and buried via designs help reduce the length of signal paths, lowering signal attenuation and crosstalk in high-frequency signal transmission, and offering better thermal conductivity and mechanical strength. Multi-layer PCBs can achieve complex electrical connections between different internal layers, such as connecting signal lines to ground planes or power planes. This design not only improves the overall efficiency of the circuit board, but also simplifies external connections, reducing signal delays and power consumption.

[0003] Currently, existing multi-layer, ultra-thick printed circuit boards with blind hole structures are composed of multiple layers. The heat generated during operation accumulates between the interlayers, making it impossible to quickly disperse the internal temperature. At the same time, the use of screws for installation causes the nuts to press against the edges of the through-holes on the circuit board, posing a risk of circuit board breakage. Utility Model Content

[0004] In response to the shortcomings of the existing technology, the utility model provides a multi-layer, extra-thick printed circuit board with a blind hole structure, which has the advantages of being able to quickly and effectively disperse the temperature between the interlayers of the circuit board, reduce the overall temperature of the circuit board, and ensure stable installation of the circuit board. It solves the problem that the temperature generated by the circuit board during operation at the current stage cannot be quickly and effectively dispersed, and the use of screws for fixing causes the nut to be pressed tightly on the circuit board, which easily creates the risk of circuit board breakage.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multi-layer, ultra-thick printed circuit board with a blind via structure, comprising a board assembly, a through-hole assembly, and a blind via assembly. The board assembly includes a circuit board, an insulating layer fixed to the bottom of the circuit board, a thermally conductive layer fixed on the insulating layer, and a resin filling layer fixed on the thermally conductive layer. The circuit board is provided with through holes that penetrate the bottom and blind vias that do not penetrate the bottom. The thermally conductive layer is fixed on top of the resin filling layer, and an insulating layer is fixed on the outside of the thermally conductive layer. The circuit board is fixed on the outside of the insulating layer. The insulating layer is used for electrical isolation and serves as a mechanical component, while protecting the internal circuits and components of the circuit board from external environmental influences. In addition, the insulating layer helps ensure precise alignment and positioning between different layers during the PCB manufacturing process, ensuring that through holes and other connectors pass through in the correct position to facilitate subsequent assembly and connection. The thermally conductive layer is used to absorb and transfer heat generated by the circuit board to prevent large amounts of heat from being stored on the circuit board. The resin filling layer can enhance the mechanical strength and thermal management capabilities of the circuit board, and also improve its electrical performance and long-term reliability.

[0006] The through-hole component includes a protective layer fixed in the through-hole, a connecting cavity is opened in the protective layer, mounting cavities are opened at both ends of the connecting cavity, a mounting ring is inserted in the mounting cavity, a rubber ring is fixed on the mounting ring, a connecting cavity running through the top and bottom ends is opened in the protective layer, the connecting cavity has threads, and the circuit board can be fixed by screws, and at the same time, mounting cavities are opened in the protective layer and at both ends of the connecting cavity, and the diameter of the mounting cavity matches the diameter of the mounting ring. After installation, the top surface is flush with the top surface of the circuit board, so that the bottom of the rubber ring fits on the circuit board. When the screw is installed, the bottom of the nut fits on the rubber ring, so that the rubber ring is pressed tightly, reducing the direct pressure of the nut on the circuit board to reduce the phenomenon of breakage caused by the nut.

[0007] The blind hole component includes a filling layer installed in the blind hole, a copper foil is fixed in the filling layer, a protective layer is fixed in the copper foil, and a filler is fixed in the protective layer. The filling layer is made of flexible material and is placed in the blind hole. By inputting the filler into the filling layer and pressing, the outer wall of the filling layer fits into the blind hole. After the filler solidifies, the blind hole component is hardened as a whole to form the same shape as the corresponding blind hole, so that a sufficient filling effect can be obtained. The filling layer is made of resin, and the internal filler is specifically formed by solidifying the conductive paste.

[0008] When installing a multi-layer, extra-thick printed circuit board with a blind hole structure, a protective layer is installed on the side of the circuit board so that the protective layer is sleeved on the sides of the insulating layer, thermal conductive layer and resin filling layer in the circuit board and the middle interlayer, and then the through-hole component and the blind hole component are installed in the corresponding through-hole and blind hole so that the blind hole component seals the blind hole. At the same time, the limiting rings at both ends of the side of the protective layer are tightly attached to the two ends of the through hole to fix the position of the protective layer in the through hole. Then, mounting rings are inserted into the mounting cavities at both ends of the protective layer so that the card block is clamped in the bayonet to fix the mounting ring. At this time, the top of the mounting ring is flush with the surface of the circuit board, and the rubber ring is attached to the circuit board. At this time, the screw is inserted into the connecting cavity and rotated so that the screw passes through the protective layer and is threadedly connected to the housing to be installed.

[0009] As a further improvement of the above solution, an edge protection layer is fixed to the side of the circuit board.

[0010] Through the above technical solution, the edge guard is specifically made of a glue material, which is adhered to the sides of the circuit board and the middle interlayers to play a role in protecting the sides.

[0011] As a further improvement of the above solution, a limiting ring is fixed on the side of the protective layer, and the limiting ring is fixed in the through hole.

[0012] Through the above technical solution, limiting rings are installed on the sides of both ends of the protective layer, and the two limiting rings are inclined toward the two ends. When installed in the through hole, the limiting rings are tightly attached to the two ends of the through hole, thereby improving the stability of the installation of the through hole component.

[0013] As a further improvement of the above solution, a clamping block is provided in the installation cavity, and a bayonet is provided on the side of the installation ring, and the clamping block is clamped in the bayonet.

[0014] Through the above technical solution, the mounting ring is used to fix the rubber ring above the through hole. When the mounting ring is inserted into the mounting cavity, the card block is engaged in the card slot, thereby improving the stability of the installation and preventing the mounting ring from detaching from the mounting cavity, causing the rubber ring to fall off.

[0015] As a further improvement of the above solution, a circulation groove is provided on the side of the installation cavity.

[0016] Through the above technical solution, the flow groove corresponds to the heat conducting layer, so that after the heat conducting layer absorbs the heat source generated by the circuit board, it outputs it to the outside through the flow groove, thereby improving the overall heat dissipation effect of the circuit board.

[0017] As a further improvement of the above solution, a positioning ring is fixed to the side of the mounting ring.

[0018] Through the above technical solution, the outer side of the positioning ring fits against the outer edge of the through-hole interface, thereby improving the hardness of the through-hole and preventing the through-hole of the circuit board from being damaged due to extrusion.

[0019] Compared with the prior art, the present invention provides a multi-layer, ultra-thick printed circuit board with a blind hole structure, which has the following beneficial effects:

[0020] 1. This multi-layer, extra-thick printed circuit board with a blind hole structure has a heat-conducting layer installed between the multi-layer circuit boards. The heat-conducting layer corresponds to the flow grooves opened on the protective layer. After the heat source generated by the circuit board is absorbed by the heat-conducting plate, it is discharged from the flow grooves, thereby achieving rapid and effective temperature dispersion in the circuit board interlayer, further improving its practicality.

[0021] 2. This multi-layer, extra-thick printed circuit board with a blind hole structure has installation cavities at both ends of the protective layer. Installation rings are inserted into the installation cavities and fixed by clamping blocks in the bayonet sockets, so that the rubber ring installed on the top is at the edge of the through hole. When the screw is installed, the nut presses the rubber ring, and the elastic force of the rubber ring absorbs the pressing force, effectively solving the problem of the nut directly fitting on the circuit board and causing the circuit board to break when the pressure is too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of the device of the utility model;

[0023] Figure 2 This is a schematic diagram of the connection structure between the circuit board and each interlayer of the utility model;

[0024] Figure 3 This is a schematic diagram of the overall external structure of the through-hole component of the utility model;

[0025] Figure 4 This is a schematic diagram of the overall internal structure of the protective layer of the utility model;

[0026] Figure 5 This is a schematic diagram of the cross-sectional structure of the blind hole component of the utility model.

[0027] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0028] 1. Board assembly; 101. Circuit board; 102. Insulation layer; 103. Thermal conductive layer; 104. Resin filling layer; 105. Edge protection layer; 106. Through hole; 107. Blind hole;

[0029] 2. Through-hole assembly; 201. Protective layer; 202. Limiting ring; 203. Connecting cavity; 204. Mounting cavity; 205. Block; 206. Mounting ring; 207. Bayonet; 208. Rubber ring; 209. Flow slot; 210. Positioning ring;

[0030] 3. Blind hole component; 301. Filling layer; 302. Copper foil; 303. Protective layer; 304. Filler. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example 1

[0032] See also Figure 1-5 As shown, the multi-layer, ultra-thick printed circuit board with a blind hole structure proposed in this embodiment includes a board component 1, a through-hole component 2 and a blind hole component 3. The board component 1 includes a circuit board 101. An insulating layer 102 is fixed to the bottom of the circuit board 101, a heat-conducting layer 103 is fixed on the insulating layer 102, and a resin filling layer 104 is fixed on the heat-conducting layer 103. At the same time, a through hole 106 penetrating the bottom thereof and a blind hole 107 not penetrating the bottom thereof are opened on the circuit board 101. The heat-conducting layer 103 is fixed on the top of the resin filling layer 104, and an insulating layer 102 is fixed on the outside of the heat-conducting layer 103. The circuit board 101 is fixed on the outside of the insulating layer 102. The insulating layer 102 is used for electrical isolation and plays a role in mechanical composition. At the same time, it can protect the internal circuits and components of the circuit board from the influence of the external environment. In addition, the insulating layer is provided on the PCB. The manufacturing process also helps ensure precise alignment and positioning between different layers, ensuring that through-holes and other connecting devices pass through in the correct position to facilitate subsequent assembly and connection. The thermal conductive layer 103 is used to absorb and transfer the heat generated by the circuit board 101 to avoid a large amount of heat being stored on the circuit board 101, while the resin filling layer 104 can improve the mechanical strength and thermal management capabilities of the circuit board, and also improve its electrical performance and long-term reliability.

[0033] The through-hole component 2 includes a protective layer 201 fixed in the through-hole 106, and a connecting cavity 203 is provided in the protective layer 201. Mounting cavities 204 are provided at both ends of the connecting cavity 203. A mounting ring 206 is inserted in the mounting cavity 204, and a rubber ring 208 is fixed on the mounting ring 206. A connecting cavity 203 running through the top and bottom ends is provided in the protective layer 201, and the connecting cavity 203 has threads, and the circuit board 101 can be fixed by screws. At the same time, mounting cavities 204 are provided in the protective layer 201 and at both ends of the connecting cavity 203. The diameter of the mounting cavity 204 matches the diameter of the mounting ring 206. After installation, the top surface is flush with the top surface of the circuit board 101, so that the bottom of the rubber ring 208 is attached to the circuit board 101. When the screw is installed, the bottom of the nut is attached to the rubber ring 208, so that the rubber ring 208 is pressed tightly, reducing the direct pressure of the nut on the circuit board 101 and causing breakage.

[0034] The blind hole component 3 includes a filling layer 301 installed in the blind hole 107, a copper foil 302 is fixed in the filling layer 301, a protective layer 303 is fixed in the copper foil 302, and a filler 304 is fixed in the protective layer 303. The filling layer 301 is made of a flexible material. When the filling layer 301 is placed in the blind hole 107, the filler 304 is input into the filling layer 301 and pressed so that the outer wall of the filling layer 301 fits in the blind hole 107. After the filler 304 solidifies, the blind hole component 3 hardens as a whole to form the same shape as the corresponding blind hole 107, thereby achieving a sufficient filling effect. The filling layer 301 is made of resin, and the internal filler 304 is specifically formed by solidifying a conductive paste.

[0035] The working principle of the multi-layer, ultra-thick printed circuit board with a blind hole structure proposed in this embodiment is as follows: when in use, the edge protection layer 105 is installed on the side of the circuit board 101, so that the edge protection layer 105 is sleeved on the side of the circuit board 101 and the insulating layer 102, the heat conductive layer 103 and the resin filling layer 104 in the middle interlayer, and then the through-hole component 2 and the blind hole component 3 are installed in the corresponding through-hole 106 and blind hole 107, so that the blind hole component 3 blocks the blind hole 107, and at the same time, the limiting rings 202 at both ends of the side of the protective layer 201 are tightly attached to the through-hole At both ends of the through hole 106, the position of the protective layer 201 in the through hole 106 is fixed, and then mounting rings 206 are inserted into the mounting cavities 204 at both ends of the protective layer 201, so that the clamping block 205 is clamped in the clamping socket 207 to fix the mounting ring 206. At this time, the top of the mounting ring 206 is flush with the surface of the circuit board 101, and the rubber ring 208 is attached to the circuit board 101. At this time, the screw is inserted into the connecting cavity 203, and by rotating it, the screw passes through the protective layer 201 and is threadedly connected to the shell to be installed. Example 2

[0036] See also Figure 1-5 As shown, the multi-layer, extra-thick printed circuit board with a blind hole structure proposed in this embodiment, based on the first embodiment, further includes: a side guard layer 105 is fixed to the side of the circuit board 101, a limit ring 202 is fixed to the side of the protective layer 201, the limit ring 202 is fixed in the through hole 106, a clamping block 205 is provided in the mounting cavity 204, and a bayonet 207 is provided on the side of the mounting ring 206, the clamping block 205 is clamped in the bayonet 207, a flow groove 209 is provided on the side of the mounting cavity 204, and a positioning ring 210 is fixed to the side of the mounting ring 206.

[0037] In this solution, the edge guard 105 is specifically made of a colloid material and is adhered to the sides of the circuit board 101 and the intermediate layers to protect the sides. The sides of both ends of the protective layer 201 are both installed with limit rings 202, and the two limit rings 202 are inclined toward both ends. When installed in the through hole 106, the limit rings 202 are tightly attached to the two ends in the through hole 106, thereby improving the installation stability of the through hole component 2. The mounting ring 206 is used to fix the rubber ring 208 above the through hole 106. When the mounting ring 206 is inserted into the mounting cavity 204, The block 205 is engaged in the bayonet 207 to improve the stability of the installation and prevent the installation ring 206 from detaching from the installation cavity 204, which would cause the rubber ring 208 to fall off. The flow groove 209 corresponds to the heat-conducting layer 103, so that the heat source generated by the circuit board 101 is absorbed by the heat-conducting layer 103 and then output to the outside through the flow groove 209, thereby improving the overall heat dissipation effect of the circuit board 101. The outer side of the positioning ring 210 is attached to the outer edge of the interface of the through hole 106, thereby improving the hardness of the through hole 106 and preventing the through hole 106 of the circuit board 101 from being damaged due to extrusion.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-layer, ultra-thick printed circuit board with a blind hole structure, comprising a board component, a through-hole component and a blind hole component, characterized in that: The board assembly includes a circuit board, an insulating layer fixed to the bottom of the circuit board, a heat-conducting layer fixed on the insulating layer, a resin filling layer fixed on the heat-conducting layer, and a through hole penetrating the bottom of the circuit board and a blind hole not penetrating the bottom of the circuit board. The heat-conducting layer is fixed on the top of the resin filling layer, and the insulating layer is fixed on the outside of the heat-conducting layer, and the circuit board is fixed on the outside of the insulating layer. The through-hole assembly includes a protective layer fixed in the through-hole, a connecting cavity is opened in the protective layer, mounting cavities are opened at both ends of the connecting cavity, mounting rings are inserted in the mounting cavities, a rubber ring is fixed on the mounting ring, and a connecting cavity is opened in the protective layer that passes through the top and bottom ends; The blind hole assembly comprises a filling layer installed in the blind hole, a copper foil is fixed in the filling layer, a protective layer is fixed in the copper foil, and a filler is fixed in the protective layer.

2. The multi-layer, ultra-thick printed circuit board with a blind hole structure according to claim 1, characterized in that: An edge protection layer is fixed to the side of the circuit board.

3. The multi-layer, ultra-thick printed circuit board with a blind hole structure according to claim 1, characterized in that: A limiting ring is fixed on the side of the protective layer, and the limiting ring is fixed in the through hole.

4. The multi-layer, ultra-thick printed circuit board with a blind hole structure according to claim 1, characterized in that: A clamping block is arranged in the installation cavity, and a clamping slot is provided on the side of the installation ring, and the clamping block is clamped in the clamping slot.

5. The multi-layer, ultra-thick printed circuit board with a blind hole structure according to claim 4, characterized in that: A circulation groove is provided on the side of the installation cavity.

6. The multi-layer, ultra-thick printed circuit board with a blind hole structure according to claim 4, characterized in that: A positioning ring is fixed on the side of the mounting ring.

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