Ultrathin circuit board
By setting up structures such as arc-shaped support pads and straight rods on the circuit board, the problem of electrical performance degradation caused by bending and deformation in the product is solved, and the stability and cost reduction of ultra-thin circuit boards are achieved.
Patent Information
- Application Number
- CN202422546266.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-10-22
AI Technical Summary
When used in products, existing circuit boards are prone to deterioration of electrical performance due to bending and deformation, and the direct installation of circuit boards and products is likely to cause physical damage, affecting the use effect.
An ultra-thin circuit board is designed. By setting arc support pads and straight rods, oblique rods and other structures on both sides of the board, stable triangle and rectangular support are formed. Combined with reinforced rods and insulating blocks, the structural stability of the circuit board is enhanced, deformation is reduced and thickness is reduced.
It improves the bending deformation of the circuit board, improves electrical performance, reduces production costs and space occupation, and enhances the use effect and stability of the circuit board.
Smart Images
Figure CN223261702U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a circuit board, in particular to an ultra-thin circuit board. Background Art
[0002] A circuit board is an electronic component used to electrically connect electronic components. It connects various electronic components, including resistors, capacitors, and chips, by etching conductive patterns on insulating materials. Currently, circuit boards are classified by the number of layers: single-sided, double-sided, and multi-layer. Standard circuit board thickness ranges from 0.78 to 2.36 mm. Circuit board welding is performed by arranging the circuits on the board and soldering the electronic components.
[0003] Currently, when circuit boards are used in products, to save space and reduce costs, the larger plug-in components on the board are optimized with compact surface mount components. By placing these components on the same layer of the board, soldering components on that layer is facilitated, reducing both production and material costs. However, when these circuit boards are directly mounted on the product, they can easily cause bending and deformation, affecting the board's electrical performance and causing physical damage to the board's materials or solder joints, leading to short circuits or open circuits. For these reasons, there is a need to design an ultra-thin circuit board that can mitigate bending and deformation and reduce its overall thickness. Utility Model Content
[0004] In view of the above-mentioned problems existing in the prior art, the purpose of the present invention is to provide an ultra-thin circuit board, which can improve the bending deformation phenomenon of the circuit board and reduce the overall thickness of the circuit board.
[0005] To achieve the above purpose, the technical solution of this utility model is as follows:
[0006] An ultra-thin circuit board comprises a board body, with a plurality of patch components and large components respectively arranged on both sides of the board body, two pairs of arc-shaped support pads provided on the edge of the board surface of the board body, inner grooves are provided on the inner sides of the arc-shaped support pads, connecting blocks are provided at both ends of the arc-shaped support pads, a same straight rod is provided between two opposite connecting blocks, and a same diagonal rod is provided between two diagonal inner grooves, for stable support of the circuit board structure.
[0007] Preferably, the arc-shaped support pad is made of insulating material, and an adhesive sheet is provided at the end of the arc-shaped support pad, and the arc-shaped support pad is adhered to the plate body through the adhesive sheet.
[0008] Preferably, a slot cooperating with the straight rod is provided on the connecting block, and one side of the slot is connected to the connecting block.
[0009] Preferably, the inner groove has an arc-shaped structure, and there are two groups of inner grooves, and the two groups of oblique rods are overlapped and distributed.
[0010] Preferably, a plurality of reinforcement rods are provided between two of the straight rods, and the plurality of reinforcement rods are distributed in parallel.
[0011] Preferably, the straight rod is provided with reinforcing ribs inside, the reinforcing ribs are made of carbon steel, and the straight rod is provided with an insulating layer on the outside.
[0012] Preferably, a plurality of first insulating blocks are provided on two sides of the straight rod, and a plurality of second insulating blocks perpendicular to the first insulating blocks are provided on the other two sides of the straight rod. Both the first insulating blocks and the second insulating blocks are triangular prism structures, and the structures of the straight rod, oblique rod and reinforcement rod are the same.
[0013] Compared with the prior art, the ultra-thin circuit board provided by the present invention can reinforce the structure of the circuit board, improve its bending deformation phenomenon, reduce the application of support structures, and compress the overall thickness of the circuit board. Specifically, by setting two pairs of arc-shaped support pads on the edge of the circuit board surface, it is convenient to use multiple straight rods to form a rectangular structure using connection blocks to support the edge of the circuit board. Then, by opening two inner grooves on the inner side of the arc-shaped support pad, two oblique rods support the diagonal corners of the rectangular structure to form a triangular structure, thereby enhancing the stability of the structure, avoiding deformation of the circuit board, and improving the use effect of the circuit board. Through the structural connection of the straight rods, oblique rods and arc-shaped support pads, the components on both sides of the board body can be protected, saving the reuse of the component protection structure on the circuit board, reducing the overall thickness of the circuit board, saving production costs, and reducing the space occupied by the circuit board in the product, which is very beneficial to the actual application of the circuit board.
[0014] Moreover, by connecting and using the reinforcing rods between the relatively straight rods, the connection strength between the straight rods can be increased, and the supporting balance of the straight rods on the circuit board can be improved, so that it can be flexibly applied on the side of the patch components or the side of the large components, thereby reducing the processing cost of the circuit board protection structure, compressing the volume of the circuit board, and realizing the ultra-thin application of the circuit board in the product, which is very beneficial to the wide application of the circuit board.
[0015] It should be understood that the general description and detailed description herein are exemplary and explanatory only and are not intended to restrict the present disclosure.
[0016] This application document provides various implementations or exemplary overviews of the technology described in this disclosure, and is not a comprehensive disclosure of the full scope or all features of the disclosed technology. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the overall structure of the ultra-thin circuit board of the present utility model;
[0018] Figure 2 This is an exploded diagram of the structure of the ultra-thin circuit board of the utility model;
[0019] Figure 3 This is a schematic diagram of another structural form of the ultra-thin circuit board of the present invention;
[0020] Figure 4 This is an exploded view of the structure of the arc-shaped support pad and the oblique rod in the ultra-thin circuit board of the present invention;
[0021] Figure 5 This is a schematic diagram of the partial structure of the connecting block and the straight rod in the ultra-thin circuit board of the present utility model.
[0022] Main reference numerals:
[0023] 1. Board; 11. SMD components; 12. Large components; 2. Arc-shaped support pads; 21. Inner groove; 22. Connecting block; 221. Slot; 23. Adhesive sheet; 31. Straight rod; 32. Diagonal rod; 33. Reinforcement rod; 311. Reinforcement rib; 312. First insulating block; 313. Second insulating block. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the embodiments of the present disclosure are described in more detail below in conjunction with the drawings of the embodiments. Note: The described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0025] As attached Figure 1 and attached Figure 2As shown, the ultra-thin circuit board provided by the embodiment of the present invention is used to reinforce the structure of the circuit board, improve the deformation phenomenon of the circuit board, improve its use effect, and stably install and apply it in the product; reduce the overall thickness of the circuit board, reduce the space occupied by the circuit board in the product, and realize the ultra-thin use of the circuit board. During the processing of the circuit board, by planning the lines of the patch components 11 and the large components 12 in the circuit board and welding them separately, the several patch components 11 and large components 12 used in the circuit board can be respectively arranged on both sides of the board body 1, compressing the thickness of the circuit board and reducing the space occupied by the circuit board. Then, according to the distribution range of the several patch components 11 and the large components 12 on the board body 1, two pairs of arc-shaped support pads 2 are arranged on the edge of the board surface of the board body 1, and an inner groove 21 is opened on the inner side of the arc-shaped support pad 2, and connecting blocks 22 are provided at both ends of the arc-shaped support pad 2. By connecting the straight rods 31 between two relatively connected blocks 22, multiple straight rods 31 and the arc-shaped support pads 2 can be connected to form a rectangular structure to support the edge of the plate body 1; then, an oblique rod 32 is arranged between the two diagonal corners of the rectangular structure, and the two ends of the oblique rod 32 are respectively arranged between the inner grooves 21 of the arc-shaped support pad 2. The two oblique rods 32 are distributed in an "X" shape to provide structural support for the rectangular structure formed by the arc-shaped support pad 2 and the straight rods 31. The stability of the triangular structure between the oblique rods 32, the straight rods 31 and the arc-shaped support pad 2 is utilized to increase the strength of the structural stability of the plate body 1. Among them, the height of the arc support pad 2 can be set between the height of the patch component 11 and the large component 12. When processing the circuit board, the circuit board can use a single set of arc support pads 2 on one side of the patch component 11, and use two stacked sets of arc support pads 2 on one side of the large component 12, so that the circuit board can not only strengthen the structure of the board body 1, but also provide protective support for the outside of the large component 12, reducing the use of the external protective structure of the circuit board, reducing the thickness of the circuit board, and realizing ultra-thin application of the circuit board.
[0026] In order to better apply the circuit board in the product, the arc support pad 2 will be made of insulating material, such as Figure 3 As shown, during the processing of the circuit board, an adhesive sheet 23 can be provided at the end of the arc-shaped support pad 2, and the arc-shaped support pad 2 can be quickly adhered to the board body 1 through the adhesive sheet 23. When the arc-shaped support pad 2 is applied to the board body 1 on one side of the large component 12, two groups of arc-shaped support pads 2 can be provided on the side of the board body 1 where the large components 12 are gathered, depending on the height of the large components 12. The two groups of arc-shaped support pads 2 are stacked and distributed through the adhesive sheet 23, thereby expanding the support range of the straight rod 31 for the large component 12, preventing deformation of the board body 1 caused by the deviation of the large component 12, increasing the flexibility and convenience of the application of the straight rod 31 in the circuit board, achieving balanced support on both sides of the board body 1, and improving the structural stability of the circuit board.
[0027] In order to better set up and use the circuit board support structure, such as Figure 5As shown, a slot 221 that cooperates with the straight rod 31 can be opened on the connecting block 22, and one side of the slot 221 is set to be connected with the connecting block 22, so that the processing personnel can easily pass the straight rod 31 through the slot 221 and insert it into the connecting block 22, thereby providing structural support for one side of the board body 1 and increasing the convenience of connection between the straight rod 31 and the arc-shaped support pad 2; the circuit board can utilize the advantages of the arc structure in saving materials, improving rigidity and stability, and reinforcing the shape of the circuit board.
[0028] In order to facilitate the stable setting of circuit board structures of different specifications, such as Figure 4 As shown, the inner groove 21 can be set to an arc-shaped structure to facilitate the quick connection of the diagonal rod 32 with the two diagonal arc-shaped support pads 2; then the number of inner grooves 21 is set to two groups, and the two groups of inner grooves 21 are set in a parallel structure on the arc-shaped support pad 2, which is convenient for the overlapping setting of the two groups of diagonal rods 32, providing conditions for the "X"-shaped structure setting of the two groups of diagonal rods 32, ensuring the right-angled triangle structure distribution of the diagonal rods 32 and the straight rods 31, and increasing the structural stability between the straight rods 31 and the arc-shaped support pad 2.
[0029] In order to better increase the structural stability of the circuit board, such as Figure 2 As shown, a plurality of reinforcing rods 33 may be provided between two opposite straight rods 31 , and the plurality of reinforcing rods 33 may be distributed in parallel to increase the connection strength between the straight rods 31 , thereby increasing the support strength of the straight rods 31 on the plate body 1 .
[0030] It is worth mentioning that Figure 5 As shown, the straight rod 31 is provided with reinforcing ribs 311 inside, and the reinforcing ribs 311 can be made of carbon steel. The outer side of the straight rod 31 is provided with an insulating layer, and the insulating layer can be made of heat-resistant rubber, plastic, etc., so that the straight rod 31 can be safely used in the circuit board.
[0031] In some embodiments, in order to ensure the stability of the circuit board structure and make it safer to be used in products, further improvements can be made to the structures of the straight rod 31, the oblique rod 32 and the reinforcing rod 33. A plurality of first insulating blocks 312 can be set on two sides of the straight rod 31, and a plurality of second insulating blocks 313 perpendicular to the first insulating blocks 312 can be set on the other two sides of the straight rod 31. In addition, the first insulating blocks 312 and the second insulating blocks 313 are both triangular prism-shaped structures, which facilitates the first insulating blocks 312 and the second insulating blocks 313 to insulate the straight rod 31 while facilitating heat dissipation. The vertically distributed first insulating blocks 312 and the second insulating blocks 313 can also increase the structural stability of the straight rod 31 and improve the structural strength of the straight rod 31. The structures of the straight rod (31), the oblique rod (32) and the reinforcing rod (33) are the same. Similarly, the structural strength of the oblique rod 32 and the reinforcing rod 33 is increased, the support strength of the board body 1 and the components is enhanced, the deformation and damage of the circuit board are avoided, the use effect of the circuit board is improved, the stacking application of the support structure is reduced, the thickness of the circuit board is compressed, and the circuit board is applied in an ultra-thin manner.
[0032] Of course, the above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.
Claims
1. An ultra-thin circuit board, comprising a board body (1), wherein a plurality of patch components (11) and a plurality of large components (12) are respectively provided on both sides of the board body (1), characterized in that: Two pairs of arc-shaped support pads (2) are provided at the edge of the plate surface of the plate body (1), inner grooves (21) are provided on the inner sides of the arc-shaped support pads (2), connecting blocks (22) are provided at both ends of the arc-shaped support pads (2), a same straight rod (31) is provided between two opposite connecting blocks (22), and a same oblique rod (32) is provided between two diagonally opposite inner grooves (21), for stable support of the circuit board structure.
2. The ultra-thin circuit board according to claim 1, wherein: The arc-shaped support pad (2) is made of insulating material, and an adhesive sheet (23) is provided at the end of the arc-shaped support pad (2), and the arc-shaped support pad (2) is adhered to the plate body (1) via the adhesive sheet (23).
3. The ultra-thin circuit board according to claim 1, wherein: The connecting block (22) is provided with a slot (221) that cooperates with the straight rod (31), and one side of the slot (221) is connected to the connecting block (22).
4. The ultra-thin circuit board according to claim 1, wherein: The inner groove (21) has an arc-shaped structure, and the number of the inner grooves (21) is two groups, and the two groups of oblique rods (32) are overlapped and distributed.
5. The ultra-thin circuit board according to claim 1, wherein: A plurality of reinforcing rods (33) are provided between two of the straight rods (31), and the plurality of reinforcing rods (33) are distributed in parallel.
6. The ultra-thin circuit board according to claim 1, wherein: A reinforcing rib (311) is provided inside the straight rod (31), and the reinforcing rib (311) is made of carbon steel. An insulating layer is provided on the outside of the straight rod (31).
7. The ultra-thin circuit board according to claim 6, wherein: A plurality of first insulating blocks (312) are provided on two sides of the straight rod (31), and a plurality of second insulating blocks (313) perpendicular to the first insulating blocks (312) are provided on the other two sides of the straight rod (31). The first insulating blocks (312) and the second insulating blocks (313) are both triangular prism-shaped structures. The straight rod (31), the oblique rod (32) and the reinforcement rod (33) have the same structure.