Multilayer board blind hole mark layer alignment structure

Abstract

The utility model relates to the field of multilayer circuit boards, and discloses a multilayer board blind hole mark layer alignment structure comprising a multilayer board body, the surface of the multilayer board body is provided with a through groove, the inner wall of the through groove is fixedly connected with a light-transmitting board, the surface of the light-transmitting board is provided with a blind hole, the surface of the multilayer board body is provided with an alignment hole, and the alignment hole is fixedly connected with the through groove. A positioning groove is formed in the surface of the multilayer board body, a copper layer is arranged in the blind hole, a heat conduction layer is fixedly connected to the outer surface of the copper layer, an insulating layer is fixedly connected to the outer surface of the heat conduction layer, a through hole is formed in the surface of the heat conduction layer, and a positioning assembly is arranged on the surface of the multilayer board body. And the outer surface of the insulating layer is fixedly connected with the inner wall of the blind hole. According to the utility model, the alignment structure is arranged, so that when the laminates of the multi-layer board are fixed, whether the blind holes are in an alignment state or not can be conveniently observed, and further, the processing effect of the multi-layer board is ensured.

Description

Technical Field

[0001] The utility model relates to the field of multi-layer circuit boards, in particular to a layer alignment structure for blind hole markings on multi-layer boards. Background Art

[0002] Blind via marking and layer alignment of multilayer boards is a professional term in the manufacturing process of multilayer printed circuit boards. Multilayer boards refer to circuit boards made up of multiple conductive layers and insulating layers stacked alternately. These conductive layers are connected by guide holes. Blind vias are a special type of guide hole that connects the outer layer and at least one inner layer but does not penetrate the entire board. In PCB design, alignment refers to the process of ensuring the correct alignment between the various layers during the manufacturing process of multilayer boards. When making blind vias, the holes need to be precisely placed in the correct position to ensure that they can be properly connected to the target layer.

[0003] After searching, Chinese patent announcement number: CN114189979B discloses a layer-by-layer alignment structure and method for blind hole marking on a multi-layer board. A first layer alignment mechanism is set through the inner layer FPC controller, and a second layer alignment mechanism is set relative to it on other layers. When the equipment processes each layer of FPC controller, it scans the first layer alignment mechanism through the second layer alignment mechanism, and processes based on the same reference point of the first layer alignment mechanism, thereby avoiding deviation problems in the processing of each layer of FPC controller.

[0004] In the above technical solution, blind holes are opened on the light-transmitting layer to facilitate observation of whether the blind holes of the layer boards are in alignment with each other. However, a copper layer needs to be installed inside the blind holes for conductivity, which will hinder the observation of the light-transmitting layer. At the same time, the lack of positioning between the layer boards will cause the risk of deviation between the blind holes. Therefore, a multi-layer board blind hole marking layer alignment structure is proposed to solve the above problems. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a multi-layer board blind hole marking layer alignment structure, which aims to improve the problem in the existing technology that the multi-layer board blind hole marking layer alignment structure lacks the positioning function for multiple groups of layer boards, resulting in deviations between blind holes and causing non-alignment.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a multi-layer board blind hole marking layer alignment structure, comprising a multi-layer board body, a through groove is provided on the surface of the multi-layer board body, a light-transmitting plate is fixedly connected to the inner wall of the through groove, a blind hole is provided on the surface of the light-transmitting plate, an alignment hole is provided on the surface of the multi-layer board body, a positioning groove is provided on the surface of the multi-layer board body, a copper layer is provided inside the blind hole, a heat-conducting layer is fixedly connected to the outer surface of the copper layer, an insulating layer is fixedly connected to the outer surface of the heat-conducting layer, a through hole is provided on the surface of the heat-conducting layer, and a positioning component is provided on the surface of the multi-layer board body.

[0007] As a further description of the above technical solution:

[0008] The outer surface of the insulating layer is fixedly connected to the inner wall of the blind hole.

[0009] As a further description of the above technical solution:

[0010] The through holes are provided in a plurality of groups, and the through holes in the plurality of groups are distributed in a circular array with the center point of the heat conducting layer as the symmetry axis.

[0011] As a further description of the above technical solution:

[0012] The positioning assembly includes a positioning plate, an observation hole is opened at the center of the positioning plate, an elastic band is fixedly connected to the outer wall of the positioning plate, and a clamping groove is opened on the surface of the multilayer board body.

[0013] As a further description of the above technical solution:

[0014] The center points of the observation hole and the blind hole are on the same horizontal line, and the outer wall of the positioning plate is in contact with the surface of the multilayer board body.

[0015] As a further description of the above technical solution:

[0016] The inner surface of the elastic band is matched with the inner wall of the clamping groove.

[0017] As a further description of the above technical solution:

[0018] The clamping groove and the positioning groove are located on the same side wall of the multilayer board body.

[0019] As a further description of the above technical solution:

[0020] A positioning hole is provided on the surface of the multilayer board body, and a positioning block is provided inside the positioning hole.

[0021] As a further description of the above technical solution:

[0022] The top end of the positioning block is fixedly connected to the outer wall of the positioning plate on one side close to the elastic band.

[0023] As a further description of the above technical solution:

[0024] The outer wall of the positioning block is adapted to the inner wall of the positioning hole.

[0025] The utility model has the following beneficial effects:

[0026] 1. In the present invention, the alignment between the layers of the multilayer board is ensured by providing alignment holes and positioning grooves. The copper layer, thermal conductive layer, and insulating layer cooperate with the through holes to ensure the electrical conductivity and heat dissipation performance of the blind holes. The positioning components can help fix the layers while facilitating observation of whether the blind holes are in alignment, thereby ensuring the processing effect of the multilayer board.

[0027] 2. In the present invention, the fixing plate can be quickly connected to the outermost layer of the multilayer board body by providing positioning holes and positioning blocks. The positioning plate provides a stable reference point for the multilayer board, and can quickly separate or combine the positioning plate and the multilayer board body to ensure positioning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a top view schematic diagram of the main structure of a multi-layer board blind hole marking layer alignment structure proposed by the utility model;

[0029] Figure 2 This is a partial separation diagram of the main structure of a multi-layer board blind hole marking layer alignment structure proposed by the utility model;

[0030] Figure 3 This is a partial cross-sectional schematic diagram of a multilayer board main body structure of a multilayer board blind hole marking layer alignment structure proposed by the present invention;

[0031] Figure 4 This utility model proposes a multi-layer board blind hole marking layer alignment structure Figure 3 Enlarged schematic diagram of area A in the middle.

[0032] Legend:

[0033] 1. Multilayer board body; 2. Blind hole; 3. Through slot; 4. Translucent board; 5. Alignment hole; 6. Positioning slot; 7. Copper layer; 8. Thermal conductive layer; 9. Insulation layer; 10. Through hole; 11. Positioning plate; 12. Observation hole; 13. Elastic band; 14. Clamping slot; 15. Positioning hole; 16. Positioning block. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] Reference Figure 1-Figure 3 , the utility model provides an embodiment: a multi-layer board blind hole marking layer alignment structure, including a multi-layer board body 1, a through groove 3 is opened on the surface of the multi-layer board body 1, the through groove 3 is used to install a transparent plate 4, a blind hole 2 is opened on the transparent plate 4 to facilitate whether the blind hole 2 is in a non-aligned state, the inner wall of the through groove 3 is fixedly connected to the transparent plate 4, the surface of the transparent plate 4 is provided with a blind hole 2, the surface of the multi-layer board body 1 is provided with an alignment hole 5, the alignment hole 5 is opened in two groups, and the two groups of alignment holes 5 are symmetrically arranged with the central axis of the multi-layer board body 1 as the symmetry axis, the alignment holes 5 can allow different circuit board layers to be accurately aligned, ensuring the conductive connection and mechanical stability between layers, and at the same time, the alignment holes 5 are arranged on the multi-layer board body 1, which can improve the mechanical stability and rigidity of the overall structure, and the surface of the multi-layer board body 1 is provided with a positioning groove 6, and the positioning groove 6 is opened in a certain A dry group, and several groups of positioning grooves 6 are equidistantly distributed on the outer walls on both sides of the multilayer board body 1. The positioning grooves 6 ensure that the layers are correctly positioned during the assembly process, so as to determine that the blind holes 2 are opened on the same horizontal line. A copper layer 7 is provided inside the blind hole 2. The copper layer 7 provides a conductive path for the blind hole 2, connecting different circuit layers to realize the transmission of electrical signals or power. The outer surface of the copper layer 7 is fixedly connected with a thermal conductive layer 8. The thermal conductive layer 8 can help the heat in the blind hole 2 to be transferred to the external environment. The thermal conductive layer 8 can be set to a material with thermal conductivity, such as a metal composite material or ceramic. The outer surface of the thermal conductive layer 8 is fixedly connected with an insulating layer 9. The surface of the thermal conductive layer 8 is provided with a through hole 10. The through hole 10 is a heat dissipation hole or a thermal conductive hole of the thermal conductive layer 8. The through hole 10 can provide an additional conduction path to help heat conduction. The surface of the multilayer board body 1 is provided with a positioning component.

[0036] Reference Figure 2-Figure 4The outer surface of the insulating layer 9 is fixedly connected to the inner wall of the blind hole 2. Several groups of through holes 10 are provided, and several groups of through holes 10 are distributed in a circular array with the center point of the heat-conducting layer 8 as the symmetry axis. The opening of multiple groups of through holes 10 is conducive to the heat conduction of the heat-conducting layer 8. The positioning component includes a positioning plate 11. An observation hole 12 is opened at the center of the positioning plate 11. The positioning plate 11 is made of a transparent material as a whole. The aperture of the observation hole 12 is larger than the aperture of the through groove 3, so as to facilitate the observation of the opening of the blind hole 2. The outer wall of the positioning plate 11 is fixedly connected with an elastic band 13. The elastic band 13 helps to position and fix the multi-layer plates, and avoids the offset between the layers when the blind hole 2 is opened, which causes the blind hole 2 to be not located. In the aligned state, a clamping groove 14 is provided on the surface of the multilayer board body 1, the center points of the observation hole 12 and the blind hole 2 are on the same horizontal line, the outer wall of the positioning plate 11 is in contact with the surface of the multilayer board body 1, and the inner surface of the elastic band 13 is adapted to the inner wall of the clamping groove 14. When the elastic band 13 is sleeved on the clamping groove 14, it can prevent the elastic band 13 from slipping or shifting, and can provide a better locking effect for multiple groups of layers. After stretching, the elastic band 13 can be evenly distributed on the clamping groove 14, reducing local stress concentration, avoiding material damage, and making the layers evenly stressed. The clamping groove 14 and the positioning groove 6 are on the same side wall of the multilayer board body 1.

[0037] Reference Figure 2 A positioning hole 15 is provided on the surface of the multilayer board body 1, and a positioning block 16 is provided inside the positioning hole 15. The top of the positioning block 16 is fixedly connected to the outer wall of the positioning plate 11 close to the elastic band 13. The outer wall of the positioning block 16 is adapted to the inner wall of the positioning hole 15. There are two groups of positioning blocks 16 and two groups of positioning holes 15, and the two groups of positioning blocks 16 and the positioning holes 15 are symmetrically arranged with the central axis of the positioning plate 11 as the symmetry axis. Through the cooperation of the positioning blocks 16 and the positioning holes 15, the positioning blocks 16 can be quickly positioned with the outermost layer, which is convenient for the subsequent elastic band 13 to fix the remaining layers.

[0038] Working principle: The positioning block 16 is inserted into the corresponding positioning hole 15, so that the positioning plate 11 is quickly positioned on the outermost layer of the multilayer board body 1, and then the elastic band 13 is used to fix all the layers of the multilayer board body 1. The elastic band 13 is inside the clamping groove 14 of each group of layers to provide them with a fixing function, and then according to the alignment degree of the alignment hole 5 and the positioning groove 6, it is ensured that each group of layers is in a flush state, and the deviation problem is avoided when processing the layers. After the layers are bonded, the elastic band 13 can ensure the firmness between the layers. Finally, the elastic band 13 is released, and the positioning plate 11 drives the positioning block 16 to disengage from the positioning hole 15 and separate from the multilayer board body 1, so that the multilayer board body 1 can ensure that the blind hole 2 is in the alignment state when the blind hole 2 is aligned. At the same time, when the multilayer board body 1 is processed, the layers can maintain alignment to facilitate the subsequent fixation of each layer.

[0039] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A multilayer board blind hole marking layer alignment structure, comprising a multilayer board body (1), a through groove (3) being provided on the surface of the multilayer board body (1), a light-transmitting plate (4) being fixedly connected to the inner wall of the through groove (3), and a blind hole (2) being provided on the surface of the light-transmitting plate (4), characterized in that: The surface of the multilayer board body (1) is provided with an alignment hole (5), the surface of the multilayer board body (1) is provided with a positioning groove (6), the interior of the blind hole (2) is provided with a copper layer (7), the outer surface of the copper layer (7) is fixedly connected to a heat-conducting layer (8), the outer surface of the heat-conducting layer (8) is fixedly connected to an insulating layer (9), the surface of the heat-conducting layer (8) is provided with a through hole (10), and the surface of the multilayer board body (1) is provided with a positioning component.

2. The multi-layer board blind hole marking layer alignment structure according to claim 1, characterized in that: The outer surface of the insulating layer (9) is fixedly connected to the inner wall of the blind hole (2).

3. The layer-by-layer alignment structure for blind hole marking of multi-layer boards according to claim 1, characterized in that: The through holes (10) are provided in a plurality of groups, and the plurality of groups of through holes (10) are distributed in a circular array with the center point of the heat conducting layer (8) as the axis of symmetry.

4. The layer-by-layer blind hole marking alignment structure for multi-layer boards according to claim 1, characterized in that: The positioning assembly comprises a positioning plate (11), an observation hole (12) is provided at the center of the positioning plate (11), an elastic band (13) is fixedly connected to the outer wall of the positioning plate (11), and a clamping groove (14) is provided on the surface of the multilayer board body (1).

5. The layer-by-layer alignment structure for blind hole marking of multi-layer boards according to claim 4, characterized in that: The center points of the observation hole (12) and the blind hole (2) are on the same horizontal line, and the outer wall of the positioning plate (11) is in contact with the surface of the multilayer board body (1).

6. The layer-by-layer alignment structure for blind hole marking of multi-layer boards according to claim 4, characterized in that: The inner surface of the elastic band (13) is adapted to the inner wall of the clamping groove (14).

7. The multi-layer board blind hole marking layer alignment structure according to claim 4, characterized in that: The clamping groove (14) and the positioning groove (6) are located on the same side wall of the multilayer board body (1).

8. The layer-by-layer alignment structure for blind hole marking of multi-layer boards according to claim 1, characterized in that: A positioning hole (15) is provided on the surface of the multilayer board body (1), and a positioning block (16) is provided inside the positioning hole (15).

9. The layer-by-layer alignment structure for blind hole marking of multi-layer boards according to claim 8, characterized in that: The top end of the positioning block (16) is fixedly connected to the outer wall of the positioning plate (11) on one side close to the elastic band (13).

10. The layer-by-layer alignment structure for blind hole marking of multi-layer boards according to claim 8, characterized in that: The outer wall of the positioning block (16) is adapted to the inner wall of the positioning hole (15).

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