Circuit board with heat insulation structure

Abstract

The utility model discloses a circuit board with a heat insulation structure, and relates to the technical field of circuit boards, the circuit board with the heat insulation structure comprises a circuit board body, a heat insulation board and a heat dissipation assembly, the heat insulation board is arranged below the circuit board body; the heat dissipation assembly is arranged above the circuit board body; the heat insulation plate sequentially comprises an upper heat insulation layer, a first bonding layer, a reflecting layer, a second bonding layer and a lower heat insulation layer from top to bottom, the heat dissipation assembly comprises a mounting seat and a heat dissipation fan, the heat dissipation fan is detachably arranged on the mounting seat, and the heat dissipation fan faces the circuit board body; heat insulation between the circuit board body and used equipment is achieved through the heat insulation plate, heat transfer is blocked, and the service life of the circuit board body and the service life of the used equipment are prolonged. Heat is dissipated through the heat dissipation assembly, damage to the circuit board body and used equipment due to too high temperature is prevented, and the protection effect is achieved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a circuit board with a heat insulation structure. Background Art

[0002] When a circuit board is used for a long time, it will generate heat, which may cause heat damage to the inside of the circuit board. Excessive heat transfer may also damage the electronic products in use. The circuit boards in the prior art do not use heat insulation boards to achieve heat insulation between the circuit board body and the equipment used, which is not convenient for blocking heat transfer and extending the service life of the circuit board body and the equipment used. They do not use heat dissipation components to dissipate heat, which is not convenient for preventing damage to the circuit board body and the equipment used due to excessive temperature, and is not convenient for playing a protective role. There is an urgent need to develop a circuit board with a heat insulation structure to meet the needs of actual use. Utility Model Content

[0003] In view of this, the present invention addresses the deficiencies in the prior art, and its main purpose is to provide a circuit board with a heat-insulating structure. The heat-insulating structure achieves heat insulation between the circuit board body and the equipment used by adopting a heat-insulating plate, thereby blocking heat transfer and increasing the service life of the circuit board body and the equipment used. The heat dissipation is achieved by adopting a heat dissipation component, thereby preventing damage to the circuit board body and the equipment used due to excessive temperature, thereby playing a protective role.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A circuit board with a heat insulation structure includes a circuit board body, a heat insulation board and a heat dissipation assembly, wherein the heat insulation board is arranged below the circuit board body; the heat dissipation assembly is arranged above the circuit board body; the heat insulation board includes, from top to bottom, an upper heat insulation layer, a first adhesive layer, a reflective layer, a second adhesive layer and a lower heat insulation layer; the heat dissipation assembly includes a mounting seat and a heat dissipation fan, wherein the mounting seat is detachably arranged above the circuit board body, and the heat dissipation fan is detachably arranged on the mounting seat, and the heat dissipation fan faces the circuit board body.

[0006] As a preferred solution: the mounting seat includes an integrally connected mounting portion and a connecting portion, the mounting portion is horizontally arranged above the circuit board body, the connecting portion is vertically arranged on the lower surface of the mounting portion, the cooling fan is detachably arranged on the mounting portion, and the connecting portion is connected to the circuit board body.

[0007] As a preferred solution: the mounting portion is provided with a plurality of ventilation holes corresponding to the positions of the heat dissipation fans, and the plurality of ventilation holes are evenly distributed in a circular shape.

[0008] As a preferred solution: the lower side of the connecting part extends outward to form a protrusion, which is provided with a connecting hole, and the circuit board body is provided with a through hole corresponding to the connecting hole, and the connecting part is detachably connected to the circuit board body through the connecting hole and the through hole.

[0009] As a preferred solution: a plurality of connecting columns are provided on the insulation board, and openings matching the through holes are opened on the connecting columns. There are a plurality of through holes, and the plurality of through holes correspond one-to-one to the openings on the plurality of connecting columns.

[0010] As a preferred solution: there are two cooling fans, which are symmetrically arranged on the mounting base, and both face the circuit board body.

[0011] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that by adopting a heat insulation board to achieve heat insulation between the circuit board body and the equipment used, heat transfer is blocked, and the service life of the circuit board body and the equipment used is increased; by adopting a heat dissipation component to achieve heat evacuation, damage to the circuit board body and the equipment used due to excessive temperature is prevented, thereby playing a protective role.

[0012] In order to more clearly illustrate the structural features and effects of the present invention, it is described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the three-dimensional structure of a circuit board with a heat insulation structure according to the present invention;

[0014] Figure 2 This is an exploded view of a circuit board with a heat insulation structure according to the present invention;

[0015] Figure 3 This is a schematic diagram of the three-dimensional structure of the mounting base of the utility model;

[0016] Figure 4 This is a schematic diagram of the structure of the heat insulation board of the present utility model.

[0017] Description of the accompanying drawings:

[0018] In the figure: 10, circuit board body; 20, insulation board; 21, upper insulation layer; 22, first adhesive layer; 23, reflective layer; 24, second adhesive layer; 25, lower insulation layer; 26, connecting column; 261, opening; 30, heat dissipation component; 31, mounting seat; 311, mounting portion; 3111, ventilation hole; 312, connecting portion; 3121, bump; 3122, connecting hole; 32, cooling fan. DETAILED DESCRIPTION

[0019] The utility model Figures 1 to 4 As shown, a circuit board with a heat insulation structure includes a circuit board body 10, a heat insulation board 20 and a heat dissipation assembly 30, wherein:

[0020] The heat insulation board 20 is arranged below the circuit board body 10; the heat dissipation assembly 30 is arranged above the circuit board body 10; the heat insulation board 20 includes an upper heat insulation layer 21, a first adhesive layer 22, a reflective layer 23, a second adhesive layer 24 and a lower heat insulation layer 25 from top to bottom; the heat dissipation assembly 30 includes a mounting seat 31 and a heat dissipation fan 32, the mounting seat 31 is detachably arranged above the circuit board body 10, and the heat dissipation fan 32 is detachably arranged on the mounting seat 31, and the heat dissipation fan 32 faces the circuit board body 10.

[0021] The thermal insulation board 20 is arranged below the circuit board body 10, and serves to insulate the circuit board body 10 and the equipment used. The thermal insulation board 20 includes an upper thermal insulation layer 21, a first adhesive layer 22, a reflective layer 23, a second adhesive layer 24 and a lower thermal insulation layer 25 from top to bottom. The thermal insulation board 20 is bonded by the first adhesive layer 22 and the second adhesive layer 24. The upper thermal insulation layer 21 adopts cross-linked polyimide aerogel material, and the lower thermal insulation layer 25 adopts cross-linked polyimide aerogel; the heat dissipation component 30 is detachably arranged above the circuit board body 10, and the cooling fan 32 serves to dissipate heat for the circuit board body 10.

[0022] By adopting the heat insulation board 20, heat insulation is achieved between the circuit board body 10 and the equipment used, which blocks heat transfer and increases the service life of the circuit board body 10 and the equipment used; by adopting the heat dissipation component 30, heat is dissipated to prevent damage to the circuit board body 10 and the equipment used due to excessive temperature, thereby playing a protective role; by detachably setting the mounting seat 31 above the circuit board body 10, the cooling fan 32 is detachably set on the mounting seat 31, which is convenient for disassembly and replacement, thereby reducing maintenance costs.

[0023] The mounting seat 31 includes an integrally connected mounting portion 311 and a connecting portion 312. The mounting portion 311 is horizontally arranged above the circuit board body 10, and the connecting portion 312 is vertically arranged on the lower surface of the mounting portion 311. The cooling fan 32 is detachably arranged on the mounting portion 311, and the connecting portion 312 is connected to the circuit board body 10.

[0024] The installation of the heat dissipation fan 32 is facilitated by adopting the installation portion 311 and the connection portion 312 , and the overall structure is compact and occupies a small area.

[0025] The mounting portion 311 is provided with a plurality of ventilation holes 3111 at positions corresponding to the cooling fan 32 . The ventilation holes 3111 are evenly distributed in a circular shape.

[0026] The plurality of ventilation holes 3111 facilitates ventilation and ensures the operation of the heat dissipation fan 32 .

[0027] The lower side of the connecting portion 312 extends outward to form a protrusion 3121, and a connecting hole 3122 is provided on the protrusion 3121. A through hole corresponding to the connecting hole 3122 is opened on the circuit board body 10. The connecting portion 312 is detachably connected to the circuit board body 10 through the connecting hole 3122 and the through hole.

[0028] The connection hole 3122 and the through hole facilitate the detachable connection of the connection portion 312 to the circuit board body 10 .

[0029] The heat insulation board 20 is provided with a plurality of connecting posts 26 , each of which is provided with openings 261 matching the through holes. There are a plurality of through holes, and the plurality of through holes correspond one to one with the openings 261 on the connecting posts 26 .

[0030] The through holes and the openings 261 are used to achieve a detachable connection between the heat shield 20 and the mounting base 31 .

[0031] There are two cooling fans 32 , which are symmetrically disposed on the mounting base 31 . Both cooling fans 32 face the circuit board body 10 .

[0032] The usage and principle of this circuit board with thermal insulation structure are as follows:

[0033] The thermal insulation board is arranged below the circuit board body, and plays a role in heat insulation for the circuit board body and the equipment used. The thermal insulation board includes an upper thermal insulation layer, a first adhesive layer, a reflective layer, a second adhesive layer and a lower thermal insulation layer from top to bottom. The thermal insulation board is bonded by the first adhesive layer and the second adhesive layer. The upper thermal insulation layer adopts cross-linked polyimide aerogel material, and the lower thermal insulation layer adopts cross-linked polyimide aerogel; the heat dissipation component is detachably arranged above the circuit board body, and the cooling fan plays a role in heat dissipation for the circuit board body.

[0034] The design focus of the utility model is that the heat insulation between the circuit board body and the equipment used is achieved by adopting a heat insulation board, heat transfer is blocked, and the service life of the circuit board body and the equipment used is increased; the heat dissipation component is adopted to achieve heat evacuation, thereby preventing damage to the circuit board body and the equipment used due to excessive temperature, and playing a protective role; by detachably arranging the mounting seat above the circuit board body and detachably arranging the cooling fan on the mounting seat, it is easy to disassemble and replace, thereby reducing maintenance costs.

[0035] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A circuit board with a heat insulation structure, characterized in that: It includes a circuit board body, a heat insulation board and a heat dissipation assembly, wherein the heat insulation board is arranged below the circuit board body; the heat dissipation assembly is arranged above the circuit board body; the heat insulation board includes, from top to bottom, an upper heat insulation layer, a first adhesive layer, a reflective layer, a second adhesive layer and a lower heat insulation layer; the heat dissipation assembly includes a mounting seat and a heat dissipation fan, wherein the mounting seat is detachably arranged above the circuit board body, and the heat dissipation fan is detachably arranged on the mounting seat, and the heat dissipation fan faces the circuit board body.

2. The circuit board with a heat insulation structure according to claim 1, characterized in that: The mounting seat includes an integrally connected mounting portion and a connecting portion, the mounting portion is horizontally arranged above the circuit board body, the connecting portion is vertically arranged on the lower surface of the mounting portion, the cooling fan is detachably arranged on the mounting portion, and the connecting portion is connected to the circuit board body.

3. The circuit board with a heat insulation structure according to claim 2, characterized in that: The mounting portion is provided with a plurality of ventilation holes corresponding to the positions of the heat dissipation fan, and the plurality of ventilation holes are evenly distributed in a circular shape.

4. The circuit board with a heat insulation structure according to claim 2, characterized in that: The lower side of the connecting portion extends outward to form a bulge, which is provided with a connecting hole. The circuit board body is provided with a through hole corresponding to the connecting hole. The connecting portion is detachably connected to the circuit board body through the connecting hole and the through hole.

5. The circuit board with a heat insulation structure according to claim 4, characterized in that: The heat insulation board is provided with a plurality of connecting columns, each of which is provided with openings matching the through holes. There are a plurality of through holes, and the plurality of through holes correspond one to one with the openings on the connecting columns.

6. The circuit board with a heat insulation structure according to claim 1, characterized in that: There are two cooling fans, which are symmetrically arranged on the mounting base and both face the circuit board body.

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