Thermoelectric separation copper-based circuit board

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a thermoelectric separation copper-based circuit board, which comprises a substrate and a baffle plate on the surface of the substrate, a heat absorbing plate is arranged above the substrate, the heat absorbing plate is in butt joint with a positioning groove in the substrate through a plug block at the lower end, the heating area of heat transfer is increased, heat emission is promoted, and the efficient heat dissipation effect is achieved; a heat collection part is arranged above the heat absorption plate and used for being attached to a heating element to increase the heating contact face so as to promote heat absorption and prevent heat from being diffused outwards to affect electronic elements of the substrate. According to the utility model, the heat dissipation efficiency of the circuit board can be greatly improved, the condition of heat accumulation can be prevented so as to ensure the stable operation of the circuit board, in addition, the electronic components can be protected in a coating type heat absorption mode, and the negative influence on the electronic components on the surface of the circuit board caused by the overflow of the heat of the heating components can be avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, in particular to a thermal and electrical separation copper-based circuit board. Background Art

[0002] Thermoelectric separation copper-based circuit board is an innovative circuit board. Its circuit part and thermal layer are distributed on different circuit layers. The thermal layer is in direct contact with the heating element to achieve efficient heat dissipation and power transmission. It is suitable for high-power LED lighting, communication equipment, industrial control and other fields, providing reliable heat dissipation and power transmission support.

[0003] At present, in actual applications, it is found that the existing thermal separation copper-based circuit boards are mostly exposed parts of the copper substrate that contact the heating elements. As a result, when absorbing heat, the efficiency of heat transfer to the outside is limited, making it unsuitable for long-term operation of the equipment.

[0004] In order to solve the above problems, this application proposes a thermal and electrical separation copper-based circuit board. Utility Model Content

[0005] The purpose of the utility model is to provide a thermal and electrical separation copper-based circuit board, which solves the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The utility model is a thermoelectric separation copper-based circuit board, comprising: a substrate and a resistance plate on its surface; a heat absorbing plate is provided above the substrate, and the heat absorbing plate is butted against a positioning groove inside the substrate through a plug at the lower end, thereby increasing the heated area of ​​heat transfer to promote heat discharge and achieve an efficient heat dissipation effect; a heat collecting portion is provided above the heat absorbing plate, which is used to fit on a heating element to increase the heated contact surface, thereby promoting heat absorption and preventing heat from diffusing outwards and affecting the electronic components of the substrate.

[0008] Furthermore, a bottom plate is provided below the substrate, and a plug groove is provided on the upper surface of the bottom plate to connect with the positioning groove, so as to contact the bottom area of ​​the plug block to increase the heat transfer area.

[0009] Furthermore, protruding positioning columns are provided above the front and rear sides of the bottom plate, which are engaged with the positioning holes on the front and rear sides of the base plate, so as to combine the bottom plate and the base plate into an integrated structure.

[0010] Furthermore, a barrier is provided on the outer side of the heat absorbing plate to cover the heat collecting part.

[0011] Furthermore, the outer area of ​​the heat collecting portion is a stepped structure that is wider at the bottom and narrower at the top, and a side groove is formed at the intersection.

[0012] Furthermore, a blocking pad is provided on the inner side of the enclosure to fill the side groove for squeezing and fixing the heat collecting part.

[0013] Furthermore, the enclosure is a soft rubber structure, which is used to install and remove heat collecting parts of different shapes at any time, so that the circuit board can adapt to different working environments.

[0014] The utility model has the following beneficial effects:

[0015] The utility model can transfer heat outwards in a short time after contacting the heating element through the combined structure of the base plate and the bottom plate and cooperate with the assembly and disassembly contact surface of the heat absorbing plate, thereby achieving the effect of efficient heat dissipation and preventing the situation where heat is accumulated inside and the heat dissipation rate cannot reach the heat absorption rate.

[0016] The utility model adopts the combined installation method of the heat collecting part and the heat absorbing plate, and the heat collecting part of different shapes can be replaced before use to fit the heating element to increase the contact area, thereby achieving the effect of efficiently absorbing and concentrating heat, and preventing heat from escaping to the outside and causing the surface temperature of the circuit board to rise, affecting the operation of the electronic components.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the overall appearance and structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the overall exploded state structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the internal structure of the base plate and bottom plate of the utility model;

[0022] Figure 4 This is a schematic diagram of the interior of the heat absorbing plate and its partially enlarged structure of the present invention;

[0023] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0024] In the figure: 1. Base plate; 2. Block plate; 3. Bottom plate; 4. Heat absorbing plate; 5. Heat collecting part; 6. Positioning groove; 7. Plug groove; 8. Plug block; 9. Baffle; 10. Positioning column; 11. Positioning hole; 12. Side groove; 13. Blocking pad. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0027] See also Figure 1-4 As shown, the utility model is a thermoelectric separation copper-based circuit board, comprising: a substrate 1 and a baffle 2 on its surface; a heat absorbing plate 4 is provided above the substrate 1, and the heat absorbing plate 4 is connected to the positioning groove 6 inside the substrate 1 through a plug 8 at the lower end, thereby increasing the heat transfer heating area to promote heat discharge and achieve efficient heat dissipation.

[0028] A heat collecting portion 5 is provided above the heat absorbing plate 4, which is used to attach to the heating element to increase the heat contact surface, thereby promoting heat absorption and preventing it from diffusing outwards and affecting the electronic components of the substrate 1;

[0029] This embodiment provides a thermoelectric separation copper-based circuit board that can accelerate heat absorption and heat dissipation. The arranged combination structure of the plug block 8 and the positioning groove 6 can greatly increase the heat dissipation contact surface, improve the heat dissipation effect to prevent heat accumulation from causing poor subsequent heat absorption effect. In addition, the heat collection part 5 can be used to adapt to heating elements of different structures, achieving enclosed heat absorption while preventing heat overflow from affecting the operation of electronic components.

[0030] Among them, a bottom plate 3 is provided under the substrate 1, and a plug groove 7 is opened on the upper surface of the bottom plate 3 to connect with the positioning groove 6, which is used to contact the bottom area of ​​the plug block 8 to increase the heat transfer area, form a double-layer heat dissipation effect, and promote the outward discharge of heat.

[0031] Among them, protruding positioning columns 10 are provided above the front and rear sides of the bottom plate 3, which are engaged with the positioning holes 11 on the front and rear sides of the base plate 1, so as to combine the bottom plate 3 and the base plate 1 into an integrated structure, which is convenient for subsequent paving operations.

[0032] The outer area of ​​the heat collecting portion 5 is a stepped structure that is wider at the bottom and narrower at the top, with side grooves 12 formed at the intersection.

[0033] The outer side of the heat absorbing plate 4 is provided with a baffle 9 covering the heat collecting part 5 , and the inner side of the baffle 9 is provided with a blocking pad 13 filling the side groove 12 for squeezing and fixing the heat collecting part 5 .

[0034] Among them, the enclosure 9 is a rubber soft structure, which is used to install and remove the heat collecting part 5 of different shapes at any time, so that the circuit board can adapt to different working environments, solving the problem that most heat separation copper-based circuit boards need to be customized.

[0035] It can be understood that the present invention can greatly improve the heat dissipation efficiency of the circuit board and prevent heat accumulation to ensure the stable operation of the circuit board. In addition, it can also protect the electronic components through the encapsulated heat absorption method to prevent the heat overflow of the heating elements from negatively affecting the electronic components on the surface of the circuit board.

[0036] A specific application of the operating process of this embodiment is as follows: when in use, first, the positioning column 10 is inserted into the interior of the positioning hole 11 so that the bottom plate 3 and the baffle 2 are combined into one. After this arrangement, after the heat absorbing plate 4 absorbs heat, the heat transfer efficiency can be improved by increasing the contact area between the plug 8 and the positioning groove 6 and the plug groove 7, so as to prevent the heat from accumulating inside and being unable to be quickly and fully discharged, thereby ensuring the subsequent heat absorption efficiency; in addition, before installation, the heat collecting part 5 of different shapes can be replaced according to the structure of the heating element so that it is covered on the surface of the heating element to achieve an efficient heat absorption effect and prevent the heat from diffusing outward to the surface of the baffle 2 and affecting the use effect of its electronic components.

[0037] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0038] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A thermoelectric separation copper-based circuit board, characterized in that: include: A substrate (1) and a blocking plate (2) on its surface; A heat absorbing plate (4) is provided above the substrate (1), and the heat absorbing plate (4) is docked with the positioning groove (6) inside the substrate (1) through a plug (8) at the lower end, thereby increasing the heat transfer heating area to promote heat discharge and achieve an efficient heat dissipation effect; A heat collecting portion (5) is provided above the heat absorbing plate (4) for attaching to the heating element to increase the heat contact surface, thereby promoting heat absorption and preventing heat from diffusing outwards and affecting the electronic components of the substrate (1).

2. The thermal and electrical separation copper-based circuit board according to claim 1, characterized in that: A bottom plate (3) is provided below the substrate (1), and a plug groove (7) is provided on the upper surface of the bottom plate (3) and docked with the positioning groove (6) for contacting the bottom area of ​​the plug block (8) to increase the heat transfer area.

3. The thermal and electrical separation copper-based circuit board according to claim 2, characterized in that: Protruding positioning columns (10) are provided above the front and rear sides of the bottom plate (3) and engage with positioning holes (11) on the front and rear sides of the base plate (1) to combine the bottom plate (3) and the base plate (1) to form an integrated structure.

4. The thermal and electrical separation copper-based circuit board according to claim 1, characterized in that: The outer side of the heat absorbing plate (4) is provided with a baffle (9) covering the heat collecting portion (5).

5. The thermal and electrical separation copper-based circuit board according to claim 1, characterized in that: The outer area of ​​the heat collecting portion (5) is a stepped structure that is wider at the bottom and narrower at the top, with side grooves (12) formed at the intersection.

6. The thermal and electrical separation copper-based circuit board according to claim 4, characterized in that: A blocking pad (13) is provided on the inner side of the enclosure (9) and is filled in the side groove (12) for squeezing and fixing the heat collecting portion (5).

7. The thermal and electrical separation copper-based circuit board according to claim 4, characterized in that: The enclosure (9) is a rubber soft structure, which is used to install and remove heat collecting parts (5) of different shapes at any time, so that the circuit board can adapt to different working environments.

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