Small power amplifier box with low thermal resistance

Abstract

The utility model relates to the technical field of power amplifier devices, in particular to a low-thermal-resistance power amplifier small box which comprises a connecting box body, a heat dissipation assembly is arranged in the connecting box body, a power amplifier tube is arranged above the heat dissipation assembly and located in the connecting box body, and a closing assembly is arranged at the top of the connecting box body. The heat dissipation assembly is used for carrying out heat dissipation treatment on a power amplifier tube in the connection box main body, the heat dissipation assembly is composed of a connection frame, cooling fins, a cooling pipe, a conveying pipe, a water storage tank and a heat dissipation fan, the connection frame is located in the connection box main body, and the multiple sets of cooling fins are located in the connection frame. The cooling pipes are all located among the cooling fins, the conveying pipe is located on the outer side of the connecting frame, the water storage tank is located at the end, away from the conveying pipe, of the outer side of the connecting frame, and compared with an existing small power amplifier box, the overall practicability of the small power amplifier box can be improved through the design.

Description

Technical Field

[0001] The utility model relates to the technical field of power amplifier devices, in particular to a small power amplifier box with low thermal resistance. Background Art

[0002] Power amplifier, abbreviated as power amplifier, generally refers to one of the most basic devices in the audio system, commonly known as "amplifier". Its task is to amplify the weak electrical signal from the signal source (from the mixing console in professional audio systems) to drive the speaker to make sound. Whether the power amplifier can operate normally and reliably and stably for a long time directly affects the sound quality of the audio system; professional power amplifier assembly consists of transformer, power supply board, power amplifier board, and front board; components include power frequency transformer, capacitor, inductor, resistor (including cement resistor, metal carbon film resistor), diode (including voltage regulator diode, switching diode), op amp IC front part, power amplifier tube back part, and heat sink assembly.

[0003] When the power amplifier tube is working, it generates a lot of heat. If this heat cannot be dissipated in time, the temperature of the power amplifier tube will rise, which will affect its performance and stability. When the power amplifier is not used for a long time, it is easy for dust to enter the interior through the heat dissipation vents, affecting the heat dissipation effect during the operation of the power amplifier. Therefore, it is particularly important to improve the existing power amplifier box and design a new low thermal resistance power amplifier box to solve the above technical defects and improve the practicality of the entire power amplifier box. Utility Model Content

[0004] The purpose of the present utility model is to provide a low thermal resistance power amplifier box. When the coolant is introduced into the interior of the cooling tube and the cooling tube is cooled, the low temperature dissipated by the cooling tube can be conducted to the outside of the power amplifier tube through multiple groups of heat sinks, and the power amplifier tube is cooled. The cooling fan is started to introduce the low-temperature gas to the outside of the power amplifier tube, thereby further increasing the heat dissipation effect of the power amplifier tube. The design of multiple groups of heat sinks can not only increase the flow rate of the heat dissipation medium, but also increase the contact area between the heat dissipation medium and the power amplifier tube, which is beneficial for the heat dissipation medium to take away the heat from the power amplifier tube through heat exchange, reduce thermal resistance, and prevent heat from accumulating in the connection box body. At the same time, it can prevent dust from being introduced into the interior of the connection box body and affecting the heat dissipation effect during the operation of the power amplifier, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A low thermal resistance power amplifier box includes a connection box body, a heat dissipation assembly is provided inside the connection box body, a power amplifier tube is provided above the heat dissipation assembly and inside the connection box body, and a closing assembly is provided on the top of the connection box body;

[0007] The heat dissipation assembly is used to dissipate heat for the power amplifier tube inside the connection box body, and the heat dissipation assembly consists of a connection frame, a heat sink, a cooling tube, a delivery pipe, a water storage tank and a cooling fan. The connection frame is located inside the connection box body, multiple groups of heat sinks are located inside the connection frame, multiple groups of cooling tubes are located between multiple groups of heat sinks, the delivery pipe is located outside the connection frame, the water storage tank is located outside the connection frame and away from one end of the delivery pipe, and two groups of cooling fans are located at the bottom of the connection frame;

[0008] The closing assembly is used to close the interior of the connection box body.

[0009] As a preferred solution of the present invention, multiple groups of heat sinks are distributed at equal intervals inside the connecting frame, and multiple groups of cooling tubes are distributed at equal intervals inside the connecting frame.

[0010] As a preferred solution of the present invention, both ends of the cooling pipe extend to both ends of the interior of the connecting frame respectively, and one end of the delivery pipe away from the connecting frame extends to the interior of the water tank.

[0011] As a preferred solution of the present invention, a circulation pump is provided inside the water tank, the output end of the circulation pump is connected to the connecting frame, a semiconductor refrigeration plate is provided inside the water tank and at one end away from the circulation pump, and a heat dissipation block is provided outside the semiconductor refrigeration plate and outside the water tank.

[0012] As a preferred solution of the present invention, a fixing frame is provided inside the connection box body and outside the closing assembly, and the closing assembly is connected to the connection box body via the fixing frame.

[0013] As a preferred solution of the present invention, the closing assembly consists of a closing plate, a connecting rod, a rotating rod and a moving rod. Multiple groups of closing plates are rotatably connected to the inside of the fixed frame, two groups of connecting rods are fixedly connected to the two ends of the closing plate, the rotating rod is rotatably connected to the outside of the closing plate and away from one end of the connecting rod, and the moving rod is located at one end of the multiple groups of rotating rods away from the closing plate.

[0014] As a preferred solution of the present invention, the end of the rotating rod away from the closing plate is rotatably connected to the moving rod, the outer side of the moving rod is fixedly connected to the driving end of the telescopic cylinder, and the end of the telescopic cylinder away from the moving rod is connected to the fixed frame.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. In the present invention, through the design of the heat dissipation component, when the coolant is introduced into the interior of the cooling tube, when the cooling tube is cooled, the low temperature dissipated by the cooling tube can be conducted to the outside of the power amplifier tube through multiple groups of heat sinks, and the power amplifier tube is cooled. The cooling fan is started to introduce the low-temperature gas to the outside of the power amplifier tube, further increasing the heat dissipation effect of the power amplifier tube. The design of multiple groups of heat sinks can not only increase the flow rate of the heat dissipation medium, but also increase the contact area between the heat dissipation medium and the power amplifier tube, which is beneficial for the heat dissipation medium to take away the heat from the power amplifier tube through heat exchange, reduce thermal resistance, and prevent the problem of heat accumulation in the connection box body.

[0017] 2. In the present invention, through the design of the closing component, when the connection box body is not in operation for a long time, the closing component is used to close the interior of the connection box body to prevent dust from entering the interior of the connection box body and affecting the heat dissipation effect during the operation of the power amplifier. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the heat dissipation component of the utility model;

[0020] Figure 3 This is a schematic diagram of the heat sink structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the cooling pipe structure of the utility model;

[0022] Figure 5 This is a schematic diagram of the closed component structure of the utility model.

[0023] In the figure: 1. Connection box body; 2. Heat dissipation assembly; 3. Closing assembly; 4. Connection frame; 5. Heat sink; 6. Cooling pipe; 7. Delivery pipe; 8. Water storage tank; 9. Cooling fan; 10. Semiconductor refrigeration plate; 11. Fixed frame; 12. Closing plate; 13. Connecting rod; 14. Rotating rod; 15. Moving rod. DETAILED DESCRIPTION

[0024] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] Example:

[0026] See also Figure 1-Figure 5, the utility model provides a technical solution:

[0027] A low thermal resistance power amplifier box includes a connection box body 1, a heat dissipation component 2 is provided inside the connection box body 1, a power amplifier tube is provided above the heat dissipation component 2 and inside the connection box body 1, and a closing component 3 is provided on the top of the connection box body 1;

[0028] The heat dissipation assembly 2 is used to dissipate heat for the power amplifier tube inside the connection box body 1, and the heat dissipation assembly 2 consists of a connection frame 4, a heat sink 5, a cooling tube 6, a delivery pipe 7, a water storage tank 8 and a cooling fan 9. The connection frame 4 is located inside the connection box body 1, multiple groups of heat sinks 5 are located inside the connection frame 4, multiple groups of cooling tubes 6 are located between multiple groups of heat sinks 5, the delivery pipe 7 is located outside the connection frame 4, the water storage tank 8 is located outside the connection frame 4 and away from one end of the delivery pipe 7, and two groups of cooling fans 9 are located at the bottom of the connection frame 4;

[0029] The closing component 3 is used to close the interior of the connection box body 1 .

[0030] Furthermore, multiple groups of heat sinks 5 are distributed at equal intervals inside the connecting frame 4, and multiple groups of cooling tubes 6 are distributed at equal intervals inside the connecting frame 4. When the coolant is introduced into the cooling tubes 6 and the cooling tubes 6 are cooled, the low temperature dissipated by the cooling tubes 6 can be conducted to the outside of the power amplifier tubes through the multiple groups of heat sinks 5 to dissipate heat for the power amplifier tubes. The cooling fan 9 is started to introduce the low-temperature gas into the outside of the power amplifier tubes, thereby further increasing the heat dissipation effect on the power amplifier tubes.

[0031] Among them, the two ends of the cooling pipe 6 extend to the two ends inside the connecting frame 4 respectively, and the end of the delivery pipe 7 away from the connecting frame 4 extends to the inside of the water tank 8. When the coolant is introduced into the inside of the connecting frame 4, the coolant can be introduced into the inside of the cooling pipe 6.

[0032] Secondly, a circulation pump is provided inside the water tank 8, and the output end of the circulation pump is connected to the connecting frame 4. A semiconductor refrigeration plate 10 is provided inside the water tank 8 and at one end away from the circulation pump. A heat sink is provided on the outside of the semiconductor refrigeration plate 10 and located on the outside of the water tank 8. When the circulation pump is started, the coolant inside the water tank 8 can be introduced into the interior of the connecting frame 4 through the circulation pump, so that the coolant is introduced into the interior of the cooling pipe 6, and the cooling pipe 6 is cooled, so that the cooling pipe 6 emits low temperature. The coolant can be continuously introduced, so that the excess coolant is introduced into the interior of the delivery pipe 7 and into the interior of the water tank 8. The semiconductor refrigeration plate 10 is started, and the coolant inside the water tank 8 is cooled by the cooling end of the semiconductor refrigeration plate 10, so that the coolant cools the cooling pipe 6 inside the cooling pipe 6. When the semiconductor refrigeration plate 10 is in operation, the heating end is cooled by the heat sink to prevent the heating end from affecting the operation of the cooling end.

[0033] Furthermore, a fixing frame 11 is provided inside the connection box body 1 and outside the closing component 3. The closing component 3 is connected to the connection box body 1 through the fixing frame 11. By connecting the closing component 3 to the fixing frame 11, the closing component 3 can be connected to the connection box body 1.

[0034] Furthermore, the closing component 3 is composed of a closing plate 12, a connecting rod 13, a rotating rod 14 and a moving rod 15. Multiple groups of closing plates 12 are rotatably connected to the inside of the fixed frame 11, two groups of connecting rods 13 are fixedly connected to the two ends of the closing plate 12, the rotating rod 14 is rotatably connected to the outside of the closing plate 12 and away from one end of the connecting rod 13, and the moving rod 15 is located at one end of the multiple groups of rotating rods 14 away from the closing plate 12. When the connection box main body 1 has not been operated for a long time, the interior of the connection box main body 1 is closed by the closing component 3 to prevent dust from being introduced into the interior of the connection box main body 1 and affecting the heat dissipation effect during the operation of the power amplifier.

[0035] Furthermore, the end of the rotating rod 14 away from the closing plate 12 is rotatably connected to the moving rod 15, and the outer side of the moving rod 15 is fixedly connected to the driving end of the telescopic cylinder. The end of the telescopic cylinder away from the moving rod 15 is connected to the fixed frame 11. The telescopic cylinder is started to drive the moving rod 15 to move, so that the rotating rod 14 is moved, and the closing plate 12 is driven to rotate, so that the two ends of multiple groups of closing plates 12 are in contact with each other, so that the connection box body 1 can be closed.

[0036] In this embodiment, the implementation scenario is specifically as follows: during actual use, the semiconductor refrigeration plate 10 is started, and the cooling end of the semiconductor refrigeration plate 10 is used to cool the coolant inside the water tank 8, so that the coolant cools the cooling tube 6 inside the cooling tube 6. When the semiconductor refrigeration plate 10 is in operation, the heat dissipation block is used to dissipate heat on the heating end to prevent the heating end from affecting the operation of the cooling end. The circulation pump is started, and the coolant inside the water tank 8 can be introduced into the interior of the connecting frame 4 through the circulation pump, so that the coolant is introduced into the interior of the cooling tube 6, and the cooling tube 6 is cooled so that the cooling tube 6 emits low temperature, and the cooling tube 6 can be dissipated by multiple sets of heat sinks 5. The low temperature is conducted to the outside of the power amplifier tube to dissipate heat for the power amplifier tube. The coolant can be continuously introduced so that excess coolant is introduced into the inside of the delivery pipe 7 and then into the inside of the water storage tank 8 for re-refrigeration treatment. Through the circulating refrigeration treatment of the coolant, the power amplifier tube can be effectively dissipated by the cooling fan 9. The design of multiple groups of heat sinks 5 can not only increase the flow rate of the heat dissipation medium, but also increase the contact area between the heat dissipation medium and the power amplifier tube, which is beneficial for the heat dissipation medium to take away the heat from the power amplifier tube through heat exchange, reduce thermal resistance, and prevent the problem of heat accumulation in the connection box body 1. Compared with the existing power amplifier box, the utility model can improve the overall practicality of the power amplifier box through design.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A low thermal resistance power amplifier box, comprising a connection box body (1), characterized in that: A heat dissipation component (2) is provided inside the connection box body (1); a power amplifier tube is provided above the heat dissipation component (2) and inside the connection box body (1); and a closing component (3) is provided on the top of the connection box body (1); The heat dissipation component (2) is used to dissipate heat for the power amplifier tube inside the connection box body (1), and the heat dissipation component (2) is composed of a connection frame (4), a heat sink (5), a cooling pipe (6), a delivery pipe (7), a water storage tank (8) and a heat dissipation fan (9). The connection frame (4) is located inside the connection box body (1), multiple groups of heat sinks (5) are located inside the connection frame (4), multiple groups of cooling pipes (6) are located between multiple groups of heat sinks (5), the delivery pipe (7) is located outside the connection frame (4), the water storage tank (8) is located outside the connection frame (4) and away from one end of the delivery pipe (7), and two groups of heat dissipation fans (9) are located at the bottom of the connection frame (4); The closing component (3) is used to close the interior of the connection box body (1).

2. The low thermal resistance power amplifier box according to claim 1, characterized in that: The plurality of groups of heat sinks (5) are distributed at equal intervals inside the connection frame (4), and the plurality of groups of cooling tubes (6) are distributed at equal intervals inside the connection frame (4).

3. The low thermal resistance power amplifier box according to claim 1, characterized in that: The two ends of the cooling pipe (6) extend to the two ends inside the connecting frame (4), respectively, and the end of the delivery pipe (7) away from the connecting frame (4) extends to the inside of the water storage tank (8).

4. The low thermal resistance power amplifier box according to claim 1, characterized in that: A circulation pump is provided inside the water storage tank (8), and an output end of the circulation pump is connected to a connection frame (4). A semiconductor refrigeration plate (10) is provided inside the water storage tank (8) and at one end away from the circulation pump. A heat dissipation block is provided outside the semiconductor refrigeration plate (10) and outside the water storage tank (8).

5. The low thermal resistance power amplifier box according to claim 1, characterized in that: A fixing frame (11) is provided inside the connection box body (1) and outside the closing component (3); the closing component (3) is connected to the connection box body (1) via the fixing frame (11).

6. The low thermal resistance power amplifier box according to claim 5, characterized in that: The closing assembly (3) is composed of a closing plate (12), a connecting rod (13), a rotating rod (14) and a moving rod (15); multiple groups of the closing plates (12) are rotatably connected to the inside of the fixed frame (11); two groups of the connecting rods (13) are fixedly connected to the two ends of the closing plate (12); the rotating rod (14) is rotatably connected to the outside of the closing plate (12) and away from one end of the connecting rod (13); and the moving rod (15) is located at one end of the multiple groups of rotating rods (14) away from the closing plate (12).

7. The low thermal resistance power amplifier box according to claim 6, characterized in that: The end of the rotating rod (14) away from the closing plate (12) is rotatably connected to the moving rod (15), the outer side of the moving rod (15) is fixedly connected to the driving end of the telescopic cylinder, and the end of the telescopic cylinder away from the moving rod (15) is connected to the fixed frame (11).

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