Clamping device and wire cutting machine

Abstract

The utility model provides a clamping device and a wire cutting machine. The clamping device comprises a clamping seat, a clamping table, a crystal support, a lifting unit and a positioning piece. The clamping table is provided with a crystal support installation groove and a through hole penetrating through the clamping table and located in the upper side of the crystal support installation groove. The crystal support is arranged on the lower side of the clamping table, and a clamping block is arranged on the upper side of the crystal support and installed in the crystal support installation groove. The lifting unit is installed on the clamping base and is configured to drive the crystal support or the clamping table to move upwards. The positioning piece is used for penetrating through the through hole and is arranged between the clamping block and the clamping seat so as to limit the upward moving stroke of the crystal support relative to the clamping seat. According to the invention, a processing surface for positioning can be obviously reduced, and when a smaller processing surface is processed, the processing cost can be obviously reduced under the condition of improving the processing quality. And the machining quality of the machining surface is high, namely the flatness of the machining surface is high, so that the clamping effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wire cutting, in particular to a clamping device and a wire cutting machine. Background Art

[0002] In the field of online cutting technology, taking photovoltaic silicon rods as an example, it is generally necessary to go through processes such as squaring and slicing to make silicon rods into silicon wafers. When slicing the silicon rods on the slicer, it is necessary to clamp the crystal support with the help of a clamping device to make the crystal rod as stable as possible to prevent instability and quality problems during the cutting process. The existing clamping device usually includes a clamping seat and a crystal support. The clamping seat is provided with a crystal support mounting groove. When positioned, the top surface of the crystal support mounting groove is in contact with the upper surface of the crystal support to achieve clamping of the crystal support. However, the inventors found that due to the increased processing surface ratio between the top surface of the crystal support mounting groove and the upper surface of the crystal support, there is a problem of poor clamping effect due to uneven processing surface due to processing problems, or the cost is increased in order to improve the flatness of the processing surface. Utility Model Content

[0003] In view of the above problems, the present invention proposes a clamping device and a wire cutting machine to solve the problems of poor clamping effect or high cost of the clamping device in the prior art, and the clamping device can have a higher clamping effect at a lower cost.

[0004] Specifically, the utility model provides a clamping device, which includes:

[0005] A clamping platform, the clamping platform including a crystal tray mounting groove and a through hole penetrating the clamping platform and located above the crystal tray mounting groove;

[0006] A crystal tray, the crystal tray is arranged on the lower side of the clamping platform, and a clamping block is provided on the upper side of the crystal tray, and the clamping block is installed in the crystal tray installation groove;

[0007] A positioning member is used to pass through the through hole, and the positioning member is configured to contact the upper surface of the blocking block to limit the upward movement of the crystal support.

[0008] Optionally, the clamping device further comprises: a clamping seat and a lifting unit, wherein the lifting unit is mounted on the clamping seat and configured to drive the crystal holder or the clamping table to move upward;

[0009] The positioning member is arranged between the clamping block and the clamping seat to limit the upward movement of the crystal holder relative to the clamping seat.

[0010] Optionally, the positioning member is fixedly connected to the clamping seat; or,

[0011] The positioning member is movably arranged on the clamping seat or the clamping platform, and the upper end of the positioning member is configured to contact the clamping seat.

[0012] Optionally, the positioning member is a limiting column or a limiting block, and the projection of the positioning member in the horizontal plane is circular, square, polygonal or plum blossom-shaped;

[0013] The positioning member contacts at least a middle portion of the clamping block along a width direction of the clamping block.

[0014] Optionally, the through hole of the clamping table has a movement position at a lower side of the positioning member.

[0015] Optionally, the clamping device further includes a reset unit, which is disposed between the clamping platform and the positioning member and configured to cause the lower end of the positioning member to remain on the upper side of the crystal tray mounting groove or remain in the crystal tray mounting groove.

[0016] Optionally, the through-hole is a stepped hole, and the stepped hole is used to prevent the positioning member from moving downward and out of the through-hole. The lower end of the positioning member is located in the crystal support mounting groove, and the lifting unit is configured to drive the crystal support to move upward.

[0017] Optionally, a limiting hole with an opening facing downward is provided on the clamping seat, and the upper end of the positioning member is configured to be located in the limiting hole.

[0018] Optionally, there are at least two crystal tray mounting grooves, and the at least two crystal tray mounting grooves include a first crystal tray mounting groove and a second crystal tray mounting groove;

[0019] There are at least two crystal trays, and the at least two crystal trays include a first crystal tray and a second crystal tray; the clamping blocks include a first clamping block and a second clamping block;

[0020] The first crystal support is arranged on the lower side of the clamping platform, the first clamping block is arranged on the upper side of the first crystal support, and the first clamping block is installed in the first crystal support installation groove;

[0021] The second crystal support is arranged on the lower side of the clamping platform, and the second crystal support is arranged parallel to the first crystal support; the second clamping block is arranged on the upper side of the second crystal support, and the second clamping block is installed in the second crystal support installation groove.

[0022] Optionally, there are at least two positioning members, and the at least two positioning members include a first positioning member and a second positioning member; there are at least two through-holes, and the at least two through-holes include a first through-hole and a second through-hole;

[0023] The first positioning member is used to pass through the first through-hole, and the first through-hole is provided on the upper side of the first crystal support mounting groove;

[0024] The second positioning member is used to pass through the second through-hole, and the second through-hole is arranged on the upper side of the second crystal support mounting groove.

[0025] Optionally, the through hole includes a first hole portion located above the first crystal tray mounting groove, a second hole portion located above the second crystal tray mounting groove, and a connecting portion connecting the first hole portion and the second hole portion;

[0026] The positioning member includes a first positioning portion located on the upper side of the first clamping block, a second positioning portion located on the upper side of the second clamping block, and a connecting portion connecting the first positioning portion and the second positioning portion.

[0027] Optionally, both the first wafer support and the second wafer support are half-piece wafer supports, so that the lower side of the first wafer support and the lower side of the second wafer support are both used for mounting a half rod.

[0028] Optionally, the first wafer tray is in contact with the second wafer tray, and a lower surface of the first wafer tray is flush with a lower surface of the second wafer tray.

[0029] Optionally, the crystal support mounting groove is used to prevent the clamping block from detaching downward from the clamping platform; the crystal support mounting groove is horizontally arranged, and at least one end of the crystal support mounting groove passes through the clamping platform.

[0030] Optionally, the clamping platform can be movably arranged on the clamping seat;

[0031] The clamping seat has a clamping platform installation groove, and the clamping platform is installed in the clamping platform installation groove.

[0032] Optionally, the clamping platform mounting groove is used to prevent the clamping platform from disengaging downward from the clamping seat;

[0033] The clamping platform installation groove is horizontally arranged, and at least one end of the clamping platform installation groove passes through the clamping seat.

[0034] Optionally, the clamping platform is fixedly mounted on or integrally formed with the clamping seat.

[0035] The utility model also provides a wire cutting machine, which comprises any one of the above-mentioned clamping devices.

[0036] In the clamping device and wire cutting machine of the present invention, due to the presence of perforations and positioning members, when the crystal tray moves upward, the positioning member abuts against the crystal tray through the perforations, thereby securing the crystal tray. The surface of the positioning member used for positioning, that is, the lower end face of the positioning member, is significantly smaller than the top surface of the crystal tray mounting groove. Accordingly, the positioning surface corresponding to the upper surface of the clamping block on the crystal tray is only a portion of the upper surface of the clamping block. This can significantly reduce the processing surface, and when processing smaller processing surfaces, it is obviously beneficial to reduce processing costs while improving processing quality. Moreover, due to the high processing quality of the processing surface, that is, the high flatness of the processing surface, it is beneficial to improve the clamping effect. That is, the clamping device of the present invention has lower costs and higher clamping effects compared to existing clamping devices.

[0037] Furthermore, in the clamping device and wire cutting machine of the present invention, since the perforations are located above the wafer tray mounting slots, the clamping block can clamp the center of the wafer tray, preventing the wafer tray from deflecting when clamping at the wafer tray's edges. This helps prevent the wafer tray from being higher on one side than on the other. Clamping the wafer tray at the center reduces processing costs compared to clamping at both sides.

[0038] In particular, the clamping device and wire saw of the present invention have two wafer trays. When the two wafer trays are close together or need to touch, it is impossible to clamp them on both sides of each wafer tray, which means that the wafer tray deflection problem cannot be solved. Therefore, the present invention adopts a solution of central clamping using perforations and positioning members, which helps to keep the lower surfaces of the two wafer trays on the same plane.

[0039] Furthermore, the clamping device and wire saw machine of the present invention, which include two wafer holders adapted for bonding half-ingots and a clamping table, allow both half-ingots to be simultaneously mounted on an existing wire saw. The machine then simultaneously cuts the entire ingot, effectively utilizing the cutting capacity of existing wire saws. Specifically, the clamping device of the present invention allows for mounting half-ingots, with one wafer holder attached to each wafer holder, eliminating interference and squeezing issues, and simplifying installation. The ability to simultaneously cut both half-ingots improves cutting efficiency compared to cutting each half-ingot separately. Furthermore, the slicer simultaneously slices both half-ingots, facilitating adaptation to the slicer's cutting capacity and process. Furthermore, after slicing, the two wafer holders can be separated for unloading, facilitating the retrieval of the slices. Specifically, the two wafer holders are separated before debonding, with each half-ingot bonded to its own wafer holder. This allows for automated post-processing of stripping, insertion, and cleaning. Clearly, the clamping device of the present invention provides technical support for conveniently obtaining smaller slices.

[0040] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0042] Figure 1 is a schematic structural diagram of a clamping device according to one embodiment of the present utility model;

[0043] Figure 2 is a schematic structural diagram of a clamping device according to one embodiment of the present utility model;

[0044] Figure 3 is a schematic structural diagram of a clamping device according to one embodiment of the present utility model;

[0045] Figure 4 yes Figure 3 a schematic side view of the clamping device shown;

[0046] Figure 5 It is along Figure 3 Schematic cross-section of the AA;

[0047] Figure 6 It is along Figure 5 Schematic cross-section of the middle BB;

[0048] Figure 7 yes Figure 3 Schematic structural diagram of the clamping platform in the clamping device shown.

[0049] Description of reference numerals:

[0050] 10. Clamping table; 11. First crystal tray mounting slot; 12. Second crystal tray mounting slot; 14. Positioning piece; 15. First positioning piece; 16. Second positioning piece; 20. Crystal tray; 21. First crystal tray; 22. Second crystal tray; 25. First clamping block; 26. Second clamping block; 30. Clamping seat; 40. Lifting unit; 41. Lifting block; 42. Locking strip. DETAILED DESCRIPTION

[0051] Refer to the following Figures 1 to 7To describe the clamping device and wire cutting machine of the embodiment of the present utility model. In the description of this embodiment, it should be understood that the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and other features may be further included.

[0052] Unless otherwise expressly specified or limited, terms such as "disposed," "installed," "connected," "connected," "fixed," and "coupled" should be interpreted broadly. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two elements or interaction between two elements, unless otherwise expressly limited. A person of ordinary skill in the art should be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0053] In addition, in the description of this embodiment, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. That is, in the description of this embodiment, the first feature being "above", "above", and "above" the second feature includes the first feature being directly above and diagonally above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below", or "below" the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is lower in level than the second feature. Moreover, it should be noted that in the description of this embodiment, directions such as up and down are exemplary and can be determined according to specific working conditions. For example, A is above B in the description, but in actual use, A is below B, or A is to one side of B, etc.

[0054] In the description of the present embodiment, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any appropriate manner in any one or more embodiments or examples.

[0055] Unless otherwise stated, the term "plurality" means two or more.

[0056] In the embodiments of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B. The term "and / or" describes an association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0057] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0058] like Figure 1 As shown, and reference Figures 2 to 7 The present invention provides a clamping device comprising a clamping platform 10, a wafer tray 20, and a positioning member 14. The clamping platform 10 has a wafer tray mounting slot and a through-hole extending through the clamping platform 10 and located above the wafer tray mounting slot. The wafer tray 20 is disposed on the lower side of the clamping platform 10, and a clamping block is disposed on the upper side of the wafer tray 20, which is mounted in the wafer tray mounting slot. The positioning member 14 is configured to pass through the through-hole and contact the upper surface of the clamping block to limit the upward movement of the wafer tray 20.

[0059] Furthermore, in some embodiments, the tray mounting groove is used to prevent the clamping block from disengaging downward from the clamping platform 10. In other embodiments, when the tray 20 is directly driven upward, the tray mounting groove may be configured to not prevent the clamping block from disengaging downward from the clamping platform 10. Of course, to facilitate the transportation of the tray 20 and protect the tray 20, the tray mounting groove is preferably configured to prevent the clamping block from disengaging downward from the clamping platform 10.

[0060] During operation, a crystal ingot or half-ingot can be mounted on the crystal holder 20, which is then mounted on the clamping platform 10 via the crystal holder mounting slot. The crystal holder 20 is then moved upward, either directly or through the clamping platform 10. As the crystal holder 20 moves upward, the positioning members 14 act on the crystal holder 20, hindering its upward movement and thereby clamping the crystal holder 20. The clamping device of this embodiment of the utility model achieves clamping of the crystal holder 20 through the provision of perforations and positioning members 14. The reverse action also allows for removal of the crystal holder 20, achieving the functions of clamping, securing, and removing the crystal ingot or half-ingot on a single work platform.

[0061] In the embodiment of the present invention, the surface used for positioning of the positioning member 14, i.e., the lower end surface of the positioning member 14, is significantly smaller than the top surface of the crystal support mounting groove. Accordingly, the positioning surface corresponding to the upper surface of the clamping block on the crystal support 20 is only a portion of the upper surface of the clamping block. This can significantly reduce the processing surface. When processing a smaller processing surface, it is obviously beneficial to reduce processing costs while improving processing quality. Moreover, due to the high processing quality of the processing surface, i.e., the high flatness of the processing surface, it is beneficial to improve the clamping effect. Compared with existing clamping devices, the clamping device of the present invention has lower costs and higher clamping effect.

[0062] Furthermore, because the through-hole is located above the wafer tray mounting slot, the positioning member 14 contacts at least the middle portion of the clamping block along its width, thereby clamping the clamping block in the middle. This prevents the wafer tray 20 from deflecting when clamping at its edges, effectively preventing one side of the wafer tray 20 from being higher than the other. Compared to clamping at both sides of the wafer tray 20, clamping in the middle can reduce processing costs.

[0063] In some embodiments of the present invention, the clamping device further includes a clamping seat 30 and a lifting unit 40. The clamping seat 30 is generally used to be installed on the support frame of the wire cutting machine. Of course, the clamping seat 30 can also be installed on other devices as needed. The clamping table 10 can be installed on the clamping seat. The positioning member 14 is arranged between the clamping block and the clamping seat 30 to limit the upward movement of the crystal holder 20 relative to the clamping seat 30. That is to say, during operation, the crystal rod or half rod can be installed on the crystal holder 20, and then the crystal holder can be installed on the clamping table 10 through the crystal holder mounting groove. Then, the lifting unit 40 can be used to directly drive the crystal holder 20 or drive the crystal holder 20 to move upward through the clamping table 10. As the crystal holder 20 moves upward, the positioning member 14 acts between the crystal holder 20 and the clamping seat 30 and prevents the crystal holder 20 from moving upward. At this time, the clamping of the crystal holder 20 is achieved.

[0064] In some embodiments of the present invention, Figure 1 and Figure 2As shown, the positioning member 14 is fixedly connected to the clamping seat 30. For example, the positioning member 14 can be mounted on the clamping seat 30, or the positioning member 14 and the clamping seat 30 can be integrally formed. In other words, a smaller clamping mating surface is provided on the clamping seat 30 to reduce costs.

[0065] In other embodiments of the present invention, Figures 3 to 7 As shown, the positioning member 14 is movably mounted vertically, with the upper end of the positioning member 14 configured to contact the clamping seat 30. In other words, the positioning member 14 is movably mounted vertically on the clamping seat 30 or the clamping platform 10. Preferably, the positioning member 14 is movably mounted vertically on the clamping platform 10. This movable arrangement, such as placing the positioning member 14 directly within the through-hole, facilitates replacement of the positioning member 14 and installation of the clamping device.

[0066] In some embodiments of the present invention, the through-hole of the clamping platform 10 is positioned below the positioning member 14. In particular, when the positioning member 14 is disposed on the clamping seat 30, the position of the clamping platform 10 facilitates horizontal movement of the clamping platform 10, facilitating installation of the clamping platform 10. The positioning member 14 also guides the lifting and lowering of the clamping platform 10. In this embodiment, the clamping platform 10 needs to be mounted on the clamping seat 30 so that it can move vertically.

[0067] In some embodiments of the present invention, the clamping device further includes a reset unit, disposed between the clamping platform 10 and the positioning member 14, configured to maintain the lower end of the positioning member 14 above the wafer tray mounting slot. For example, the reset unit may be a compression spring mounted on the positioning member 14. In its initial position, the lower end of the positioning member 14 is above the wafer tray mounting slot, i.e., not within the wafer tray mounting slot. This eliminates any obstruction to the clamping block during wafer tray 20 installation, facilitating faster installation. In this embodiment, the clamping platform 10 is mounted on the clamping base 30 in a manner that allows for vertical movement.

[0068] In some alternative embodiments of the present invention, the lower end of the positioning member 14 can also extend into the crystal support mounting groove, as long as it does not hinder the installation of the clamping block. Even if the installation is a little difficult, it is an acceptable solution. When the lower end of the positioning member 14 can also extend into the crystal support mounting groove, there is no need to set a reset unit. It is only necessary to prevent the positioning member 14 from moving downwardly away from the clamping table 10. For example, the perforation is a stepped hole, and the stepped hole is used to prevent the positioning member 14 from moving downwardly away from the perforation. The use of the stepped hole is conducive to the rapid installation of the positioning member 14. Of course, the reset unit can also be used to prevent the positioning member 14 from moving downwardly away from the clamping table 10.

[0069] In some embodiments of the present invention, the positioning member 14 is placed directly in the through-hole. Specifically, after the wafer tray is mounted on the clamping table 10, the positioning member 14 is placed directly in the through-hole, with the lower end of the positioning member 14 contacting the wafer tray 20. After the wafer tray 20 or the clamping table 10 is raised, the upper end of the positioning member 14 contacts the clamping seat 30.

[0070] In some embodiments of the present invention, the clamping seat 30 is provided with a downwardly opening limiting hole, and the upper end of the positioning member 14 is configured to be located within the limiting hole. In embodiments where the positioning member 14 is fixedly mounted on the clamping seat 30, the provision of the limiting hole facilitates the installation of the positioning member 14. In embodiments where the positioning member 14 is movably mounted on the clamping seat 30, the limiting hole has both installation and guiding functions. When the positioning member 14 is movably mounted on the clamping platform 10, the provision of the limiting hole facilitates the insertion of the positioning member 14, thereby facilitating the mating of the clamping seat 30 and the clamping groove.

[0071] In some embodiments of the present invention, the positioning member 14 is a limiting column or a limiting block, and the projection of the positioning member 14 in the horizontal plane is circular, square, polygonal, triangular or plum blossom-shaped.

[0072] In some embodiments of the present invention, there are at least two crystal tray mounting grooves, including a first crystal tray mounting groove 11 and a second crystal tray mounting groove 12. There are at least two crystal trays 20, including a first crystal tray 21 and a second crystal tray 22. The clamping block includes a first clamping block 25 and a second clamping block 26. The first crystal tray 21 is arranged on the lower side of the clamping table 10, and the first clamping block 25 is arranged on the upper side of the first crystal tray 21. The first clamping block 25 is mounted in the first crystal tray mounting groove 11. The second crystal tray 22 is arranged on the lower side of the clamping table 10, and the second crystal tray 22 is arranged parallel to the first crystal tray 21. The second clamping block 26 is arranged on the upper side of the second crystal tray 22, and the second clamping block 26 is mounted in the second crystal tray mounting groove 12.

[0073] In the clamping device of the present invention, since two wafer trays 20 are provided, and the distance between the two wafer trays 20 is relatively close or when they need to touch, it is impossible to clamp them on both sides of each wafer tray 20, which means that the problem of wafer tray 20 deflection cannot be solved. In view of this, the present invention adopts a solution of central clamping using perforations and positioning members 14, which helps to keep the lower surfaces of the two wafer trays 20 on the same plane.

[0074] In some preferred embodiments of the present invention, the first crystal support 21 and the second crystal support 22 are both half-piece crystal supports 20, so that the lower side of the first crystal support 21 and the lower side of the second crystal support 22 are both used to install half rods. This arrangement allows the cutting device to cut two half rods at the same time, and smaller slices can be easily obtained after cutting.

[0075] It should also be noted that in the photovoltaic industry, a half-rod is not exactly half of a square rod in the geometric sense. For example, a square rod of 180×180 may correspond to a half-rod of 180×89, 180×90, 180×91, and so on. In other words, a half-rod can be larger or smaller than the geometric half of a square rod. Specifically, the relationship between the length and width of a half-rod's cross section can be: the width of the half-rod's cross section is between half the length of the cross section minus a predetermined difference and half the length of the cross section plus a predetermined difference. The predetermined difference can be 1 / 10 of the half-rod's cross section length. Typically, the two half-rods carried by the first and second wafer trays 21 and 22 form a complete square rod. In actual manufacturing, the two half-rods carried by the first and second wafer trays 21 and 22 can be larger than, smaller than, or equal to the geometric half of a square rod.

[0076] In some alternative embodiments of the present invention, the sizes of the first and second wafer trays 21, 22 can be adjusted based on actual needs. For example, a crystal ingot can be mounted on the lower side of the first wafer tray 21 and the lower side of the second wafer tray 22. In other alternative embodiments of the present invention, the lower surface of the first wafer tray 21 can also be smaller or larger than the lower surface of the second wafer tray 22.

[0077] Furthermore, the first wafer tray 21 contacts the second wafer tray 22, and the lower surface of the first wafer tray 21 is flush with the lower surface of the second wafer tray 22. Of course, as needed, a certain distance can be set between the first wafer tray 21 and the second wafer tray 22, and a certain height difference can be set between the lower surfaces.

[0078] That is, in some embodiments of the present invention, the first wafer tray 21 is in contact with the second wafer tray 22, and the lower surface of the first wafer tray 21 is flush with the lower surface of the second wafer tray 22, or the height difference is very small, less than 5mm. This arrangement helps form the crystal ingots on the first wafer tray 21 and the second wafer tray 22 into a single unit, facilitating the cutting device to cut the crystal ingots simultaneously or with a small time difference. In other embodiments of the present invention, the first wafer tray 21 and the second wafer tray 22 can be spaced apart according to actual working conditions, and the distance between the first wafer tray 21 and the second wafer tray 22 should be less than or equal to 15mm. For example, the distance between the first wafer tray 21 and the second wafer tray 22 is 1mm, 2mm, 3mm, 4mm, 5mm, 8mm, 10mm, 11mm, 12mm, or 13mm.

[0079] In this embodiment, the wafer trays 20 are each half-piece wafer trays, and there are two wafer trays, namely a first wafer tray 21 and a second wafer tray 22. Each wafer tray is suitable for bonding half-ingots, allowing a half-ingot to be mounted on the underside of each wafer tray. Furthermore, the wafer trays include a clamping table 10, which allows the ingot to be mounted on an existing wire saw. The wire saw cuts the entire ingot simultaneously, effectively utilizing the cutting capacity of the existing wire saw. Specifically, when mounting a half-ingot, the clamping device mounts one half-ingot on each wafer tray, eliminating interference and squeezing issues, and easing installation. The wire saw can cut both half-ingots simultaneously, effectively utilizing its cutting capacity and reducing costs. After cutting, the two wafer trays can be separated to facilitate unloading, and the slices on each wafer tray can be automatically debonded, facilitating the retrieval of the resulting slices. Clearly, the clamping device of this embodiment of the utility model provides technical support for easily obtaining smaller slices.

[0080] In some embodiments of the present invention, Figure 7 As shown, there are at least two positioning members 14, including a first positioning member 15 and a second positioning member 16. There are at least two through-holes, including a first through-hole and a second through-hole.

[0081] The first positioning member 15 is used to pass through a first through-hole provided on an upper side of the first crystal support mounting groove 11 .

[0082] The second positioning member 16 is used to pass through a second through-hole disposed on an upper side of the second crystal support mounting groove 12 .

[0083] In other embodiments of the present invention, the through-hole includes a first hole portion located above the first crystal tray mounting slot 11, a second hole portion located above the second crystal tray mounting slot 12, and a connecting portion connecting the first hole portion and the second hole portion. The positioning member 14 includes a first positioning portion located above the first clamping block 25, a second positioning portion located above the second clamping block 26, and a connecting portion connecting the first and second positioning portions.

[0084] In some embodiments of the present invention, the first tray mounting groove 11 is used to prevent the first clamping block 25 from disengaging downward from the clamping platform 10. The first tray mounting groove 11 is horizontally disposed, and at least one end of the first tray mounting groove 11 extends through the clamping platform 10. The second tray mounting groove 12 is used to prevent the second clamping block 26 from disengaging downward from the clamping platform 10. The second tray mounting groove 12 is horizontally disposed, and at least one end of the second tray mounting groove 12 extends through the clamping platform 10. The tray mounting groove extending through the clamping platform 10 facilitates the installation of the tray 20.

[0085] In some embodiments of the present invention, the clamping table 10 can be movably arranged on the clamping seat 30 up and down. For example, the clamping seat 30 has a clamping table mounting groove for installing the clamping table 10, and the clamping table 10 is installed in the clamping table mounting groove. When in use, after the crystal holder 20 is installed on the clamping table 10, the whole formed by the crystal holder 20 and the clamping table 10 is then installed on the clamping seat 30, which is convenient for the transportation and installation of the crystal rod. Moreover, the clamping seat 30 can directly utilize the clamping seat 30 in the existing wire cutting machine. That is to say, during the production and manufacturing process, the clamping device of the embodiment of the present invention can be based on the existing clamping device, and the clamping seat 30 therein does not need to be redesigned or significantly modified, which is conducive to reducing costs. Furthermore, the clamping table mounting groove is used to prevent the clamping table 10 from detaching downward from the clamping seat 30. The clamping table mounting groove is arranged horizontally, and at least one end of the clamping table mounting groove passes through the clamping seat 30. Of course, in some alternative embodiments, the clamping platform installation slot is only for facilitating the installation of the clamping platform 10 , and a lifting device is used to prevent the clamping platform 10 from falling off the clamping seat 30 .

[0086] In some embodiments of the present invention, the clamping platform 10 is fixedly mounted on or integrally formed with the clamping base 30. That is, when in use, two crystal trays are directly mounted on the clamping platform 10. When transferring a crystal ingot or half-ingot, it is only the individual crystal trays and the crystal ingots bonded to them that are transferred, not the entire crystal tray and clamping platform 10.

[0087] In some embodiments of the present invention, Figure 3 As shown, the clamping device also includes a lifting block 41, which can also be called a mushroom head. The clamping platform 10 also has a receiving slot, which is located between the first mounting slot and the second mounting slot. The lifting block 41 is arranged in the receiving slot and is configured to drive the clamping platform 10 to rise by contacting the clamping platform 10. The lifting unit 40 is configured to drive the lifting block 41 to move upward. Preferably, there are multiple lifting blocks 41, which are arranged in sequence along the length direction of the receiving slot. Multiple lifting blocks 41 move synchronously.

[0088] In some embodiments of the present invention, the receiving slot is connected to both the first mounting slot and the second mounting slot. The lifting block 41 is disposed in the receiving slot and configured to, when rising, drive the first clamping block 25 and the second clamping block 26 to rise by contacting the first clamping block 25 and the second clamping block 26.

[0089] In other embodiments of the present invention, the clamping device further includes a locking bar 42, which is horizontally disposed and configured to simultaneously lift the first and second wafer holders 21 and 22 during elevation. Furthermore, the first clamping block 25 is provided with a first through-hole, and the second clamping block 26 is provided with a second through-hole; the locking bar 42 passes through the first and second through-holes. This through-hole mounting arrangement allows the locking bar 42 to be securely attached to the first and second clamping blocks 25 and 26, improving the stability of the upward movement of the first and second clamping blocks 25 and 26. The locking bar 42 passes through the receiving slot, and the lifting block 41 (also known as a mushroom head) drives the locking bar 42 upward. For example, the lifting block 41 is provided with a third through-hole, through which the locking bar 42 passes. In other embodiments of the present invention, the lifting block 41 is disposed below the locking bar 42, so that the lifting block 41 contacts the locking bar 42, driving the locking bar 42 upward.

[0090] Furthermore, the clamping platform 10 may be provided with a fourth through-hole through which a locking bar 42 passes, allowing the clamping platform 10 and the wafer tray 20 to rise synchronously. Specifically, the lifting unit 40, mounted on the clamping base 30, is configured to drive the wafer tray 20 and the clamping platform 10 upward in a synchronous manner. When the positioning member 14 contacts the wafer tray 20, the wafer tray 20 is clamped.

[0091] In other embodiments of the present invention, Figures 3 to 6 As shown, the locking strip 42 is only used to drive the clamping platform 10 to move up and down.

[0092] In some embodiments of the present invention, the lifting unit 40 may be a hydraulic cylinder, etc. The mounting groove of the crystal holder may be a T-slot, a dovetail slot, or a reverse dovetail slot, etc.

[0093] In some embodiments of the present invention, the lifting unit 40 is configured to move the wafer holder or clamping platform upward. When the wafer holder or clamping platform moves downward, it can descend as the lifting unit 40 descends due to its own gravity. In some embodiments of the present invention, the lifting unit 40 is configured to move the wafer holder or clamping platform downward. That is, when the wafer holder or clamping platform moves downward, the lifting unit 40 can be used to drive the wafer holder or clamping platform downward.

[0094] An embodiment of the present utility model also provides a wire cutting machine, which includes a cutting device and a clamping device in any of the above embodiments. The wire cutting machine is a cutting device for cutting hard and brittle material rods such as single crystal silicon material rods, polycrystalline silicon material rods, sapphire rods, magnetic material rods, etc. The wire cutting machine has the advantages of high efficiency, high production capacity, and high precision. Its principle is to achieve the purpose of cutting by rubbing the workpiece to be processed with a high-speed moving cutting wire. The wire cutting machine often uses single-wire or multi-wire diamond wire to cut, square, and slice silicon materials, etc., so as to obtain corresponding silicon wafers or silicon materials. In this embodiment, a clamping device is used to fix the workpiece, such as a crystal rod, a half rod, or two half rods, and the cutting device moves the cutting wire on it to cut the workpiece.

[0095] In some embodiments of the present invention, the wire saw is a slicer. It can slice silicon rods and the like. For example, crystalline silicon, the primary raw material for solar panels, requires processes such as squaring and slicing before it can be made into thin wafers. The slicing process is performed using a slicer, which slices the squared silicon rods into silicon wafers. The wire saws in embodiments of the present invention are particularly capable of slicing half-rods and offer high cutting efficiency.

[0096] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention can be directly determined or deduced from the contents disclosed herein without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A clamping device, characterized in that: include: A clamping platform, the clamping platform including a crystal support mounting groove and a through hole penetrating the clamping platform and located above the crystal support mounting groove; A crystal tray, the crystal tray is arranged on the lower side of the clamping platform, and a clamping block is provided on the upper side of the crystal tray, and the clamping block is installed in the crystal tray installation groove; a positioning member, configured to pass through the through hole, wherein the positioning member is configured to contact the upper surface of the clamping block to limit the upward movement of the cradle; There are at least two crystal tray mounting grooves, and the at least two crystal tray mounting grooves include a first crystal tray mounting groove and a second crystal tray mounting groove; There are at least two crystal trays, and the at least two crystal trays include a first crystal tray and a second crystal tray; the clamping blocks include a first clamping block and a second clamping block; The first crystal support is arranged on the lower side of the clamping platform, the first clamping block is arranged on the upper side of the first crystal support, and the first clamping block is installed in the first crystal support installation groove; The second crystal support is arranged on the lower side of the clamping platform, and the second crystal support is arranged parallel to the first crystal support; the second clamping block is arranged on the upper side of the second crystal support, and the second clamping block is installed in the second crystal support installation groove.

2. The clamping device according to claim 1, characterized in that Also includes: A clamping seat and a lifting unit, wherein the lifting unit is installed on the clamping seat and is configured to drive the crystal holder or the clamping table to move upward; The positioning member is arranged between the clamping block and the clamping seat to limit the upward movement of the crystal holder relative to the clamping seat.

3. The clamping device according to claim 2, characterized in that The positioning member is fixedly connected to the clamping seat; or, The positioning member is movably disposed on the clamping seat or the clamping platform, and the upper end of the positioning member is configured to contact the clamping seat; or, The positioning piece is placed in the through hole.

4. The clamping device according to claim 1, characterized in that The positioning member is a limiting column or a limiting block, and the projection of the positioning member in the horizontal plane is circular, polygonal or plum blossom-shaped; The positioning member contacts at least a middle portion of the clamping block along a width direction of the clamping block.

5. The clamping device according to claim 1, characterized in that The through hole of the clamping table has a moving position at a lower side of the positioning member.

6. The clamping device according to claim 1, characterized in that The clamping device further includes a reset unit, which is disposed between the clamping platform and the positioning member and configured to cause the lower end of the positioning member to remain on the upper side of the crystal tray mounting groove or to remain in the crystal tray mounting groove.

7. The clamping device according to claim 2, characterized in that: The through hole is a stepped hole, which is used to prevent the positioning member from moving downward and leaving the through hole. The lower end of the positioning member is located in the crystal support mounting groove, and the lifting unit is configured to drive the crystal support to move upward.

8. The clamping device according to claim 2, characterized in that: The clamping seat is provided with a limiting hole with an opening facing downward, and the upper end of the positioning member is configured to be located in the limiting hole.

9. The clamping device according to claim 1, characterized in that: There are at least two positioning members, including a first positioning member and a second positioning member; there are at least two through-holes, including a first through-hole and a second through-hole; The first positioning member is used to pass through the first through-hole, and the first through-hole is provided on the upper side of the first crystal support mounting groove; The second positioning member is used to pass through the second through-hole, and the second through-hole is arranged on the upper side of the second crystal support mounting groove.

10. The clamping device according to claim 1, characterized in that The through hole includes a first hole portion located above the first crystal tray mounting groove, a second hole portion located above the second crystal tray mounting groove, and a connecting portion connecting the first hole portion and the second hole portion; The positioning member includes a first positioning portion located on the upper side of the first clamping block, a second positioning portion located on the upper side of the second clamping block, and a connecting portion connecting the first positioning portion and the second positioning portion.

11. The clamping device according to claim 1, characterized in that: The first wafer support and the second wafer support are both half-piece wafer supports, so that the lower side of the first wafer support and the lower side of the second wafer support are both used for mounting half rods.

12. The clamping device according to claim 11, characterized in that The first crystal tray contacts the second crystal tray, and the lower surface of the first crystal tray is flush with the lower surface of the second crystal tray; or, the distance between the first crystal tray and the second crystal tray is less than or equal to 15 mm, and the lower surface of the first crystal tray is flush with the lower surface of the second crystal tray.

13. The clamping device according to claim 1, characterized in that The crystal support mounting groove is used to prevent the clamping block from detaching downward from the clamping platform; the crystal support mounting groove is arranged horizontally, and at least one end of the crystal support mounting groove passes through the clamping platform.

14. The clamping device according to claim 2, characterized in that The clamping platform is movably arranged on the clamping seat; The clamping seat has a clamping platform installation groove, and the clamping platform is installed in the clamping platform installation groove.

15. The clamping device according to claim 14, characterized in that The clamping platform mounting groove is used to prevent the clamping platform from being disengaged downward from the clamping seat; The clamping platform installation groove is horizontally arranged, and at least one end of the clamping platform installation groove passes through the clamping seat.

16. The clamping device according to claim 2, characterized in that The clamping platform is fixedly mounted on or integrally formed with the clamping seat.

17. A wire cutting machine, characterized in that: Comprising the clamping device according to any one of claims 1 to 16.

18. The wire cutting machine according to claim 17, characterized in that The wire cutting machine is a slicer.

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