Circuit board device, battery and electronic equipment
Through the design of circuit boards that combine rigidity and flexibility and the application of plastic seals, the problem of excessive thickness of circuit board devices is solved, and the thinning and flexibility of batteries and electronic devices are improved.
Patent Information
- Application Number
- CN202422049273.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-22
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-08-22
AI Technical Summary
Due to the different heights of the device, traditional circuit board devices have large thicknesses, which cannot meet the lightweight and thinning requirements of batteries and electronic devices, especially the requirements for battery flexibility and thinning in folding designs.
The design of combining rigid circuit boards and flexible circuit boards is adopted. The flexible circuit board is set to thinner and the rigid circuit board is set to thicker. The rigidity and protection are improved through the plastic sealing part, and the device layout is optimized to reduce the overall thickness.
Effectively reducing the overall thickness of the circuit board device will help thin the battery and electronic equipment, improve the flexibility of the battery and the portability of the electronic equipment.
Smart Images

Figure CN223274262U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic equipment, and in particular to a circuit board device, a battery and an electronic equipment. Background Art
[0002] In current electronic device designs, batteries serve as core energy supply components, and their size and weight directly impact the overall size and portability of the device. Traditional battery modules typically utilize circuit board designs. Due to the varying heights of components on the circuit board assembly, the overall thickness of the circuit board assembly is limited by the size of the tallest component, making it unable to meet the growing demand for thinner and lighter devices. This is especially true for electronic devices with foldable designs, which place higher demands on battery flexibility and thinness. Consequently, the circuit board assemblies used in related technologies suffer from a relatively large thickness, hindering the thinning of the battery, and consequently, the electronic device. Utility Model Content
[0003] The utility model discloses a circuit board device, a battery and an electronic device, so as to solve the problem in the related art that the circuit board device has a large thickness, which is not conducive to the thinning of the battery and further not conducive to the thinning of the electronic device.
[0004] In order to solve the above technical problems, the utility model is achieved as follows:
[0005] In a first aspect, the present application discloses a circuit board device, which includes a first functional device, a second functional device, a first circuit board and a second circuit board connected in sequence, wherein the first device mounting surface of the first circuit board is higher than the second device mounting surface of the second circuit board, the first circuit board is a rigid circuit board, and the second circuit board is a flexible circuit board, the first functional device is arranged on the first device mounting surface, and the second functional device is arranged on the second device mounting surface, and the thickness of the first functional device is less than the thickness of the second functional device.
[0006] Optionally, the circuit board device further includes a first plastic packaging portion, and the first plastic packaging portion covers the second functional component.
[0007] Optionally, the first plastic sealing portion and the first circuit board are spaced apart.
[0008] Optionally, the circuit board device further includes a second plastic packaging portion, and the second plastic packaging portion covers the first functional component.
[0009] Optionally, the circuit board device further includes a third plastic packaging portion, and the third plastic packaging portion covers the first functional component and the second functional component.
[0010] Optionally, in the thickness direction of the first circuit board, the second circuit board is connected to the center position of the first circuit board.
[0011] Optionally, the circuit board device further includes a fourth plastic sealing portion, which is provided on a side of the second circuit board facing away from the second component mounting surface and is flush with a side of the first circuit board facing away from the first component mounting surface.
[0012] Optionally, in the thickness direction of the first circuit board, a side of the second circuit board facing away from the second component mounting surface is flush with a side of the first circuit board facing away from the first component mounting surface.
[0013] In a second aspect, the present application further discloses a battery, which includes the circuit board device described in the first aspect.
[0014] In a third aspect, the present application further discloses an electronic device, which includes the battery described in the second aspect.
[0015] The technical solution adopted by the utility model can achieve the following technical effects:
[0016] The circuit board device disclosed in the embodiment of the present application is configured such that the first circuit board is configured as a rigid circuit board and the second circuit board is configured as a flexible circuit board, so that the first circuit board and the second circuit board are connected to form a rigid-soft circuit board. Since the thickness of the flexible circuit board is relatively thin and the thickness of the rigid circuit board is relatively thick, the second device mounting surface of the second circuit board can be lower than the first device mounting surface of the first circuit board, so that the thicker second functional device can be arranged on the second circuit board and the thinner first functional device can be arranged on the first circuit board. Compared with the related art in which the thicker functional device is also arranged on the rigid circuit board, the overall thickness of the circuit board device can be effectively reduced, which is beneficial to the thinning of the battery and further beneficial to the thinning of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic structural diagram of a first circuit board device disclosed in an embodiment of the present utility model;
[0018] Figure 2 This is a structural diagram of a second circuit board device disclosed in an embodiment of the present utility model;
[0019] Figure 3 This is a schematic structural diagram of a third circuit board device disclosed in an embodiment of the present utility model;
[0020] Figure 4 This is a schematic structural diagram of a fourth circuit board device disclosed in an embodiment of the present utility model;
[0021] Figure 5 This is a structural schematic diagram of the fifth circuit board device disclosed in an embodiment of the present utility model.
[0022] Description of reference numerals:
[0023] 100-first circuit board, 101-first device mounting surface,
[0024] 200-second circuit board, 201-second device mounting surface,
[0025] 310-first functional device, 320-second functional device,
[0026] 410-first plastic sealing part, 420-second plastic sealing part, 430-third plastic sealing part, 440-fourth plastic sealing part,
[0027] 500-pad. DETAILED DESCRIPTION
[0028] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, the following will provide a clear and complete description of the technical solutions of the present invention in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.
[0029] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0030] Please refer to Figures 1 to 5 The embodiment of the present invention discloses a circuit board device, which includes a first functional device 310, a second functional device 320, a first circuit board 100 and a second circuit board 200 connected in sequence.
[0031] In the set position state, for example, the first circuit board 100 and the second circuit board 200 are in parallel, the first device mounting surface 101 of the first circuit board 100 is higher than the second device mounting surface 201 of the second circuit board 200. For details, please refer to Figure 1 It should be noted that, when the first circuit board 100 and the second circuit board 200 are connected, the side of the second circuit board 200 facing away from the second device mounting surface 201 is lower than the side of the first circuit board 100 facing away from the first device mounting surface 101 or is flush with the side of the first circuit board 100 facing away from the first device mounting surface 101, that is, the side of the second circuit board 200 facing away from the second device mounting surface 201 does not exceed the side of the first circuit board 100 facing away from the first device mounting surface 101.
[0032] The first circuit board 100 is a rigid circuit board, and the second circuit board 200 is a flexible circuit board. It should be noted that the rigid circuit board needs to meet its rigidity requirements, so the thickness of the rigid circuit board is relatively thick, while the flexible circuit board needs to maintain its flexibility, so the thickness of the flexible circuit board is relatively thin.
[0033] The first functional device 310 is disposed on the first device mounting surface 101 , and the second functional device 320 is disposed on the second device mounting surface 201 . The thickness of the first functional device 310 is smaller than that of the second functional device 320 .
[0034] The circuit board device disclosed in the embodiment of the present application is configured such that the first circuit board 100 is configured as a rigid circuit board and the second circuit board 200 is configured as a flexible circuit board, so that the first circuit board 100 and the second circuit board 200 are connected to form a rigid-soft circuit board. Since the thickness of the flexible circuit board is relatively thin and the thickness of the rigid circuit board is relatively thick, the second device mounting surface 201 of the second circuit board 200 can be lower than the first device mounting surface 101 of the first circuit board 100, so that the thicker second functional device 320 can be arranged on the second circuit board 200, and the thinner first functional device 310 can be arranged on the first circuit board 100. Compared with the related art in which the thicker functional devices are also arranged on the rigid circuit board, the overall thickness of the circuit board device can be effectively reduced, thereby facilitating the thinning of the battery and, in turn, the thinning of the electronic device.
[0035] Since the rigidity of the flexible circuit board is relatively low, in order to improve the rigidity of the circuit board device at the flexible circuit board, the circuit board device may optionally further include a first plastic packaging portion 410 , and the first plastic packaging portion 410 may cover the second functional component 320 .
[0036] The circuit board device disclosed in the embodiment of the present application is provided with a first plastic sealing part 410 so that the first plastic sealing part 410 covers the second functional device 320, so that the first plastic sealing part 410 can not only improve the rigidity of the circuit board device at the position corresponding to the second functional device 320, but also can
[0037] The second functional device 320 performs protection.
[0038] Specifically, the first plastic sealing portion 410 can extend to the end surface of the first circuit board 100 connected to the second circuit board 200, so that the first plastic sealing portion 410 can be connected to the end surface of the first circuit board 100, thereby improving the stiffness of the connection between the first circuit board 100 and the second circuit board 200, and further improving the overall stiffness of the circuit board device.
[0039] In some actual application scenarios, due to the device arrangement of electronic devices, the circuit board device needs to be bent. In order to enable the circuit board device to adapt to the device arrangement of the electronic device and have the ability to bend, optionally, the first plastic sealing part 410 can be spaced apart from the first circuit board 100, and the part of the second circuit board 200 corresponding to the space between the first plastic sealing part 410 and the first circuit board 100 can have better bending performance, thereby enabling the circuit board device to better adapt to the device arrangement of the electronic device and the need to bend.
[0040] In order to protect the first functional component 310 , the circuit board device may optionally further include a second plastic sealing portion 420 . The second plastic sealing portion 420 may cover the first functional component 310 , thereby protecting the first functional component 310 .
[0041] In order to further improve the overall rigidity of the circuit board device, the circuit board device may optionally further include a third plastic sealing portion 430, which may cover the first functional device 310 and the second functional device 320. Figure 3 The third plastic sealing part 430 can entirely cover the side of the circuit board device where the functional components are provided.
[0042] The circuit board device disclosed in the embodiment of the present application is provided with a third plastic sealing portion 430 so that the third plastic sealing portion 430 completely covers the first functional device 310 and the second functional device 320, thereby further improving the overall rigidity of the circuit board device and protecting the first functional device 310 and the second functional device 320.
[0043] Optionally, the second circuit board 200 may be connected to the center of the first circuit board 100 in the thickness direction of the first circuit board 100 .
[0044] Since the center position of the first circuit board 100 is relatively easy to determine, connecting the second circuit board 200 to the center position of the first circuit board 100 in the thickness direction is beneficial for optimizing the process flow.
[0045] In order to improve the rigidity of the circuit board device at the position of the second circuit board 200, in an optional embodiment, the circuit board device may also have a fourth plastic sealing portion 440. The fourth plastic sealing portion 440 may be arranged on the side of the second circuit board 200 facing away from the second device mounting surface 201 and be flush with the side of the first circuit board 100 facing away from the first device mounting surface 101.
[0046] The circuit board device disclosed in the embodiment of the present application sets a fourth plastic sealing portion 440 on the side of the second circuit board 200 facing away from the second device mounting surface 201, so that the fourth plastic sealing portion 440 can support the second circuit board 200, thereby improving the rigidity of the circuit board device at the position of the second circuit board 200.
[0047] In order to provide a thicker second functional component 320 while satisfying the overall thinning requirement of the circuit board device, optionally, in the thickness direction of the first circuit board 100, the side of the second circuit board 200 facing away from the second component mounting surface 201 is flush with the side of the first circuit board 100 facing away from the first component mounting surface 101, so that the second circuit board 200 is at the lowest position relative to the first circuit board 100 in the thickness direction, which is conducive to the arrangement of the thicker second functional component 320 on the second circuit board 200.
[0048] The circuit board device may further include a solder pad 500 , and the first functional device 310 and the second functional device 320 may be respectively disposed on the first circuit board 100 and the second circuit board 200 via the solder pad 500 .
[0049] There may be multiple first functional devices 310 and multiple second functional devices 320 . The multiple first functional devices 310 may be distributed at intervals on the first circuit board 100 , and the multiple second functional devices 320 may be distributed at intervals on the second circuit board 200 .
[0050] This application also discloses a battery, comprising the circuit board assembly disclosed in the above-described embodiments. The circuit board assembly may be a battery protection module (PCM), a key component in a battery management system, primarily responsible for monitoring and protecting the battery from abnormal conditions, ensuring safe battery use. Of course, the circuit board assembly may also be another circuit module of the battery, and the embodiments of this application do not specifically limit the type of circuit board assembly.
[0051] The battery disclosed in the embodiment of the present application can effectively reduce the overall thickness of the circuit board device by providing the circuit board device disclosed in the above embodiment, thereby facilitating the thinning of the battery and further facilitating the thinning of the electronic device.
[0052] The present application also discloses an electronic device, which includes the battery disclosed in the above embodiment.
[0053] The electronic device disclosed in the embodiment of the present application can effectively reduce the overall thickness of the circuit board device by disposing the battery disclosed in the above embodiment, which is conducive to the thinning of the battery and further the thinning of the electronic device.
[0054] It should be noted that the electronic device can be a mobile phone, tablet, game console or other electronic device, and the embodiments of the present application do not limit the type of electronic device.
[0055] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.
[0056] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.
Claims
1. A circuit board device, characterized in that: The invention comprises a first functional device (310), a second functional device (320), a first circuit board (100) and a second circuit board (200) connected in sequence, wherein the first device mounting surface (101) of the first circuit board (100) is higher than the second device mounting surface (201) of the second circuit board (200), the first circuit board (100) is a rigid circuit board, and the second circuit board (200) is a flexible circuit board, the first functional device (310) is arranged on the first device mounting surface (101), and the second functional device (320) is arranged on the second device mounting surface (201), and the thickness of the first functional device (310) is less than the thickness of the second functional device (320).
2. The circuit board device according to claim 1, wherein: The circuit board device further comprises a first plastic sealing portion (410), wherein the first plastic sealing portion (410) covers the second functional device (320).
3. The circuit board device according to claim 2, wherein: The first plastic sealing portion (410) and the first circuit board (100) are spaced apart.
4. The circuit board device according to claim 1, wherein: The circuit board device further comprises a second plastic sealing portion (420), wherein the second plastic sealing portion (420) covers the first functional device (310).
5. The circuit board device according to claim 1, wherein: The circuit board device further comprises a third plastic sealing portion (430), wherein the third plastic sealing portion (430) covers the first functional device (310) and the second functional device (320).
6. The circuit board device according to claim 1, wherein: In the thickness direction of the first circuit board (100), the second circuit board (200) is connected to the center position of the first circuit board (100).
7. The circuit board device according to claim 6, wherein: The circuit board device further comprises a fourth plastic sealing portion (440), the fourth plastic sealing portion (440) being arranged on a side of the second circuit board (200) facing away from the second device mounting surface (201) and being flush with a side of the first circuit board (100) facing away from the first device mounting surface (101).
8. The circuit board device according to claim 1, wherein: In the thickness direction of the first circuit board (100), a side of the second circuit board (200) facing away from the second component mounting surface (201) is flush with a side of the first circuit board (100) facing away from the first component mounting surface (101).
9. A battery, characterized in that: A circuit board device comprising the circuit board device according to any one of claims 1 to 8.
10. An electronic device, characterized in that: A battery comprising the battery of claim 9.