Circuit board, battery and electronic equipment

Abstract

The utility model discloses a circuit board, a battery and electronic equipment, and belongs to the technical field of batteries. The circuit board comprises a plurality of conducting layers and insulating medium layers distributed between two adjacent conducting layers. The at least two conductive layers in the circuit board can be directly and electrically connected through the first opening and the through hole without arranging an additional conductive connection structure between the through hole and the first opening, so that other types of conductive structures can be arranged at the positions of the conductive connection structures originally distributed between the first opening and the through hole, and the circuit board can be electrically connected through the first opening and the through hole. The conductive structure of the type can be electrically connected with the conductive layer distributed on the side, away from the first insulating dielectric layer, of the second insulating dielectric layer to ensure that the total area of the conductive part used for transmitting the same signal in the conductive layer is large, so that the resistance of the conductive part used for transmitting the same signal in the conductive layer is reduced; therefore, the heating value of the conductive layer during signal transmission is low, and the working temperature of the circuit board is low.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a circuit board, a battery, and an electronic device. Background Art

[0002] The core components of a battery include the circuit board and battery cells, which are key to ensuring safe and efficient battery use. As the core component of energy storage, the battery cell is directly related to the battery's energy storage capacity. The circuit board built into the battery can monitor and control the operating status of the battery cell in real time, ensuring that the cell operates within the appropriate voltage and current range, preventing potential risks such as overcharging, over-discharging, and overheating, thereby ensuring battery safety.

[0003] Generally speaking, the size of a battery cell is closely related to its energy storage capacity. In theory, a larger battery cell means more battery energy storage. Therefore, in order to achieve longer battery life, the size of the battery cell can be increased, thereby extending the battery life.

[0004] However, if the battery package size remains constant, an increase in cell volume will result in a decrease in the volume of the circuit board, which in turn reduces the area of ​​copper foil for the conductors on the circuit board. This will increase the resistance of the copper foil, and the increased resistance will generate more heat when current flows through it, leading to higher operating temperatures of the circuit board. Utility Model Content

[0005] The present invention provides a circuit board, a battery, and an electronic device. The present invention solves the problem of high operating temperature of circuit boards in the prior art. The technical solution is as follows:

[0006] In one aspect, a circuit board is provided, comprising:

[0007] Multiple conductive layers, and an insulating dielectric layer distributed between two adjacent conductive layers;

[0008] The multiple insulating dielectric layers include: two outermost first insulating dielectric layers, and at least one second insulating dielectric layer located between the two first insulating dielectric layers; at least one first insulating dielectric layer has a first opening, and the at least one second insulating dielectric layer has a through hole;

[0009] The orthographic projection of the through hole on the target plane overlaps with the orthographic projection of the first opening on the target plane, and at least two layers of the conductive layer are electrically connected through at least one of the first opening and the through hole; the target plane is a plane parallel to the circuit board.

[0010] Optionally, the orthographic projection of the first opening on the target plane is located within the orthographic projection of the through hole on the target plane.

[0011] Optionally, a central axis of the first opening coincides with a central axis of the through hole.

[0012] Optionally, the circuit board further includes: a first conductive portion and a second conductive portion distributed at both ends of the through hole, and a third conductive portion located on the inner wall of the through hole, wherein both ends of the third conductive portion are electrically connected to the first conductive portion and the second conductive portion respectively;

[0013] The orthographic projections of the first conductive portion and the second conductive portion on the target plane are both located within the orthographic projection of the through hole on the target plane, and at least two conductive layers are electrically connected to the first conductive portion and the second conductive portion respectively.

[0014] Optionally, in the case where both of the two first insulating dielectric layers have the first openings, the multi-layer conductive layer includes: a first conductive layer distributed between the first insulating dielectric layer and the at least one second insulating dielectric layer;

[0015] Wherein, the first conductive layer is distributed around the through hole.

[0016] Optionally, the first conductive layer has a second opening, the orthographic projection of the through hole on the target plane is located within the orthographic projection of the second opening on the target plane, and the boundary of the orthographic projection of the through hole on the target plane does not overlap with the boundary of the orthographic projection of the second opening on the target plane.

[0017] Optionally, a distance between a boundary of an orthographic projection of the through hole on the target plane and a boundary of an orthographic projection of the second opening on the target plane is in a range of 0.2 mm to 0.5 mm.

[0018] Optionally, the multi-layer conductive layer includes: a second conductive layer and a third conductive layer distributed on both sides of the first insulating dielectric layer;

[0019] The first insulating dielectric layer further comprises two third openings spaced apart from each other, and a connecting groove for connecting the two third openings, wherein the third openings are used to connect the second conductive layer and the third conductive layer;

[0020] The circuit board further includes: conductive parts distributed in the communicating grooves.

[0021] Optionally, the first insulating dielectric layer further has an opening communicating with the communicating groove, and the opening is located on a side of the communicating groove away from the second insulating dielectric layer;

[0022] Wherein, the conductive part is used to be filled into the communicating groove through the opening.

[0023] On the other hand, a battery is provided, comprising: a battery cell and a circuit board electrically connected to the battery cell, wherein the circuit board is any of the circuit boards described above.

[0024] On the other hand, an electronic device is provided, comprising: a device body and a battery installed in the device body, wherein the battery is the battery described above.

[0025] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0026] A circuit board comprises: multiple conductive layers; and an insulating dielectric layer disposed between two adjacent conductive layers. Because the orthographic projection of a through-hole on a target plane overlaps the orthographic projection of a first opening on the target plane, at least two conductive layers in the circuit board can be electrically connected directly through the first opening and the through-hole without providing an additional conductive connection structure between the through-hole and the first opening, thereby ensuring smooth transmission of electrical signals between the two different conductive layers within the circuit board. Furthermore, a different type of conductive structure can be provided in place of the conductive connection structure originally disposed between the first opening and the through-hole. This type of conductive structure can be electrically connected to a conductive layer disposed on a side of the second insulating dielectric layer facing away from the first insulating dielectric layer, thereby ensuring a larger total area of ​​the conductive portions of this conductive layer used to transmit the same signal. This reduces the resistance of the conductive portions of this conductive layer used to transmit the same signal, resulting in a lower heat generation of this conductive layer during signal transmission, thereby lowering the operating temperature of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 It is a cross-sectional view of a circuit board;

[0029] Figure 2 is a top view of a circuit board provided in an embodiment of the present application;

[0030] Figure 3 yes Figure 2 A cross-sectional view of the circuit board shown at AA';

[0031] Figure 4 yes Figure 2 A cross-sectional view of the circuit board shown at BB';

[0032] Figure 5is a cross-sectional view of a circuit board provided in an embodiment of the present application;

[0033] Figure 6 is a partial top view of a circuit board provided in an embodiment of the present application;

[0034] Figure 7 is a top view of another circuit board provided in an embodiment of the present application;

[0035] Figure 8 yes Figure 7 A cross-sectional view of the circuit board at line DD' is shown. DETAILED DESCRIPTION

[0036] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0037] Please refer to Figure 1 , Figure 1 The circuit board 00 may include: multiple conductive layers 10 , and an insulating dielectric layer 20 distributed between two adjacent conductive layers 10 .

[0038] The multilayer insulating dielectric layer 20 in the circuit board 00 includes two outermost first insulating dielectric layers 21 and at least one second insulating dielectric layer 22 located between the two first insulating dielectric layers 21. In other words, the circuit board 00 has first insulating dielectric layers 21 on both the top and bottom sides, with at least one second insulating dielectric layer 22 located between the top and bottom first insulating dielectric layers 21.

[0039] The two outermost first insulating dielectric layers 21 in the circuit board 000 each have a first opening M, and at least one second insulating dielectric layer 22 may have a through-hole N. Here, the orthographic projection of the first opening M on the target plane (i.e., a plane parallel to the circuit board) does not coincide with the orthographic projection of the through-hole N on the target plane.

[0040] To this end, the circuit board 00 also needs to include a conductive connection structure 30, the ends of which are respectively connected to the first opening M and the through-hole N. In this case, the conductive layer 10 located on the side of the first insulating dielectric layer 21 facing away from the second insulating dielectric layer 22 can be electrically connected to the conductive layer 10 on the side of another first insulating dielectric layer 201 facing away from the second insulating dielectric layer 22 through the first opening M provided in the first insulating dielectric layer 21, the conductive connection structure 30, the through-hole N provided in at least one second insulating dielectric layer 201, and the first opening M provided in another first insulating layer 21. Thus, the through-hole N, two first openings M, and two conductive connection structures 30 are required within the circuit board 00 to connect the two outermost conductive layers 10 of the circuit board 00, thereby enabling signal transmission between the two different conductive layers 20 within the circuit board 00.

[0041] Please refer to Figure 2 and Figure 3 , Figure 2 is a top view of a circuit board provided in an embodiment of the present application, Figure 3 yes Figure 2 The circuit board is shown in a cross-sectional view taken along line A-A'. Circuit board 000 may include multiple conductive layers 100 and insulating dielectric layers 200 disposed between two adjacent conductive layers 100. It should be noted that the number of conductive layers 100 in circuit board 000 is typically four or more. Therefore, the number of insulating dielectric layers 200 in circuit board 000 may typically be three or more. It should also be noted that each conductive layer 100 in circuit board 000 may be made of copper foil.

[0042] In the present application, each conductive layer 100 in the circuit board 000 can be used to transmit signals. For example, at least some of the conductive layers 100 in the circuit board 000 can include signal lines for signal transmission, and at least one conductive layer 100 in the circuit board 000 can include connection pads for electrical connection to electronic components. Here, the electronic components can be fixed to the circuit board 000 via the connection pads, and the connection pads can be electrically connected to the signal lines in other conductive layers in the circuit board 000, thereby enabling the circuit board 000 to implement corresponding signal processing and signal transmission functions through the electronic components fixed to the circuit board 000.

[0043] The insulating dielectric layer 200 located between two adjacent conductive layers 100 in the circuit board 000 can be used to provide necessary electrical isolation for the two adjacent conductive layers 100, preventing current from flowing between the conductive layers 100 that should not be connected, thereby ensuring the normal operation of the circuit board 000.

[0044] like Figure 3As shown, the multi-layer insulating dielectric layer 200 in the circuit board 000 includes: two outermost first insulating dielectric layers 201, and at least one second insulating dielectric layer 202 located between the two first insulating dielectric layers 201. In other words, the circuit board 000 may have a first insulating dielectric layer 201 on both the top and bottom sides, with at least one second insulating dielectric layer 202 located between the top first insulating dielectric layer 201 and the bottom first insulating dielectric layer 201.

[0045] At least one first insulating dielectric layer 201 in the circuit board 000 may have a first opening K1 , and at least one second insulating dielectric layer 202 may have a through hole C.

[0046] In the present application, the orthographic projection of the through hole C of at least one first insulating dielectric layer 201 on the target plane may overlap with the orthographic projection of the first opening K1 of the first insulating dielectric layer 201 on the target plane, and at least two conductive layers 100 are electrically connected via the at least one first opening K1 and the through hole C. The target plane is a plane parallel to the circuit board 000.

[0047] In an exemplary implementation, Figure 3 As shown, in a circuit board 000, when both first insulating dielectric layers 201 have first openings K1, at least one second insulating dielectric layer 202 located between the two first insulating dielectric layers 201 has a through-hole C. In this case, the conductive layer 100 located on the side of the first insulating dielectric layer 201 facing away from the second insulating dielectric layer 202 can be electrically connected to the conductive layer 100 on the side of another first insulating dielectric layer 201 facing away from the second insulating dielectric layer 202, sequentially through the first openings K1 provided in the first insulating dielectric layer 201, the through-holes C provided in at least one second insulating dielectric layer 201, and the first openings K1 provided in another first insulating layer 201. Thus, by providing the through-holes C and the two first openings K1 in the circuit board 000, the two outermost conductive layers 100 in the circuit board 000 can be electrically connected, thereby enabling signal transmission between two different conductive layers 200 within the circuit board 000.

[0048] In another exemplary implementation, please refer to Figure 4 , Figure 4 yes Figure 2The cross-sectional view of the circuit board at line BB' is shown. In the case where one first insulating dielectric layer 201 in the circuit board 000 has a first opening K1 and another first insulating dielectric layer 201 does not have a first opening K1, at least one second insulating dielectric layer 202 closest to the first insulating dielectric layer 201 having the first opening K1 is provided with a through-hole C. In this case, the conductive layer 100 located on the side of the first insulating dielectric layer 201 having the first opening K1 facing away from the second insulating dielectric layer 202 can be electrically connected to the conductive layer 100 on the side of the at least one second insulating dielectric layer 202 having the through-hole C facing away from the first insulating dielectric layer 201, sequentially through the first opening K1 provided in the first insulating dielectric layer 201 and the through-hole C provided in the at least one second insulating dielectric layer 202. In this way, by setting a through hole C and a first opening K1 in the circuit board 000, the outermost conductive layer 200 in the circuit board 000 can be connected to the internally distributed conductive layer 200, thereby realizing signal transmission between two different conductive layers 200 inside the circuit board 000.

[0049] In this case, by ensuring that the orthographic projection of the through-hole C on the target plane overlaps with the orthographic projection of the first opening K1 on the target plane, at least two conductive layers 100 in the circuit board 000 can be electrically connected directly through the first opening K1 and the through-hole C without providing an additional conductive connection structure between the through-hole C and the first opening K1, thereby ensuring smooth transmission of electrical signals between two different conductive layers 200 within the circuit board 000. In this way, another type of conductive structure can be provided in the location of the conductive connection structure originally located between the first opening K1 and the through-hole C. This type of conductive structure can be electrically connected to the conductive layer 100 located on the side of the second insulating dielectric layer 202 facing away from the first insulating dielectric layer 201, thereby ensuring that the total area of ​​the conductive portions of this conductive layer 100 used to transmit the same signal is larger, thereby reducing the resistance of the conductive portions of this conductive layer 100 used to transmit the same signal, thereby reducing the heat generated by this conductive layer 100 during signal transmission and thus lowering the operating temperature of the circuit board 000.

[0050] In summary, the present application proposes a circuit board comprising: multiple conductive layers; and an insulating dielectric layer disposed between two adjacent conductive layers. Because the orthographic projection of a through-hole on a target plane overlaps with the orthographic projection of a first opening on the target plane, at least two conductive layers in the circuit board can be electrically connected directly through the first opening and the through-hole without providing an additional conductive connection structure between the through-hole and the first opening, thereby ensuring smooth transmission of electrical signals between two different conductive layers within the circuit board. Furthermore, another type of conductive structure can be provided in the location of the conductive connection structure originally disposed between the first opening and the through-hole. This type of conductive structure can be electrically connected to a conductive layer disposed on a side of the second insulating dielectric layer facing away from the first insulating dielectric layer, thereby ensuring a larger total area of ​​the conductive portions in this conductive layer used to transmit the same signal, thereby reducing the resistance of the conductive portions in this conductive layer used to transmit the same signal, resulting in lower heat generation in this conductive layer during signal transmission, thereby lowering the operating temperature of the circuit board.

[0051] In the embodiment of the present application, the orthographic projection of the first opening K1 in the first insulating dielectric layer 201 on the target plane may be located within the orthographic projection of the through hole C in at least one second insulating dielectric layer 202 on the target plane.

[0052] In this case, the area of ​​the conductive layer 100 in the circuit board 000 can be further expanded, so that the path of the current passing through the conductive layer 100 is wider, and the resistance of the conductive layer 100 is reduced to ensure that the heat generated by the conductive layer 100 is small, thereby ensuring that the circuit board 000 can operate at a lower temperature, thereby improving the safety of the circuit board 000.

[0053] Exemplarily, the central axis of the first opening K1 in the first insulating dielectric layer 201 coincides with the central axis of the through hole C in at least one second insulating dielectric layer 202 .

[0054] In the examples of this application, please refer to Figure 5 , Figure 5 is a cross-sectional view of a circuit board 000 provided in an embodiment of the present application. Circuit board 000 may further include: a first conductive portion 300 and a second conductive portion 400 located at both ends of a through hole C; and a third conductive portion 500 located on the inner wall of the through hole C. The third conductive portion 500 has its two ends electrically connected to the first conductive portion 300 and the second conductive portion 400, respectively.

[0055] The orthographic projections of the first conductive portion 300 and the second conductive portion 400 on the target plane are both located within the orthographic projection of the through hole C on the target plane, and at least two conductive layers 200 are electrically connected to the first conductive portion 300 and the second conductive portion 400 respectively.

[0056] For example, the third conductive portion 500 can be an annular columnar conductive structure, and the outer boundary of the orthographic projection of the first conductive portion 300 on the target plane can coincide with the outer boundary of the orthographic projection of the third conductive portion 500 on the target plane, to ensure that one end of the third conductive portion 500 can be electrically connected to the first conductive portion 300. Similarly, the outer boundary of the orthographic projection of the second conductive portion 400 on the target plane can coincide with the outer boundary of the orthographic projection of the third conductive portion 500 on the target plane, to ensure that the other end of the third conductive portion 500 can be electrically connected to the second conductive portion 400.

[0057] Optionally, the circuit board 000 may further include a filling portion 700 located within the area enclosed by the third conductive portion 500. By providing the filling portion 700 within the through-hole C, the circuit board 000 can be reinforced to ensure that the circuit board 000 does not suffer from a weakening due to the provision of the through-hole C. For example, the filling portion 700 may be made of an insulating material such as resin or rubber.

[0058] In the embodiments of this application, Figure 5 As shown, when both first insulating dielectric layers 201 in the circuit board 000 have first openings K1, the multi-layer conductive layer 100 in the circuit board 000 may include: a first conductive layer 101 distributed between the first insulating dielectric layer 201 and at least one second insulating dielectric layer 202. The first conductive layer 101 is distributed around the through-hole C.

[0059] In this case, the first conductive layer 101 in the multi-layer conductive layer 100 can extend around the through-hole C and form a ring-shaped layout around the through-hole C, so that the first conductive layer 101 can be more closely attached to the through-hole C. In this way, the layout of the first conductive layer 101 around the through-hole C can fully utilize the internal space of the circuit board 000, making the area of ​​the first conductive layer 101 as large as possible. The increased area of ​​the conductive layer 100 can reduce the resistance of the current passing through the first conductive layer 101, thereby reducing the heat generated when the current passes through the conductive layer 100, ensuring that the circuit board 000 can maintain a low temperature level during operation, and improving the operating safety of the circuit board 000.

[0060] In the examples of this application, please refer to Figure 6 , Figure 6 This is a partial top view of a circuit board provided in an embodiment of the present application. The first conductive layer 101 of the multi-layer conductive layer 100 has a second opening K2. The orthographic projection of a through-hole C in at least one second insulating dielectric layer 202 on the target plane is located within the orthographic projection of the second opening K2 on the target plane, and the boundary of the orthographic projection of the through-hole C on the target plane does not overlap with the boundary of the orthographic projection of the second opening K2 on the target plane.

[0061] In this case, a safe electrical gap provided by the insulating dielectric layer 200 can always be maintained between the through hole C and the first conductive layer 101, thereby effectively avoiding direct contact between the first conductive layer 101 and the through hole C and reducing the risk of short circuit.

[0062] Exemplarily, the distance d between the boundary of the orthographic projection of the through-hole C in at least one second insulating dielectric layer 202 on the target plane and the boundary of the orthographic projection of the second opening K2 on the target plane ranges from 0.2 mm to 0.5 mm. For example, the distance d between the boundary of the orthographic projection of the through-hole C in at least one second insulating dielectric layer 202 on the target plane and the boundary of the orthographic projection of the second opening K2 on the target plane ranges from 0.25 mm. This ensures sufficient electrical isolation between the through-hole C and the second opening K2. Even when the circuit board 000 is subjected to thermal expansion, contraction, or vibration, the risk of short circuits can be effectively avoided, thereby improving the electrical safety of the circuit board 000.

[0063] In the examples of this application, please refer to Figure 7 and Figure 8 , Figure 7 is a top view of another circuit board provided in an embodiment of the present application, Figure 8 yes Figure 7 The multi-layer conductive layer 100 in the circuit board 000 includes a second conductive layer 102 and a third conductive layer 103 distributed on both sides of the first insulating dielectric layer 201 .

[0064] The first insulating dielectric layer 201 further has two third openings K3 spaced apart from each other, and a connecting groove M for connecting the two third openings K3 . The third openings K3 are used to connect the second conductive layer 102 and the third conductive layer 103 .

[0065] In the present application, the circuit board 000 further includes: a conductive portion 600 distributed in the connecting groove M.

[0066] In this case, by adding a conductive part 600 in the connecting groove M, not only the electrical connection between the second conductive layer 102 and the third conductive layer 103 is made more stable, but the addition of the conductive part 600 can effectively expand the conductive path of the circuit board 000, reducing the resistance when the current passes through the first conductive layer 101 and the second conductive layer 102, thereby greatly reducing the heat generated by the circuit board 000 when the current passes through, so as to ensure that the circuit board 000 can still maintain a lower operating temperature under high load conditions, significantly improving the thermal stability and long-term operation reliability of the circuit board 000.

[0067] In the embodiment of the present application, the first insulating dielectric layer 201 in the insulating dielectric layer 200 further has an opening L communicating with the communicating groove M. The opening L is located on a side of the communicating groove M facing away from the second insulating dielectric layer 202 .

[0068] The conductive portion 300 in the circuit board 000 is used to be filled into the communicating groove M through the opening L.

[0069] In this case, the opening L provides a direct channel for filling the conductive part 600. The conductive material can be directly injected into the connecting groove M through the opening L, avoiding a complicated drilling process, reducing production difficulty and cost, and improving manufacturing efficiency.

[0070] In summary, the present application proposes a circuit board comprising: multiple conductive layers; and an insulating dielectric layer disposed between two adjacent conductive layers. Because the orthographic projection of a through-hole on a target plane overlaps with the orthographic projection of a first opening on the target plane, at least two conductive layers in the circuit board can be electrically connected directly through the first opening and the through-hole without providing an additional conductive connection structure between the through-hole and the first opening, thereby ensuring smooth transmission of electrical signals between two different conductive layers within the circuit board. Furthermore, another type of conductive structure can be provided in the location of the conductive connection structure originally disposed between the first opening and the through-hole. This type of conductive structure can be electrically connected to a conductive layer disposed on a side of the second insulating dielectric layer facing away from the first insulating dielectric layer, thereby ensuring a larger total area of ​​the conductive portions in this conductive layer used to transmit the same signal, thereby reducing the resistance of the conductive portions in this conductive layer used to transmit the same signal, resulting in lower heat generation in this conductive layer during signal transmission, thereby lowering the operating temperature of the circuit board.

[0071] An embodiment of the present application further provides a battery, which includes: a battery cell and a circuit board 000 electrically connected to the battery cell, wherein the circuit board 000 is any of the circuit boards 000 described above.

[0072] For example, the circuit board 000 can be a battery protection board. The battery protection board can ensure the safety of the battery by monitoring and regulating the working status of the battery cells in real time, ensuring that the battery cells operate within a reasonable voltage and current range, preventing potential risks such as overcharging, over-discharging, and overheating.

[0073] The embodiment of the present application further provides an electronic device, which may be a smart phone, a laptop, or an e-book, etc. The electronic device may include: a device body and a battery installed in the device body, wherein the battery is the battery described above.

[0074] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0075] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A circuit board, characterized in that: include: Multiple conductive layers (100), and an insulating dielectric layer (200) distributed between two adjacent conductive layers (100); The multiple insulating dielectric layers (200) include: two outermost first insulating dielectric layers (201), and at least one second insulating dielectric layer (202) located between the two first insulating dielectric layers (201); at least one first insulating dielectric layer (201) has a first opening (K1), and the at least one second insulating dielectric layer (202) has a through hole (C); The orthographic projection of the through hole (C) on the target plane overlaps with the orthographic projection of the first opening (K1) on the target plane, and at least two layers of the conductive layer (100) are electrically connected through at least one of the first opening (K1) and the through hole (C); and the target plane is a plane parallel to the circuit board.

2. The circuit board according to claim 1, wherein: The orthographic projection of the first opening (K1) on the target plane is located within the orthographic projection of the through hole (C) on the target plane.

3. The circuit board according to claim 2, wherein: The central axis of the first opening (K1) coincides with the central axis of the through hole (C).

4. The circuit board according to claim 1, wherein: The circuit board further comprises: a first conductive portion (300) and a second conductive portion (400) distributed at both ends of the through hole (C), and a third conductive portion (500) located on the inner wall of the through hole (C), wherein both ends of the third conductive portion (500) are electrically connected to the first conductive portion (300) and the second conductive portion (400) respectively; The orthographic projections of the first conductive part (300) and the second conductive part (400) on the target plane are both located within the orthographic projection of the through hole (C) on the target plane, and at least two layers of the conductive layer (100) are electrically connected to the first conductive part (300) and the second conductive part (400), respectively.

5. The circuit board according to claim 1, wherein: In the case where both of the two first insulating dielectric layers (201) have the first opening (K1), the multi-layer conductive layer (100) comprises: a first conductive layer (101) distributed between the first insulating dielectric layer (201) and the at least one second insulating dielectric layer (202); Wherein, the first conductive layer (101) is distributed around the through hole (C).

6. The circuit board according to claim 5, characterized in that The first conductive layer (101) has a second opening (K2), the orthographic projection of the through hole (C) on the target plane is located within the orthographic projection of the second opening (K2) on the target plane, and the boundary of the orthographic projection of the through hole (C) on the target plane does not overlap with the boundary of the orthographic projection of the second opening (K2) on the target plane.

7. The circuit board according to claim 6, wherein: The distance between the boundary of the orthographic projection of the through hole (C) on the target plane and the boundary of the orthographic projection of the second opening (K2) on the target plane is in the range of 0.2 mm to 0.5 mm.

8. The circuit board according to any one of claims 1 to 7, characterized in that: The multi-layer conductive layer (100) comprises: a second conductive layer (102) and a third conductive layer (103) distributed on both sides of the first insulating dielectric layer (201); The first insulating dielectric layer (201) further comprises two third openings (K3) spaced apart from each other, and a connecting groove (M) for connecting the two third openings (K3), wherein the third openings (K3) are used to connect the second conductive layer (102) and the third conductive layer (103); The circuit board further comprises: a conductive portion (600) distributed in the communicating groove (M).

9. The circuit board according to claim 8, wherein: The first insulating medium layer (201) further comprises an opening (L) communicating with the communicating groove (M), wherein the opening (L) is located on a side of the communicating groove (M) facing away from the second insulating medium layer (202); Wherein, the conductive portion (600) is used to fill into the communicating groove (M) through the opening (L).

10. A battery, characterized in that: The invention comprises: a battery cell and a circuit board electrically connected to the battery cell, wherein the circuit board is the circuit board according to any one of claims 1 to 9.

11. An electronic device, characterized in that: include: A device body and a battery installed in the device body, wherein the battery is the battery according to claim 10.

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