Protective cover with shielding function

Abstract

A protective cover with a shielding function comprises an insulating shell formed by hot pressing, a copper foil attached to a preset area of the inner surface of the insulating shell and a pasting film covering part of the outer surface of the copper foil, the front face and the back face of the copper foil are each provided with a gelatinous layer, the copper foil is bonded to the inner surface of the insulating shell through the gelatinous layer on one side, and the copper foil is bonded to the outer surface of the insulating shell through the gelatinous layer on the other side. And the film is bonded together through the gelatinous layer on the surface of the other side of the copper foil. The protection cover has certain shielding performance.

Description

Technical Field

[0001] The present application relates to the field of shielding components, and in particular to a protective cover with a shielding function. Background Art

[0002] Shielding components are widely used in electronic components, particularly integrated circuit boards, to reduce signal interference between components on the circuit board. Metal shielding covers are typically used to shield certain electronic components. However, the bottom of the metal shielding cover extends to form several solder pins for soldering to the printed circuit board, leaving gaps between the solder pins that can leak signals. Furthermore, the top and sides of the metal shielding cover also have gaps. Some shielding covers include a shielding frame and a shielding cover that snaps onto the shielding frame, inevitably leaving gaps between the shielding frame and the shielding cover.

[0003] In some demanding electronic devices, a shielding cover alone isn't sufficient to achieve the desired shielding function, and additional components are needed to enhance shielding performance. For example, a protective cover can be added outside the shielding cover over a cluster of electronic components where enhanced shielding is needed. This cover can provide protection against dust and other issues, while also enhancing shielding in certain directions. For example, a layer of copper foil can be added between electronic components that may interfere with each other to strengthen signal shielding in that direction.

[0004] It takes some time from the completion of product manufacturing to the final assembly inside the electronic product. The protective cover of this application may be stored in a warehouse or other places, exposed to the outside air, and some of the copper foil used for shielding is exposed to the air. As time goes by, the colloid layer on the surface of the copper foil will be oxidized and damaged, and the surface of the insulating shell is also easily damaged. Utility Model Content

[0005] In view of this, it is necessary to provide a protective cover with a shielding function, which can effectively enhance the shielding performance of the covered area.

[0006] In order to solve the above technical problems, the present application provides a protective cover with a shielding function, including a hot-pressed insulating shell, a copper foil applied to a predetermined area on the inner surface of the insulating shell, and a film covering the outer surface of the copper foil portion. The copper foil is provided with a glue layer on both sides, the copper foil is bonded to the inner surface of the insulating shell through the glue layer on one side, and the film is bonded together through the glue layer on the other side surface of the copper foil.

[0007] Preferably, the insulating shell is made of polycarbonate material, and the insulating shell includes a shell body, side edges extending downward from the periphery of the shell body, and a raised space protruding upward from the shell body.

[0008] Preferably, the thickness of the insulating shell is between 0.4 mm and 0.5 mm.

[0009] Preferably, the copper foil includes a first copper foil, a second copper foil and a third copper foil, the first copper foil is applied on a predetermined area of ​​the inner surface of the insulating shell, the second copper foil is applied on part of the outer surface of the first copper foil, the third copper foil is applied on the surface of the second copper foil, and the film is applied on the surface of the third copper foil.

[0010] Preferably, the first copper foil includes a first copper foil body, a stamped convex bump formed by stamping upward from a predetermined position of the first copper foil body, and a fitting side wall formed by bending and extending from the periphery of the first copper foil body, and the stamped convex bump corresponds to the raised space of the insulating shell and fits thereon.

[0011] Preferably, the copper foil includes a copper foil layer and a colloid layer provided on both sides of the copper foil layer. The thickness of the copper foil layer is 0.04 mm, and the thickness of the colloid layer is 0.027 mm.

[0012] Preferably, the colloid layer is formed on the surface of the copper foil layer by electroplating.

[0013] Preferably, the film is bonded to the surface of the third copper foil through the colloid layer on the surface of the third copper foil, and the thickness of the film is 0.05 mm.

[0014] Preferably, the protective cover further includes a plurality of adhesive stickers adhered to the inner surface of the insulating shell.

[0015] Preferably, the raised space on the first copper foil is not covered by the second copper foil, and the portion of the first copper foil not covered by the second copper foil is temporarily protected by a protective film.

[0016] The protective cover with shielding function in this application is first formed into an insulating shell by hot pressing of PC material, and then copper foil is attached to the required position of the insulating shell to enhance the shielding performance in a certain position or direction to compensate for the signal leakage that may be caused by the traditional shielding cover, further enhancing the shielding performance between electronic components on the circuit board, and avoiding electromagnetic interference to the outside world or the outside world to the inside. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 A three-dimensional diagram of the protective cover with shielding function for this application;

[0019] Figure 2 A three-dimensional view of the protective cover with shielding function of this application from another angle;

[0020] Figure 3 This is a three-dimensional exploded view of the protective cover with shielding function of this application;

[0021] Figure 4 This is a three-dimensional image of the protective cover with shielding function in this application with a protective film affixed;

[0022] Figure 5 This is a three-dimensional exploded view of the protective cover and protective film with shielding function in this application.

[0023] Description of Reference Numerals

[0024] Insulating shell 10; shell body 11; side 12; raised space 13; copper foil 20; first copper foil 21; first copper foil body 211; stamped convex bump 212; fitted side wall 213; second copper foil 22; third copper foil 23; film 30; adhesive tape 40; first protective film 50; applying portion 51; first tear-off end 52; second protective film 60; film body 61; second tear-off end 62. DETAILED DESCRIPTION

[0025] To make the purpose, technical solutions and advantages of this application more clear, the technical solutions of this application will be described clearly and completely below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of them.

[0026] See also Figures 1 to 3 As shown, the protective cover A with shielding function of the present application includes an insulating shell 10 formed into a cover structure, a copper foil 20 applied to the inner surface of the insulating shell 10, a film 30 partially covering the surface of the copper foil 20, and a plurality of adhesive stickers 40 applied to the inner surface of the insulating shell 10.

[0027] The insulating shell 10 is formed of polycarbonate material (also known as PC material). When forming the insulating shell 10, the incoming material is a flat sheet coil, and the sheet coil is formed into the contour structure of the insulating shell 10 by hot pressing. The thickness of the insulating shell 10 is 0.46 mm, and the actual thickness can be implemented in the range of 0.4-0.50 mm.

[0028] The insulating housing 10 includes a housing body 11 covering the upper side, a side edge 12 extending downward from the periphery of the housing body 11 by bending downward, and a raised space 13 formed by hot pressing and protruding upward from the housing body 11. The raised space 13 protrudes upward to form a receiving space for accommodating higher protruding electronic components.

[0029] The copper foil 20 includes a first copper foil 21 applied to the inner surface of the shell body 11 of the insulating shell 10, a second copper foil 22 applied to a portion of the outer surface of the first copper foil 21, and a third copper foil 23 applied to the outer surface of the second copper foil 22.

[0030] The first copper foil 21 includes a first copper foil body 211, a stamped bump 212 formed by stamping the first copper foil body 211 upward, and a fitting sidewall 213 formed by bending downward and extending from a portion of the outer edge of the first copper foil body 211. The stamped bump 212 fits in contact with the raised space 13 of the insulating housing 10.

[0031] The second copper foil 22 and the third copper foil 23 only partially cover the surface of the first copper foil 21, and the location of the stamped bump 212 is not covered by the second copper foil 22 and the third copper foil 23. The copper foil 20 includes a copper foil layer and an adhesive layer bonded to both sides of the copper foil layer. The thickness of the copper foil layer is greater than the thickness of the adhesive layer on both sides. Specifically, the thickness of the copper foil layer is 0.04 mm, and the thickness of the adhesive layer is 0.027 mm. The adhesive layer is present on both sides of the first copper foil 21, the second copper foil 22, and the third copper foil 23.

[0032] The number of layers of copper foil 20 is determined by specific test data. In actual implementation, if one layer of copper foil 20 can achieve the desired shielding performance, only the first copper foil 21 is required; otherwise, second, third, and fourth layers of copper foil 20 may be required to ensure shielding performance. The first copper foil 21 is attached to the inner surface of the housing body 11, the second copper foil 22 is attached to the outer surface of the first copper foil 21, and the third copper foil 23 is attached to the outer surface of the second copper foil 22.

[0033] The adhesive tape 40 is attached to the inner surface of the housing body 11 and does not overlap with the area where the copper foil 20 is located. The adhesive tape 40 is a double-sided adhesive tape.

[0034] Part of the surface of the copper foil 20 is also covered with a film 30. Specifically, the shape of the film 30 is substantially consistent with the shapes of the second copper foil 22 and the third copper foil 23. That is, the film 30 is adhered to the surface of the third copper foil 23. The film 30 is made of PC material and has a thickness of 0.05 mm.

[0035] The protective cover A with shielding function of the present application is manufactured by the following method:

[0036] First, the insulating housing 10 is hot-pressed from a PC sheet to form the desired structural features. A first copper foil 21 is then attached to the inner surface of the insulating housing 10. The first, second, and third copper foils 21, 22, and 23 are each covered with a removable film on the outer surface of the adhesive layer on both sides of the copper foil 20. The second copper foil 22 is then attached to a portion of the first copper foil 21, and the third copper foil 23 is attached to the second copper foil 22. Alternatively, the third copper foil 23 and the second copper foil 22 can be bonded together and then attached to a portion of the first copper foil 21. Finally, the film 30 is applied to the surface of the third copper foil 23. The adhesive tape 40 is then applied to the inner surface of the insulating housing 10.

[0037] The protective cover A with shielding function in the present application is first formed into an insulating shell 10 by hot pressing of PC material, and then copper foil 20 is attached to the required position of the insulating shell 10 to enhance the shielding performance in a certain position or direction to compensate for the signal leakage that may be caused by the traditional shielding cover, further enhancing the shielding performance between electronic components on the circuit board, and avoiding electromagnetic interference to the outside world or the outside world to the inside.

[0038] Please continue reading Figure 4 、 Figure 5 As shown, in order to expose the surface of the copper foil 20 on the protective cover A with shielding performance of the present application, it is necessary to temporarily protect the product after production.

[0039] The protective cover A with shielding performance of the present application further includes a first protective film 50 attached to the surface of the copper foil 20 and a second protective film 60 attached to the first protective film 50 .

[0040] The first protective film 50 includes an application portion 51 designed along the exposed copper foil 20 on the insulating housing 10, and a first tear-off end 52 extending from one end of the application portion 51 outside the insulating housing 10. The application portion 51 is a frame structure that only covers the exposed copper foil 20. The first protective film 50 has no adhesive on its surface and is fixed to the copper foil 20 by a colloid layer adhered to the surface.

[0041] The second protective film 60 covers the inner surface of the insulating housing 10. A slightly sticky gelatin layer is provided on one side of the second protective film 60, and the slightly sticky gelatin layer allows the second protective film 60 to adhere to the inner surface of the insulating housing 10. The second protective film 60 includes a film body 61 and a second tear-off end 62 extending outside the insulating housing 10. The first tear-off end 52 and the second tear-off end 62 overlap with each other.

[0042] The present application utilizes a first protective film 50 without adhesive applied to the surface of the copper foil 20 exposed to the outside world, and then a second protective film 60 with an adhesive layer applied to the first protective film 50 and the surface of the insulating housing 10. If a protective film with an adhesive layer is used to cover the insulating housing 10, the adhesive layer of the exposed copper foil 20 and the adhesive layer of the protective film will adhere to each other, resulting in excessive adhesion and difficulty in removing the protective film. If a protective film without an adhesive layer is used to cover the insulating housing 10, the adhesive layer will be insufficient and easily fall off. The present application solves the above technical problems by using two protective films, one without adhesive and one with adhesive.

[0043] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The above embodiments merely represent preferred implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A protective cover with shielding function, characterized in that: It includes a hot-pressed insulating shell, a copper foil applied to a predetermined area on the inner surface of the insulating shell, and a film covering the outer surface of the copper foil portion. The copper foil is provided with a glue layer on both sides. The copper foil is bonded to the inner surface of the insulating shell through the glue layer on one side, and the film is bonded together through the glue layer on the other side of the copper foil.

2. The protective cover with shielding function according to claim 1, characterized in that: The insulating shell is made of polycarbonate material and includes a shell body, side edges extending downward from the periphery of the shell body, and a raised space protruding upward from the shell body.

3. The protective cover with shielding function according to claim 2, characterized in that: The thickness of the insulating shell is between 0.4 mm and 0.5 mm.

4. The protective cover with shielding function according to claim 2, characterized in that: The copper foil includes a first copper foil, a second copper foil and a third copper foil. The first copper foil is applied to a predetermined area on the inner surface of the insulating shell, the second copper foil is applied to a portion of the outer surface of the first copper foil, the third copper foil is applied to the surface of the second copper foil, and the film is applied to the surface of the third copper foil.

5. The protective cover with shielding function according to claim 4, characterized in that: The first copper foil includes a first copper foil body, a stamped convex bump stamped upward from a predetermined position of the first copper foil body, and a fitting side wall formed by bending and extending from the periphery of the first copper foil body. The stamped convex bump corresponds to the raised space of the insulating shell and fits thereon.

6. The protective cover with shielding function according to claim 5, characterized in that: The copper foil includes a copper foil layer and a colloid layer provided on both sides of the copper foil layer. The thickness of the copper foil layer is 0.04 mm, and the thickness of the colloid layer is 0.027 mm.

7. The protective cover with shielding function according to claim 6, characterized in that: The colloid layer is formed on the surface of the copper foil layer by electroplating.

8. The protective cover with shielding function according to claim 6, characterized in that: The film is bonded to the surface of the third copper foil through the colloid layer on the surface of the third copper foil, and the thickness of the film is 0.05 mm.

9. The protective cover with shielding function according to claim 1, wherein: The protective cover also includes a plurality of adhesive stickers adhered to the inner surface of the insulating shell.

10. The protective cover with shielding function according to claim 5, characterized in that: The raised spaces on the first copper foil are not covered by the second copper foil, and the portion of the first copper foil not covered by the second copper foil is temporarily protected by a protective film.

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