High-vacuum seal welding system
By designing the cooling plate movement mechanism and infrared non-contact heating pipe of the high vacuum sealing and welding system, the cooling unevenness of the bottom plate of the heat-activated fixture is solved, and the temperature control and vacuum performance improvement of the multi-layer fixture is achieved.
Patent Information
- Application Number
- CN202422052565.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-08-23
AI Technical Summary
In the existing high vacuum sealing and welding systems, the cooling uniformity of the bottom plate of the heat-activated fixture is poor, and the temperature control of the multi-layer fixture is difficult to meet the temperature requirements of different time periods when welding.
A high vacuum sealing and welding system including an upper cover assembly, a lower cavity, a lifting mechanism, a plurality of lower heating pipes, the first and second horizontal movement mechanisms, a cooling plate movement mechanism and an inner liner are designed. The cooling plate movement mechanism is used to achieve uniform cooling of the bottom plate of the heat-activated fixture, and heated with an infrared non-contact heating pipe to avoid the cooling plate interfering with the heating process.
The temperature uniform cooling of the heat-activated fixture base plate is achieved, the welding effect is improved, the temperature control requirements for different time periods is met, and the vacuum performance is enhanced.
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Figure CN223277395U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum furnaces, in particular to a high vacuum sealing system. Background Art
[0002] Many existing structures cannot meet the requirements for welding single-layer, small-area fixtures in a single-process, multi-temperature welding process. If the temperature is directly increased to the preset temperature, the solder's melting point may be reached during the thermal activation process, causing it to melt. Therefore, to achieve better welding results, it is necessary to weld multiple layers of fixtures at different temperatures and time periods. The baseplate of the heat-activated fixture in current heat-activated high-vacuum sealing systems has poor cooling uniformity and is directly mounted on the cooling tube. Summary of the Invention
[0003] The utility model provides a high vacuum sealing system, which is used to solve the problem of poor cooling uniformity of a bottom plate of a heat-activated fixture in the prior art.
[0004] A high vacuum sealing system comprises: an upper cover assembly, a lower cavity, a lifting mechanism, a plurality of lower heating tubes, a first horizontal motion mechanism, a second horizontal motion mechanism, a cooling plate motion mechanism and an inner liner; the upper cover of the upper cover assembly and the lower cavity form a sealed vacuum cavity, the lifting mechanism is arranged below the lower cavity, the lower heating tube is arranged inside the lower cavity, the inner liner is arranged inside the lower cavity and below the heating tube, the first horizontal motion mechanism and the second horizontal motion mechanism are vertically arranged and the heat insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism are stacked in the vacuum cavity, the heat insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism reciprocate horizontally in the vacuum cavity, the cooling plate motion mechanism is arranged on the side of the lower cavity, the cooling plates of the cooling plate motion mechanism are arranged below the heat insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism, and the cooling plates of the cooling plate motion mechanism reciprocate horizontally in the vacuum cavity.
[0005] According to the high vacuum sealing system of the present invention, the cooling plate movement mechanism also includes a cooling plate connecting rod, a cooling plate driving mechanism and a cooling plate slider assembly; the cooling plate connecting rod connects the cooling plate, the cooling plate driving mechanism drives the slider of the cooling plate slider assembly to move, and the slider of the cooling plate slider assembly drives the cooling plate to move.
[0006] According to the high vacuum sealing system of the present invention, it further includes avoidance grooves, which are provided on both sides of the heat insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism.
[0007] According to the high vacuum sealing system of the present invention, it also includes a heat insulation plate driving mechanism and at least one supporting roller; the supporting roller is arranged below the heat insulation plate, and the heat insulation plate driving mechanism drives the heat insulation plate.
[0008] According to the high vacuum sealing system of the present invention, it further includes at least one inner liner support column, and the inner liner is supported on the bottom plate of the lower cavity through the inner liner support column.
[0009] According to the high vacuum sealing system of the present invention, it also includes a lifting support plate and a support sleeve. The lifting support plate is arranged on the bottom plate of the lower cavity, and the support sleeve is arranged on the lifting support plate.
[0010] According to the high vacuum sealing system of the present invention, the lifting mechanism is arranged below the lifting support plate, and the lifting mechanism lifts and lowers the lifting support plate.
[0011] According to the high vacuum sealing system of the present invention, it further includes a vacuum pumping device. The vacuum pumping device is arranged below the lower cavity, and the lifting mechanism is arranged around the vacuum pumping device.
[0012] According to the high vacuum sealing system of the present invention, the heat insulation board is a structure of at least one layer.
[0013] During cooling, the cooling plate extends to support the heat-activated jig, allowing the jig's base to directly contact the cooling plate. This ensures uniform cooling of the jig's base. Because the upper and lower heating tubes are infrared non-contact heating tubes, the cooling plate retracts during heating, eliminating the need for the infrared heating tubes to heat the jig and workpiece. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the high vacuum sealing system;
[0016] Figure 2 It is a schematic diagram of the main structure of the high vacuum sealing system;
[0017] Figure 3 It is a cross-sectional structural diagram of a high vacuum sealing system;
[0018] Figure 4is a schematic diagram of the three-dimensional structure of the first horizontal motion mechanism;
[0019] Figure 5 A schematic diagram of the three-dimensional structure of the cooling plate motion mechanism Figure 1 ;
[0020] Figure 6 A schematic diagram of the three-dimensional structure of the cooling plate motion mechanism Figure 2 ;
[0021] Figure numerals: 1. Upper cover assembly; 11. Heating tube cover; 12. Upper cover opening mechanism; 14. Upper cover cooling tube; 15. Upper cover; 16. Upper heating tube; 2. Lower cavity; 3. First horizontal motion mechanism; 4. Second horizontal motion mechanism; 5. Cooling plate motion mechanism; 31. Heat insulation plate; 33. Heat insulation plate driving mechanism; 34. Telescopic bellows; 35. Avoidance groove; 21. Observation window; 22. Lifting mechanism; 23. Vacuuming device; 24. Lower heating tube; 25. Inner liner; 26. Inner liner support column; 27. Support sleeve; 28. Lifting mechanism; 29. Bottom plate; 51. Cooling plate; 52. Cooling plate connecting rod; 53. Cooling plate driving mechanism; 54. Cooling plate slider assembly. DETAILED DESCRIPTION
[0022] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0023] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.
[0024] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.
[0025] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.
[0026] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or at least one embodiment or example in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.
[0027] The following combination Figure 1-6Description of an embodiment of the present utility model: a high vacuum sealing system, comprising: an upper cover assembly 1, a lower cavity 2, a lifting mechanism 22, a plurality of lower heating tubes 24, a first horizontal motion mechanism 3, a second horizontal motion mechanism 4, a cooling plate motion mechanism 5 and an inner liner 25; the first horizontal motion mechanism 3 and the second horizontal motion mechanism 4 have the same structure; the upper cover 15 of the upper cover assembly 1 and the lower cavity 2 form a sealed vacuum cavity, the lifting mechanism 22 is arranged below the lower cavity 2, the lower heating tube 24 is arranged inside the lower cavity 2, the inner liner 25 is arranged inside the lower cavity 2 and below the lower heating tube 24, the first horizontal motion mechanism 3 and the second horizontal motion mechanism 4 are vertically arranged and the heat insulation plates 31 of the first horizontal motion mechanism 3 and the second horizontal motion mechanism 4 are stacked in the vacuum cavity, and the heat insulation plates 31 of the first horizontal motion mechanism 3 and the second horizontal motion mechanism 4 reciprocate horizontally in the lower cavity 2. The cooling plate movement mechanism 5 is positioned on the side of the lower chamber 2. Its cooling plate 51 is positioned below the heat shield 31 of the first and second horizontal movement mechanisms 3 and 4. The cooling plate 51 of the cooling plate movement mechanism 5 reciprocates horizontally within the lower chamber 2. This means that the cooling plate 51 of the cooling plate movement mechanism 5 enters the lower chamber 2 when the bottom plate of the heat-activated fixture needs cooling. The heat shield 31 is within the vacuum chamber. The first and second horizontal movement mechanisms 3 and 4 are positioned perpendicularly, with the heat shield 31 of the first and second horizontal movement mechanisms 3 and 4 stacked one above the other to enhance thermal insulation.
[0028] In some embodiments, the cooling plate movement mechanism 5 also includes a cooling plate connecting rod 52, a cooling plate driving mechanism 53 and a cooling plate slider assembly 54; the cooling plate connecting rod 52 connects the cooling plate 51, the cooling plate driving mechanism 53 drives the slider of the cooling plate slider assembly 54 to move, and the slider of the cooling plate slider assembly 54 drives the cooling plate 51 to move. The lower cavity 2 is provided with an observation window 21. When cooling is required, the lifting mechanism 28 lowers the bottom plate of the fixture onto the cooling plate 51. When heating is required, the lifting mechanism 28 lifts the bottom plate of the fixture away from the cooling plate 51, and then the cooling plate driving mechanism 53 drives the cooling plate 51 to retract. There is a cooling water channel inside the cooling plate 51. Since the cooling temperature of the cooling plate 51 is uniform, the cooling temperature of the bottom plate of the fixture is also uniform.
[0029] In some embodiments, avoidance grooves 35 are provided on both sides of the heat shield 31 of the first and second horizontal motion mechanisms 3 and 4. The avoidance grooves 35 allow the heat shield 31 to move horizontally, while the fixture's columns move relative to each other within the avoidance grooves 35. This provides guidance while also increasing the shielding area of the heat shield 31, improving the insulation effect. The heat shield 31 isolates the activation zone and the welding zone.
[0030] In some embodiments, the upper cover assembly 1 further includes a heating pipe cover 11, an upper cover opening mechanism 12, and an upper cover cooling pipe 14. The upper cover cooling pipe 14 is disposed on the upper portion of the upper cover 15, and the heating pipe cover 11 is disposed above the upper cover cooling pipe 14. An upper heating pipe 16 is disposed within the upper cover assembly 1.
[0031] The upper cover opening mechanism 13 opens the upper cover 15, and the rope tightens the hanging ring to facilitate the maintenance of the high vacuum sealing system. The upper heating tube 16 and the lower heating tube 24 are infrared heating tubes.
[0032] In some embodiments, it also includes a heat insulation plate driving mechanism 33 and at least one supporting roller; the supporting roller is provided below the heat insulation plate 31, and the heat insulation plate driving mechanism 33 drives the heat insulation plate 31. The heat insulation plate 31 is in the vacuum chamber, and the heat insulation plate driving mechanism 33 is provided outside. The heat insulation plate 31 and the heat insulation plate driving mechanism 33 are connected by a telescopic bellows 34 to achieve horizontal movement of the heat insulation plate 31 in a vacuum environment. The support roller is provided below the heat insulation plate 31 to ensure the stability of the horizontal movement of the heat insulation plate 31 and prevent it from tilting due to long-term operation. In other words, the first horizontal motion mechanism 3 and the second horizontal motion mechanism 4 include the heat insulation plate 31, the telescopic bellows 34 and the heat insulation plate driving mechanism 33.
[0033] In some embodiments, at least one inner liner support column 26 is further included, and the inner liner 25 is supported on the bottom plate 29 of the lower cavity 2 by the inner liner support column 26 .
[0034] In some embodiments, the system further includes a lifting support plate and a support sleeve 27. The lifting support plate is disposed on the bottom plate 29 of the lower chamber 2, and the support sleeve 27 is disposed on the lifting support plate. A support rod is disposed within the support sleeve 27. By arranging the support rod within the support sleeve 27, heat transfer from the support rod to the lifting mechanism 28 is reduced.
[0035] In some embodiments, the lifting mechanism 28 is disposed below the lifting plate, and the lifting mechanism 28 lifts and lowers the lifting plate.
[0036] In some embodiments, a vacuum device 23 is further included. The vacuum device 23 is disposed below the lower cavity 2, and a lifting mechanism 28 is disposed around the vacuum device 23. The vacuum device 23 is provided with a vacuum filter.
[0037] In some embodiments, the heat insulation board 31 is a structure of at least one layer. Preferably, the heat insulation board 31 is a structure of two layers. The multi-layer heat insulation structure provides heat insulation without water cooling, that is, without water cooling related components, and the vacuum performance is improved.
[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.
Claims
1. A high vacuum sealing system, characterized in that: include: An upper cover assembly, a lower cavity, a lifting mechanism, multiple lower heating tubes, a first horizontal motion mechanism, a second horizontal motion mechanism, a cooling plate motion mechanism and an inner tank; the upper cover of the upper cover assembly and the lower cavity form a sealed vacuum cavity, the lifting mechanism is arranged below the lower cavity, the lower heating tube is arranged inside the lower cavity, the inner tank is arranged inside the lower cavity and below the heating tube, the first horizontal motion mechanism and the second horizontal motion mechanism are vertically arranged and the insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism are stacked in the vacuum cavity, the insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism reciprocate horizontally in the vacuum cavity, the cooling plate motion mechanism is arranged on the side of the lower cavity, the cooling plate of the cooling plate motion mechanism is arranged below the insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism, and the cooling plate of the cooling plate motion mechanism reciprocates horizontally in the vacuum cavity.
2. The high vacuum sealing system according to claim 1, characterized in that: The cooling plate movement mechanism also includes a cooling plate connecting rod, a cooling plate driving mechanism and a cooling plate slider assembly; the cooling plate connecting rod connects the cooling plate, the cooling plate driving mechanism drives the slider of the cooling plate slider assembly to move, and the slider of the cooling plate slider assembly drives the cooling plate to move.
3. The high vacuum sealing system according to claim 1, characterized in that: It also includes avoidance grooves, which are arranged on both sides of the heat insulation plates of the first horizontal motion mechanism and the second horizontal motion mechanism.
4. The high vacuum sealing system according to claim 1, characterized in that: It also includes a heat insulation board driving mechanism and at least one supporting roller; the supporting roller is arranged below the heat insulation board, and the heat insulation board driving mechanism drives the heat insulation board.
5. The high vacuum sealing system according to claim 1, characterized in that: It also includes at least one inner liner support column, and the inner liner is supported on the bottom plate of the lower cavity through the inner liner support column.
6. The high vacuum sealing system according to claim 1, characterized in that: It also includes a lifting support plate and a support sleeve, wherein the lifting support plate is arranged below the inner container, and the support sleeve is arranged on the lifting support plate.
7. The high vacuum sealing system according to claim 6, characterized in that: The lifting mechanism is arranged below the lifting support plate, and the lifting mechanism lifts and lowers the lifting support plate.
8. The high vacuum sealing system according to claim 7, characterized in that: It also includes a vacuum pumping device, which is arranged below the lower cavity, and the lifting mechanism is arranged around the vacuum pumping device.
9. The high vacuum sealing system according to claim 1, characterized in that: The heat insulation board is a structure of at least one layer.