Photoresist coating device

Abstract

The utility model relates to the technical field of photoresist coating, and discloses a photoresist coating device which comprises a base plate, a ring seat for bearing is fixedly mounted at the top of the base plate, an adsorption seat for adsorbing and fixing is fixedly mounted in the ring seat, the bottom of the adsorption seat is fixedly connected with a vacuum pump, and the vacuum pump is fixedly connected with the base plate. An arch frame used for installation is further fixedly installed on the top of the base plate, an electric control air cylinder is fixedly installed in the middle of the arch frame, a collecting cover is fixedly installed at the end of the electric control air cylinder, the collecting cover is integrally in an annular shape, and a driving motor is fixedly installed at the bottom of the collecting cover. According to the device, through mutual cooperation of the structures, photoresist coating can be conveniently carried out on the surface of a wafer, meanwhile, the uniformity of photoresist coating is improved, photoresist splashed onto the inner wall during photoresist spinning can be conveniently cleaned and recycled, the coating cost is reduced, use during photoresist coating is more convenient, and the device is more practical.

Description

Technical Field

[0001] The utility model relates to the technical field of photoresist coating, in particular to a photoresist coating device. Background Art

[0002] In the field of semiconductor manufacturing, photoresist coating equipment is one of the key equipment to ensure the manufacturing accuracy of integrated circuits (ICs). With the rapid development of IC technology, higher requirements are placed on the uniformity, efficiency and cleanliness of photoresist coating. Traditional photoresist coating equipment often has many limitations when dealing with these challenges.

[0003] For example, a uniformly distributed photoresist coating suction head disclosed in a Chinese patent has a patent announcement number of CN213023935U. When the above device is in use, the wafer to be coated is placed into the mounting cavity through the opening, and the positioning mechanism in the mounting cavity positions the wafer so that the center of the wafer coincides with the center of the tray. This device is also connected to a vacuum generator or a vacuum pump, and its output end is connected to the through hole, thereby adsorbing the wafer. A motor is also provided on the outside to drive the chassis to rotate, thereby performing a glue throwing process to evenly coat the photoresist on the wafer. The device is also provided with a positioning mechanism to prevent uneven centrifugal force at various positions during the glue throwing process, which causes uneven coating of the photoresist on the end face of the wafer and produces edge jaggedness and the like. However, when the wafer surface is thrown, some photoresist will remain on the inner wall of the device. If the stacked photoresist is not removed in time, it will increase the splashback and cause residual defects on the wafer surface.

[0004] In order to solve the above problems, we have proposed a photoresist coating device, which can facilitate the coating of photoresist on the wafer surface, improve the uniformity of the photoresist coating, and facilitate the cleaning and recovery of the photoresist splashed onto the inner wall during the spinning process, thereby reducing the coating cost and making it more convenient to use during the photoresist coating. Utility Model Content

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a photoresist coating device to solve the above-mentioned problems.

[0007] (2) Technical solution

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a photoresist coating device, comprising a substrate, a ring seat for carrying is fixedly installed on the top of the substrate, and an adsorption seat for adsorption and fixation is fixedly installed inside the ring seat, and the bottom of the adsorption seat is fixedly connected to a vacuum pump, the vacuum pump is fixedly installed on the substrate, and an arch for installation is also fixedly installed on the top of the substrate, an electric control cylinder for controlling pushing is fixedly installed in the middle of the arch, and a collection cover for protection is fixedly installed at each end of the electric control cylinder, the collection cover is annular as a whole, and a driving motor for driving is fixedly installed at the bottom thereof, and further comprising:

[0009] A coating assembly is provided at the end of the driving motor and is used for coating the surface of the wafer with photoresist.

[0010] Preferably, a plurality of bearing blocks for bearing are fixedly installed at equal intervals on the top of the ring seat, and a deformable gasket is fixedly installed on the top of each of the plurality of bearing blocks.

[0011] Preferably, the top of the adsorption seat is flush with the bearing block on the top of the ring seat, and a deformable air ring for enhancing sealing is fixedly installed at the edge of the adsorption seat.

[0012] Preferably, the coating assembly includes a coating plate, a connecting shaft and a guide tube groove. A connecting shaft for connection is fixedly installed on the back side of the coating plate. The connecting shaft is fixedly connected to the output end of the driving motor. Several guide tube grooves for guiding the photoresist are equidistantly opened inside the connecting shaft.

[0013] Preferably, scraping grooves for scraping are respectively provided on both sides of the coating plate, and the ports of the guide pipe grooves are both opened on one side of the scraping grooves.

[0014] Preferably, a feed port for feeding is provided on one side of the connecting shaft, and the feed port is communicated with the guide pipe groove.

[0015] Preferably, guide posts for guiding and positioning are slidably mounted on the top of the base plate at positions corresponding to both sides of the ring seat, and side sliders for sliding limitation are fixedly mounted on both sides of the collecting cover.

[0016] (3) Beneficial effects

[0017] Compared with the prior art, the present invention provides a photoresist coating device with the following beneficial effects:

[0018] 1. The photoresist coating device, through the arrangement of the supporting block and the pad, can better adapt to wafers of different sizes, thereby improving the versatility and flexibility of the device. At the same time, the deformable pad can provide additional buffering during the supporting process, protecting the wafer from damage, and ensuring the stability and accuracy of the coating process.

[0019] 2. The photoresist coating device, through the setting of the air ring, not only enhances the device's adsorption and fixation effect on the wafer, but also further improves the sealing performance, which can effectively prevent the wafer from shifting during the photoresist coating process, ensuring the coating quality and the cleanliness of the production environment. At the same time, the deformable air ring can adapt to the slight unevenness of the wafer surface, ensuring the uniformity and stability of adsorption.

[0020] 3. The photoresist coating device realizes precise control and uniform coating of photoresist through the setting of coating components, which not only improves the coating efficiency, but also ensures the uniformity and consistency of the coating layer, thereby improving the production quality and yield of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the ring seat structure of the utility model;

[0023] Figure 3 This is a schematic diagram of the coating component structure of the utility model.

[0024] In the figure: 1. Base plate; 2. Ring seat; 3. Adsorption seat; 4. Arch; 5. Carrying block; 6. Electric cylinder; 7. Collecting cover; 8. Driving motor; 9. Gasket; 10. Air ring; 11. Coating plate; 12. Connecting shaft; 13. Guide tube groove; 14. Scraper groove; 15. Feed port; 16. Guide column; 17. Side slider. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figure 1-3A photoresist coating device includes a substrate 1, a ring seat 2 for carrying is fixedly installed on the top of the substrate 1, and an adsorption seat 3 for adsorption and fixation is fixedly installed inside the ring seat 2, and the bottom of the adsorption seat 3 is fixedly connected to a vacuum pump, the vacuum pump is fixedly installed on the substrate 1, and an arch 4 for installation is also fixedly installed on the top of the substrate 1, an electric control cylinder 6 for controlling pushing is fixedly installed in the middle of the arch 4, and a collection cover 7 for protection is fixedly installed at each end of the electric control cylinder 6, the collection cover 7 is annular as a whole, and a driving motor 8 for driving is fixedly installed at its bottom, and further includes:

[0027] The coating assembly is arranged at the end of the driving motor 8, and is used to coat the surface of the wafer with photoresist.

[0028] Furthermore, a number of supporting blocks 5 for carrying are fixedly installed at equal intervals on the top of the ring seat 2, and a deformable pad 9 is fixedly installed on the top of each of the supporting blocks 5. Through the arrangement of the supporting blocks 5 and the pad 9, the photoresist coating device can better adapt to wafers of different sizes, thereby improving the versatility and flexibility of the device. At the same time, the deformable pad 9 can provide additional buffering during the carrying process, protect the wafer from damage, and ensure the stability and accuracy of the coating process.

[0029] Furthermore, the top of the adsorption seat 3 is flush with the supporting block 5 on the top of the ring seat 2, and a deformable air ring 10 is fixedly installed at the edge of the adsorption seat 3 for strengthening the sealing. Through the setting of the air ring 10, not only the adsorption and fixing effect of the device on the wafer is enhanced, but also the sealing performance is further improved, which can effectively prevent the wafer from shifting during the coating process of the photoresist, thereby ensuring the coating quality and the cleanliness of the production environment. At the same time, the deformable air ring 10 can adapt to the slight unevenness of the wafer surface, ensuring the uniformity and stability of the adsorption.

[0030] Furthermore, the coating assembly includes a coating plate 11, a connecting shaft 12 and a guide tube groove 13. The back side of the coating plate 11 is fixedly installed with a connecting shaft 12 for connection. The connecting shaft 12 is fixedly connected to the output end of the drive motor 8. The interior of the connecting shaft 12 is equidistantly provided with a number of guide tube grooves 13 for guiding the photoresist. Through the setting of the coating assembly, precise control and uniform coating of the photoresist are achieved, which not only improves the coating efficiency, but also ensures the uniformity and consistency of the coating layer, thereby improving the production quality and yield of the wafer.

[0031] Furthermore, scraping grooves 14 for leveling are respectively provided on both sides of the coating plate 11, and the ports of the guide tube grooves 13 are all opened on one side of the scraping grooves 14. Through the setting of the scraping grooves 14, the excess photoresist can be effectively smoothed during the coating process to ensure the flatness and thickness consistency of the coating layer. At the same time, the scraping operation can also reduce the waste of photoresist and reduce production costs.

[0032] Furthermore, a feed port 15 for feeding is provided on one side of the connecting shaft 12, and the feed port 15 is connected to the guide tube groove 13. Through the setting of the feed port 15, the feeding process of the photoresist is smoother and more controllable. By adjusting the flow rate and speed of the feed, the thickness of the coating layer can be accurately controlled, further improving the coating quality and production efficiency.

[0033] Furthermore, guide posts 16 for guiding and positioning are slidably installed on the top of the substrate 1 at positions on both sides of the ring seat 2, and side sliders 17 for sliding limitation are fixedly installed on both sides of the collecting cover 7. Through the setting of the guide posts 16 and the side sliders 17, the device can maintain stability and accuracy during the coating process. The guide posts 16 can correct and limit the position of the wafer, and the side sliders 17 can prevent the collecting cover 7 from deviating from the track or shaking during movement, thereby ensuring the stability of the overall operation of the device.

[0034] Instructions

[0035] During use, first place the wafer on the top of the ring seat 2, and adjust the position of the wafer by adjusting the position and height of the guide columns 16 on both sides. Then, start the vacuum pump and adsorb the wafer through the adsorption seat 3 through the suction of the vacuum pump. The setting of the air ring 10 can effectively avoid damage to the bottom of the wafer and enhance the stability of adsorption. At the same time, the cooperation of the pad 9 can provide additional buffering during the carrying process to protect the wafer from damage. After that, the guide column 16 can be adjusted down, and then by starting the electric cylinder 6, through the program and distance set on the electric cylinder 6, the electric cylinder 6 drives the collection cover 7 and the drive motor 8 to descend together until the bottom of the coating plate 11 drops to the appropriate position. After that, the feed port 15 can be started to inject air into the interior of the coating plate 11. The photoresist is poured into the wafer until it overflows from the ports of the guide tube grooves 13 and falls on the surface of the wafer. The driving motor 8 can be started to drive the connecting shaft 12 to rotate, thereby driving the coating plate 11 to rotate via the connecting shaft 12, so that the photoresist on the wafer surface is scraped flat by the scraping grooves 14 opened on both sides of the coating plate 11, and the photoresist falling on the inner wall of the collecting cover 7 after the scraping is completed can be collected and scraped off for easy use in the next processing. The device cooperates with each other between the above structures to facilitate the photoresist coating on the wafer surface while improving the uniformity of the photoresist coating, and facilitates the cleaning and recovery of the photoresist splashed onto the inner wall during the spinning process, thereby reducing the coating cost, being more convenient for use during the photoresist coating, and being more practical.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A photoresist coating device, comprising a substrate (1), a ring seat (2) for carrying is fixedly installed on the top of the substrate (1), and an adsorption seat (3) for adsorption and fixing is fixedly installed inside the ring seat (2), and the bottom of the adsorption seat (3) is fixedly connected to a vacuum pump, the vacuum pump is fixedly installed on the substrate (1), and an arch frame (4) for installation is also fixedly installed on the top of the substrate (1), an electric control cylinder (6) for controlling pushing is fixedly installed in the middle of the arch frame (4), and a collection cover (7) for protection is fixedly installed at the end of the electric control cylinder (6), the collection cover (7) is annular as a whole, and a driving motor (8) for driving is fixedly installed at its bottom, characterized in that: Also includes: A coating component is provided at the end of a driving motor (8), and is used for coating the surface of a wafer with photoresist.

2. A photoresist coating device according to claim 1, characterized in that: A plurality of bearing blocks (5) for bearing are fixedly installed at equal intervals on the top of the ring seat (2), and a deformable gasket (9) is fixedly installed on the top of each of the bearing blocks (5).

3. A photoresist coating device according to claim 2, characterized in that: The top of the adsorption seat (3) is flush with the bearing block (5) on the top of the ring seat (2), and a deformable air ring (10) for enhancing sealing is fixedly installed at the edge of the adsorption seat (3).

4. The photoresist coating device according to claim 1, wherein: The coating assembly comprises a coating plate (11), a connecting shaft (12) and a guide tube groove (13); a connecting shaft (12) for connection is fixedly installed on the back side of the coating plate (11); the connecting shaft (12) is fixedly connected to the output end of the driving motor (8); and a plurality of guide tube grooves (13) for guiding the photoresist are equidistantly provided inside the connecting shaft (12).

5. A photoresist coating device according to claim 4, characterized in that: Scraping grooves (14) for scraping and leveling are respectively provided on both sides of the coating plate (11), and the ports of the guide tube grooves (13) are both opened on one side of the scraping grooves (14).

6. The photoresist coating device according to claim 4, characterized in that: A feeding port (15) for feeding is provided on one side of the connecting shaft (12), and the feeding port (15) is communicated with the guide pipe groove (13).

7. The photoresist coating device according to claim 1, wherein: Guide columns (16) for guiding and positioning are slidably mounted on the top of the base plate (1) at positions corresponding to both sides of the ring seat (2), and side sliders (17) for sliding and limiting are fixedly mounted on both sides of the collection cover (7).

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