Integrally-formed inductor capable of optimizing heat dissipation

Abstract

The utility model discloses an integrated inductor for optimizing heat dissipation, which is characterized in that the integrated inductor is formed by assembling a pair of preformed E-shaped magnetic cores and a U-shaped coil, the surface of one side of any E-shaped magnetic core is flat, the surface of the other side of any E-shaped magnetic core is provided with a U-shaped groove with thinned wall thickness, and a bulge part in the middle of the U-shaped groove is as high as the outer walls of the two sides. The two E-shaped magnetic cores wrap and clamp the U-shaped coil and are packaged into a whole in a hot pressing mode. Electrode bonding pads are arranged at two free ends of the U-shaped coil, and an electroplated layer for enhancing heat dissipation is arranged at the top of the inductor. According to the inductor structure, the internal heat source is locally exposed and electroplated, an effective way for the inductor to be in contact with the cooling fins on the PCB is provided, the heat dissipation performance of the inductor is greatly improved by combining the air flow channel at the bottom of the inductor, the whole PCB operates stably, and the efficiency is improved.

Description

Technical Field

[0001] The utility model relates to an inductor device, in particular to an integrated molded inductor with optimized heat dissipation and a mounting structure thereof facing a PCB board, belonging to the technical field of basic electronic components. Background Art

[0002] Inductors are one of the most commonly used components in electronic devices, widely used in various circuits to achieve filtering, energy storage, matching, and resonance. With the increasing miniaturization and portability of electronic products and the high-density assembly of components, the use of inductors has rapidly developed. Furthermore, due to electromagnetic compatibility considerations, the ability of electronic products to resist electromagnetic interference has become a fundamental design requirement, thus increasing the demand for and application of inductors.

[0003] High-load motherboards are typically designed with additional features for rapid heat dissipation. Inductors are components prone to localized heat buildup during operation, with some even exceeding 60°C. Therefore, inductor performance, manufacturing efficiency, and maintaining stable operation are key technical considerations in inductor device design. Summary of the Invention

[0004] In view of the above-mentioned defects in the prior art, the purpose of the present invention is to provide an integrated molded inductor with optimized heat dissipation.

[0005] The technical solution for achieving the above-mentioned objectives is: an integrated molded inductor with optimized heat dissipation, composed of a pair of preformed E-shaped magnetic cores and a U-shaped coil. One side of each E-shaped magnetic core has a flat surface, and the other side is provided with a U-shaped groove with a thinned wall thickness. The raised portion in the middle of the U-shaped groove is at the same height as the outer walls on both sides. The two E-shaped magnetic cores sandwich the U-shaped coil and are hot-pressed to form a whole. The two free ends of the U-shaped coil are configured as electrode pads, and the top of the inductor is provided with an electroplated layer to enhance heat dissipation.

[0006] Furthermore, the slotting depth of the U-shaped slot is such that, in a closed hole state, the U-shaped coil is clamped and fixed therein by two sides.

[0007] Furthermore, the E-shaped magnetic core is a cold-pressed body made of powder material based on a customized mold.

[0008] Furthermore, the U-shaped coil is a conductor part formed by cutting and continuously bending a copper strip.

[0009] Furthermore, an insulating spray paint layer is provided on the surface of the semi-finished product of the hot pressing package, and a paint-stripped electroplating layer is provided on the top of the inductor and the two free ends of the corresponding U-shaped coil.

[0010] Furthermore, the E-shaped magnetic core is provided with an inwardly contracted groove in the middle portion in the direction of the opening of the U-shaped groove, and the finished inductor forms an air flow channel between the two electrode pads at the bottom.

[0011] Compared with the existing technology, the advantages of using the inductor of the present invention are as follows: by partially exposing the internal heat source of the inductor and electroplating it, an effective way for it to contact the heat sink on the PCB board is provided. Combined with the airflow channel at the bottom of the inductor, the heat dissipation performance of the inductor is greatly improved, ensuring the overall stable operation of the PCB board and improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the assembly structure of the one-piece molded inductor of the utility model. DETAILED DESCRIPTION

[0013] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0014] The inductor of the present invention is an integrated packaged body with a metal core, which inherits the functions achieved by assembling and integrating various inductors on a PCB board. For the purpose of optimizing the heat dissipation of the inductor, the present application proposes adjustments and improvements on the structure of the inductor device. In summary: it is composed of a pair of pre-formed E-shaped magnetic cores 1 and a U-shaped coil 2. One side surface of any of the E-shaped magnetic cores is flat, and the other side surface is provided with a U-shaped groove 11 with a thinned wall thickness, and the raised portion 12 in the middle of the U-shaped groove is at the same height as the outer walls 13 on both sides. The inductor is composed of two such E-shaped magnetic cores 1 sandwiching a U-shaped coil 2 and hot-pressed to form a whole. The metal core serves as the heat source of the inductor, wherein the two free ends of the U-shaped coil 2 are set as electrode pads, and in particular, the top of the inductor is provided with an electroplating layer to enhance heat dissipation.

[0015] It's understandable that in PCB circuit designs, in addition to the reserved solder joints for the inductor, a heat sink extending to a dedicated heat sink is typically also included. However, the improved inductor structure of this application not only allows for conventional soldering to the PCB, but also allows the heat sink to overlap the electroplated layer on top of the inductor, leveraging the metal's excellent thermal conductivity to quickly drain heat and reduce the impact of inductor heating on surrounding components.

[0016] As shown in the diagram, the E-shaped magnetic core in the preferred embodiment of the inductor is formed by hot-pressing powder materials into a custom mold. Specifically, the powder material is a mixture of one or more of Fe-based, FeSiCr, FeNi, FeSiAl, FeSi, amorphous, or nanocrystalline materials. After being mixed and uniformly stirred with epoxy, silicone, or acrylic resin, it is cold-pressed at a pressure of 6-10 tons / cm². The U-shaped grooves in the E-shaped magnetic core are deep enough to close the hole, securing the U-shaped coil between the two sides and, in conjunction with the raised portion, firmly positioning the coil.

[0017] The U-shaped coil 2 is a conductive component cut from copper strip and continuously bent into shape, with both ends facing downward as electrode pins. Furthermore, the E-shaped magnetic core 1 features an indentation 14 in the middle of the U-shaped slot opening. This creates an airflow channel between the two electrode pads at the bottom of the finished inductor, facilitating airflow and preventing heat accumulation within the confined space.

[0018] like Figure 1 As shown, the manufacturing process of the inductor of the present application includes: S1, selecting a prefabricated part of an E-shaped magnetic core and a U-shaped coil, aligning the U-shaped coil and loading it into the U-shaped groove of the E-shaped magnetic core, and then aligning another E-shaped magnetic core to complete the pre-assembly. Here, the wall thickness of the magnetic core corresponding to the top of the U-shaped coil is thinner. S2, transferring the preassembled inductor into a hot pressing mold, and if necessary, using a powder material and resin mixture of the same quality as the E-shaped magnetic core to fill the pores of the pre-assembled body. Hot pressing for 30-180 seconds under the conditions of a temperature of 100-200°C and a pressure of 4-12Tons / cm² obtains a hot pressed molded body A. S3, and then transferring the obtained hot pressed molded body to a coating workshop for roller spraying operation to make it have the common appearance of an ordinary inductor, that is, the surface is fully covered with an insulating spray paint layer. S4, after the surface of the coated semi-finished product B is completely dry, the spray paint layer at the top of the inductor and the two free ends of the corresponding U-shaped coil is removed by laser stripping. S5, then electroplating is performed on the corresponding positions to form the electrode pads 41 and the electroplating layer 42 for enhancing heat dissipation (overlapping the heat sink when PCB is assembled).

[0019] From the above detailed description of the embodiment of the integrated molded inductor with optimized heat dissipation, it can be seen that compared with the existing technology, this solution has substantial characteristics and advancements. Its technical effect is manifested as follows: by partially exposing the internal heat source of the inductor and electroplating it, an effective way for it to contact the heat sink on the PCB board is provided. Combined with the airflow channel at the bottom of the inductor, the heat dissipation performance of the inductor is greatly improved, ensuring the overall stable operation of the PCB board and improving efficiency.

[0020] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An integrated molded inductor with optimized heat dissipation, characterized by: The inductor is composed of a pair of preformed E-shaped magnetic cores and a U-shaped coil. One side of each E-shaped magnetic core is flat, and the other side is provided with a U-shaped groove with a thinned wall. The raised portion in the middle of the U-shaped groove is at the same height as the outer walls on both sides. The two E-shaped magnetic cores sandwich the U-shaped coil and are hot-pressed into a whole. The two free ends of the U-shaped coil are set as electrode pads, and the top of the inductor is provided with an electroplating layer to enhance heat dissipation.

2. The one-piece molded inductor with optimized heat dissipation according to claim 1, characterized in that: The slotting depth of the U-shaped slot is such that, in a closed hole state, the U-shaped coil is clamped and fixed therein by two sides.

3. The one-piece molded inductor with optimized heat dissipation according to claim 1, characterized in that: The E-shaped magnetic core is a cold-pressed body made of powder material based on a customized mold.

4. The one-piece molded inductor with optimized heat dissipation according to claim 1, characterized in that: The U-shaped coil is a conductor part formed by cutting and continuously bending a copper strip.

5. The one-piece molded inductor with optimized heat dissipation according to claim 1, characterized in that: The surface of the semi-finished product of the hot pressing package is provided with an insulating spray paint layer, and the top of the inductor and the two free ends of the corresponding U-shaped coil are provided with an electroplating layer after paint stripping treatment.

6. The one-piece molded inductor with optimized heat dissipation according to claim 1, characterized in that: The E-shaped magnetic core is provided with an inward-contracted groove in the middle of the U-shaped groove opening direction, and the finished inductor forms an air flow channel between the two electrode pads at the bottom.

Images