Mounting structure of power module

Abstract

The utility model provides an installation structure of a power module, which relates to the technical field of power module installation, and comprises a shell and a cover arranged above the power module and used for fixing the power module on the surface of a radiator, the bottom of the shell is provided with a glue storage groove, and the power module and the shell are bonded through glue in the glue storage groove. The beneficial effects are that the bottom of the housing is provided with the glue storage groove, the power module and the housing are bonded through the glue in the glue storage groove, the glue contact area is increased, the bonding force is stronger than that of a traditional heat dissipation copper base plate with smooth metal and limited contact area, and especially under the vibration working condition, the degumming phenomenon is not easy to occur.

Description

Technical Field

[0001] The utility model relates to the technical field of power module installation, in particular to an installation structure of a power module. Background Art

[0002] Common semiconductor power module packaging structures on the market generally utilize traditional packaging. Core components include a heatsink copper baseplate, a copper-clad ceramic plate, output terminals, and a housing consisting of a housing and a lid. The packaging process primarily relies on traditional techniques such as SMT, bonding, and soldering. The enclosure is then sealed by applying sealant to the bottom edge of the housing and pressing it directly onto the heatsink copper baseplate. This design is intended to protect internal components and facilitate heat dissipation.

[0003] However, existing packaging structures have exposed several significant issues in practical applications. Because the surface of the heat dissipation copper baseplate is mostly smooth metal, the contact area with the sealant is limited, resulting in insufficient adhesion. This can easily lead to debonding, especially in vibration conditions, causing product failure.

[0004] These issues not only affect the reliability of power modules but also limit their widespread use in demanding applications. To overcome these shortcomings and improve the stability and durability of the modules, it is necessary to start from the source of product design and use innovative structural design to avoid reliability issues that may be encountered during the process and application, ensuring that the power modules can maintain excellent performance under various operating conditions. Utility Model Content

[0005] In view of the problems existing in the prior art, the present invention provides a power module installation structure, comprising:

[0006] The shell is covered on the top of the power module and fixes the power module on the surface of the radiator. The bottom of the shell is provided with a glue storage tank, and the power module and the shell are bonded by the glue in the glue storage tank.

[0007] Preferably, a matrix belt is provided on the power module, and the position of the matrix belt corresponds to the position of the glue storage slot.

[0008] Preferably, the matrix belt comprises a plurality of alternating convex and concave platforms, and the convex and concave platforms are diamond-shaped, and / or circular, and / or square.

[0009] Preferably, the two ends of the housing are fixedly connected to the two ends of the power module by at least six symmetrically distributed fasteners, each of which comprises:

[0010] Mounting holes are provided at both ends of the housing;

[0011] Through holes are provided at both ends of the power module and correspond to the mounting holes;

[0012] The screws are passed through the corresponding mounting holes and the through holes and are fixed on the surface of the radiator.

[0013] Preferably, the four corners of the power module include at least a first type of chamfer and a second type of chamfer, and the four corners of the inner wall of the housing are adapted to the shape of the four corners of the power module.

[0014] Preferably, the housing comprises:

[0015] A shell body, wherein the top of the shell body is hollowed out, and the mounting holes are symmetrically arranged at both ends of the shell body;

[0016] The upper cover is fastened to the top of the shell body through buckles provided on the inner wall of the shell body, and the terminals of the power module are exposed from the upper cover.

[0017] Preferably, the inner wall of the buckle includes an upper guide angle and a lower guide angle;

[0018] The upper guide angle is a straight chamfer, and the lower guide angle is a circular chamfer.

[0019] Preferably, the power module includes:

[0020] A bottom substrate, wherein the upper surface of the bottom substrate is welded with a copper-clad ceramic plate, and the lower surface of the bottom substrate is connected to the radiator;

[0021] The through holes are symmetrically arranged at two ends of the bottom substrate.

[0022] Preferably, the copper-clad ceramic substrate comprises an upper copper layer, a ceramic middle layer and a lower copper layer stacked from top to bottom, the lower copper layer is welded to the upper surface of the bottom substrate, and the upper copper layer is welded with a terminal.

[0023] Preferably, the contact surface between the glue storage tank and the glue is a roughened surface.

[0024] The above technical solution has the following advantages or beneficial effects:

[0025] A glue storage tank is provided at the bottom of the housing. The power module and the housing are bonded together with the glue in the glue storage tank, which increases the contact area of ​​the glue. This has a stronger adhesion than traditional smooth metal and heat dissipation copper base plates with limited contact area, and is less likely to debond, especially when facing vibration conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a power module installation structure in a preferred embodiment of the present utility model;

[0027] Figure 2 This is a schematic diagram of an exploded structure of a power module installation structure in a preferred embodiment of the present utility model;

[0028] Figure 3 This is a schematic structural diagram of the bottom substrate in a preferred embodiment of the present invention;

[0029] Figure 4 This is a schematic structural diagram of the housing body in a preferred embodiment of the present invention;

[0030] Figure 5 The figure is a side cross-sectional schematic diagram of a mounting structure of a power module in a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0031] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment, and other embodiments may also fall within the scope of the present invention as long as they conform to the main purpose of the present invention.

[0032] In a preferred embodiment of the present invention, based on the above problems existing in the prior art, a power module installation structure is provided. Figure 1-2 Shown include:

[0033] The housing 1 is covered on the top of the power module 3 and fixes the power module 3 on the surface of the radiator. A glue storage tank 11 is opened at the bottom of the housing 1. The power module 3 and the housing 1 are bonded by the glue in the glue storage tank 11.

[0034] Furthermore, in this embodiment, a matrix belt 31 is provided on the power module 3 , and the position of the matrix belt 31 corresponds to the position of the glue storage groove 11 .

[0035] Furthermore, in this embodiment, the contact surface between the glue storage tank 11 and the glue is a roughened surface.

[0036] Furthermore, in this embodiment, the matrix belt 31 includes a plurality of alternating convex and concave platforms 32 and concave platforms 33 , and the convex platforms 32 and concave platforms 33 are diamond-shaped, and / or circular, and / or square.

[0037] Specifically, such as Figure 3-4As shown, a glue storage tank 11 and a matrix belt 31 are provided on the contact surface between the shell 1 and the power module 3. The shell 1 is bonded to the bottom substrate 34 of the power module 3 by applying a circle of glue in the glue storage tank 11. A circle of concave-convex matrix belt 31 is provided at the position of the bottom substrate 34 corresponding to the glue storage tank 11. The shape of the bosses and concave platforms in the matrix belt 31 can be diamond, circular, square, etc., and the outer contour is consistent with the glue storage tank 11 of the shell 1. In this preferred embodiment, the width of the matrix belt 31 is 1.5 mm and the depth is 0.3 mm to 0.5 mm. It is formed by stamping or precision forging process and then nickel-plated on the surface. Through the matrix belt 31, the contact area and contact roughness between the bottom substrate 34 and the glue can be greatly increased, thereby increasing the bonding force with the shell 1.

[0038] In this preferred embodiment, the width of the glue storage tank 11 is not less than 1 mm and the depth is 0.5 mm to 0.8 mm. The glue bearing surface of the glue storage tank 11 in contact with the glue can be roughened by the injection mold to increase the contact roughness with the glue and increase the adhesion with the copper base plate.

[0039] In another preferred embodiment of the present invention, Figure 1-4 As shown, the two ends of the housing 1 and the two ends of the power module 3 are fixedly connected by at least six symmetrically distributed fasteners 2, each of which includes:

[0040] Mounting holes 21 are provided at both ends of the housing 1;

[0041] Through holes 22 are provided at both ends of the power module 3 and correspond to the mounting holes 21;

[0042] Screws are passed through the corresponding mounting holes 21 and the through holes 22 and fixed to the surface of the radiator.

[0043] Furthermore, in this embodiment, the power module 3 includes:

[0044] A bottom substrate 34 , the upper surface of which is welded with a copper-clad ceramic plate 35 , and the lower surface of which is connected to a heat sink;

[0045] The through holes 22 are symmetrically arranged at both ends of the bottom substrate 34. The copper-clad ceramic substrate 35 includes an upper copper layer, a ceramic middle layer and a lower copper layer stacked from top to bottom. The lower copper layer is welded to the upper surface of the bottom substrate, and the upper copper layer is welded with terminals 36.

[0046] Specifically, currently, low- and medium-power modules are secured solely with glue and bonding, which meets requirements in mild operating environments and low heat dissipation requirements. However, in harsh environments or with significant vibration, the lack of fasteners can easily lead to module loosening or detachment, a significant safety hazard. In this embodiment, six symmetrically arranged fasteners are used to secure the base substrate 34 to the heat sink surface. This is more reliable than using glue alone and provides multiple fastener points compared to conventional two- or four-hole fasteners, significantly increasing module installation reliability.

[0047] The bottom substrate 34 is made of a copper base plate. The aperture of the through hole 22 on the copper base plate can be φ5.5~φ6.5, and is arranged symmetrically up and down and left and right. The aperture of the mounting hole 21 on the surface of the shell 1 is larger than the aperture of the through hole 22 of the copper base plate, so that the diameter of the head of the mounting screw can pass through.

[0048] In another preferred embodiment of the present invention, the four corners of the power module 3 include at least first-type chamfers 37 and second-type chamfers 38 , and the four corners of the inner wall of the housing are adapted to the shape of the four corners of the power module.

[0049] Specifically, in this embodiment, Figure 3-4 As shown, the bottom substrate 34 of the power module 3 adopts an asymmetric design. The corners of the bottom substrate 34 are respectively provided with two circular chamfers 38 at the bottom and two straight chamfers 37 at the top. Similarly, the corners of the housing 1 are respectively provided with two circular chamfers 38 at the bottom and two straight chamfers 37 at the top, which are installed in conjunction with the copper bottom plate to prevent mistakes during the sealing process and prevent the housing from being installed upside down.

[0050] Different types of chamfers can also be set at the four corners of the bottom substrate 34 of the power module 3 in other ways. For example, the two diagonal corners use the same type of chamfer, and the adjacent corners use different types of chamfers. Ensuring that there are at least two types of chamfers in the four corners can achieve fool-proof installation.

[0051] In another preferred embodiment of the present invention, the housing 1 comprises:

[0052] The housing body 12 has a hollow top and mounting holes 21 symmetrically arranged at both ends of the housing body 12;

[0053] The upper cover 13 is fastened to the top of the housing body 12 via a buckle 121 provided on the inner wall of the housing body 12 , and the terminals 36 of the power module 3 are exposed from the upper cover 13 .

[0054] The inner wall of the buckle 121 includes an upper guide angle 122 and a lower guide angle 123;

[0055] The upper guide angle 122 is a straight chamfer, and the lower guide angle 123 is a rounded chamfer.

[0056] Specifically, such as Figure 4-5 As shown, in this embodiment, the upper cover 13 and the outer shell 12 are fastened together by means of clips 121 arranged around the inner wall of the housing body 12, two on each side and two on the top and bottom. Guide angles are provided at the fastening points of the upper cover 13, divided into upper guide angles 122 and lower guide angles 123. The upper guide angle 122 is a straight chamfer for removing the upper cover, while the lower guide angle 123 is a rounded chamfer for installing the upper cover. The upper and lower guide angles of the upper cover make it easy to install and remove the upper cover, greatly facilitating module maintenance.

[0057] The above are only preferred embodiments of the present invention and do not limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the contents of this specification and illustrations should be included in the protection scope of the present invention.

Claims

1. A power module installation structure, characterized in that: include: The shell is covered on the top of the power module and fixes the power module on the surface of the radiator. The bottom of the shell is provided with a glue storage tank, and the power module and the shell are bonded by the glue in the glue storage tank.

2. The mounting structure according to claim 1, wherein: A matrix belt is provided on the power module, and the position of the matrix belt corresponds to the position of the glue storage slot.

3. The mounting structure according to claim 2, wherein: The matrix belt includes a plurality of convex and concave terraces that are alternately concave and convex, and the convex and concave terraces are in a diamond shape, and / or a circle, and / or a square shape.

4. The mounting structure according to claim 1, wherein: The two ends of the housing are fixedly connected to the two ends of the power module by at least six symmetrically distributed fasteners, each of which includes: Mounting holes are provided at both ends of the housing; Through holes are provided at both ends of the power module and correspond to the mounting holes; The screws are passed through the corresponding mounting holes and the through holes and are fixed on the surface of the radiator.

5. The mounting structure according to claim 1, wherein: The four corners of the power module include at least a first type of chamfer and a second type of chamfer, and the four corners of the inner wall of the housing are adapted to the shape of the four corners of the power module.

6. The mounting structure according to claim 4, wherein: The housing comprises: A shell body, wherein the top of the shell body is hollowed out, and the mounting holes are symmetrically arranged at both ends of the shell body; The upper cover is fastened to the top of the shell body through buckles provided on the inner wall of the shell body, and the terminals of the power module are exposed from the upper cover.

7. The mounting structure according to claim 6, wherein: The inner wall of the buckle includes an upper guide angle and a lower guide angle; The upper guide angle is a straight chamfer, and the lower guide angle is a circular chamfer.

8. The mounting structure according to claim 4, wherein: The power module includes: A bottom substrate, wherein a copper-clad ceramic substrate is welded to the upper surface of the bottom substrate, and the lower surface of the bottom substrate is connected to the heat sink; The through holes are symmetrically arranged at two ends of the bottom substrate.

9. The mounting structure according to claim 8, characterized in that: The copper-clad ceramic substrate comprises an upper copper layer, a ceramic middle layer and a lower copper layer stacked from top to bottom. The lower copper layer is welded to the upper surface of the bottom substrate, and a terminal is welded to the upper copper layer.

10. The mounting structure according to claim 1, wherein: The contact surface between the glue storage tank and the glue is a roughened surface.

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