Ka-band radio frequency front-end module

Abstract

The utility model belongs to the technical field of microwave communication, and particularly relates to a Ka wave band radio frequency front-end module, which integrates a radio frequency circuit on a printed board and comprises a change-over switch, a receiving channel, a transmitting channel and a local oscillator driving circuit. The receiving signal mixing unit and the transmitting signal mixing unit are arranged in different SIP packaging areas respectively, packaging is reasonable, and the integration degree is high. Each channel is provided with an independent processing circuit and a frequency mixing unit, the local oscillator driving circuit provides stable oscillation signals, and signal processing is efficient. The switching switch enables the module to be flexibly switched between a receiving mode and a transmitting mode. The module has the advantages of being small in occupied space, reliable in performance, high in signal processing efficiency, flexible to use and the like, equipment miniaturization is facilitated, and actual communication requirements are met.

Description

Technical Field

[0001] The utility model belongs to the technical field of microwave communications, and in particular relates to a Ka-band radio frequency front-end module. Background Art

[0002] The Ka-band is part of the microwave band of the electromagnetic spectrum, with a frequency range of 26.5-40 GHz. Due to its large available bandwidth and market demand, the Ka-band communications satellite market is experiencing increasing demand. However, in traditional Ka-band RF front-end systems, both the upconversion and downconversion modules include numerous functional chips and other components, each discretely arranged on a corresponding PCB (i.e., a modular design). The discrete functional chips and other components are connected via copper traces or microstrip lines. Consequently, traditional Ka-band RF front-end systems occupy a large area, preventing overall product size reduction. Existing Ka-band RF front-end products manufactured using SIP packaging, while effectively reducing product size, can impact performance and cause signal distortion. Furthermore, the internal circuitry of these products is relatively fixed, typically with a unique SIP package structure corresponding to a specific specification. Redesigning the system after a change in specification requires redesigning the internal components and circuitry, which wastes significant product development time. Summary of the Invention

[0003] In response to the shortcomings of the above-mentioned existing technologies, this technical solution proposes a Ka-band RF front-end module, which does not affect the product performance while miniaturizing the product. The design adopts BGA solder balls for signal transmission, which can effectively improve the signal transmission efficiency and transmit the signal without distortion; the transition method using BGA balls can effectively improve the efficiency of signal transmission.

[0004] Specifically, the above objectives are achieved through the following technical solutions:

[0005] A Ka-band radio frequency front-end module includes a printed circuit board and a Ka-band radio frequency circuit; the Ka-band radio frequency circuit is arranged on the printed circuit board and includes a switch, a receiving channel, a transmitting channel, and a local oscillator drive circuit; the printed circuit board is processed with a first SIP packaging area and a second SIP packaging area;

[0006] The receiving channel includes a receiving signal processing circuit and a receiving signal mixing unit; the receiving signal mixing unit is arranged in the first SIP packaging area through a BGA solder ball; the input end of the receiving signal processing circuit is connected to the switching switch, and the output end of the receiving signal processing circuit is connected to the receiving signal mixing unit;

[0007] The transmission channel includes a transmission signal processing circuit and a transmission signal mixing unit; the transmission signal mixing unit is arranged in the second SIP packaging area through a BGA solder ball; the input end of the transmission signal processing circuit is connected to the transmission signal mixing unit, and the output end of the transmission signal processing circuit is connected to the switching switch;

[0008] The printed circuit board is also provided with an antenna port A, and the switch is connected to the antenna port A;

[0009] The local oscillator driving circuit is communicatively connected to the receiving signal mixing unit and the transmitting signal mixing unit respectively.

[0010] Preferably, the received signal processing circuit includes a low noise amplifier, a first filter and a first amplifier connected in sequence.

[0011] Preferably, the transmission signal mixing unit includes a first mixer; the first mixer is provided with two signal output ends, which are respectively connected to a first output branch and a second output branch; the first output branch includes a second filter, a first temperature-compensated attenuator and a third filter connected in sequence; the second output branch includes a fourth filter, a second temperature-compensated attenuator and a fifth filter connected in sequence.

[0012] Preferably, the printed board is further provided with a receiving intermediate frequency output port RXIFQ connected to the output end of the third filter, and a receiving intermediate frequency output port RXIFI connected to the output end of the fifth filter.

[0013] Preferably, the transmission signal processing circuit includes an eighth filter, a second amplifier, a seventh filter, a driving amplifier, a second isolator, a power amplifier, a first isolator and a sixth filter connected in sequence.

[0014] Preferably, the transmission signal mixing unit includes a second mixer, which is provided with two signal input ends, respectively connected to the first input branch and the second input branch; the first input branch includes a third temperature-compensated attenuator and a ninth filter connected in sequence; the second input branch includes a fourth temperature-compensated attenuator and a tenth filter connected in sequence.

[0015] Preferably, the printed board is further provided with a transmit intermediate frequency input port TXIFQ connected to the input end of the third temperature-compensated attenuator, and a transmit intermediate frequency input port TXIFI connected to the input end of the fourth temperature-compensated attenuator.

[0016] Preferably, the local oscillator driving circuit includes a power divider, a first local oscillator driving amplifier and a second local oscillator driving amplifier, and a local oscillator signal port LO is provided on the printed circuit board; the input end of the power divider is connected to the local oscillator signal port LO, the first output end of the power divider is connected to the receiving signal mixing unit through the first local oscillator driving amplifier, and the second output end of the power divider is connected to the transmitting signal mixing unit through the second local oscillator driving amplifier.

[0017] Compared with the existing technology, this technical solution has the following advantages:

[0018] 1) High integration. This technical solution integrates the Ka-band RF circuit on a printed circuit board, including multiple functional units such as the receiving channel, transmitting channel, and local oscillator drive circuit. This reduces the space occupied by the entire system and facilitates miniaturization of the device.

[0019] 2) Reasonable packaging. The receive signal mixing unit and transmit signal mixing unit of this technical solution are respectively installed in the first and second SIP packaging areas via BGA solder balls. This packaging method helps improve the performance and reliability of the circuit while facilitating modular operation during production and assembly, making it easier to repair and replace.

[0020] 3) Efficient signal processing. This technical solution's receive and transmit channels each have their own independent processing circuits and mixing units. The receive signal processing circuit can perform specialized preprocessing on the received signal, such as filtering and amplification, to improve received signal quality. The transmit signal processing circuit can also perform operations such as modulation and filtering on the transmit signal to optimize it. Furthermore, the local oscillator drive circuit provides a stable local oscillator signal to the mixing unit, enabling accurate frequency conversion. Both down-conversion during reception and up-conversion during transmission can be completed efficiently, improving signal processing efficiency and accuracy.

[0021] 4) Flexible signal switching. A switch connects antenna port A, the receive signal processing circuit, and the transmit signal processing circuit, allowing the module to flexibly switch between receive and transmit modes. This allows for rapid transitions between receive and transmit signal states based on actual communication needs, increasing the flexibility of the RF front-end module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the overall structure of this technical solution;

[0023] Figure 2 This is the principle block diagram of the Ka-band RF circuit.

[0024] In the picture:

[0025] 1. Printed circuit board; 2. Switch; 3. First SIP package area; 4. Second SIP package area; 5. Low-noise amplifier; 6. First filter; 7. First amplifier; 8. First mixer; 9. Second filter; 10. First temperature-compensated attenuator; 11. Third filter; 12. Fourth filter; 13. Second temperature-compensated attenuator; 14. Fifth filter; 15. Eighth filter; 16. Second amplifier; 17. Seventh filter; 18. Driver amplifier; 19. Second isolator; 20. Power amplifier; 21. Sixth filter; 22. Second mixer; 23. Third temperature-compensated attenuator; 24. Ninth filter; 25. Fourth temperature-compensated attenuator; 26. Tenth filter; 27. Power splitter; 28. First local oscillator driver amplifier; 29. ​​Second local oscillator driver amplifier; 30. First isolator. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. It should not be understood that the present invention is limited to the following examples. Without departing from the concept of the present invention, the deformation and improvement of the present invention in this field should be included in the protection scope of the claims of the present invention.

[0027] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by persons of ordinary skill in the art to which this disclosure belongs. Words such as "or," "comprising," and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0028] Example 1

[0029] This embodiment discloses a Ka-band radio frequency front-end module, as a preferred implementation scheme of this technical solution, such as Figure 1 As shown, it includes a printed circuit board 1 and a Ka-band radio frequency circuit; the Ka-band radio frequency circuit is arranged on the printed circuit board 1, including a switching switch 2, a receiving channel, a transmitting channel and a local oscillator driving circuit; the printed circuit board 1 is processed with a first SIP packaging area 3 and a second SIP packaging area 4.

[0030] The receiving channel includes a receiving signal processing circuit and a receiving signal mixing unit; the receiving signal mixing unit is set in the first SIP packaging area 3 through BGA solder balls; the input end of the receiving signal processing circuit is connected to the switching switch 2, and the output end of the receiving signal processing circuit is connected to the receiving signal mixing unit.

[0031] The transmitting channel includes a transmitting signal processing circuit and a transmitting signal mixing unit; the transmitting signal mixing unit is set in the second SIP packaging area 4 through BGA solder balls; the input end of the transmitting signal processing circuit is connected to the transmitting signal mixing unit, and the output end of the transmitting signal processing circuit is connected to the switching switch 2.

[0032] The printed circuit board 1 is also provided with an antenna port A, and the switch 2 is connected to the antenna port A.

[0033] The local oscillator driving circuit is communicatively connected to the receiving signal mixing unit and the transmitting signal mixing unit respectively.

[0034] Based on the above structure, the application principle of this technical solution is:

[0035] When receiving signals, the RF signal received at antenna port A enters the receive signal processing circuit through switch 2. The receive signal processing circuit performs preliminary signal processing, such as filtering and amplification. The local oscillator driver circuit then generates a low-frequency local oscillator signal and sends it to the receive signal mixing unit. The receive signal mixing unit mixes the low-frequency local oscillator signal with the processed receive signal, down-converting the RF signal (received signal) to an intermediate frequency (IF) or baseband signal (facilitating subsequent digital processing, etc.), thus completing the receive signal processing.

[0036] During transmission, the transmit IF signal is input into the transmit signal mixing unit. The local oscillator driver circuit generates a high-frequency local oscillation signal, which is also fed into the transmit signal mixing unit. The transmit signal mixing unit mixes the high-frequency local oscillation signal with the transmit IF signal, raising the transmit IF signal's frequency to a Ka-band RF frequency, completing the upconversion process for subsequent transmission through the antenna. After the upconversion, the transmit signal is processed (e.g., modulated and filtered) by the transmit signal processing circuit. The upconverted signal then passes through switch 2 to antenna port A, where it is ultimately transmitted.

[0037] In the above process, the switch 2 plays a role in switching the signal path between the two modes of receiving signals and transmitting signals, ensuring that the signal is transmitted in the correct channel.

[0038] Example 2

[0039] This embodiment discloses a Ka-band RF front-end module, which is a preferred implementation scheme of the present technical solution, that is, based on Example 1, its receiving signal processing circuit includes a low-noise amplifier 5, a first filter 6 and a first amplifier 7 connected in sequence.

[0040] Low-noise amplifier (LNA) stage: The weak RF signal received by the antenna first enters the low-noise amplifier (LNA). The LNA's primary function is to amplify the weak received signal while minimizing the introduction of additional noise. This is because RF signals attenuate during propagation, resulting in weak signal strength at the receiving end. Initial amplification is required to boost the signal level and provide sufficient signal strength for subsequent processing.

[0041] First Filter 6: After LNA amplification, the signal enters First Filter 6. This filter removes unwanted interference signals and noise outside the frequency band, allowing only signals in the target frequency band (Ka-band related bands) to pass through. This purifies the signal, improving its purity and reducing interference from signals in other frequency bands on the received signal.

[0042] First amplifier 7 stage: The filtered signal enters the first amplifier 7 again to further enhance the signal strength to meet the input signal strength requirement of the receiving signal mixing unit, ensuring that the mixing operation can be carried out effectively.

[0043] This technical solution has the following benefits:

[0044] 1) Improve signal quality: Through the process of low-noise amplification, filtering and re-amplification, the signal strength is effectively enhanced while reducing the impact of noise and interference, thereby significantly improving the quality of the received signal.

[0045] 2) Enhanced system sensitivity: LNA performs low-noise amplification on weak signals at the front end, helping the entire receiving system detect weaker signals, improving the system's sensitivity and enabling the system to receive signals from farther or weaker transmitters.

[0046] 3) Optimize subsequent processing: Providing filtered and appropriately strong signals to the receiving signal mixing unit helps the mixing unit better complete the down-conversion operation, thereby providing a high-quality signal foundation for subsequent signal demodulation and other processing processes.

[0047] Example 3

[0048] This embodiment discloses a Ka-band RF front-end module, which is a preferred implementation scheme of this technical solution, that is, based on embodiment 1 or 2, its transmission signal mixing unit includes a first mixer 8; the first mixer 8 is provided with two signal output terminals, which are respectively connected to the first output branch and the second output branch; the first output branch includes a second filter 9, a first temperature-compensated attenuator 10 and a third filter 11 connected in sequence; the second output branch includes a fourth filter 12, a second temperature-compensated attenuator 13 and a fifth filter 14 connected in sequence. Among them, the input terminal of the second filter 9 and the input terminal of the fourth filter 12 are respectively connected to the first mixer 8.

[0049] Furthermore, the printed circuit board 1 is also provided with a receiving intermediate frequency output port RXIFQ connected to the output end of the third filter 11 , and a receiving intermediate frequency output port RXIFI connected to the output end of the fifth filter 14 .

[0050] In the transmission signal mixing unit, the input signal (such as the intermediate frequency signal) and the local oscillator signal are mixed in the first mixer 8 to generate two mixed output signals, which are respectively sent to the first output branch and the second output branch.

[0051] In the first output branch, the signal first enters the second filter 9, which removes unwanted frequency components after mixing. It then passes through the first temperature-compensated attenuator 10. The temperature-compensated attenuator automatically adjusts attenuation based on temperature changes, ensuring optimal signal strength. The signal then enters the third filter 11 for further filtering and purification. In the second output branch, the signal is filtered by the fourth filter 12, then passes through the second temperature-compensated attenuator 13 to control signal strength, and finally filtered again by the fifth filter 14.

[0052] After processing by the two branches, the processed IF signals can be outputted at the receive IF output port RXIFQ connected to the output of the third filter 11 and the receive IF output port RXIFI connected to the output of the fifth filter 14. These IF signals can be used for feedback or other monitoring purposes, such as monitoring the quality of the transmitted signal.

[0053] This technical solution has the following benefits:

[0054] Signal quality optimization: Filtering the mixed signal through multiple filters can effectively remove the spurious signals and interference signals generated by the mixing, improve the purity of the signal, and ensure the quality of the transmitted signal.

[0055] Enhanced temperature stability: The use of a temperature-compensated attenuator can compensate for signal strength fluctuations caused by temperature changes. In different temperature environments, the signal strength can be maintained within an appropriate range, improving the environmental adaptability and stability of the entire circuit.

[0056] Convenient signal monitoring: Setting the receiving IF output ports RXIFQ and RXIFI can conveniently monitor and analyze the IF signal during the transmission process, making it easy to promptly discover possible problems with the transmission signal, such as frequency offset, amplitude anomaly, etc., which helps to adjust and optimize the transmission signal.

[0057] Example 4

[0058] This embodiment discloses a Ka-band RF front-end module, which is a preferred implementation scheme of the present technical solution, that is, based on Example 1, 2 or 3, and its transmission signal processing circuit includes an eighth filter 15, a second amplifier 16, a seventh filter 17, a driving amplifier 18, a second isolator 19, a power amplifier 20, a first isolator 30 and a sixth filter 21 connected in sequence.

[0059] Filtering and preliminary amplification: The signal first enters the eighth filter 15, which filters out unwanted interference signals outside the frequency band and allows only signals in the target frequency band (possibly the intermediate frequency band) to pass. After preliminary filtering, the signal enters the second amplifier 16, which amplifies the signal to ensure sufficient power for subsequent processing.

[0060] Secondary filtering and driver amplification: After being amplified by the second amplifier 16, the signal enters the seventh filter 17, which further removes any spurious signals that may have been generated during the amplification process, ensuring a pure signal frequency band. The signal then enters the driver amplifier 18, which further boosts the signal power to within the input power range required by the power amplifier 20.

[0061] Power Amplification and Isolation Filtering: The signal passes through power amplifier 20, which boosts the signal power to a level that can be effectively transmitted to meet long-distance transmission requirements. After power amplification, the signal passes through second isolator 19, which prevents reflected signals from interfering with preceding circuits and ensures unidirectional signal transmission. The signal then passes through first isolator 30 for further isolation, further minimizing the impact of reflected signals. Finally, the signal passes through sixth filter 21 for final filtering, removing spurious signals that may have been generated during the power amplification process. This purifies the transmitted signal and provides a high-quality signal for subsequent transmission operations (such as post-mixing transmission).

[0062] This technical solution has the following benefits:

[0063] High signal quality: By filtering the signal layer by layer through multiple filters (eighth filter 15, seventh filter 17 and sixth filter 21), interference signals and spurious signals can be effectively removed, ensuring the purity of the transmitted signal frequency band, thereby improving signal quality and facilitating effective signal transmission.

[0064] Reasonable power boost: The use of multi-stage amplification (second amplifier 16, driver amplifier 18 and power amplifier 20) can gradually boost the signal power to a suitable transmission level, avoiding problems such as signal distortion that may be caused by single-stage amplification, and ensuring that the signal can be transmitted with sufficient power.

[0065] Strong anti-interference capability: The presence of the two isolators (the second isolator 19 and the first isolator 30) can effectively prevent the reflected signal from interfering with the front-end circuit, thereby enhancing the stability and anti-interference capability of the circuit and ensuring the stability and accuracy of the transmitted signal.

[0066] Example 4

[0067] This embodiment discloses a Ka-band RF front-end module. As a preferred implementation of this technical solution, based on Embodiments 1, 2, 3, or 4, its transmit signal mixing unit includes a second mixer 22. Second mixer 22 has two signal input terminals, connected to a first input branch and a second input branch, respectively. The first input branch includes a third temperature-compensated attenuator 23 and a ninth filter 24, connected in sequence. The second input branch includes a fourth temperature-compensated attenuator 25 and a tenth filter 26, connected in sequence. The output terminals of the ninth filter 24 and the tenth filter 26 are each connected to the second mixer 22.

[0068] Furthermore, the printed circuit board 1 is further provided with a transmit intermediate frequency input port TXIFQ connected to the input end of the third temperature-compensated attenuator 23 , and a transmit intermediate frequency input port TXIFI connected to the input end of the fourth temperature-compensated attenuator 25 .

[0069] In the transmit signal mixing unit, the signal input from the transmit IF input port TXIFQ first passes through the third temperature-compensated attenuator 23, which adjusts signal attenuation based on temperature fluctuations to ensure appropriate signal strength. The signal then enters the ninth filter 24, which filters out unwanted frequency components and allows only signals in a specific frequency band to pass through. The cleaned signal is then input to the second mixer 22. The signal input from the transmit IF input port TXIFI follows a similar path, first passing through the fourth temperature-compensated attenuator 25 for temperature compensation and attenuation adjustment. It then passes through the tenth filter 26 to filter out spurious frequencies, resulting in a clean, appropriately strong signal that is input to the second mixer 22. In the second mixer 22, these two processed signals are mixed with the signal generated by the local oscillator (provided by the local oscillator drive circuit), up-converting the IF signal to a radio frequency (RF) signal in preparation for subsequent transmission.

[0070] This technical solution has the following benefits:

[0071] Good temperature adaptability: The third and fourth temperature-compensated attenuators 23 and 25 compensate for the effects of temperature changes on signal strength. This ensures that the signal strength input to the second mixer 22 remains within an appropriate range under varying ambient temperatures, enabling stable operation of the mixer and improving the performance stability of the entire transmit signal mixing unit under varying temperature conditions.

[0072] High signal purity: The ninth and tenth filters 26 filter the two input signals, removing spurious frequencies and interference signals, ensuring a pure signal frequency band entering the mixer. This reduces spurious signals during the mixing process, improves the quality of the mixed RF signal, and facilitates the efficient transmission of subsequent transmit signals.

[0073] Flexible IF signal input: There are two independent transmit IF input ports TXIFQ and TXIFI. This dual-input branch design can support IF signal input of different frequency bands or different modulation methods, increasing the system's adaptability to different signal sources and enabling the module to flexibly process various types of transmit IF signals.

[0074] Example 5

[0075] This embodiment discloses a Ka-band radio frequency front-end module, which is a preferred implementation scheme of the present technical solution, that is, based on Example 1, 2, 3, 4 or 5, and its local oscillator driving circuit includes a power divider 27, a first local oscillator driving amplifier 28 and a second local oscillator driving amplifier 29, and a local oscillator signal port LO is provided on the printed circuit board 1; the input end of the power divider 27 is connected to the local oscillator signal port LO, the first output end of the power divider 27 is connected to the receiving signal mixing unit through the first local oscillator driving amplifier 28, and the second output end of the power divider 27 is connected to the transmitting signal mixing unit through the second local oscillator driving amplifier 29.

[0076] The local oscillator signal is input from the local oscillator signal port LO to the power divider 27. The power divider 27 is a device that divides the input signal power into two or more output signals. Here, it divides the input local oscillator signal power into two paths.

[0077] One of the output signals is amplified by the first local oscillator driver amplifier 28 and then sent to the receive signal mixing unit. There, the local oscillator signal is mixed with the received RF signal to down-convert it to an intermediate frequency (IF) signal. This process is a key step in receive signal processing.

[0078] The other output signal is amplified by the second local oscillator driver amplifier 29 and then sent to the transmit signal mixing unit. In the transmit signal mixing unit, the local oscillator signal is mixed with the intermediate frequency signal and the intermediate frequency signal is up-converted to a radio frequency signal, which is a key step in transmit signal processing.

[0079] This technical solution has the following benefits:

[0080] Efficient resource sharing: The input signal of the local oscillator signal port LO is shared through the power divider 27, so that one local oscillator signal source can provide the required local oscillator signal for the receiving and transmitting mixing units at the same time, avoiding the need to set up independent local oscillator signal sources for receiving and transmitting respectively, reducing cost and circuit complexity.

[0081] Good signal synchronization: Because the receive and transmit mixing units use the same local oscillator signal source after power division, the frequency and phase characteristics of the local oscillator signal are highly consistent during reception and transmission. In communication systems, this synchronization helps improve system performance. For example, in duplex communication scenarios, it can better modulate and demodulate signals and reduce frequency error and phase noise.

[0082] Appropriate signal strength: The first and second local oscillator driver amplifiers 28 and 29 can amplify the two local oscillator signals separately based on the different local oscillator signal strength requirements of the receive and transmit mixers. This ensures that the local oscillator signal strengths input to both the receive and transmit mixers are within the appropriate range, facilitating efficient mixing operations.

Claims

1. A Ka-band radio frequency front-end module, characterized in that: The invention comprises a printed circuit board (1) and a Ka-band radio frequency circuit; the Ka-band radio frequency circuit is arranged on the printed circuit board (1), and comprises a switching switch (2), a receiving channel, a transmitting channel and a local oscillator driving circuit; a first SIP packaging area (3) and a second SIP packaging area (4) are processed on the printed circuit board (1); The receiving channel includes a receiving signal processing circuit and a receiving signal mixing unit; The receiving signal mixing unit is arranged in the first SIP package area (3) through a BGA solder ball; the input end of the receiving signal processing circuit is connected to the switching switch (2), and the output end of the receiving signal processing circuit is connected to the receiving signal mixing unit; The transmission channel includes a transmission signal processing circuit and a transmission signal mixing unit; The transmission signal mixing unit is arranged in the second SIP package area (4) through a BGA solder ball; the input end of the transmission signal processing circuit is connected to the transmission signal mixing unit, and the output end of the transmission signal processing circuit is connected to the switching switch (2); The printed circuit board (1) is also provided with an antenna port A, and the switch (2) is connected to the antenna port A; The local oscillator driving circuit is communicatively connected to the receiving signal mixing unit and the transmitting signal mixing unit respectively.

2. The Ka-band RF front-end module according to claim 1, wherein: The received signal processing circuit comprises a low noise amplifier (5), a first filter (6) and a first amplifier (7) connected in sequence.

3. The Ka-band RF front-end module according to claim 1, wherein: The transmission signal mixing unit includes a first mixer (8); the first mixer (8) is provided with two signal output terminals, respectively connected to a first output branch and a second output branch; the first output branch includes a second filter (9), a first temperature-compensated attenuator (10), and a third filter (11) connected in sequence; the second output branch includes a fourth filter (12), a second temperature-compensated attenuator (13), and a fifth filter (14) connected in sequence.

4. A Ka-band RF front-end module according to claim 3, characterized in that: The printed circuit board (1) is also provided with a receiving intermediate frequency output port RXIFQ connected to the output end of the third filter (11), and a receiving intermediate frequency output port RXIFI connected to the output end of the fifth filter (14).

5. The Ka-band RF front-end module according to claim 1, wherein: The transmission signal processing circuit comprises an eighth filter (15), a second amplifier (16), a seventh filter (17), a driving amplifier (18), a second isolator (19), a power amplifier (20), a first isolator (30) and a sixth filter (21) connected in sequence.

6. The Ka-band RF front-end module according to claim 1, wherein: The transmission signal mixing unit includes a second mixer (22), and the second mixer (22) is provided with two signal input terminals, respectively connected to a first input branch and a second input branch; the first input branch includes a third temperature-compensated attenuator (23) and a ninth filter (24) connected in sequence; the second input branch includes a fourth temperature-compensated attenuator (25) and a tenth filter (26) connected in sequence.

7. The Ka-band RF front-end module according to claim 6, wherein: The printed circuit board (1) is also provided with a transmission intermediate frequency input port TXIFQ connected to the input end of the third temperature-compensated attenuator (23), and a transmission intermediate frequency input port TXIFI connected to the input end of the fourth temperature-compensated attenuator (25).

8. The Ka-band RF front-end module according to claim 1, wherein: The local oscillator driving circuit includes a power divider (27), a first local oscillator driving amplifier (28) and a second local oscillator driving amplifier (29); a local oscillator signal port LO is provided on the printed circuit board (1); an input end of the power divider (27) is connected to the local oscillator signal port LO, a first output end of the power divider (27) is connected to a receiving signal mixing unit through the first local oscillator driving amplifier (28), and a second output end of the power divider (27) is connected to a transmitting signal mixing unit through the second local oscillator driving amplifier (29).

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