Dust-free protection device for silicon wafer product circle machining

Abstract

The utility model relates to the technical field of dust-free protective devices, in particular to a dust-free protective device for silicon wafer product circle processing, which comprises a polishing device, a top plate fixedly connected with the polishing device, a protective bin fixedly connected with the top plate, a bin door is opened by pulling a handle, then a silicon wafer is placed above a cover plate and is in contact with a rubber sleeve, and the polishing device is fixed on the protective bin. The dust suction machine is started, air in the circular groove and the rubber sleeve is sucked through the air suction port, negative pressure is formed between the silicon wafer and the through hole, the silicon wafer is adsorbed through the rubber sleeve, the polishing device is started to machine the silicon wafer, and silicon wafer scraps generated after machining enter the circular groove through the through hole under the action of the negative pressure and are finally discharged into the storage bin through the air outlet by the dust suction machine. As the cover plate covers the whole silicon wafer, most of the scraps can be sucked by the dust suction machine, the scraps do not need to be cleaned regularly, and the problems that an existing device is incomplete in dust removal and troublesome to use are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of dust-free protective devices, in particular to a dust-free protective device for silicon wafer processing. Background Art

[0002] Silicon wafers are the main raw material for making chips. In order to meet the processing requirements of chips, silicon wafers cut from single crystal silicon rods will undergo a polishing process to ensure that the surface of the silicon wafers is flat and smooth. Since silicon wafers will produce fine dust during polishing, a dust removal device will be used in the polishing process. Dust removal devices are needed. Existing dust removal devices mostly use water washing methods, which consume a lot of water and are not environmentally friendly.

[0003] At present, an existing dust-free polishing device for silicon wafer processing (such as patent number: CN219053836U) discloses a dust-free polishing device for silicon wafer processing, including a fixed base, a support base, a cylinder and a reduction motor fixed on the fixed base, a transmission pipe provided on the fixed base, the top of the transmission pipe passes through the fixed base and is rotatably connected to the fixed base through a bearing, the output end of the reduction motor is linked to the top of the transmission pipe through a transmission member, the bottom of the transmission pipe is equipped with a polishing mechanism, and the outer surface of the support base is equipped with a dust suction mechanism. The dust suction mechanism is equipped with a dust suction mechanism on the fixed base, and dust can be sucked into the dust collecting box for storage through the dust guide pipe during polishing, thereby achieving the effect of dust-free polishing; by respectively installing a lower grinding disc and an upper grinding disc on both sides of the silicon wafer placement disk, both sides of the silicon wafer can be polished at the same time, thereby improving the polishing efficiency.

[0004] However, during the implementation of the above technical solution, at least the following technical problems were found:

[0005] 1. The dust removal method of the existing device is to absorb the debris generated by grinding by using a dust guide tube and a dust collection box in conjunction with an exhaust fan. However, a problem with this device is that it is only provided with two dust collection mechanisms to absorb the debris generated by grinding. In fact, the debris in the grinding process is in a splashing motion, and it is impossible to accurately control the debris to move toward the two dust collection mechanisms. Therefore, the device has the problem of imperfect dust removal. During the grinding process, there will also be debris generated by grinding on the silicon wafer placement plate, and the debris of the device is loaded by providing a dust collection box. The debris is stored in the dust collection box and the dust collection mechanism needs to be regularly disassembled for cleaning, which is more troublesome. Therefore, the existing device has the problems of imperfect dust removal and is more troublesome to use.

[0006] 2. The existing device is not provided with a protective device. During the cutting and grinding process, the grinding debris will fly everywhere, not only polluting the ambient air, but also the flying debris may injure people. Therefore, the existing device has the problem of polluting the environment and may injure people when used. Utility Model Content

[0007] (1) Technical problems solved

[0008] In view of the deficiencies of the existing technology, the utility model provides a dust-free protective device for silicon wafer round processing, which solves the technical problems of the existing devices such as imperfect dust removal, cumbersome use, environmental pollution and possible injury during use.

[0009] (2) Technical solution

[0010] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0011] A dust-free protective device for processing silicon wafer rounds includes a grinding device, the grinding device is fixedly connected to a top plate, the top plate is fixedly connected to a protective bin, the bottom surface of the protective bin is fixedly connected to a bottom plate, a dust collector is fixedly installed on the bottom surface of the protective bin, the dust collector passes through the protective bin, a placement device is fixedly installed on the top surface of one end of the dust collector located inside the protective bin, an air outlet is fixedly provided on one end of the dust collector located outside the protective bin, an end of the air outlet away from the dust collector is connected to an external storage bin, an air intake is provided on the top surface of one end of the dust collector located inside the protective bin, and the air intake is fixedly connected to the placement device.

[0012] Preferably, the protective compartment is fixedly connected to two hinges, the protective compartment is hinged to two compartment doors via the two hinges, and both compartment doors are fixedly connected to a handle.

[0013] Preferably, a one-way valve is fixedly installed on the side wall of the upper half of the protection chamber, and an observation window is fixedly installed on the side of the protection chamber close to the vacuum cleaner.

[0014] Preferably: a liquid outlet is fixedly installed on one of the side walls of the lower half of the protective bin, a liquid filling port is fixedly installed on the lower half of the other side wall of the protective bin, the liquid outlet and the liquid filling port are both threadedly connected to a sealing cover at one end away from the protective bin, and the liquid filling port is set at a position higher than the liquid outlet.

[0015] Preferably: a protective net is fixedly installed on the lower half of the protective bin, the position of the protective net is at the same height as the top surface of the bottom plate, the liquid filling port is located below the protective net, the protective net is lower than the top surface of the vacuum cleaner, and adsorption liquid is provided at the bottom of the protective bin, and the surface of the adsorption liquid is lower than the protective net.

[0016] Preferably, the placement device includes a fixing plate, a ventilation slot is opened at the axis of the fixing plate, the fixing plate is fixedly connected to two fixing blocks, and one end of the fixing block away from the fixing plate is fixedly connected to the inner wall of the protective chamber.

[0017] Preferably: the top surface of the fixing plate is fixedly connected with a fixing sleeve, the inner side of the fixing sleeve is fixedly connected with a cover plate, a circular groove is opened between the cover plate and the fixing plate, a rubber sleeve is fixedly connected to the central axis of the cover plate, and a plurality of through holes are opened on the surface of the cover plate.

[0018] Preferably: the fixing plate is fixedly connected to the air intake of the vacuum cleaner, and the ventilation slot of the fixing plate is connected to the air intake of the vacuum cleaner, the through hole is connected to the circular slot, the circular slot is connected to the air intake of the vacuum cleaner, and the placement device and the grinding device are located on the same vertical line.

[0019] (3) Beneficial effects

[0020] 1. Pull the handle to open the warehouse door, place the silicon wafer on the cover plate, and make the silicon wafer contact with the rubber sleeve, start the vacuum cleaner, and suck the air in the circular groove and the rubber sleeve through the air suction port to form a negative pressure between the silicon wafer and the through hole, so that the rubber sleeve also absorbs the silicon wafer, and start the polishing device to process the silicon wafer. Under the action of negative pressure, the silicon wafer debris from the processing enters the circular groove through the through hole and is finally discharged to the storage bin through the air outlet by the vacuum cleaner. Because the cover plate covers the entire silicon wafer, most of the debris can be sucked up by the vacuum cleaner, and there is no need to clean the debris regularly, which solves the problems of imperfect dust removal and more troublesome use of existing devices.

[0021] Second, by providing a protective chamber, the polishing device can be observed through the observation window when it is working. The protective chamber is used to prevent silicon wafer debris from splashing, and has a protective function, which solves the problem that the existing device may hurt people when used. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings.

[0023] Figure 1 This is a diagram of the overall closed structure of the device of the present utility model;

[0024] Figure 2 This is a front view structural diagram of the entire device of the present invention;

[0025] Figure 3 This is a structural diagram of the device of the utility model when the protective net is removed;

[0026] Figure 4 This is a rear side structural diagram of the entire device of the present invention;

[0027] Figure 5 This is a structural diagram of the placement device of the present utility model.

[0028] Legend: 1. Grinding device; 2. Protective chamber; 3. Chamber door; 4. Bottom plate; 5. Liquid outlet; 6. Vacuum cleaner; 7. Placement device; 8. One-way valve; 201. Top plate; 202. Observation window; 301. Handle; 302. Hinge; 401. Protective net; 501. Liquid filling port; 601. Air outlet; 701. Fixing plate; 702. Fixing sleeve; 703. Round groove; 704. Fixing block; 705. Rubber sleeve; 706. Through hole; 707. Cover plate. DETAILED DESCRIPTION

[0029] The embodiments of the present application provide a dust-free protective device for silicon wafer processing, which effectively solves the problems of existing devices such as imperfect dust removal, cumbersome use, environmental pollution, and potential injury during use.

[0030] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, the technical solution in the embodiment of the present application effectively solves the technical problems of existing devices such as imperfect dust removal, cumbersome use, environmental pollution and potential harm to people during use. The overall idea is as follows:

[0031] In response to the problems existing in the prior art, the utility model provides a dust-free protective device for silicon wafer round processing, including a polishing device 1, the polishing device 1 is fixedly connected to a top plate 201, the top plate 201 is fixedly connected to a protective bin 2, the bottom surface of the protective bin 2 is fixedly connected to a bottom plate 4, a dust collector 6 is fixedly installed on the bottom surface of the protective bin 2, the dust collector 6 passes through the protective bin 2, a placement device 7 is fixedly installed on the top surface of the dust collector 6 at one end inside the protective bin 2, an air outlet 601 is fixedly provided on the end outside the protective bin 2, the air outlet 601 is connected to an external storage bin away from the dust collector 6, an air intake is provided on the top surface of the end inside the protective bin 2, and the air intake is fixedly connected to the placement device 7.

[0032] The protective compartment 2 is fixedly connected to two hinges 302 , and the protective compartment 2 is hinged to two compartment doors 3 via the two hinges 302 . Both compartment doors 3 are fixedly connected to a handle 301 .

[0033] A one-way valve 8 is fixedly installed on the side wall of the upper half of the protection chamber 2 , and an observation window 202 is fixedly installed on the side of the protection chamber 2 close to the vacuum cleaner 6 .

[0034] A liquid outlet 5 is fixedly installed on one of the side walls of the lower half of the protective bin 2, and a liquid filling port 501 is fixedly installed on the lower half of the other side wall of the protective bin 2. The liquid outlet 5 and the liquid filling port 501 are both threadedly connected with a sealing cover at one end away from the protective bin 2, and the liquid filling port 501 is set at a position higher than the liquid outlet 5.

[0035] A protective net 401 is fixedly installed on the lower half of the protective bin 2. The position of the protective net 401 is at the same height as the top surface of the bottom plate 4. The liquid filling port 501 is located below the protective net 401. The protective net 401 is lower than the top surface of the vacuum cleaner 6. Adsorption liquid is provided at the bottom of the protective bin 2, and the surface of the adsorption liquid is lower than the protective net 401.

[0036] The placement device 7 includes a fixed plate 701 with a ventilation slot at its axis. The fixed plate 701 is fixedly connected to two fixed blocks 704 . One end of the fixed block 704 away from the fixed plate 701 is fixedly connected to the inner wall of the protective chamber 2 .

[0037] The top surface of the fixing plate 701 is fixedly connected to a fixing sleeve 702, the inner side of the fixing sleeve 702 is fixedly connected to a cover plate 707, a circular groove 703 is provided between the cover plate 707 and the fixing plate 701, a rubber sleeve 705 is fixedly connected to the central axis of the cover plate 707, and a plurality of through holes 706 are provided on the surface of the cover plate 707.

[0038] The fixed plate 701 is fixedly connected to the air intake of the vacuum cleaner 6, and the ventilation groove of the fixed plate 701 is connected to the air intake of the vacuum cleaner 6, the through hole 706 is connected to the circular groove 703, and the circular groove 703 is connected to the air intake of the vacuum cleaner 6, and the placement device 7 and the grinding device 1 are located on the same vertical line.

[0039] Pull the handle 301 to open the warehouse door 3, place the silicon wafer on the cover 707, and make the silicon wafer contact with the rubber sleeve 705, start the vacuum cleaner 6, and suck the air in the circular groove 703 and the rubber sleeve 705 through the air intake port, so that negative pressure is formed between the silicon wafer and the through hole 706, and the rubber sleeve 705 adsorbs the silicon wafer. Start the polishing device 1 to process the silicon wafer. Under the action of negative pressure, the processed silicon wafer debris enters the circular groove 703 through the through hole 706 and is finally discharged to the storage bin through the air outlet 601 by the vacuum cleaner 6. Because the cover 707 covers the entire silicon wafer, most of the debris can be sucked up by the vacuum cleaner 6, and there is no need to clean the debris regularly, which solves the problem that the existing device has imperfect dust removal and is more troublesome to use.

[0040] Working principle:

[0041] The first step is to pull the handle 301 to open the warehouse door 3, place the silicon wafer on the cover 707, and make the silicon wafer contact with the rubber sleeve 705, start the vacuum cleaner 6, and suck the air in the circular groove 703 and the rubber sleeve 705 through the air intake port, so that negative pressure is formed between the silicon wafer and the through hole 706, and the rubber sleeve 705 also adsorbs the silicon wafer, start the polishing device 1 to process the silicon wafer, and the silicon wafer debris after processing enters the circular groove 703 through the through hole 706 under the action of negative pressure and is finally discharged to the storage bin by the vacuum cleaner 6 through the air outlet 601.

[0042] In the second step, the placement device 7 and the vacuum cleaner 6 cannot completely absorb the debris, and some of the debris will splash out of the placement device 7 and eventually be absorbed by the adsorption liquid at the bottom of the protective chamber 2 under the action of gravity. When the polishing device 1 is working, it can be observed through the observation window 202. The protective chamber 2 is used to prevent silicon wafer debris from splashing and has a protective function. The function of the one-way valve 8 is to control the air to only enter but not exit, and it will only open when the inside of the protective chamber 2 is in a negative pressure state.

[0043] Finally, it should be noted that the above embodiments are merely examples for the purpose of illustrating the present invention and are not intended to limit the embodiments. Those skilled in the art will readily appreciate that other variations or modifications based on the above description are possible. It is not necessary and impossible to provide an exhaustive list of all possible embodiments. However, any obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A dust-free protective device for silicon wafer round processing, comprising a grinding device (1), characterized in that: The polishing device (1) is fixedly connected to a top plate (201), the top plate (201) is fixedly connected to a protective bin (2), the bottom surface of the protective bin (2) is fixedly connected to a bottom plate (4), a dust collector (6) is fixedly mounted on the bottom surface of the protective bin (2), the dust collector (6) passes through the protective bin (2), and a placement device (7) is fixedly mounted on the top surface of one end of the dust collector (6) located inside the protective bin (2); An air outlet (601) is fixedly provided at one end of the vacuum cleaner (6) located outside the protective bin (2), an end of the air outlet (601) away from the vacuum cleaner (6) is connected to an external storage bin, and an air intake is provided on the top surface of one end of the vacuum cleaner (6) located inside the protective bin (2), and the air intake is fixedly connected to the placement device (7).

2. A dust-free protective device for silicon wafer processing according to claim 1, characterized in that: The protective bin (2) is fixedly connected to two hinges (302), and the protective bin (2) is hinged to two bin doors (3) via the two hinges (302), and both bin doors (3) are fixedly connected to a handle (301).

3. The dust-free protective device for silicon wafer processing according to claim 1, characterized in that: A one-way valve (8) is fixedly mounted on the side wall of the upper half of the protection chamber (2), and an observation window (202) is fixedly mounted on the side of the protection chamber (2) close to the vacuum cleaner (6).

4. The dust-free protective device for silicon wafer processing according to claim 1, characterized in that: A liquid outlet (5) is fixedly mounted on one side wall of the lower half of the protective bin (2), and a liquid filling port (501) is fixedly mounted on the lower half of the other side wall of the protective bin (2). The ends of the liquid outlet (5) and the liquid filling port (501) away from the protective bin (2) are both threadedly connected to sealing covers. Wherein, the liquid adding port (501) is arranged at a position higher than the liquid outlet (5).

5. A dust-free protective device for silicon wafer processing as claimed in claim 4, characterized in that: A protective net (401) is fixedly installed on the lower half of the protective bin (2), the position of the protective net (401) is at the same height as the top surface of the bottom plate (4), the liquid filling port (501) is located below the protective net (401), the protective net (401) is lower than the top surface of the vacuum cleaner (6), and adsorption liquid is provided at the bottom of the protective bin (2), the surface of the adsorption liquid is lower than the protective net (401).

6. The dust-free protective device for silicon wafer processing according to claim 1, characterized in that: The placement device (7) comprises a fixed plate (701), a ventilation slot is provided at the axis of the fixed plate (701), the fixed plate (701) is fixedly connected to two fixed blocks (704), and one end of the fixed block (704) away from the fixed plate (701) is fixedly connected to the inner wall of the protective bin (2).

7. A dust-free protective device for silicon wafer processing according to claim 6, characterized in that: The top surface of the fixing plate (701) is fixedly connected to a fixing sleeve (702), the inner side of the fixing sleeve (702) is fixedly connected to a cover plate (707), a circular groove (703) is provided between the cover plate (707) and the fixing plate (701), a rubber sleeve (705) is fixedly connected to the central axis of the cover plate (707), and a plurality of through holes (706) are provided on the surface of the cover plate (707).

8. The dust-free protective device for silicon wafer processing according to claim 7, characterized in that: The fixing plate (701) is fixedly connected to the air intake of the vacuum cleaner (6), and the ventilation slot of the fixing plate (701) is in communication with the air intake of the vacuum cleaner (6). The through hole (706) is in communication with the circular groove (703), and the circular groove (703) is in communication with the air intake of the vacuum cleaner (6). The placement device (7) and the polishing device (1) are located on the same vertical line.

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