Wafer box inspection jig

Abstract

The utility model provides a wafer box inspection jig, a containing cavity is arranged in a wafer box, the inner surface of the containing cavity is provided with a plurality of tooth grooves, the tooth grooves are used for containing a plurality of wafers, and the wafer box inspection jig comprises a base; the positioning assembly is positioned on the base and is used for positioning the wafer box; the at least one push rod assembly is in sliding connection with the base, the push rod assembly comprises a plurality of inspection grooves corresponding to the plurality of wafers, the openings of the inspection grooves face the positioning assembly, and the plurality of inspection grooves are distributed in parallel in the direction perpendicular to the base; the push rod assembly is used for sliding to the position of the wafer box so as to inspect the wafer box through the relative position of the wafer and the push rod assembly, and the relative position of the wafer and the push rod assembly comprises that the edge of the wafer is located in the corresponding inspection groove or the wafer is located between the adjacent inspection grooves; the wafer box quality inspection device is simple in operation and high in efficiency, solves the problem that wafers are scrapped due to the fact that the wafer boxes are abnormal, and has a wide application range.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer box inspection jig. Background Art

[0002] In the production and manufacturing process of semiconductor integrated circuits, in order to ensure the safe storage and handling of wafers and avoid damage and contamination, wafer boxes are widely used as wafer carriers and transportation tools, which can well protect the wafers and also facilitate the extraction of wafers by semiconductor processing equipment.

[0003] Wafer cassettes have symmetrical grooves with uniform dimensions to support both sides of the wafers. Typically, one cassette holds 25 wafers. Wafer cassettes are typically made of a translucent plastic material that is heat-resistant, wear-resistant, and has anti-static additives. Different color additives are used to distinguish between metal processing stages in semiconductor production. As wafer cassettes age and wear over time, they require regular inspection to ensure their quality. This ensures that wafer quality is not compromised due to substandard cassettes.

[0004] Therefore, how to effectively and efficiently implement the inspection of wafer boxes is a technical problem that urgently needs to be solved. Utility Model Content

[0005] The technical problem solved by the utility model is to provide a wafer box inspection jig to realize the inspection of the quality of the wafer box, with simple operation and high efficiency, and solve the problem of wafer scrapping due to abnormal wafer box, and has a wide range of applications.

[0006] In order to solve the above problems, the utility model provides a wafer box inspection jig, wherein the wafer box has a accommodating cavity, and the inner surface of the accommodating cavity has a plurality of tooth grooves for accommodating multiple wafers, and is characterized in that it includes: a base; a positioning assembly located on the base, and the positioning assembly is used to position the wafer box; at least one push rod assembly slidably connected to the base, and the push rod assembly includes a plurality of inspection slots corresponding to the multiple wafers, the openings of the inspection slots face the positioning assembly and the multiple inspection slots are distributed in parallel along a direction perpendicular to the base, the push rod assembly is used to slide to the position of the wafer box to inspect the wafer box through the relative position of the wafer and the push rod assembly, and the relative position of the wafer and the push rod assembly includes the edge of the wafer being located in the corresponding inspection slot or the wafer being located between adjacent inspection slots.

[0007] Optionally, the number of the inspection slots is the same as the number of the tooth slots.

[0008] Optionally, the number of the push rod assemblies is two, including a first push rod assembly and a second push rod assembly, the first push rod assembly, the second push rod assembly and the positioning assembly are arranged along a first direction, the positioning assembly is located between the first push rod assembly and the second push rod assembly, and the first push rod assembly and the second push rod assembly can slide along the first direction.

[0009] Optionally, the first push rod assembly has a first symmetry center line in the first direction, the second push rod assembly has a second symmetry center line in the first direction, the wafer box has a third symmetry center line parallel to the first direction, and the first symmetry center line, the second symmetry center line and the third symmetry center line coincide.

[0010] Optionally, the push rod assembly includes a slider and a push rod, the push rod is arranged on the slider and extends along a surface direction perpendicular to the base, the push rod has a first surface, the first surface faces the positioning assembly, the inspection groove is located on the push rod and is recessed from the first surface in a direction away from the positioning assembly, and the first surface is arc-shaped.

[0011] Optionally, the push rod further has a second surface connected to the first surface, the first surface is perpendicular to the second surface and the second surface is perpendicular to the base surface, and the inspection groove passes through the second surface.

[0012] Optionally, the side wall of the slider facing the wafer box has a protrusion extending toward the positioning assembly, the push rod is located on the protrusion, and the first surface is aligned with the side wall of the protrusion.

[0013] Optionally, the positioning assembly includes a positioning groove, and the positioning groove is used to position the H-shaped end face of the wafer box.

[0014] Optionally, the positioning assembly further includes a plurality of first positioning portions, wherein the first positioning portions are located on one side of the positioning groove in the first direction, and the first positioning portions are used to position an end portion of the wafer box.

[0015] Optionally, the positioning assembly further includes a plurality of second positioning portions, the second positioning portions are located on both sides of the positioning groove in a second direction, the second direction is perpendicular to the first direction, and the second positioning portions are used to position the side walls of the wafer box.

[0016] Optionally, the positioning assembly further includes a fixing plate, the positioning groove, the first positioning portion and the second positioning portion are located on the fixing plate, the fixing plate has a recessed portion on the side wall facing the push rod assembly, the recessed portion matches the raised portion, and the recessed portion cooperates with the raised portion to limit the position of the push rod assembly sliding to the wafer box.

[0017] Optionally, it further includes: a slide rail fixed on the base, and the slider and the slide rail are slidably matched.

[0018] Optionally, it further includes: a limiting column arranged on the base, the limiting column is located on the side of the slide rail away from the positioning component, and the slider slides back and forth on the slide rail between the limiting column and the wafer box.

[0019] Optionally, it further includes: a distance sensor located between the push rod assembly and the positioning assembly, for detecting the distance between the push rod assembly and the positioning assembly.

[0020] Compared with the prior art, the technical solution of the utility model has the following advantages:

[0021] In the technical solution of the present invention, after a plurality of wafers are accommodated in the wafer box, the wafer box is positioned on the base, and at least one push rod assembly is slidably connected to the base, and the push rod assembly includes an inspection groove corresponding to the wafer, and when the push rod assembly slides to the position of the wafer box, the edge of the wafer is embedded in the corresponding inspection groove or the wafer is located between adjacent inspection grooves and is pushed by the push rod assembly; on the one hand, after the wafer box is positioned on the base, a preliminary inspection of the appearance of the wafer box can be achieved by pushing the wafer box with force and observing whether the wafer box shakes, and on the other hand, after the wafer box is positioned on the base, the push rod assembly is slid to the position of the wafer box and observed according to the test results. According to the relative position of the wafer and the push rod assembly, check whether there is any abnormality in the tooth groove inside the wafer box. When there is only one push rod assembly and the push rod assembly is located on the second opening side of the wafer box, when the push rod assembly is pushed to the wafer box, if the wafer is pushed out of the wafer box by the push rod assembly, it can be roughly determined that there is a large misalignment in the tooth groove inside the wafer box. Or when the push rod assembly is located on the first opening side of the wafer box, when the push rod assembly is pushed to the wafer box, if the push rod assembly is not pushed to the appropriate position of the wafer box, the push rod assembly can no longer be pushed, which can also be roughly determined that there is a large misalignment in the tooth groove inside the wafer box.

[0022] Furthermore, there are two push rod assemblies and they are located on both sides of the positioning assembly. If the push rod assembly located on the second opening side of the wafer box slides to the position of the wafer box and it is found that the wafer is not pushed out of the wafer box, the push rod assembly located on the first opening side of the wafer box is slid to the wafer box. By observing the relative position of the edge of the wafer and the inspection groove (for example, the edge of the wafer is located in the inspection groove or between the inspection grooves), and the state of the edge of the wafer in the inspection groove (for example, the edge of the wafer is downward in the inspection groove, or the edge of the wafer is upward in the inspection groove, or the edge of the wafer is just horizontal in the inspection groove), the slight abnormalities in the tooth grooves in the wafer box can be obtained in more detail, which can better adjust the design of the wafer box, effectively realize the inspection of the wafer box, greatly avoid the phenomenon of wafer scrapping due to abnormalities of the wafer box, and ensure that the wafer box can be applied to subsequent processes, and has a wider range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic structural diagram of a wafer box inspection jig in one embodiment of the present invention;

[0024] Figure 2 for Figure 1 A top view of

[0025] Figure 3 This is a schematic structural diagram of a positioning groove in an embodiment of the present utility model;

[0026] Figure 4 A top view of a slider and a push rod in one embodiment of the present utility model;

[0027] Figure 5 This is an enlarged view of a test groove on a push rod in one embodiment of the present utility model;

[0028] Figure 6 This is a top view of the first positioning portion in one embodiment of the present utility model;

[0029] Figure 7 This is a schematic structural diagram of a wafer box in one embodiment of the present invention;

[0030] Figure 8 This is a structural diagram of a wafer box inspection jig in yet another embodiment of the present invention;

[0031] Figure 9 This is a structural diagram of a wafer box inspection jig in yet another embodiment of the present invention;

[0032] Figure 10 This is a schematic diagram of an application scenario of a wafer box inspection jig in one embodiment of the present invention;

[0033] Figures 11 to 13 For Figure 10Schematic diagram of the positional relationship between the wafer edge and the inspection slot in the application scenario;

[0034] Figure 14 Schematic diagram of the structure of the wafer box inspection fixture in the second embodiment of the present invention. DETAILED DESCRIPTION

[0035] As mentioned in the background art, there are still many problems in inspecting wafer cassettes.

[0036] The inventors have discovered that there are currently no specific standards for inspecting wafer cassettes, and there is no guarantee that the inspected wafer cassettes meet the requirements for use. This is a difficulty in the current semiconductor manufacturing process.

[0037] After research, the inventor found that a positioning assembly is provided on the base. After the wafer box is positioned on the positioning assembly, a preliminary inspection of the appearance of the wafer box can be carried out by pushing the wafer box with force and observing whether the wafer box shakes. If the wafer box shakes, it means that the appearance of the wafer box is poorly compatible with the base, and the wafer box can no longer be used for the subsequent process production; if the wafer box does not shake, the push rod assembly is slid to the position of the wafer box and the relative position of the wafer and the push rod assembly is used to check whether there is any abnormality in the tooth groove inside the wafer box. When there is only one push rod assembly and the push rod assembly is located at the second opening side of the wafer box, when the push rod assembly is pushed to the wafer box, if the wafer is pushed out of the wafer box by the push rod assembly, it can be roughly judged that there is a large misalignment in the tooth groove inside the wafer box; or when the push rod assembly is located at the first opening side of the wafer box, when the push rod assembly is pushed to the wafer box, if the push rod assembly is not pushed to the appropriate position of the wafer box, the push rod assembly can no longer be pushed. Pushing can also roughly determine that there is a large misalignment in the tooth grooves inside the wafer box; and when there are two push rod assemblies and they are located on both sides of the positioning assembly, if the push rod assembly located on the second opening side of the wafer box slides to the position of the wafer box, it is found that the wafer is not pushed out of the wafer box, and then the push rod assembly located on the first opening side of the wafer box is slid to the wafer box. By observing the relative position of the edge of the wafer and the inspection groove (for example, the edge of the wafer is located in the inspection groove or between the inspection grooves), and the state of the edge of the wafer in the inspection groove (for example, the edge of the wafer is downward in the inspection groove, or the edge of the wafer is upward in the inspection groove, or the edge of the wafer is just horizontal in the inspection groove), the slight abnormality in the tooth grooves in the wafer box can be obtained in more detail, which can better adjust the design of the wafer box, effectively realize the inspection of the wafer box, greatly avoid the phenomenon of wafer scrapping due to abnormality of the wafer box and ensure that the wafer box can be applied to subsequent processes, and has a wider range of applications.

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0039] First embodiment

[0040] Figure 1 This is a schematic structural diagram of a wafer box inspection jig in one embodiment of the present invention; Figure 2 for Figure 1 A top view of Figure 3 This is a schematic structural diagram of a positioning groove in an embodiment of the present utility model; Figure 4 A top view of a slider and a push rod in one embodiment of the present utility model; Figure 5 This is an enlarged view of a test groove on a push rod in one embodiment of the present utility model; Figure 6 This is a top view of the first positioning portion in one embodiment of the present utility model;

[0041] Figure 7 This is a schematic structural diagram of a wafer box in one embodiment of the present invention; Figure 8 This is a structural diagram of a wafer box inspection jig in yet another embodiment of the present invention; Figure 9 This is a structural diagram of a wafer box inspection fixture in another embodiment of the present invention. Figure 10 Schematic diagram of an application scenario of a wafer box inspection jig in one embodiment of the present invention.

[0042] First, please refer to Figures 1 to 10 A wafer box inspection fixture 100 includes a base 101, a positioning assembly 104, and a push rod assembly 102. The positioning assembly 104 is located on the base 101 and is used to position a wafer box 103. The accommodating cavity 103a of the wafer box 103 contains multiple wafers 103b; at least one push rod assembly 102 is slidably connected to the base 101, and the push rod assembly 102 includes an inspection groove 102a corresponding to the wafer 103b. The opening of the inspection groove 102a faces the wafer box 103 and the inspection groove 102a is distributed parallel to the direction perpendicular to the base 101.

[0043] For further information, please refer to Figure 7The wafer box 103 includes a first end face 103c, a second end face 103d opposite to the first end face 103c, and an opposite side face 103e. The side face 103e is connected to the first end face 103c and the second end face 103d respectively. The first end face 103c, the second end face 103d and the opposite side face 103e surround the accommodating cavity 103a. The accommodating cavity 103a has a first opening 103f and a second opening 103g that pass through the accommodating cavity 103a along the axial direction. The size is larger than that of the second opening 103g. The wafer 103b is placed in the accommodating cavity 103a from the first opening 103f. A plurality of tooth grooves 103h are provided on the side surface 103e in the accommodating cavity 103a. The tooth grooves 103h on the opposite side surfaces 103e are in a one-to-one correspondence. The side surface 103e also has an extension portion 103i extending toward the second opening 103g. The extension portion 103i is located on one side of the second opening 103g and is distributed parallel to the extension portions 103i on the opposite side surfaces 103e.

[0044] In this embodiment, the wafer box 103 is a 6-inch wafer box.

[0045] In other embodiments, the size of the wafer box 103 may be 4 inches, 8 inches, 12 inches, etc.

[0046] In this embodiment, the first end surface 103 c is in an H-shape, and the second end surface 103 d is in a U-shape.

[0047] In some embodiments, the first end surface 103c and the second end surface 103d may both be H-shaped or U-shaped.

[0048] In this embodiment, a protruding structure 103j is provided on the first end surface 103c.

[0049] In this embodiment, there are two push rod assemblies 102, including a first push rod assembly 1021 and a second push rod assembly 1022. The first push rod assembly 1021, the second push rod assembly 1022 and the positioning assembly 104 are arranged along the first direction, and the positioning assembly 104 is located between the first push rod assembly 1021 and the second push rod assembly 1022.

[0050] The first push rod assembly 1021 has a first symmetrical center line parallel to the sliding direction, the second push rod assembly 1022 has a second symmetrical center line parallel to the sliding direction, and the wafer box 103 has a third symmetrical center line parallel to the sliding direction. The first symmetrical center line, the second symmetrical center line and the third symmetrical center line coincide with each other, and the wafer box 103 is located between the first push rod assembly 1021 and the second push rod assembly 1022. For details, please refer to Figure 2 and Figure 10, the first push rod assembly 1021 is located on the side of the first opening 103f, and the second push rod assembly 1022 is located on the side of the second opening 103g. The first symmetry center line L1 of the first push rod assembly 1021, the second symmetry center line L2 of the second push rod assembly 1022, and the third symmetry center line L3 of the wafer box 103 are mirror images. The first symmetry center line L1, the second symmetry center line L2, and the third symmetry center line L3 are designed to coincide. The reason is that the accommodating cavity 103a of the wafer box 103 has a first opening 103f and a second opening 103g that penetrate the accommodating cavity 103a along the axial direction. The first opening 103f The size of the wafer 103b is larger than that of the second opening 103g. The wafer 103b is placed in the accommodating cavity 103a from the first opening 103f. After the wafer box 103 is fixed on the base 101, the first push rod assembly 1021 and the second push rod assembly 1022 are slid toward the first opening 103f and the second opening 103g to the position of the wafer box 103 respectively. The first symmetry center line L1, the second symmetry center line L2 and the third symmetry center line L3 are designed to coincide with each other to ensure that the edge of the wafer 103b can be embedded in the inspection groove 102a of the first push rod assembly 1021 or the second push rod assembly 1022 with the largest area, which helps to improve the inspection accuracy of the wafer box 103.

[0051] Of course, in some embodiments, the first symmetry center line L1, the second symmetry center line L2, and the third symmetry center line L3 may be designed to be non-coincidental.

[0052] Furthermore, the slide rail 102d is fixed on the base 101, the slider 102c matches the slide rail 102d, the slider 102c has a push rod 102f, the push rod 102f extends along a direction perpendicular to the surface of the base 101, the push rod 102f has a first surface 102b, the first surface 102b faces the wafer box 103, and the inspection slot 102a is located on the first surface 102b. In this embodiment, please refer to Figure 1 and Figure 2 There are two push rod assemblies, including a first push rod assembly 1021 and a second push rod assembly 1022. The first push rod assembly 1021 includes a first slider 1021c and a first push rod 1021f. The first push rod 1021f is arranged on the first slider 1021c. The first push rod 1021f extends along a surface direction perpendicular to the base 101. The first push rod 1021f has a first surface 102b. The first surface 102b faces the wafer box 103, and the inspection slot 102a is located on the first surface 102b.

[0053] In this embodiment, the slide rail 102d includes a first slide rail 1021d, and the first slider 1021c matches the first slide rail 1021d. Furthermore, there are two first sliders 1021c and two first slide rails 1021d, and the two first slide rails 1021d are arranged in parallel.

[0054] In this embodiment, the second push rod assembly 1022 includes a second slider 1022c, and the second slider 1022c has a second push rod 1022f. The second push rod 1022f extends along a surface direction perpendicular to the base 101. The second push rod 1022f has a first surface 102b, and the first surface 102b faces the wafer box 103. The inspection slot 102a is located on the first surface 102b.

[0055] In this embodiment, the slide rail 102d includes a second slide rail 1022d, the second slide rail 1022d matches the second slider 1022c, and the second slide rail 1022d and the first slide rail 1021d are located on the same straight line.

[0056] Furthermore, the push rod 102f also has a second surface 102e connected to the first surface 102b, the second surface 102e is perpendicular to the surface of the base 101, and the inspection groove 102a passes through the second surface 102e. Here, the second surface 102e is connected to the first surface 102b, and the second surface 102e is arranged perpendicular to the first surface 102b. Because when the push rod assembly 102 slides to the position of the wafer box 103, if the wafer 103b in the accommodating cavity 103a is not pushed out, the edge of the wafer 103b will be embedded in the inspection groove 102a. Since the first surface 102b is facing the wafer box 103, that is to say, the staff cannot observe the tilt of the wafer 103b in the inspection groove 102a from the direction perpendicular to the first surface 102b. The inspection groove 102a passes through the second surface 102e. At this time, the staff can directly observe the tilt of the wafer 103b in the inspection groove 102a from the visual direction perpendicular to the second surface 102e, which is convenient, fast and intuitive.

[0057] Furthermore, the inspection slots 102a are recessed inward from the first surface 102b along a direction parallel to the sliding direction. That is, the first surface 102b is recessed in a direction away from the wafer box 103 and parallel to the surface of the base 101a. Each inspection slot 102a is arranged in parallel in a direction perpendicular to the first surface 102b.

[0058] In this embodiment, the number of the inspection slots 102 a is the same as the number of the tooth slots 103 h and they correspond one to one.

[0059] Furthermore, the purpose of designing the first surface 102b to be curved is to match the edge shape of the wafer 103b, providing a buffer space for the hard contact between the first surface 102b and the edge of the wafer 103b, and avoiding damage to the wafer 103b when the push rod 102f contacts the edge of the wafer 103b to push the wafer 103b out of the wafer box 103 when the tooth groove 103h of the wafer box 103 is too misaligned, due to the lack of a certain buffer space reserved between the first surface 102b and the edge of the wafer 103b.

[0060] In this embodiment, the heights of the first push rod 1021f and the second push rod 1022f are equal. Figure 5 The height H of the push rod 102f ranges from 12 cm to 13 cm, the opening size d1 of the inspection groove 102a ranges from 0.15 cm to 0.25 cm, preferably, for example, 0.2 cm, the size d2 of the first surface 102b between adjacent inspection grooves 102a ranges from 0.15 cm to 0.25 cm, preferably, for example, 0.2 cm, and the height distance h1 of the inspection groove 102a closest to the base 101 ranges from 0.75 cm to 0.85 cm, preferably, 0.8 cm.

[0061] Furthermore, the side wall of the slider 102c facing the wafer box 103 has a protrusion 102g, the push rod 102f is located on the protrusion 102g, and the first surface 102b is aligned with the side wall of the protrusion 102g; specifically, in this embodiment, please refer to Figure 1, the first slider 1021c has a first protrusion 1021g on the side wall facing the wafer box 103, the first push rod 1021f is located on the first protrusion 1021g, and the first surface 102b is flush with the side wall of the first protrusion 1021g, the second slider 1022c has a second protrusion 1022g on the side wall facing the wafer box 103, the second push rod 1022f is located on the second protrusion 1022g, and the first surface 102b is aligned with the side wall of the second protrusion 1022g, here the first slider 1021c is provided with a first protrusion 1021g, the first push rod 1021f is located on the first protrusion 1021g, the second slider 1022c is provided with a second protrusion 1022g, and the second push rod 1022f is located on the second protrusion 1022g. 22f is located on the second protrusion 1022g, the size of the first protrusion 1021g is smaller than the size of the first slider 1021c, the size of the second protrusion 1022g is smaller than the size of the second slider 1022c, and the size of the second protrusion 1022g is smaller than the distance between adjacent extensions 103i, the size of the first protrusion 1021g is the same as the size of the second protrusion 1022g, the dimension a1 of the first slider 1021c in the direction perpendicular to the sliding direction and parallel to the surface of the base 101 is greater than or equal to the size of the first opening 103f, and the dimension of the second slider 1022c in the direction perpendicular to the sliding direction and parallel to the surface of the base 101 is greater than or equal to the size of the second opening 103g. In some embodiments, the first slider 1021c can also be directly made into the size of the first protrusion, and the second slider 1022c can also be directly made into the size of the second protrusion, as long as it is ensured that when the push rod assembly 102 is slid to the position of the wafer box 103, the edge of the wafer 103b can be directly embedded in the inspection groove 102a or the push rod assembly 102 directly pushes the wafer 103b out of the wafer box 103.

[0062] In this embodiment, please refer to Figure 1 and Figure 2 The slider 102c has a slider groove 105, which is mainly designed to facilitate the staff to push the push rod 102f.

[0063] In this embodiment, please refer to Figure 4 The size of the slider groove 105 is also designed. The length 1 of the slider groove 105 is 8.5 cm, the width w is 2 cm, the maximum width d of the slider 102c is 7.8 cm, the width a of the push rod 102f is 3 cm, and the width b of the second surface 102e is 3 cm.

[0064] It should be noted that these dimensions can be designed according to actual needs and no special regulations are made.

[0065] In some other embodiments, the slider groove may not be designed.

[0066] In this embodiment, please refer to Figure 2 A limiting column 106 is provided on the base 101 to limit the maximum distance that the slider 102c can slide away from the wafer box 103, thereby preventing the slider 102c from derailing from the slide rail 102d.

[0067] Furthermore, the wafer box 103 fixture also includes a positioning component 104, which is fixed on the base 101, and the wafer box 103 is positioned on the positioning component 104. The function of the positioning component 104 here is to fix the wafer box 103 on the one hand, and more importantly, it can inspect the appearance of the wafer box 103. For specific details on how to inspect the appearance of the wafer box 103, please see the detailed description below.

[0068] In this embodiment, please refer to Figure 1 and Figure 2 The positioning assembly 104 includes a fixing plate 104a, and the fixing plate 104a has a positioning groove 104b. Figure 7 The first end surface 103c of the wafer box 103 has a protruding structure 103j, and the positioning groove 104b is adapted to the protruding structure 103j, which mainly plays the role of fixing the wafer box 103 on the fixing plate 104a.

[0069] In this embodiment, the protruding structure 103j is in the shape of an I-shaped Chinese character.

[0070] In some embodiments, the shape of the protruding structure 103j can be designed to be other shapes according to design requirements.

[0071] In this embodiment, the shape of the positioning groove 104b is the same as that of the protruding structure 103j.

[0072] In this embodiment, the thickness of the fixing plate 104a is the same as that of the slider 102c, which helps to achieve maximum detection of abnormalities in the tooth groove 103h in the wafer box 103, because it can ensure that the bending conditions of the wafer 103b in the wafer box 103 can be detected, greatly improving the accuracy of the inspection.

[0073] In some embodiments, the thickness of the fixing plate 104 a may be greater than or less than the thickness of the slider 102 c .

[0074] Of course, in some embodiments, the wafer cassette 103 and the wafer cassette inspection jig 100 may not have the fixing plate 104 a .

[0075] In this embodiment, the fixing plate 104a further has a recessed portion 104c, which matches the raised portion 102g on the slider 102c to play a role in positioning and limiting. The wafer 103b is placed from the first opening 103f of the wafer box 103 into the corresponding tooth groove 103h. At this time, the wafer box 103 is like a basket to hold the wafer 103b, and the wafer 103b cannot leak out from the second opening 103g. Therefore, when there is an abnormal misalignment in the tooth groove 103h in the wafer 103b, the push rod assembly 102 slides to the first opening 103f of the wafer box 103. If there is no obstruction of the recessed portion 104c at this time, the slider 102c will continue to move to the first opening 103f. The wafer 103b is pushed by the opening 103f. At this time, one side of the wafer 103b is supported by the push rod 102f and the other side is supported by the wafer box 103. The two ends are subjected to force, and the wafer 103b is prone to breakage. Therefore, a recessed portion 104c is provided and the first surface 102b is concave. Even if the push rod assembly 102 slides toward the first opening 103f, there is an abnormal misalignment in the tooth groove 103h of the wafer box 103. The push rod 102f can only push until the protrusion 102g contacts the recessed portion 104c. At this time, the edge of the wafer 103b can only contact the first surface 102b between the adjacent inspection grooves 102a. This can not only play the role of inspection, but also will not damage the wafer 103b.

[0076] In this embodiment, the positioning assembly 104 further includes a plurality of first positioning portions 104d and a plurality of second positioning portions 104e. The first positioning portion 104d is located on one side of the positioning groove 104b in the first direction. The first positioning portion 104d is used to locate the end position of the extension portion 103i of the wafer box 103. The second positioning portions 104e are located on both sides of the positioning groove 104b in the second direction. The second direction is perpendicular to the first direction. The second positioning portion 104e is used to locate the position of the side surface 103e of the wafer box 103. The first positioning portion 104d and the second positioning portion 104e are located on both sides of the positioning groove 104b in the second direction. The position of the positioning portion 104e is designed based on the appearance of the wafer box 103 being in a standard state. In other words, as long as the wafer box 103 to be inspected can be placed intact in the area surrounded by the first positioning portion 104d and the second positioning portion 104e, and after the first end face 103c and the fixing plate 104a are positioned, the wafer box 103 is pushed by hand to test its stability. As long as the wafer box 103 does not shake, it means that the appearance of the wafer box 103 to be inspected is qualified and the wafer box 103 also meets the requirements in the subsequent processes.

[0077] The wafer box is positioned on the base 101. By pushing the wafer box 103 and observing the stability of the connection between the wafer box 103 and the base 101, it is preliminarily determined whether there is any major damage to the appearance of the wafer box 103 and whether it can be used for subsequent process steps. After pushing the wafer box 103, there is obvious shaking between the wafer box 103 and the base 101, indicating that the fixing effect between the wafer box 103 and the base 101 is poor, and the two are not fully compatible, indicating that the appearance inspection of the wafer box 103 is unqualified. After pushing the wafer box 103, there is no shaking between the wafer box 103 and the base 101, indicating that the two are very compatible, indicating that the appearance inspection of the wafer box 103 is qualified.

[0078] After the appearance inspection of the wafer box 103 is passed, the push rod assembly 102 is slid to the position of the wafer box 103, and the relationship between the inspection groove 102a and the edge of the wafer 103b is used to check whether there is any abnormality in the tooth groove of the wafer box 103. Please refer to Figure 10 After the second push rod assembly 1022 is pushed to the wafer box 103, the wafer 103b is not pushed out of the wafer box 103. At this time, after the first push rod assembly 1021 is pushed to the wafer box 103, although the wafer 103b is not pushed out of the wafer box 103, the edge of the wafer 103b can be observed in the inspection groove 102a of the first push rod assembly 1021. For example, the edge of the wafer 103b is downward in the inspection groove 102a of the first push rod assembly 1021 ( Figure 13 ), or the edge of the wafer 103b is upward in the inspection slot 102a of the first push rod assembly 1021 ( Figure 12 ), or the edge of the wafer 103b is exactly horizontal in the inspection groove 102a of the first push rod assembly 1021 ( Figure 11 ), thereby obtaining the minute abnormalities in the tooth grooves of the wafer box 103 in a more detailed manner, and better adjusting the tooth groove design of the wafer box 103, and having a wider range of applications.

[0079] In some embodiments, please refer to Figure 8 and Figure 9 , the number of the push rod assembly 102 can also be one.

[0080] For details, please refer to Figure 8 The push rod assembly 102 is located on the side away from the first positioning portion 104d, that is, the push rod assembly 102 is located on the first opening 103f side of the wafer box 103. When the push rod assembly 102 slides toward the position of the wafer box 103, if the wafer 103b abuts against the first surface 102b of the push rod 102f between the adjacent inspection slots 102a, and the push rod assembly 102 cannot be pushed at this time, it can also be roughly judged that there is a large misalignment in the tooth grooves inside the wafer box 103, and it is not suitable to continue to store the wafer 103b.

[0081] Please refer to Figure 9 The push rod assembly 102 is located on the side close to the first positioning portion 104d, that is, the second push rod assembly 1022 is located on the second opening 103g side of the wafer box 103. When the push rod assembly 102 slides to the position of the wafer box 103, if the wafer 103b is pushed out of the wafer box 103 by the push rod assembly 102, it can be roughly judged that there is a large misalignment in the tooth groove inside the wafer box 103, and it is not suitable to continue to store the wafer 103b.

[0082] In this embodiment, reference Figure 3 The positioning groove 104b is designed according to the protruding structure 103j on the wafer box 103, wherein the multiple sizes of the positioning groove 104b include w1 of 7.8cm, w2 of 7.7cm, w3 of 8.2cm, l1 of 13cm, l2 of 14.2cm, l3 of 13.6cm, and l4 of 13.4.

[0083] Of course, the size of the positioning groove 104b here is designed according to the size of the protruding structure 103j on the specific wafer box 103. The sizes of the protruding structures 103j on different wafer boxes 103 are different, so the multiple sizes of the corresponding positioning grooves 104b are also different.

[0084] In this embodiment, please refer to Figure 6 The size of the first positioning portion 104d is designed to be certain. The length 1 of the first positioning portion 104d is 2 cm, the width d1 is 1.5 cm, and the width d2 is 1.8 cm.

[0085] Figure 10 Schematic diagram of an application scenario of a wafer cassette inspection jig according to some embodiments of this specification. Figures 11 to 13 For Figure 10 The positional relationship between the wafer edge and the inspection groove in the application scenario.

[0086] In some embodiments, when inspecting the wafer box 103, the wafer box 103 is positioned on the positioning assembly 104. If the wafer box 103 can be positioned on the positioning assembly 104 and the wafer box 103 does not shake when the wafer box 103 is pushed, it means that the appearance of the wafer box 103 is qualified; then the second push rod assembly 1022 is pushed, and the second push rod assembly 1022 will slide until the second protrusion 1022g contacts the recessed portion 104c. If a wafer 103b is pushed out of the wafer box 103 at this time, it means that the wafer box 103 is unqualified at this time, and there is no need to push the first push rod assembly 1021 anymore; if the second push rod assembly 1022 slides until the second protrusion 1022g contacts the recessed portion 104c, and no wafer 103b is pushed out of the wafer box 103 at this time, it means that the wafer box 103 basically meets the requirements at this time and the wafer box 103 can be used.

[0087] However, in order to more accurately determine whether the tooth groove 103h in the wafer box 103 is out of position, the first push rod assembly 1021 is slid to the wafer box 103 until the first protrusion 1021g contacts the recess 104c, and the distribution of the wafer 103b in the inspection groove 102a is observed from the second surface 102e. Figures 11 to 13 ,from Figure 11 It can be seen that the edge of the wafer 103b is in a horizontal direction (parallel to the reference plane A) in the inspection slot 102a of the first push rod assembly 1021, indicating that the tooth slot 103h of the wafer box 103 is not out of position at this time; Figure 12 It can be seen that the edge of the wafer 103b is facing upward in the inspection groove 102a of the first push rod assembly 1021, and the deformation direction of the tooth groove is also upward; Figure 13 It can be seen that the edge of the wafer 103b is downward in the inspection groove 102a of the first push rod assembly 1021, and the deformation direction of the tooth groove here is also downward, so as to accurately determine the abnormal deviation of the tooth groove 103h in the wafer box 103, and play a good and accurate guiding role in repairing the tooth groove 103h in the wafer box 103.

[0088] It should be noted that the reference plane A here is a plane parallel to the surface of the base 101 and perpendicular to the extension direction of the push rod.

[0089] Figures 11 to 13 The distribution of the edge of a wafer in the inspection groove is shown, mainly to illustrate how to determine the tooth groove misalignment based on the distribution of the edge of the wafer in the inspection groove.

[0090] Second embodiment

[0091] The difference between the second embodiment and the first embodiment is that the positioning assembly in the second embodiment does not include a fixing plate.

[0092] Please refer to Figure 14 A wafer box inspection fixture 200 includes a base 201, a positioning assembly and a push rod assembly 202. The wafer box is positioned on the base 201. The accommodating cavity of the wafer box contains multiple wafers. The push rod assembly 202 includes an inspection groove 202a corresponding to the wafer.

[0093] In this embodiment, two push rod assemblies 202 are slidably connected to the base 201 .

[0094] In some embodiments, a push rod assembly can be slidably connected to the base.

[0095] In this embodiment, the structure of the push rod assembly 202 is the same as that in the first embodiment, and will not be repeated here. For details, please refer to Figure 1 and Figure 2 .

[0096] In this embodiment, the wafer box inspection jig 200 also includes: a distance sensor 203 located between the push rod assembly 202 and the positioning assembly, which is used to detect the distance between the push rod assembly 202 and the positioning assembly, that is, to check the position of the push rod assembly 202 sliding to the wafer box, and use the distance sensor to accurately control the distance from the push rod assembly 202 to the wafer box to avoid the push rod assembly 202 sliding excessively toward the wafer box, thereby pressing against the wafer and causing the wafer 103b to be broken.

[0097] Specifically, the distance sensor may be an optical distance sensor, an ultrasonic distance sensor, a capacitive distance sensor, or the like.

[0098] In this embodiment, the structure of the wafer box is as follows Figure 7 , I will not repeat it here.

[0099] In this embodiment, the positioning assembly includes a positioning groove 201a, which is provided on the base 201. The first end surface 103c (please refer to Figure 7 ) has a protruding structure 103j, and a snap connection is formed between the protruding structure 103j and the positioning groove 201a.

[0100] In this embodiment, the positioning assembly also includes: a first positioning portion 201b and a second positioning portion 201c located on the base 201. After the wafer box 103 is positioned on the base 201, the first positioning portion 201b is used to position the position of the side 103e, and the second positioning portion 201c is used to position the end position of the extension portion 103i.

[0101] In this embodiment, the principle of wafer box inspection jig 200 for implementing wafer box inspection is the same as that in the first embodiment, and will not be described again here.

[0102] Although the present invention is disclosed as above, it is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer box inspection jig, wherein the wafer box has a receiving cavity, and the inner surface of the receiving cavity has a plurality of tooth grooves for receiving a plurality of wafers, characterized in that: include: base; a positioning assembly located on the base, the positioning assembly being used to position the wafer box; At least one push rod assembly is slidably connected to the base, the push rod assembly includes a plurality of inspection slots corresponding to the plurality of wafers, the openings of the inspection slots face the positioning assembly and the plurality of inspection slots are distributed in parallel along a direction perpendicular to the base, the push rod assembly is used to slide to the position of the wafer box to inspect the wafer box through the relative position of the wafer and the push rod assembly, the relative position of the wafer and the push rod assembly includes the edge of the wafer being located in the corresponding inspection slot or the wafer being located between adjacent inspection slots.

2. The wafer box inspection jig according to claim 1, wherein: The number of the inspection grooves is the same as the number of the tooth grooves.

3. The wafer box inspection jig according to claim 1, wherein: There are two push rod assemblies, including a first push rod assembly and a second push rod assembly. The first push rod assembly, the second push rod assembly and the positioning assembly are arranged along a first direction. The positioning assembly is located between the first push rod assembly and the second push rod assembly. The first push rod assembly and the second push rod assembly can slide along the first direction.

4. The wafer box inspection jig according to claim 3, wherein: The first push rod assembly has a first symmetry center line in the first direction, the second push rod assembly has a second symmetry center line in the first direction, the wafer box has a third symmetry center line parallel to the first direction, and the first symmetry center line, the second symmetry center line and the third symmetry center line coincide.

5. The wafer box inspection jig according to claim 1, wherein: The push rod assembly includes a slider and a push rod, the push rod is arranged on the slider and extends along a surface direction perpendicular to the base, the push rod has a first surface, the first surface faces the positioning assembly, the inspection groove is located on the push rod and is recessed from the first surface in a direction away from the positioning assembly, and the first surface is arc-shaped.

6. The wafer box inspection jig according to claim 5, characterized in that: The push rod further has a second surface connected to the first surface, the second surface is perpendicular to the base surface, and the inspection groove passes through the second surface.

7. The wafer box inspection jig according to claim 5, wherein: The side wall of the slider facing the wafer box has a protrusion extending toward the positioning assembly. The push rod is located on the protrusion, and the first surface is aligned with the side wall of the protrusion.

8. The wafer box inspection jig according to claim 7, wherein: The positioning assembly includes a positioning groove, and the positioning groove is used to position the H-shaped end face of the wafer box.

9. The wafer box inspection jig according to claim 8, wherein: The positioning assembly further includes a plurality of first positioning portions, each of which is located on one side of the positioning groove in the first direction, and is used to position an end portion of the wafer box.

10. The wafer box inspection jig according to claim 9, wherein: The positioning assembly further includes a plurality of second positioning portions, which are located on both sides of the positioning groove in a second direction, the second direction being perpendicular to the first direction, and are used to position the side walls of the wafer box.

11. The wafer box inspection jig according to claim 10, wherein: The positioning assembly also includes a fixing plate, the positioning groove, the first positioning portion and the second positioning portion are located on the fixing plate, and the fixing plate has a recessed portion on the side wall facing the push rod assembly, and the recessed portion matches the raised portion, and the recessed portion cooperates with the raised portion to limit the position of the push rod assembly sliding to the wafer box.

12. The wafer box inspection jig according to claim 5, wherein: Also includes: A slide rail is fixed on the base, and the slider is slidably matched with the slide rail.

13. The wafer box inspection jig according to claim 12, wherein: Also includes: A limiting post is provided on the base, and the limiting post is located on a side of the slide rail away from the positioning assembly. The slider slides back and forth on the slide rail between the limiting post and the wafer box.

14. The wafer box inspection jig according to claim 1, wherein: Also includes: The distance sensor located between the push rod assembly and the positioning assembly is used to detect the distance between the push rod assembly and the positioning assembly.

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