Supporting device for wafer code scanning and code scanning system thereof

Abstract

The utility model relates to the technical field of wafer code scanning, and discloses a wafer code scanning supporting device which comprises a fixing unit and a wafer supporting disc. The wafer supporting disc is provided with a plurality of wafer supporting pieces which are arranged in a circumferential array mode, and the wafer supporting pieces are used for supporting the edge of a wafer so that the middle of the wafer can be suspended; the bottom of the wafer supporting disc is provided with a wafer exposing area and a wafer shielding area. The fixing unit is provided with at least three wafer supporting parts; meanwhile, the utility model further provides a wafer code scanning system with the supporting device, the wafer is supported by the wafer supporting piece, the contact between the wafer supporting disc and the bottom of the wafer is avoided, and when the coding part of the wafer or the whole coding part of the wafer is located in the shielding area of the wafer, the coding part of the wafer can not be blocked by the wafer supporting piece. The wafer supporting disc is driven by the lifting unit and the rotating unit to change the relative position of the wafer exposure area and the wafer, so that the wafer code is located in the wafer exposure area, and the wafer code is prevented from being shielded and cannot be recognized.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer code scanning, in particular to a wafer code scanning support device and a code scanning system thereof. Background Art

[0002] With the continuous development of science and technology, chips are crucial to today's information age. However, the chip manufacturing process is very complicated. After the crystal rod is produced, it is coded and traced. After the wafer is cut, it begins the grinding process; the wafer is ground to reduce saw marks and surface damage on the front and back sides, while thinning the wafer and helping to release the stress accumulated during the cutting process; after grinding, the wafer enters the coding process, using a laser coding machine to mark a QR code or barcode number or character at a fixed position on the upper or lower surface of the wafer, so as to identify the production traceability of the wafer and view the current wafer production status in real time. The subsequent processing of the wafer requires code reading for traceability.

[0003] During the chip production process, the present invention can quickly and accurately find the QR code, barcode, number and character position corresponding to the chip, accurately identify and read it, and provide real-time feedback to the production system MES to monitor the production status of the chip. It can find the current production status and position of the wafer faster and more accurately, and can effectively achieve accurate monitoring of the production process.

[0004] In the prior art, the invention patent (CN117291883A) discloses a sapphire wafer patch traceability, detection system and control method, the system includes a chip code identification component, a detection pressing component and an identification control system, the chip code identification component and the detection pressing component are installed on the equipment platform, the identification control system is electrically connected to the chip code identification component and the detection pressing component respectively, the sapphire wafer patch traceability, detection system control method includes the following steps: start, ceramic disk QR code identification, edge finding, chip code identification, re-pressing, defect judgment; the present invention provides chip code identification, ceramic disk QR code identification, chip and ceramic disk binding, chip patch defect detection, secondary pressing and alarm prompt functions for the sapphire wafer patch process, the method is to scan the code by means of an edge finding motor and an edge finder, and cannot be applied to wafers of various specifications and sizes, and this will directly contact the middle part of the wafer, which will affect the double-sided polishing effect of the subsequent processing of the wafer.

[0005] Based on this, the technical problem to be solved in this case is: how to avoid contact with the bottom of the wafer when scanning the code. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a support device for wafer code scanning. The support device supports the wafer by arranging a wafer support member on the wafer support plate to avoid contact between the wafer support plate and the bottom of the wafer. At the same time, a wafer exposure area is set on the wafer support plate. When the wafer code is partially or completely located in the wafer blocking area, the wafer support plate can be driven downward by the lifting unit to place the wafer on the support unit, and is driven to rotate by the rotating unit to change the relative position of the wafer exposure area and the wafer, so that the wafer code is located in the wafer exposure area, preventing the wafer code from being blocked and unable to be identified. At the same time, the utility model also provides a wafer code scanning system with the support device.

[0007] The technical solution of the utility model is:

[0008] A wafer scanning support device includes a fixing unit and a wafer support plate;

[0009] The wafer support plate is provided with a plurality of wafer supports arranged in a circumferential array, and the wafer supports are used to support the edges of the wafer so that the middle of the wafer is suspended;

[0010] The bottom of the wafer support plate is provided with a wafer exposure area and a wafer shielding area;

[0011] The fixing unit is provided with at least three wafer supporting parts; and a gap for the wafer supporting plate to pass through is provided between adjacent wafer supporting parts;

[0012] When part or all of the wafer's code is located in the wafer shielding area, the wafer support plate is driven downward by a lifting unit, the wafer is placed on the wafer support part, and is driven to rotate a preset angle by a rotating unit to change the relative position of the wafer exposed area and the wafer so that the code is located in the wafer exposed area.

[0013] In the above-mentioned wafer scanning support device, the wafer support member is a support column with a protrusion on the top, a support block with an inclined side, or a support table with a stepped top;

[0014] When the wafer support member is a support column with a protrusion on the top, the support column is used to support the edge area of ​​the bottom of the wafer, and the protrusion is used to press against the side of the wafer;

[0015] When the wafer support member is a support block, the inclined surface is the support surface of the wafer;

[0016] When the wafer support is a support platform with a stepped top, the horizontal portion of the top of the support platform is used to support the bottom of the wafer, and the vertical portion of the top of the support platform is used to press against the side of the wafer.

[0017] In the above-mentioned support device for wafer scanning, the wafer support plate includes a plurality of support rods arranged in a circular array, and one ends of the plurality of support rods are connected to each other to form a structure, a cross structure or a star structure. In the horizontal plane projection, the wafer exposed area is located between two adjacent support rods; the wafer shielding area is the overlapping area of ​​the support bar and the wafer, and the wafer support parts are respectively located at the top of the free ends of the support rods.

[0018] In the above-mentioned wafer scanning support device, the fixing unit includes a wafer fixing plate, the wafer fixing plate is provided with a through hole for the wafer supporting plate to pass through, and the wafer supporting part is located in the through hole.

[0019] In the above-mentioned wafer scanning support device, wafer support members are provided on each wafer support portion.

[0020] A wafer scanning system includes a scanning unit, a horizontal drive unit, and the above-mentioned wafer scanning support device, wherein the scanning unit is used to scan the upper and lower surfaces of the wafer;

[0021] The lifting unit is connected to the horizontal driving unit. The rotating unit is located inside the lifting unit and is used to drive the output end of the lifting unit to rotate. The wafer supporting plate is connected to the output end of the lifting unit.

[0022] When the rotating unit drives the wafer to rotate one circle in the code scanning unit and the code scanning unit does not read the code, the wafer supporting plate is driven away from the code scanning unit by the horizontal driving unit and driven downward by the lifting unit to place the wafer on the fixed unit; the rotating unit drives the wafer supporting plate to rotate a preset angle, and after changing the relative position of the exposed area of ​​the wafer and the wafer, the lifting unit drives the wafer supporting plate again to lift the wafer and drive it into the code scanning unit through the horizontal driving unit.

[0023] In the above-mentioned wafer scanning system, the wafer scanning system further includes a lifting device, and the horizontal driving unit is connected to the power output end of the lifting device.

[0024] In the above-mentioned wafer scanning system, the scanning unit includes a base, an upper code reader and a lower code reader connected to the base. The upper code reader and the lower code reader are arranged opposite to each other, and the scanning area is between the upper code reader and the lower code reader.

[0025] In the above-mentioned wafer scanning system, both the upper code reader and the lower code reader are infrared optical code readers.

[0026] One of the above technical solutions of the utility model has at least one of the following advantages or beneficial effects:

[0027] The utility model supports the wafer by arranging a wafer support member on the wafer supporting plate to avoid contact between the wafer supporting plate and the bottom of the wafer, and at the same time, a wafer exposure area is arranged on the wafer supporting plate. When the code of the wafer is partially or completely located in the wafer blocking area, the wafer supporting plate can be driven downward by the lifting unit to place the wafer on the supporting unit, and is driven to rotate by the rotating unit to change the relative position of the wafer exposure area and the wafer, so that the wafer code is located in the wafer exposure area, preventing the wafer code from being blocked and unable to be recognized. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic structural diagram of Example 1 of the present utility model;

[0029] Figure 2 This is a structural diagram of the fixing unit and wafer support plate of the utility model;

[0030] Figure 3 This is a schematic diagram of the contact between the fixing unit and the wafer of the present invention;

[0031] Figure 4 This is a schematic diagram of the contact between the wafer support plate and the wafer of the present invention.

[0032] Among them, the figure markings of each figure are as follows: 1. fixing unit; 2. wafer supporting plate; 3. code scanning unit; 4. horizontal driving unit; 5. lifting device; 6. wafer; 11. rotating unit; 12. lifting unit; 13. wafer fixing plate; 14. wafer supporting part; 21. wafer exposed area; 22. wafer shielding area; 23. wafer support; 24. support rod; 31. base; 32. upper code reader; 33. lower code reader; 131. through hole. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] Example 1

[0035] See also Figures 1 to 4 , a wafer scanning support device, comprising a fixing unit 1 and a wafer support plate 2;

[0036] The wafer support plate 2 is provided with a plurality of wafer supports 23 arranged in a circumferential array. The wafer supports 23 are used to support the edges of the wafer 6 so that the middle of the wafer is suspended in the air.

[0037] The bottom of the wafer support plate 2 is provided with a wafer exposure area 21 and a wafer shielding area 22;

[0038] At least three wafer supporting parts 14 are provided on the fixing unit 1 , and gaps are provided between adjacent wafer supporting parts 14 for the wafer supporting plate 2 to pass through.

[0039] In actual application, the wafer 6 is moved by the external manipulator and placed on the fixed unit 1. At this time, the wafer support plate 2 is located below the fixed unit 1. After the fixed unit 1 is driven by the horizontal drive unit 4 to move close to the code scanning unit 3, the lifting unit 12 lifts the wafer support plate 2 upward from its original state until the wafer 6 is lifted from the fixed unit 1 and enters the code scanning area of ​​the code scanning unit 3. Then the rotating unit 11 drives the wafer support plate 2 to rotate, thereby driving the wafer 6 to rotate. After one rotation, when the coding part or all of the wafer 6 is located in the wafer shielding area 22, the wafer 6 is 6 support plate is driven downward by a lifting unit 12, and the wafer 6 is placed on the wafer support part 14, and is driven to rotate a preset angle by a rotating unit 11 to change the relative position of the wafer exposure area 21 and the wafer 6, so that the code is located in the wafer exposure area 21. Specifically, when the scanning unit 3 completes the scanning, the external robot will take away the wafer 6, and then the wafer support plate 2 is reset, which completes the scanning of the wafer 6 once, and then continues to complete the scanning of the entire batch of wafers 6 in sequence. In this way, wafers 6 of various specifications and sizes can be scanned, thereby improving the scanning efficiency.

[0040] Preferably, the wafer support 23 is a wafer support 23 with a protrusion on the top, a support block with an inclined side, or a support table with a stepped top;

[0041] When the wafer support 23 is a wafer support 23 with a protrusion on the top, the wafer support 23 is used to support the edge area of ​​the bottom of the wafer 6, and the protrusion is used to press against the side of the wafer 6;

[0042] When the wafer support 23 is a support block, the inclined surface is the support surface of the wafer 6;

[0043] When the wafer support 23 is a support platform with a stepped top, the horizontal portion of the top of the support platform is used to support the bottom of the wafer 6 , and the vertical portion of the top of the support platform is used to press against the side of the wafer 6 .

[0044] Through the above design, the contact area between the wafer support 23 and the wafer 6 is reduced, and only the bottom edge of the wafer 6 is contacted, and multiple wafer support members 23 are used to press against the side of the wafer 6 to fix the wafer 6, so that during the lifting of the wafer support plate 2, the wafer 6 can stably follow the lifting of the wafer support plate 2. On the other hand, when the rotating unit 11 drives the wafer support plate 2 to rotate, the stability of the wafer 6 is also improved, so that only the bottom edge of the wafer 6 is contacted, which is beneficial to the subsequent polishing process. If the bottom of the wafer 6 is contacted, it is not conducive to the polishing of the wafer 6. In this embodiment, the wafer support 23 used is a support column. Among the support column, support block, and support table, the support block does not fix the wafer 6 as well as the support column does. The support table has a larger contact area with the wafer 6 than the support column, resulting in the subsequent polishing effect of the wafer 6 not being as good as the effect of supporting the wafer 6 with the support column.

[0045] More preferably, the wafer support plate 2 includes a plurality of support rods 24 arranged in a circular array, and one ends of the plurality of support rods 24 are connected to each other to form a Y-shaped structure, a cross-shaped structure or a star-shaped structure. In the projection on the horizontal plane, the wafer exposure area 21 is located between two adjacent support rods 24; the wafer shielding area 22 is the overlapping area between the support rods 24 and the wafer, and the wafer support members 23 are respectively located at the top of the free ends of the support rods 24.

[0046] In this embodiment, multiple support rods 24 can better fix the wafer 6. Specifically, the number of support rods 24 in this embodiment is 4, which are arranged at an angle of 90° to each other, that is, arranged in a circular array. The wafer support plate 2 arranged in this way will have an overlapping area with the lower surface of the wafer 6. This overlapping area is the wafer shielding area 22. When the code of the wafer 6 is located in the wafer shielding area 22, the scanning unit 3 cannot identify the code of the wafer 6. At this time, the wafer support plate 2 needs to be lowered, rotated and then lifted to place the wafer 6 code in the wafer exposure area 21, and then enter the scanning area of ​​the scanning unit 3 again to complete the scanning. The fewer the number of support rods 24, the larger the proportion of the wafer exposure area 21, which is conducive to scanning wafers 6 of different specifications and sizes. In particular, the number of support rods 24 can be adjusted, which is specifically manifested in that the wafer support plate 2 can be replaced manually.

[0047] More preferably, the fixing unit 1 includes a wafer fixing plate 13 , in which a through hole 131 is provided for the wafer supporting plate 2 to pass through, and the wafer supporting portion 14 is located in the through hole 131 .

[0048] In the above design, the through hole 131 can accommodate the wafer supporting plate 2 to pass through the wafer fixing plate 13, which is beneficial for the lifting unit 12 to drive the wafer supporting plate 2 to rise and fall. Specifically, it is beneficial for the wafer 6 to change its position between the wafer fixing plate 13 and the wafer supporting plate 2. Specifically, when the wafer supporting plate 2 rises from its original state, the wafer 6 changes from the position of the wafer fixing plate 13 to the position of the wafer supporting plate 2; when the wafer supporting plate 2 rotates one circle and still fails to recognize the wafer 6 code, the wafer supporting plate 2 descends and the wafer 6 moves from the wafer supporting plate 2 is changed to the position of the wafer fixing plate 13. On the other hand, the wafer 6 can be fixed on the wafer fixing plate 13 by the wafer supporting part 14, which is beneficial for the wafer 6 to not shift when changing its position, resulting in that when the wafer supporting plate 2 rotates to change the wafer exposure area 21, the relative position of the wafer 6 may not change, which may result in the wafer supporting plate 2 rotating and then lifting the wafer 6 to enter the scanning area and still unable to scan the code. Therefore, the wafer supporting part 14 can effectively avoid the occurrence of this problem.

[0049] More preferably, each wafer supporting portion 14 is provided with a wafer supporting member 23 .

[0050] Through the above design, the wafer fixing plate 13 where the wafer support part 14 is located can fix the wafer 6 in the same way as the wafer support plate 2, which can effectively prevent the wafer 6 from shifting when switching between the wafer fixing plate 13 and the wafer support plate 2, thereby causing the relative position of the wafer 6 to not change when adjusting the wafer exposure area 21, and is also beneficial to the polishing of the wafer 6 in the same way.

[0051] A wafer scanning system includes a scanning unit 3, a horizontal drive unit 4 and the above-mentioned wafer scanning support device, wherein the scanning unit 3 is used to scan the upper and lower surfaces of the wafer 6;

[0052] The lifting unit 12 is connected to the horizontal driving unit 4. The rotating unit 11 is located inside the lifting unit 12 and is used to drive the output end of the lifting unit 12 to rotate. The wafer supporting plate 2 is connected to the output end of the lifting unit 12.

[0053] When the rotating unit 11 drives the wafer 6 to rotate one circle in the code scanning unit 3 and the code scanning unit 3 does not read the code, the wafer supporting plate 2 is driven away from the code scanning unit 3 by the horizontal driving unit 4, and is driven downward by the lifting unit 12 to place the wafer 6 on the fixed unit 1; the rotating unit 11 drives the wafer supporting plate 2 to rotate a preset angle, and after changing the relative position of the wafer exposed area 21 and the wafer 6, the lifting unit 12 drives the wafer supporting plate 2 again to lift the wafer 6 and drive it into the code scanning unit 3 through the horizontal driving unit 4.

[0054] In actual operation, when there is a wafer 6 on the fixing unit 1, the horizontal driving unit 4 moves the fixing unit 1 close to the code scanning unit 3, and then the wafer supporting plate 2 is raised through the fixing unit 1 by the lifting unit 12, and the wafer 6 on the fixing unit 1 is lifted, and the wafer 6 is lifted into the code scanning area of ​​the code scanning unit 3, and the wafer supporting plate 2 is driven to rotate by the rotating unit 11 so that the code scanning unit 3 can scan the upper and lower surfaces of the wafer 6, thereby improving the code scanning efficiency. When the rotating unit 11 drives the wafer 6 to rotate one circle in the code scanning unit 3, and the code scanning unit 3 does not read the code, the wafer supporting plate 2 is driven away from the code scanning unit 3 by the horizontal driving unit 4, and is lifted by the lifting unit 12. The lifting unit 12 drives the wafer 6 downward and places it on the fixed unit 1; the rotating unit 11 drives the wafer supporting plate 2 to rotate a preset angle, and after changing the relative position of the wafer exposed area 21 and the wafer 6, the lifting unit 12 drives the wafer supporting plate 2 again to lift the wafer 6 and drives it into the scanning unit 3 through the horizontal driving unit 4 to scan the code again. After reading the code of wafer 6, the robot takes away wafer 6, and the wafer supporting plate 2 is reset to continue scanning the next wafer 6. In this way, it can be ensured that the wafer 6 is scanned without touching the bottom of the wafer 6, which will not affect the subsequent polishing of the wafer 6, and it can also ensure that the codes of all wafers 6 are read.

[0055] More preferably, the wafer scanning system further includes a lifting device 5 , and the horizontal driving unit 4 is connected to a power output end of the lifting device 5 .

[0056] Through the above design, the lifting device 5 can drive the horizontal driving unit 4 upward or downward, thereby driving the wafer fixing plate 13 and the wafer supporting plate 2 to move synchronously. The lifting device 5 can increase the range of movement of the wafer fixing plate 13 and the wafer supporting plate 2, which is conducive to adjustment according to the situation.

[0057] More preferably, the code scanning unit 3 includes a base 31, an upper code reader 32 and a lower code reader 33 connected to the base 31, the upper code reader 32 and the lower code reader 33 are arranged opposite to each other, and the code scanning area is between the upper code reader 32 and the lower code reader 33.

[0058] In this embodiment, the upper code reader 32 and the lower code reader 33 can scan the upper surface and the lower surface of the wafer 6 respectively. In particular, the upper code reader 32 and the lower code reader 33 are wide-angle scanners, and the area between the upper code reader 32 and the lower code reader 33 is a scanning area. When the wafer 6 rotates in the scanning area, the entire circumference of the wafer 6 can be scanned. Scanning in this way can improve the efficiency of scanning.

[0059] More preferably, both the upper code reader 32 and the lower code reader 33 are infrared optical code readers.

[0060] Since the surface of the wafer 6 is mirror reflective, reading the code with an infrared optical code reader can avoid interference from ambient light, which is conducive to scanning the code on both sides of the wafer 6.

[0061] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer scanning support device, characterized in that: It includes a fixing unit and a wafer supporting plate; The wafer supporting plate is provided with a plurality of wafer supporting members arranged in a circumferential array, and the wafer supporting members are used to support the edges of the wafer so that the middle of the wafer is suspended in the air; The bottom of the wafer supporting plate is provided with a wafer exposing area and a wafer shielding area; The fixing unit is provided with at least three wafer supporting parts; and a gap is provided between adjacent wafer supporting parts for the wafer supporting plate to pass through; When part or all of the wafer code is located in the wafer shielding area, the wafer support plate is driven downward by a lifting unit to place the wafer on the wafer support part, and is driven to rotate by a preset angle by a rotating unit to change the relative position of the wafer exposed area and the wafer so that the code is located in the wafer exposed area.

2. The wafer scanning support device according to claim 1, characterized in that: The wafer support is a support column with a protrusion on the top, a support block with an inclined side, or a support table with a stepped top; When the wafer support member is a support column with a protrusion on the top, the support column is used to support the edge area of ​​the bottom of the wafer, and the protrusion is used to press against the side of the wafer; When the wafer support member is the support block, the inclined surface is the support surface of the wafer; When the wafer support is a support platform with a stepped top, the horizontal portion of the top of the support platform is used to support the bottom of the wafer, and the vertical portion of the top of the support platform is used to press against the side of the wafer.

3. The wafer scanning support device according to claim 1, characterized in that: The wafer support plate includes a plurality of support rods arranged in a circular array, and one ends of the plurality of support rods are connected to each other to form a Y-shaped structure, a cross-shaped structure or a star-shaped structure. In the horizontal plane projection, the wafer exposure area is located between two adjacent support rods; the wafer shielding area is the overlapping area between the support rods and the wafer, and the wafer support members are respectively located on the top of the free ends of the support rods.

4. The wafer scanning support device according to claim 1, characterized in that: The fixing unit includes a wafer fixing plate. The wafer fixing plate is provided with a through hole for the wafer supporting plate to pass through. The wafer supporting portion is located in the through hole.

5. The wafer scanning support device according to claim 2, characterized in that: The wafer supporting parts are all provided with the wafer supporting components.

6. A wafer scanning system, characterized in that: It comprises a code scanning unit, a horizontal driving unit and a supporting device according to any one of claims 1 to 5, wherein the code scanning unit is used to scan the upper and lower surfaces of the wafer; The lifting unit is connected to the horizontal driving unit, the rotating unit is located in the lifting unit and is used to drive the output end of the lifting unit to rotate, and the wafer supporting plate is connected to the output end of the lifting unit; When the rotating unit drives the wafer to rotate one circle in the code scanning unit and the code scanning unit does not read the code, the wafer supporting plate is driven away from the code scanning unit by the horizontal driving unit, and is driven downward by the lifting unit to place the wafer on the fixed unit; the rotating unit drives the wafer supporting plate to rotate a preset angle, and after changing the relative position of the wafer exposed area and the wafer, the lifting unit drives the wafer supporting plate again to lift the wafer and drive it into the code scanning unit through the horizontal driving unit.

7. The wafer scanning system according to claim 6, characterized in that: The wafer scanning system further includes a lifting device, and the horizontal driving unit is connected to a power output end of the lifting device.

8. The wafer scanning system according to claim 6, characterized in that: The code scanning unit includes a base, an upper code reader and a lower code reader connected to the base, the upper code reader and the lower code reader are arranged opposite to each other, and a code scanning area is between the upper code reader and the lower code reader.

9. The wafer scanning system according to claim 8, characterized in that: The upper code reader and the lower code reader are both infrared optical code readers.

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