High-power heat dissipation packaging structure

Abstract

The utility model discloses a high-power heat dissipation packaging structure, and particularly relates to the technical field of semiconductors, the high-power heat dissipation packaging structure comprises a packaging assembly, the top surface of the packaging assembly is fixedly provided with a heat dissipation assembly, the bottom surface of the packaging assembly is bonded with a chip assembly, and the packaging assembly comprises a butt joint heat conduction plate. According to the high-power heat dissipation packaging structure, a square cavity can be formed through the packaging groove, the bottom face of the heat dissipation bottom plate and the top face of the semiconductor chip, and the cavity can be exactly filled by directly injecting quantitative wafer packaging glue into the cavity. The top surface of the semiconductor chip can be quickly coated with the wafer packaging adhesive, namely, the thickness of the wafer packaging adhesive on the top surface of the semiconductor chip can be controlled, a heat dissipation area at the top of the semiconductor chip can be fully paved with the wafer packaging adhesive, and meanwhile, the closed cavity can prevent the wafer packaging adhesive from flowing into the slot, so that the wafer packaging adhesive is prevented from flowing into the slot. Therefore, short circuit or virtual connection of circuit boards such as a semiconductor chip and a mainboard can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a high-power heat dissipation packaging structure. Background Art

[0002] In response to the strong demand from the domestic semiconductor industry, in addition to substrate materials, the urgency of packaging materials has also increased rapidly. As the functionality and power of chips increase, the heat generated by the chips themselves also increases, so the thermal conductivity requirements of packaging materials also increase.

[0003] The existing semiconductor chip packaging structure generally involves manually applying heat dissipation colloid to the surface of the semiconductor chip, which requires manual scraping. This is not only cumbersome and inefficient, but the surface of the semiconductor chip may also be easily scratched during the scraping process. At the same time, when the heat sink is pressed onto the semiconductor chip, if too much colloid is applied, the heat dissipation colloid may be squeezed out and flow into the slot, causing a short circuit or a false connection. Utility Model Content

[0004] The purpose of the present invention is to provide a high-power heat dissipation packaging structure to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions: a high-power heat dissipation packaging structure, comprising a packaging assembly, a heat dissipation assembly fixedly mounted on the top surface of the packaging assembly, a chip assembly bonded to the bottom surface of the packaging assembly, the packaging assembly comprising a docking heat conducting plate, a packaging groove formed in the middle of the top surface of the docking heat conducting plate, and a mounting groove formed in the middle of the bottom surface of the docking heat conducting plate;

[0006] The heat dissipation assembly includes a heat dissipation base plate, a plurality of heat dissipation fins are fixedly installed on the top surface of the heat dissipation base plate at equal distances from one side to the other side, and a packaging tube is fixedly embedded in the center of the top surface of the heat dissipation base plate;

[0007] The chip assembly includes a semiconductor chip, and the bottom surface of the semiconductor chip is provided with a pin surface;

[0008] The heat dissipation base plate is fixedly mounted on the top surface of the docking heat conducting plate, and the semiconductor chip is fixedly bonded in the mounting groove.

[0009] Preferably, the size of the packaging groove is smaller than that of the mounting groove, and the bottom of the packaging groove is connected to the top of the mounting groove.

[0010] Preferably, side plates are fixedly mounted on the bottom of both sides of the docking heat conducting plate, and threaded holes are provided at both outer corners of the top surfaces of the two side plates, and mounting bolts are threadedly inserted into the threaded holes.

[0011] Preferably, a water cooling tube is connected in series between a plurality of the heat dissipation fins, and the water cooling tube is bent in multiple sections.

[0012] Preferably, both ends of the water-cooling pipe are fixedly mounted with butt-jointed threaded heads.

[0013] Preferably, an inner sealing rod is inserted into the inner thread of the packaging tube, and the bottom end of the packaging tube is connected to the interior of the packaging groove.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] The high-power heat dissipation packaging structure can form a square cavity through the packaging groove, the bottom surface of the heat dissipation base plate and the top surface of the semiconductor chip. The cavity can be filled by directly injecting a certain amount of wafer packaging glue into the cavity, and then the wafer packaging glue can be quickly applied to the top surface of the semiconductor chip. That is, the thickness of the wafer packaging glue on the top surface of the semiconductor chip can be controlled, and it can also be spread over the heat dissipation area on the top of the semiconductor chip. At the same time, the closed cavity can also prevent the wafer packaging glue from flowing into the slot, thereby causing a short circuit or false connection between the semiconductor chip and the main board and other circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2 This is a bottom-up three-dimensional structural diagram of the present invention;

[0018] Figure 3 This is a schematic diagram of the expanded three-dimensional structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the cross-sectional three-dimensional structure of the packaging component and the heat dissipation component of the present invention.

[0020] In the figure: 1. Packaging assembly; 101. Docking heat conduction plate; 102. Packaging slot; 103. Mounting slot; 104. Side plate; 105. Mounting bolts; 2. Heat dissipation assembly; 201. Heat dissipation base plate; 202. Heat dissipation fins; 203. Water-cooling pipe; 204. Docking threaded head; 205. Packaging tube; 206. Inner sealing rod; 3. Chip assembly; 301. Semiconductor chip; 302. Pin surface. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] like Figure 1-4 As shown, the utility model provides a technical solution: comprising a packaging component 1, a heat dissipation component 2 is fixedly mounted on the top surface of the packaging component 1, a chip component 3 is bonded to the bottom surface of the packaging component 1, the packaging component 1 comprises a docking heat conducting plate 101, a packaging groove 102 is opened in the middle of the top surface of the docking heat conducting plate 101, a mounting groove 103 is opened in the middle of the bottom surface of the docking heat conducting plate 101, the packaging tube 205 is internally threaded to be inserted into the inner sealing rod 206, and the top of the rod body of the inner sealing rod 206 is connected to the packaging tube 20 5 is connected with the bottom end of the packaging tube 205 being connected with the interior of the packaging groove 102. The inner sealing rod 206 can be unscrewed from the top of the packaging tube 205, and then a needle tube filled with wafer encapsulation glue is inserted into the packaging tube 205. The needle head is moved to the top of the packaging groove 102, and then the piston handle of the needle tube is manually pressed to inject the wafer encapsulation glue into the packaging groove 102. After the injection is completed, the inner sealing rod 206 is screwed into the packaging tube 205 to complete the heat dissipation packaging of the semiconductor chip 301.

[0023] The heat dissipation assembly 2 includes a heat dissipation base plate 201, on the top surface of which a plurality of heat dissipation fins 202 are evenly and evenly fixed and installed from one side to the other. A packaging tube 205 is fixedly embedded in the center of the top surface of the heat dissipation base plate 201;

[0024] The chip assembly 3 includes a semiconductor chip 301, and a pin surface 302 is provided on the bottom surface of the semiconductor chip 301;

[0025] The heat dissipation base plate 201 is fixedly mounted on the top surface of the heat conducting plate 101 , and the semiconductor chip 301 is fixedly bonded in the mounting groove 103 .

[0026] In this embodiment, the size of the packaging groove 102 is smaller than the size of the mounting groove 103, and the bottom of the packaging groove 102 is connected to the top of the mounting groove 103, so that the contact area between the mounting groove 103 and the top surface of the semiconductor chip 301 is adapted to the heat dissipation area of ​​the semiconductor chip 301.

[0027] The bottom of both sides of the docking heat conducting plate 101 are fixedly mounted with side plates 104, and the two corners of the outer top surfaces of the two side plates 104 are provided with threaded holes, and mounting bolts 105 are threadedly inserted into the threaded holes, so that the packaging structure can be easily mounted on the corresponding circuit board.

[0028] A water cooling tube 203 is connected in series between several of the heat dissipation fins 202. The water cooling tube 203 is arranged in multiple sections of bending. Both ends of the water cooling tube 203 are fixedly installed with docking threaded heads 204. Heat can be better absorbed and conducted through the heat dissipation fins 202 and the water cooling tube 203, effectively improving the overall heat dissipation effect of the packaging structure.

[0029] During use, a colloid is applied to the edges around the top of the semiconductor chip 301. The colloid adopts ultra-high thermal conductivity wafer encapsulation glue, and is a silicone oil-free material with a thermal conductivity of 8W / mK. It is then bonded into the mounting groove 103. After bonding, the inner sealing rod 206 can be unscrewed from the top of the packaging tube 205, and then the needle tube filled with wafer encapsulation glue is inserted into the packaging tube 205. The needle head is moved to the top of the packaging groove 102, and then the piston handle of the needle tube is manually pressed to inject the wafer encapsulation glue into the packaging groove 102. After the injection is completed, the inner sealing rod 206 is threaded into the packaging tube 205 to complete the heat dissipation packaging of the semiconductor chip 301.

[0030] To sum up, the high-power heat dissipation packaging structure can form a square cavity through the packaging groove 102, the bottom surface of the heat dissipation base plate 201 and the top surface of the semiconductor chip 301. The cavity can be filled by directly injecting a certain amount of wafer packaging glue into the cavity, and then the wafer packaging glue can be quickly applied to the top surface of the semiconductor chip 301, that is, the thickness of the wafer packaging glue on the top surface of the semiconductor chip 301 can be controlled, and it can also be spread over the heat dissipation area on the top of the semiconductor chip 301. At the same time, the closed cavity can also prevent the wafer packaging glue from flowing into the slot, thereby causing a short circuit or false connection between the semiconductor chip 301 and circuit boards such as the main board.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-power heat dissipation packaging structure, characterized in that : comprising a packaging component (1), a heat dissipation component (2) being fixedly mounted on the top surface of the packaging component (1), a chip component (3) being bonded to the bottom surface of the packaging component (1), the packaging component (1) comprising a docking heat conducting plate (101), a packaging groove (102) being provided in the middle of the top surface of the docking heat conducting plate (101), and a mounting groove (103) being provided in the middle of the bottom surface of the docking heat conducting plate (101); The heat dissipation assembly (2) comprises a heat dissipation base plate (201), a plurality of heat dissipation fins (202) are fixedly mounted on the top surface of the heat dissipation base plate (201) at equal distances from one side to the other, and a packaging tube (205) is fixedly embedded in the center of the top surface of the heat dissipation base plate (201); The chip assembly (3) comprises a semiconductor chip (301), and a pin surface (302) is provided on the bottom surface of the semiconductor chip (301); The heat dissipation base plate (201) is fixedly mounted on the top surface of the docking heat conducting plate (101), and the semiconductor chip (301) is fixedly bonded in the mounting groove (103).

2. A high-power heat dissipation packaging structure according to claim 1, characterized in that: The size of the packaging groove (102) is smaller than the size of the installation groove (103), and the bottom of the packaging groove (102) is connected to the top of the installation groove (103).

3. The high-power heat dissipation packaging structure according to claim 1, characterized in that: Side plates (104) are fixedly mounted on the bottom of both sides of the docking heat conducting plate (101), and threaded holes are provided at both corners of the outer sides of the top surfaces of the two side plates (104), and mounting bolts (105) are threadedly inserted into the threaded holes.

4. The high-power heat dissipation packaging structure according to claim 1, characterized in that: A water cooling pipe (203) is connected in series between a plurality of the heat dissipation fins (202), and the water cooling pipe (203) is arranged in a multi-section bend.

5. The high-power heat dissipation packaging structure according to claim 4, characterized in that: Both ends of the water cooling pipe (203) are fixedly mounted with butt-jointed threaded heads (204).

6. The high-power heat dissipation packaging structure according to claim 1, characterized in that: The packaging tube (205) is internally threaded with an inner sealing rod (206), and the bottom end of the packaging tube (205) is connected to the interior of the packaging groove (102).

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