Driver and LED lamp

Abstract

The utility model belongs to the technical field of electric driving equipment, and particularly relates to a driver and an LED lamp. The driver comprises a metal shell which comprises a first shell and a second shell, the first shell forms an accommodating space, and the second shell covers the first shell; the driving circuit board is arranged in the accommodating space; the grounding support is made of metal materials and comprises a welding bottom wall, the driving circuit board is provided with a bonding pad corresponding to the grounding support, the welding bottom wall is welded to the bonding pad in a surface-mounted mode, when the second shell covers the first shell, the side wall of the second shell is electrically connected with the grounding support, and the metal shell is arranged in a grounding mode. By applying the technical scheme, the problem that the overall production efficiency of drivers produced and manufactured in related technologies is low is solved.

Description

Technical Field

[0001] The present application belongs to the technical field of electric drive equipment, and in particular relates to a driver and an LED lamp. Background Art

[0002] In the driver, the grounding bracket is used to transfer between the driver circuit board and the shell cover, thereby realizing the driver grounding setting. In the related art, the grounding bracket and the driver circuit board are assembled through the THT (Through-Hole Technology) welding process. First, the pins of the grounding bracket are inserted into the through-holes of the driver circuit board, and then the pins are firmly fixed to the substrate of the driver circuit board through wave soldering, and the grounding bracket and the driver circuit board are electrically connected. This method of assembling the grounding bracket generally requires at least two people to operate on the production line, one to insert the pins of the grounding bracket into the through-holes of the driver circuit board, and the other to perform wave soldering. This reduces the overall production efficiency of the driver. Utility Model Content

[0003] The purpose of this application is to provide a driver and an LED lamp, aiming to solve the problem of low overall production efficiency of drivers produced in related technologies.

[0004] To achieve the above-mentioned purpose, according to the first aspect of the present application, the technical solution adopted in the present application is: a driver, comprising:

[0005] The metal shell includes a first shell and a second shell, the first shell forms a receiving space, and the second shell covers the first shell;

[0006] A driving circuit board is arranged in the accommodation space;

[0007] The grounding bracket is made of metal material and includes a welding bottom wall. The driving circuit board is provided with a welding pad corresponding to the grounding bracket. The welding bottom wall is mounted and welded to the welding pad. When the second shell is covered with the first shell, the side wall of the second shell is electrically connected to the grounding bracket, and the metal shell is grounded.

[0008] In some embodiments of the present application, the grounding bracket also includes a first stand and a second stand, the first stand and the second stand are both connected to the welded bottom wall, the first stand and the second stand are opposite to each other and spaced apart, and when the second shell cover is closed on the first shell, the first stand and the second stand clamp the side wall of the second shell to electrically connect the second shell to the grounding bracket.

[0009] In some embodiments of the present application, the first stand is provided with at least one first tine, which extends toward the second stand, and when the second shell is covered on the first shell, the first tine abuts against the side wall of the second shell to electrically connect the second shell to the grounding bracket; and / or, the second stand is provided with at least one second tine, which extends toward the first stand, and when the second shell is covered on the first shell, the second tine abuts against the side wall of the second shell to electrically connect the second shell to the grounding bracket.

[0010] In some embodiments of the present application, the first stand is provided with a first tine, and the second stand is provided with a second tine. The first tine and the second tine extend toward each other. When the second shell is covered on the first shell, the first tine and the second tine clamp the side wall of the second shell to electrically connect the second shell to the grounding bracket.

[0011] In some embodiments of the present application, the first stand is provided with a plurality of first tines, which are arranged at intervals, the second stand is provided with a plurality of second tines, which are arranged at intervals, and the plurality of first tines and the plurality of second tines are arranged in one-to-one correspondence.

[0012] In some embodiments of the present application, a first arc-shaped recess is provided on a side of the first stand facing away from the second stand, and the first arc-shaped recess is provided at an end of the first stand close to the welded bottom wall; and / or a second arc-shaped recess is provided on a side of the second stand facing away from the first stand, and the second arc-shaped recess is provided at an end of the second stand close to the welded bottom wall.

[0013] In some embodiments of the present application, the grounding bracket is an integrally formed component.

[0014] In some embodiments of the present application, the soldering bottom wall is provided with a gap for accommodating excess solder paste.

[0015] In some embodiments of the present application, a first adsorption surface is provided at one end of the first stand away from the welding bottom wall, and the first adsorption surface is used to cooperate with the suction cup by adsorption; and / or a second adsorption surface is provided at one end of the second stand away from the welding bottom wall, and the second adsorption surface is used to cooperate with the suction cup by adsorption.

[0016] According to a second aspect of the present application, an LED lamp is provided. The LED lamp comprises:

[0017] LED light source; and

[0018] As with the aforementioned driver, the driver circuit board of the driver is electrically connected to the LED light source.

[0019] This application has at least the following beneficial effects:

[0020] The driver of the present application uses a grounding bracket of a new structural form to electrically connect the driver circuit board and the metal shell, and the metal shell is grounded, thereby realizing the grounding setting of the driver circuit board. Among them, the grounding bracket of the new structural form includes a welding bottom wall, and correspondingly, the driver circuit board is provided with a soldering pad, and the welding bottom wall is mounted and soldered to the soldering pad. That is, the grounding bracket based on the new structural form is provided with a welding bottom wall, and the driver circuit board is correspondingly provided with a soldering pad. When the grounding bracket is electrically connected to the driver circuit board, the SMD (Surface Mounted Devices) reflow soldering process is used between the welding bottom wall and the soldering pad. Compared with the related art of assembling the grounding bracket and the driver circuit board through the THT soldering process, the operating efficiency of mounting the grounding bracket on the soldering pad in the present application is higher than the operating efficiency of the plug-in pins, and the soldering efficiency of the reflow soldering process is also higher than the soldering efficiency of the wave soldering. Therefore, the application of the technical solution of the present application to produce and manufacture the driver can greatly improve the overall production efficiency of the driver. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 This is a schematic diagram of the assembly structure of the driver according to an embodiment of the present application;

[0023] Figure 2 for Figure 1 An exploded schematic diagram of the drive is shown;

[0024] Figure 3 for Figure 2 A magnified schematic diagram of point A in the middle;

[0025] Figure 4 This is a structural diagram of a ground bracket welded to a driver circuit board in a driver according to an embodiment of the present application;

[0026] Figure 5 for Figure 4 A magnified schematic diagram of point B in the middle;

[0027] Figure 6 This is a schematic diagram of the structure of the grounding bracket of the driver according to the embodiment of the present application. Figure 1 ;

[0028] Figure 7 This is a schematic diagram of the structure of the grounding bracket of the driver according to the embodiment of the present application. Figure 2 .

[0029] Among them, the reference numerals in the figures are:

[0030] 10. Metal shell; 11. First shell; 12. Second shell; 121. Side wall; 13. Accommodation space;

[0031] 20. Driver circuit board; 21. Solder pad;

[0032] 30. Grounding bracket; 31. Welding bottom wall; 311. Gap; 32. First stand; 321. First tine; 322. First arc-shaped recess; 323. First adsorption surface; 33. Second stand; 331. Second tine; 332. Second arc-shaped recess; 333. Second adsorption surface. DETAILED DESCRIPTION

[0033] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0034] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0035] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0036] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0037] like Figures 1 to 5As shown, an embodiment of the present application provides a driver, and the driver is applied to an LED lamp, and the driver drives the light source of the LED lamp to conduct light for illumination. The driver includes a metal shell 10, a driver circuit board 20 and a grounding bracket 30. The metal shell 10 includes a first shell 11 and a second shell 12. The first shell 11 forms a storage space 13, and the second shell 12 covers the first shell 11. The driver circuit board 20 is arranged in the storage space 13. The driver circuit board 20 is provided with a soldering pad 21 corresponding to the grounding bracket 30. In addition, the grounding bracket 30 is made of metal material and includes a welding bottom wall 31. The welding bottom wall 31 is mounted and soldered to the soldering pad 21. When the second shell 12 covers the first shell 11, the side wall 121 of the second shell 12 is electrically connected to the grounding bracket 30. Furthermore, the metal shell 10 is grounded. In this way, a grounding circuit is formed, that is, the driver circuit board 20 is grounded in turn through the grounding bracket 30 and the metal shell 10.

[0038] The driver of this application utilizes a new structural grounding bracket 30 to electrically connect the driver circuit board 20 to the metal housing 10. Furthermore, the metal housing 10 is grounded, thereby grounding the driver circuit board 20 to the metal housing 10. The new structural grounding bracket 30 includes a soldering bottom wall 31, and the driver circuit board 20 is provided with a corresponding soldering pad 21. The soldering bottom wall 31 is mounted and soldered to the soldering pad 21. Specifically, the new structural grounding bracket 30 is provided with the soldering bottom wall 31, and the driver circuit board 20 is provided with a corresponding soldering pad 21. When electrically connecting the grounding bracket 30 to the driver circuit board 20, an SMD reflow soldering process is employed between the soldering bottom wall 31 and the soldering pad 21. Compared to the related art method of assembling the grounding bracket 30 and the driver circuit board 20 using a THT soldering process, the present application's method of attaching the grounding bracket 30 to the soldering pad 21 is more efficient than the conventional method of inserting pins. Furthermore, the reflow soldering process is more efficient than wave soldering. Therefore, applying the technical solution of the present application to produce and manufacture drivers can greatly improve the overall production efficiency of the drivers.

[0039] like Figure 6 and Figure 7As shown, the grounding bracket 30 further includes a first stand 32 and a second stand 33. Both the first stand 32 and the second stand 33 are connected to the welding bottom wall 31, and both the first stand 32 and the second stand 33 are electrically connected to the welding bottom wall 31. In the grounding bracket 30, the first stand 32 and the second stand 33 are opposite and spaced apart. When the second shell 12 is covered on the first shell 11, the first stand 32 and the second stand 33 clamp the side wall 121 of the second shell 12 to electrically connect the second shell 12 to the grounding bracket 30. The first shell 11 and the second shell 12 can be fastened together by a snap connection or fixed together by a screw locking method. The first shell 11 and the second shell 12 cannot be opened and separated at will, that is, the side wall 121 of the second shell 12 and the grounding bracket 30 cannot be separated at will, thereby ensuring that the driver circuit board 20 can always maintain a grounded setting with the metal shell 10 through the grounding bracket 30. Furthermore, the side wall 121 of the second shell 12 is directly inserted between the first stand 32 and the second stand 33 and clamped by the two, which makes assembly simple and efficient.

[0040] Generally, the outer surface and the inner surface of the second shell 12 are sprayed with a protective paint, and the protective paint is insulating. In order to ensure good conduction between the grounding bracket 30 and the second shell 12, in some embodiments of the present application, such as Figure 6 and Figure 7 As shown, the first stand 32 has at least one first tine 321 extending toward the second stand 33. When the second shell 12 is placed over the first shell 11, the first tine 321 breaks through the protective paint on the corresponding surface of the second shell 12. The first tine 321 then abuts against the sidewall 121 of the second shell 12, thereby forming a good electrical connection between the second shell 12 and the grounding bracket 30.

[0041] Alternatively, in other embodiments of the present application, Figure 6 and Figure 7 As shown, the second stand 33 has at least one second tine 331 extending toward the first stand 32. When the second shell 12 is placed over the first shell 11, the second tine 331 breaks through the protective paint on the corresponding surface of the second shell 12. The second tine 331 then abuts against the sidewall 121 of the second shell 12, thereby forming a good electrical connection between the second shell 12 and the grounding bracket 30.

[0042] Alternatively, in some other embodiments of the present application, Figure 6 and Figure 7As shown, the first stand 32 is provided with a first tine 321, and the second stand 33 is provided with a second tine 331. The first tine 321 extends toward the second stand 33, and the second tine 331 extends toward the first stand 32. When the second shell 12 is placed on the first shell 11, the first tine 321 and the second tine 331 will jointly break the protective paint on the corresponding surfaces of the second shell 12. Then, the first tine 321 and the second tine 331 will simultaneously abut the side wall 121 of the second shell 12, thereby forming a good electrical connection between the second shell 12 and the grounding bracket 30.

[0043] Further, such as Figure 6 and Figure 7 As shown, the first tines 321 and the second tines 331 extend toward each other. When the second shell 12 is covered on the first shell 11, the first tines 321 and the second tines 331 simultaneously break the protective paint on the corresponding surfaces of the second shell 12 and clamp the side wall 121 of the second shell 12 together to form a good electrical connection between the second shell 12 and the grounding bracket 30.

[0044] Furthermore, the first stand 32 is provided with a plurality of first tines 321, which are spaced apart. The second stand 33 is provided with a plurality of second tines 331, which are spaced apart. Furthermore, the plurality of first tines 321 and the plurality of second tines 331 are arranged in a one-to-one correspondence. When the second shell 12 is placed over the first shell 11, the plurality of first tines 321 and the plurality of second tines 331 together break through the protective paint on the corresponding surfaces of the second shell 12. Subsequently, the plurality of first tines 321 and the plurality of second tines 331 simultaneously abut against the sidewall 121 of the second shell 12, thereby forming a good electrical connection between the second shell 12 and the grounding bracket 30.

[0045] When the second shell 12 covers the first shell 11 and the side wall 121 of the second shell 12 is inserted between the first stand 32 and the second stand 33, the side wall 121 of the second shell 12 exerts a force on the first stand 32 and the second stand 33, and this force is transmitted along the ground support 30 to the driver circuit board 20. When this force is transmitted through the soldering position between the solder bottom wall 31 and the solder pad 21, it may cause the soldering bottom wall 31 and the solder pad 21 to become desolderable, resulting in ground failure.

[0046] In order to reduce the probability of desoldering between the bottom wall 31 and the pad 21, in some embodiments of the present application, as shown in FIG. Figure 6 and Figure 7As shown, a first arc-shaped recess 322 is provided on the side of the first stand 32 facing away from the second stand 33. The first arc-shaped recess 322 is provided at one end of the first stand 32 near the welding bottom wall 31. Thus, when the force exerted by the side wall 121 of the second shell 12 on the first stand 32 and the second stand 33 is transmitted along the grounding bracket 30, due to the first arc-shaped recess 322 provided on the first stand 32, stress deformation occurs in the first arc-shaped recess 322 under the action of the force. This can reduce to a certain extent the magnitude of the force that continues to be transmitted to the driver circuit board 20, thereby reducing the probability of desoldering between the welding bottom wall 31 and the welding pad 21, protecting the effective electrical connection between the welding bottom wall 31 and the welding pad 21, and ensuring effective grounding.

[0047] Alternatively, in other embodiments of the present application, Figure 6 and Figure 7 As shown, a second arc-shaped recess 332 is provided on the side of the second stand 33 facing away from the first stand 32. The second arc-shaped recess 332 is provided at one end of the second stand 33 near the welding bottom wall 31. Thus, when the force exerted by the side wall 121 of the second shell 12 on the first stand 32 and the second stand 33 is transmitted along the grounding bracket 30, the second stand 33 will generate stress deformation at the second arc-shaped recess 332 under the action of this force. This can reduce to a certain extent the magnitude of this force that continues to be transmitted to the driver circuit board 20, thereby reducing the probability of desoldering between the welding bottom wall 31 and the welding pad 21, protecting the effective electrical connection between the welding bottom wall 31 and the welding pad 21, and ensuring effective grounding.

[0048] Alternatively, in some other embodiments of the present application, a first arc-shaped recess 322 is provided on the side of the first stand 32 facing away from the second stand 33, and the first arc-shaped recess 322 is provided at an end of the first stand 32 close to the welding bottom wall 31; and a second arc-shaped recess 332 is provided on the side of the second stand 33 facing away from the first stand 32, and the second arc-shaped recess 332 is provided at an end of the second stand 33 close to the welding bottom wall 31. In this way, in the process of the side wall 121 of the second shell 12 transmitting the force of the first stand 32 and the second stand 33 along the grounding stand 30, since the first stand 32 is provided with a first arc-shaped recess 322, and the second stand 33 is provided with a second arc-shaped recess 332, the first stand 32 will generate stress deformation at the first arc-shaped recess 322 under the action of the force, and the second stand 33 will generate stress deformation at the second arc-shaped recess 332 under the action of the force, which can greatly reduce the size of the force continued to be transmitted to the driving circuit board 20, thereby effectively reducing the probability of desoldering between the welding bottom wall 31 and the welding pad 21, protecting the effective electrical connection between the welding bottom wall 31 and the welding pad 21, and ensuring effective grounding.

[0049] In the embodiment of the present application, the grounding bracket 30 is an integrally formed component. Preferably, the grounding bracket 30 is manufactured by integrally forming a metal blank using a punching process, which has high processing efficiency and good forming consistency of the grounding bracket 30.

[0050] like Figure 6 and Figure 7 As shown, the welding bottom wall 31 is provided with a gap 311 for accommodating excess solder paste. When welding the welding bottom wall 31 to the pad 21, the molten solder paste on the pad 21 is squeezed by the welding bottom wall 31, causing the excess solder paste to flow into the gap 311. This prevents the excess solder paste from overflowing around the pad 21 and contacting the solder joints of other electronic components on the driver circuit board 20, causing a short circuit.

[0051] In order to further improve the overall production efficiency of the drive and reduce labor costs, such as Figure 6 and Figure 7 As shown, the first stand 32 is provided with a first adsorption surface 323 at one end away from the welding bottom wall 31, and the first adsorption surface 323 is used to be adsorbed and matched with the suction cup. And / or, in order to further improve the overall production efficiency of the driver and reduce labor costs, as shown Figure 6 and Figure 7 As shown, a second adsorption surface 333 is provided at one end of the second stand 33 away from the welding bottom wall 31 , and the second adsorption surface 333 is used for adsorption cooperation with the suction cup.

[0052] In the driver provided in the embodiments of the present application, preferably, a first suction surface 323 is provided at one end of the first stand 32 away from the welding bottom wall 31, and a second suction surface 333 is provided at one end of the second stand 33 away from the welding bottom wall 31. This allows the suction cup to simultaneously absorb both the first suction surface 323 and the second suction surface 333, and then the grounding bracket 30 is moved. Mechanical equipment replaces manual labor to automatically move the grounding bracket 30, align the welding bottom wall 31, and place it on the pad 21 for welding. This automated process of moving the grounding bracket 30 using mechanical equipment greatly improves the overall production efficiency of the driver and significantly reduces labor costs.

[0053] According to another aspect of the present application, an LED lamp is provided, wherein the LED lamp includes an LED light source and the aforementioned driver, wherein a driver circuit board 20 of the driver is electrically connected to the LED light source, and the driver drives the LED light source to conduct light and illuminate.

[0054] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A driver comprising: A metal shell (10) comprises a first shell (11) and a second shell (12), wherein the first shell (11) forms a receiving space (13), and the second shell (12) covers the first shell (11); A driving circuit board (20) is disposed in the accommodating space (13); Characterized in that the driver further comprises: A grounding bracket (30) made of metal material comprises a welding bottom wall (31); the driving circuit board (20) is provided with a welding pad (21) corresponding to the grounding bracket (30); the welding bottom wall (31) is mounted and welded to the welding pad (21); when the second shell (12) covers the first shell (11), the side wall (121) of the second shell (12) is electrically connected to the grounding bracket (30), and the metal shell (10) is grounded.

2. The driver according to claim 1, wherein: The grounding bracket (30) further includes a first stand (32) and a second stand (33), wherein the first stand (32) and the second stand (33) are both connected to the welded bottom wall (31), and the first stand (32) and the second stand (33) are opposite to and spaced apart from each other. When the second shell (12) is covered on the first shell (11), the first stand (32) and the second stand (33) clamp the side wall (121) of the second shell (12) so that the second shell (12) is electrically connected to the grounding bracket (30).

3. The driver according to claim 2, characterized in that The first stand (32) is provided with at least one first tine (321), the first tine (321) extending toward the second stand (33), and when the second shell (12) covers the first shell (11), the first tine (321) abuts against the side wall (121) of the second shell (12), so that the second shell (12) is electrically connected to the grounding bracket (30); And / or, the second stand (33) is provided with at least one second tine (331), the second tine (331) extends toward the first stand (32), and when the second shell (12) covers the first shell (11), the second tine (331) abuts against the side wall (121) of the second shell (12) to electrically connect the second shell (12) to the grounding bracket (30).

4. The driver according to claim 2, characterized in that The first stand (32) is provided with a first tine (321), and the second stand (33) is provided with a second tine (331). The first tine (321) and the second tine (331) are arranged to extend toward each other. When the second shell (12) is covered on the first shell (11), the first tine (321) and the second tine (331) clamp the side wall (121) of the second shell (12) so that the second shell (12) is electrically connected to the grounding bracket (30).

5. The driver according to claim 4, characterized in that The first stand (32) is provided with a plurality of first tines (321), and the plurality of first tines (321) are arranged at intervals; the second stand (33) is provided with a plurality of second tines (331), and the plurality of second tines (331) are arranged at intervals; the plurality of first tines (321) and the plurality of second tines (331) are arranged in a one-to-one correspondence.

6. The driver according to any one of claims 2 to 5, characterized in that: A first arc-shaped notch (322) is provided on a side of the first stand (32) facing away from the second stand (33), and the first arc-shaped notch (322) is provided at an end of the first stand (32) close to the welding bottom wall (31); And / or, a second arc-shaped notch (332) is provided on a side of the second stand (33) facing away from the first stand (32), and the second arc-shaped notch (332) is provided at an end of the second stand (33) close to the welding bottom wall (31).

7. The driver according to any one of claims 2 to 5, characterized in that: The grounding bracket (30) is an integrally formed component.

8. The driver according to claim 7, characterized in that The welding bottom wall (31) is provided with a gap (311) for accommodating excess solder paste.

9. The driver according to claim 7, characterized in that A first adsorption surface (323) is provided at one end of the first stand (32) away from the welding bottom wall (31), and the first adsorption surface (323) is used for adsorption cooperation with the suction cup; And / or, the second stand (33) is provided with a second adsorption surface (333) at one end away from the welding bottom wall (31), and the second adsorption surface (333) is used for adsorption cooperation with the suction cup.

10. An LED lamp, characterized in that: include: LED light source; as well as, The driver according to any one of claims 1 to 9, wherein a driving circuit board (20) of the driver is electrically connected to the LED light source.

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