Heat dissipation module, mainboard and electronic product

Abstract

The utility model relates to the technical field of electronic product heat dissipation, in particular to a heat dissipation module, a mainboard and an electronic product, the heat dissipation module comprises a heat pipe, a fan and a fin assembly, and the fin assembly comprises an upper cover plate, a lower cover plate, a fin body and a foam metal filler; a plurality of fin bodies are arranged between the upper cover plate and the lower cover plate, the fin bodies are perpendicular to the upper cover plate and the lower cover plate, and the fin bodies are arranged in parallel at intervals. A plurality of independent heat dissipation channels are defined by the upper cover plate, the lower cover plate and the fin body, and foam metal filler is arranged in the heat dissipation channels. According to the technical scheme, the interior of the foam metal filler is of a porous structure, when air flows through the foam metal filler, the flowing instability is increased, the flow speed change of airflow is large, when the Reynolds number exceeds a certain threshold value, the flow speed of the air is changed from laminar flow to turbulent flow, and therefore the heat exchange coefficient is increased, and the purpose of improving the heat exchange efficiency is achieved; and the porous material has a sound-absorbing effect, so that the noise of the fan can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation module, a mainboard and an electronic product. Background Art

[0002] With the development of notebook computer industry technology, the heat flux density of chips is getting higher and higher, and the heat dissipation capacity of the heat dissipation module is becoming more and more important. Especially for high-power processing chips, the accumulation of heat in the chip will reduce the operating performance of the entire machine and reduce its stability. In order to maintain the high performance of the whole machine, the volume of the heat dissipation module will also increase with the increase of chip power consumption. However, within the limited design space of the notebook computer, how to improve the heat dissipation efficiency without increasing the volume of the heat dissipation module has always been the optimization direction pursued by the notebook computer thermal design. Moreover, as the power consumption of the notebook computer increases, in order to improve the heat dissipation capacity, the fan noise level of the heat dissipation module is also getting higher and higher. How to reduce the fan noise level without adding additional sound absorption and noise reduction modules is also a research direction.

[0003] A laptop's cooling module primarily consists of heat pipes, a fan, and cooling fins. Heat from the chip is transferred to the fins via the heat pipes, and the fan dissipates the heat. Existing air-cooled laptop cooling modules have high thermal resistance at the fins in the heat dissipation path. Increasing the heat dissipation of the module requires increasing the fin's heat dissipation area, height, or density.

[0004] However, due to the limited space in the laptop computer, the height of the fins is restricted by the structural design of the laptop computer and cannot be increased at will. The increase in fin density has certain limitations on the improvement of the heat exchange efficiency of the heat dissipation module. The heat exchange efficiency does not always increase with the increase in fin density. When the fin density is too large, it will lead to increased wind resistance, thereby reducing the heat exchange efficiency, reducing the heat dissipation of the heat dissipation module, and also resulting in waste of costs. Utility Model Content

[0005] In order to solve at least the above technical problems existing in the prior art, the utility model provides a heat dissipation module, a mainboard and an electronic product.

[0006] On the one hand, the utility model provides a heat dissipation module, including a heat pipe, a fan and a fin assembly, wherein the fin assembly includes an upper cover plate, a lower cover plate, a fin body and a foam metal filler; a plurality of fin bodies are arranged between the upper cover plate and the lower cover plate, the fin bodies are perpendicular to the upper cover plate and the lower cover plate, and the plurality of fin bodies are parallel and spaced apart; the upper cover plate, the lower cover plate and the fin bodies enclose a plurality of independent heat dissipation channels, and the foam metal filler is arranged in the heat dissipation channels.

[0007] In some embodiments, one end of the heat pipe is used to connect to the heating element, and the other end is overlapped with the upper cover plate, and the heat pipe transfers the heat of the heating element to the fin assembly; along the length direction of the upper cover plate and the lower cover plate, the porosity of the foam metal filler in the multiple heat dissipation channels gradually decreases.

[0008] In some embodiments, the foam metal filler includes a first porosity filler, a second porosity filler, and a third porosity filler, the porosity of the first porosity filler is greater than the porosity of the second porosity filler, and the porosity of the second porosity filler is greater than the porosity of the third porosity filler; along the length direction of the upper cover plate and the lower cover plate, the multiple heat dissipation channels are divided into three groups, and the three groups of heat dissipation channels are filled with the first porosity filler, the second porosity filler, and the third porosity filler in sequence.

[0009] In some embodiments, the foam metal filler is located in the heat dissipation channel and is bonded or welded to the upper cover plate, the lower cover plate and the fin body.

[0010] In some embodiments, the porosity of the metal foam filler ranges from 90% to 97%, and the pore density of the metal foam filler ranges from 5 PPi to 100 PPi.

[0011] In some embodiments, the porosity of the first porosity filler is 90% to 93%, the porosity of the second porosity filler is 93% to 95%, and the porosity of the third porosity filler is 95% to 97%.

[0012] In some embodiments, the spacing between adjacent fin bodies ranges from 1 mm to 20 mm, and the height of the fin body is less than 10 mm; the foam metal filler fills the heat dissipation channel.

[0013] In some embodiments, the foam metal filler includes one or more of foam copper filler, foam aluminum filler, foam alloy filler, foam iron filler, foam stainless steel filler, or foam nickel filler.

[0014] On the other hand, the present invention further provides a mainboard, comprising the above-mentioned heat dissipation module.

[0015] In another aspect, the present invention further provides an electronic product, comprising the above-mentioned heat dissipation module or the above-mentioned mainboard.

[0016] The utility model provides a heat dissipation module, a mainboard and an electronic product. In the heat dissipation module, a foam metal filler is filled in the heat dissipation channel formed by the fin body, the heat absorbed by the heat pipe is transferred to the fin assembly, and the fan is started to take away the heat of the fin assembly. The fin assembly has a higher specific surface area by filling the foam metal filler, which can effectively increase the heat exchange area. Moreover, since the interior of the foam metal filler is a porous structure, when air flows through it, the instability of the flow increases, resulting in a large change in the flow rate of the airflow. When the Reynolds number exceeds a certain threshold, the air flow rate changes from laminar flow to turbulent flow, thereby increasing the heat transfer coefficient, thereby achieving the purpose of improving the heat exchange efficiency. In addition, the porous material has a sound-absorbing effect, which can reduce the fan noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, in which:

[0018] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0019] Figure 1 A schematic structural diagram of a heat dissipation module provided in an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of the fin assembly in the heat dissipation module provided in an embodiment of the present utility model.

[0021] In the picture:

[0022] 10: heat pipe; 20: fan; 30: fin assembly;

[0023] 31: upper cover plate; 32: lower cover plate; 33: fin body; 34: foam metal filler; 341: first porosity filler; 342: second porosity filler; 343: third porosity filler. DETAILED DESCRIPTION

[0024] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0025] An embodiment of the present utility model provides a heat dissipation module, including a heat pipe, a fan and a fin assembly. The heat pipe contacts the heating element for heat exchange and is used to transfer heat to the fin assembly. The fin assembly is used to dissipate heat. During heat dissipation, the fan is used to generate airflow at the fin assembly, and the airflow is used to assist the fin assembly in heat dissipation.

[0026] The following describes in detail the various structures of the heat dissipation module provided by the embodiment of the present invention, as well as the positional relationship and connection relationship of the various structures, in conjunction with the accompanying drawings.

[0027] like Figure 1 and Figure 2 As shown, in the embodiment of the present invention, the heat pipe 10 and the fan 20 are the same or similar to the traditional structure. Heat is transferred to the fin assembly 30 through the heat pipe 10. The fan 20 is located at one end of the fin assembly 30. When the fan 20 is started, a heat dissipation airflow can be formed on the fin assembly 30.

[0028] In an embodiment of the present invention, the fin assembly 30 includes an upper cover plate 31, a lower cover plate 32, a fin body 33 and a foam metal filler 34; a plurality of fin bodies 33 are arranged between the upper cover plate 31 and the lower cover plate 32, the fin bodies 33 are perpendicular to the upper cover plate 31 and the lower cover plate 32, and the plurality of fin bodies 33 are parallel and spaced apart; the upper cover plate 31, the lower cover plate 32 and the fin body 33 form a plurality of independent heat dissipation channels, the fin body 33 has a certain expansion area, which can be used for heat dissipation, and the heat dissipation channel cooperates with the fan 20 to form an airflow in the heat dissipation channel, and the flow of airflow can improve the heat dissipation efficiency of the fin assembly 30.

[0029] In addition, in an embodiment of the present invention, the heat dissipation channel is also filled with a foam metal filler 34. Compared with a pure fin heat sink (not filled with the foam metal filler 34), the larger specific surface area and complex three-dimensional through-hole structure of the foam metal filler 34 can effectively enhance the airflow disturbance of the cooling air, thereby increasing the heat dissipation area to improve the heat exchange efficiency.

[0030] The structural form of the combination of the fin body 33 and the foam metal filler 34 has a high comprehensive thermal conductivity and better temperature uniformity compared to pure foam metal filler 34 as a radiator, which can achieve better heat dissipation effect and more uniform temperature distribution.

[0031] In this embodiment, one end of the heat pipe 10 is connected to the heating element, and the other end is superimposed on the upper cover plate 31. The heat pipe 10 transfers heat from the heating element to the fin assembly 30. Based on the heat source's heating power, operating temperature, and the structural parameters (density, porosity, etc.) of the metal foam filler 34, the working medium dosage, liquid filling ratio, and fan 20 air volume are calculated, and the arrangement and structural parameters of the fin body 33 are determined. The heat pipe 10 can be manufactured using a hot mold continuous casting and welding process, which can reduce weight by approximately one-third while ensuring effective heat dissipation.

[0032] The porosity of the foam metal filler 34 in the plurality of heat dissipation channels gradually decreases along the length of the upper cover plate 31 and the lower cover plate 32. For example, the porosity of the foam metal filler 34 ranges from 90% to 97%, and the pore density of the foam metal filler 34 ranges from 5 PPi to 100 PPi.

[0033] In different wind speed and flow rate areas, the foam metal fillers 34 embedded in the heat dissipation channels are foam metal fillers 34 with different porosities. The foam metal fillers 34 enhance the cooling air disturbance and further improve the heat exchange efficiency.

[0034] Continue to refer Figure 2 As shown, for example, the foam metal filler 34 includes a first porosity filler 341, a second porosity filler 342 and a third porosity filler 343, the porosity of the first porosity filler 341 is greater than the porosity of the second porosity filler 342, and the porosity of the second porosity filler 342 is greater than the porosity of the third porosity filler 343; along the length direction of the upper cover plate 31 and the lower cover plate 32, the multiple heat dissipation channels are divided into three groups, and the three groups of heat dissipation channels are filled with the first porosity filler 341, the second porosity filler 342 and the third porosity filler 343 in sequence.

[0035] Each group of heat dissipation channels has the same shape and size, differing only in the porosity of the metal foam filler 34 within them. As the porosity of the metal foam filler 34 increases, different wind speed zones—low, medium, and high—are formed within the heat dissipation channels. The metal foam filler 34 enhances the turbulence of the cooling air in these different wind speed zones, thereby improving heat exchange efficiency.

[0036] For example, the porosity of the first porosity filler 341 is 90% to 93%, the porosity of the second porosity filler 342 is 93% to 95%, and the porosity of the third porosity filler 343 is 95% to 97%. In addition, the pore densities of the first porosity filler 341, the second porosity filler 342, and the third porosity filler 343 can be the same or different.

[0037] For example, as shown in the figure, the fin assembly 30 is divided into 20 heat dissipation channels by the fin body 33, wherein 7 heat dissipation channels are provided with a first porosity filler 341, 6 heat dissipation channels are provided with a second porosity filler 342 and 7 heat dissipation channels are provided with a third porosity filler 343.

[0038] In the embodiment of the present invention, the foam metal filler 34 is located in the heat dissipation channel and is bonded or welded to the upper cover plate 31 , the lower cover plate 32 and the fin body 33 , thereby achieving a fixed connection between the foam metal filler 34 and the heat dissipation channel.

[0039] For example, the metal foam filler 34 may include one or more of copper foam, aluminum foam, alloy foam, iron foam, stainless steel foam, or nickel foam. For example, the metal foam filler 34 may be machined into a desired shape through a machining process such as wire cutting or milling. For example, the metal foam filler 34 may be slightly larger in shape and size than the heat dissipation channel, ensuring that the metal foam filler 34 completely fills the heat dissipation channel when filled therein.

[0040] Continue to refer Figure 2 As shown, in this embodiment of the present invention, the metal foam filler 34 completely fills the heat dissipation channel. For example, the spacing between adjacent fin bodies 33 ranges from 1 mm to 20 mm, and the height of the fin bodies 33 is less than 10 mm. When the fan 20 drives the airflow, the entire airflow flows through the metal foam filler 34, thereby improving heat dissipation efficiency.

[0041] The present invention also provides a motherboard including the aforementioned heat dissipation module. Furthermore, the present invention also provides an electronic product including the aforementioned heat dissipation module or the aforementioned motherboard. Heat is exchanged between the heat pipe 10 of the heat dissipation module and a heating element on the motherboard, such as by connecting the heat pipe 10 to a chip on the motherboard, and the heat pipe 10 and the chip are in close contact for heat exchange, thereby achieving heat dissipation.

[0042] The heat dissipation module, motherboard and electronic product provided by the present invention, compared with the traditional heat dissipation module, add the foam metal filler 34, which can effectively enhance the airflow disturbance of the cooling air, increase the heat dissipation area, and thus improve the heat exchange efficiency; after adding the foam metal filler 34, the heat storage energy of the heat dissipation module can also be increased; so that under the condition of the same fin appearance size, the heat exchange amount is greater; and the addition of the foam metal filler 34 has a sound-absorbing effect, which can reduce the noise value of the fan 20 to a certain extent.

[0043] The sound absorption principle is as follows: the numerous irregular holes and protrusions on its surface scatter sound waves, dispersing them in different directions and reducing reflection. The holes and pore walls within the metal foam cause multiple reflections and refractions of the sound waves, causing them to propagate and dissipate multiple times within the material. Furthermore, as sound waves pass through the metal foam, they rub against the pore walls and air molecules within the material. These energy conversion methods convert the sound wave energy into weak heat, which is then dissipated to the outside world by fan 20, thereby reducing noise and improving the acoustic environment, enhancing the user experience.

[0044] In the description of this specification, reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and integrate different embodiments or examples described in this specification, as well as features of different embodiments or examples, unless they are mutually inconsistent.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0046] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A heat dissipation module, comprising a heat pipe (10), a fan (20) and a fin assembly (30), characterized in that: The fin assembly (30) comprises an upper cover plate (31), a lower cover plate (32), a fin body (33) and a foam metal filler (34); A plurality of fin bodies (33) are arranged between the upper cover plate (31) and the lower cover plate (32), the fin bodies (33) are perpendicular to the upper cover plate (31) and the lower cover plate (32), and the plurality of fin bodies (33) are arranged in parallel and at intervals; The upper cover plate (31), the lower cover plate (32) and the fin body (33) form a plurality of independent heat dissipation channels, and the foam metal filler (34) is arranged in the heat dissipation channels.

2. The heat dissipation module according to claim 1, characterized in that: One end of the heat pipe (10) is used to be connected to a heating element, and the other end is superimposed on the upper cover plate (31), and the heat pipe (10) transfers heat from the heating element to the fin assembly (30); Along the length direction of the upper cover plate (31) and the lower cover plate (32), the porosity of the foam metal fillers (34) in the plurality of heat dissipation channels gradually decreases.

3. The heat dissipation module according to claim 2, characterized in that: The foam metal filler (34) includes a first porosity filler (341), a second porosity filler (342), and a third porosity filler (343); the porosity of the first porosity filler (341) is greater than the porosity of the second porosity filler (342); and the porosity of the second porosity filler (342) is greater than the porosity of the third porosity filler (343); Along the length direction of the upper cover plate (31) and the lower cover plate (32), the plurality of heat dissipation channels are divided into three groups, and the three groups of heat dissipation channels are sequentially filled with the first porosity filler (341), the second porosity filler (342), and the third porosity filler (343).

4. The heat dissipation module according to claim 1, wherein: The foam metal filler (34) is located in the heat dissipation channel and is bonded or welded to the upper cover plate (31), the lower cover plate (32) and the fin body (33).

5. The heat dissipation module according to claim 2, characterized in that: The porosity of the foam metal filler (34) ranges from 90% to 97%, and the pore density of the foam metal filler (34) ranges from 5PPi to 100PPi.

6. The heat dissipation module according to claim 3, characterized in that: The porosity of the first porosity filler (341) is 90% to 93%, the porosity of the second porosity filler (342) is 93% to 95%, and the porosity of the third porosity filler (343) is 95% to 97%.

7. The heat dissipation module according to claim 1, characterized in that: The spacing between adjacent fin bodies (33) ranges from 1 mm to 20 mm, and the height of the fin bodies (33) is less than 10 mm; The foam metal filler (34) fills the heat dissipation channel.

8. The heat dissipation module according to claim 1, characterized in that: The foam metal filler (34) includes one or more of foam copper filler, foam aluminum filler, foam alloy filler, foam iron filler, foam stainless steel filler or foam nickel filler.

9. A motherboard, characterized in that: The heat dissipation module comprises the heat dissipation module according to any one of claims 1 to 8.

10. An electronic product, characterized in that: It comprises the heat dissipation module according to any one of claims 1 to 8 or the mainboard according to claim 9.

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