Radiator

Abstract

The utility model relates to the technical field of radiators, in particular to a radiator. Comprising a shell and a heat dissipation module, one side face of the shell is provided with a protective net cover, the protective net cover comprises a connecting plate and a plurality of supporting ribs, the supporting ribs are arranged on the outer ring of the connecting plate, the protective net cover is connected with the shell through the supporting ribs, a first ventilation opening is formed between every two adjacent supporting ribs, and a first through hole is formed in the connecting plate; the heat dissipation module comprises a heat dissipation fan, a heat dissipation piece and a lifting assembly, the heat dissipation fan is arranged in the shell and corresponds to the first ventilation opening, the lifting assembly is slidably connected with the connecting plate through the first through hole, a semiconductor chilling plate corresponding to the electronic equipment is arranged on the lifting assembly, and the heat dissipation piece is connected with the lifting assembly. The heat dissipation piece is located between the heat dissipation fan and the lifting assembly and attached to the semiconductor chilling plate. The problems that in the prior art, the heat dissipation efficiency is low and the heat dissipation effect is poor due to the fact that the attaching degree of a radiator and electronic equipment is low are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a radiator. Background Art

[0002] With the development of electronic devices, the functions of electronic devices have become popular in all aspects of people's lives. Therefore, during the use of electronic devices, electronic devices will inevitably generate heat due to the long-term operation of internal heating components.

[0003] To address the heating issues of electronic devices, a wide range of heat sinks have emerged on the market. These heat sinks attach to the heating surface of the electronic device and dissipate heat through a built-in cooling fan or semiconductor cooler.

[0004] However, the existing radiator can only dissipate heat from the electronic device through the surface of the radiator that is in contact with the electronic device. However, the existing radiator has a poor fit with the heat dissipation surface of the electronic device, resulting in low heat dissipation efficiency and poor heat dissipation and cooling effect. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present utility model is to provide a radiator to solve the problem in the prior art that the radiator is not well fitted to the electronic device, resulting in low heat dissipation efficiency and poor heat dissipation effect.

[0006] The utility model discloses a radiator, comprising: a shell and a heat dissipation module, a protective mesh cover is provided on one side of the shell, the protective mesh cover comprises a connecting plate and a plurality of supporting ribs, the supporting ribs are provided on the outer ring of the connecting plate, and the protective mesh cover is connected to the shell through the supporting ribs, a first vent is formed between adjacent supporting ribs, and a first through hole is provided on the connecting plate; the heat dissipation module comprises a heat dissipation fan, a heat dissipation element and a lifting assembly, the heat dissipation fan is provided in the shell and is provided corresponding to the first vent, the lifting assembly is slidably connected to the connecting plate through the first through hole, a semiconductor refrigeration sheet corresponding to the electronic device is provided on the lifting assembly, the heat dissipation element is connected to the lifting assembly and is located between the heat dissipation fan and the lifting assembly, and the heat dissipation element is in contact with the semiconductor refrigeration sheet.

[0007] Optionally, the shell includes a supporting panel and a supporting base that are interlocked, the protective mesh cover is arranged on the supporting panel, and the supporting base is provided with a second ventilation hole corresponding to the protective mesh cover.

[0008] Optionally, the lifting component also includes a lifting platform and a heat conducting plate. A first sinking groove is provided on one side of the lifting platform, and a second through hole is provided at the bottom of the first sinking groove. The heat conducting plate is arranged in the first sinking groove, and the semiconductor refrigeration plate is arranged in the second through hole. The heat conducting plate is arranged in the first sinking groove and fits the side of the semiconductor refrigeration plate away from the heat sink. The lifting component is slidably connected to the first through hole through the lifting platform.

[0009] Optionally, a plurality of guide columns are provided on the side of the lifting platform facing the support panel, a guide sleeve corresponding to the guide column is provided on the connecting plate, the guide column is slidably connected to the guide sleeve, an elastic member is sleeved on the guide column, a stop platform is provided in the guide sleeve, and the opposite ends of the elastic member are respectively abutted against the lifting platform and the stop platform.

[0010] Optionally, the heat sink includes a connecting portion and a plurality of fins circumferentially arranged around the connecting portion, the semiconductor refrigeration plate is fitted with the connecting portion, the fins are arranged corresponding to the supporting ribs, and a first avoidance groove for avoiding the guide sleeve is formed between two adjacent fins.

[0011] Optionally, a second sunken groove is provided on a side surface of the connecting plate facing away from the heat sink, the first through hole is located at the bottom of the second sunken groove, and the lifting platform is provided corresponding to the second sunken groove.

[0012] Optionally, a connecting column is provided on the lifting platform, a second avoidance groove is provided on the edge of the first through hole for avoiding the connecting column, a connecting hole corresponding to the connecting column is provided on the connecting part, and the heat sink is connected to the lifting platform through the corresponding connection between the connecting hole and the connecting column.

[0013] Optionally, the radiator also includes a support assembly, which includes a support frame and an auxiliary rod. Two connecting grooves and two second rotation grooves are provided on the side of the support base plate facing away from the support panel. The support frame is rotatably connected to the support base plate through the connecting grooves, and the opposite ends of the auxiliary rod are respectively rotatably connected to the second rotation grooves. A plurality of card slots are provided on the support frame, and the auxiliary rod can be pressed against the support frame through the card slots.

[0014] Optionally, at least one first accommodating groove is provided on the support panel, and the radiator further includes a support plate, which is located in the first accommodating groove, and first rotation grooves are opened on the inner walls on both sides of the opposite sides of the first accommodating groove, and the support plate is rotatably connected to the first rotation groove.

[0015] Optionally, the support assembly also includes a vertical frame, which is arranged on one side of the support frame, the support frame is provided with a rotating shaft, the vertical frame is provided with a third rotating groove, the rotating shaft is rotatably connected to the third rotating groove, and the vertical frame is provided with a limit groove, which is used to place a mobile phone.

[0016] Compared to the prior art, the radiator provided by the present invention has the following advantages: a protective mesh is provided on the housing, which not only provides ventilation and heat dissipation, but also protects the user from the cooling fan within the housing. The protective mesh includes a connecting plate and support ribs, the support ribs connecting the connecting plate to the housing, and a first vent is formed between two adjacent support ribs, the first vent ensuring air circulation within the radiator. A lifting assembly is provided on the connecting plate, the lifting assembly being slidably connected to the first through-hole to enable the lifting assembly to move relative to the first through-hole. A heat sink is provided between the lifting assembly and the cooling fan, and the heat sink is connected to the lifting assembly so that the heat sink can move with the lifting assembly relative to the housing. A semiconductor cooling fin is provided within the lifting assembly, and the semiconductor cooling fin is in contact with the heat sink, so that the electronic device can transfer its own heat to the semiconductor cooling fin. The semiconductor cooling fin transfers the heat to the heat sink, which is then cooled by the heat sink's own heat dissipation structure and the cooling fan provided on one side of the heat sink, thereby achieving efficient and rapid cooling and heat dissipation of the electronic device connected to the radiator. During actual use, the electronic device is placed on the surface of the radiator, and the electronic device presses down the lifting assembly by its own weight so that the heat sink connected to the lifting assembly is closer to the cooling fan. At this time, the heat generated by the electronic device during use is transferred to the semiconductor refrigeration plate through the lifting assembly. The semiconductor refrigeration plate absorbs the heat of the electronic device on the side close to the electronic device due to its own characteristics to cool the electronic device, and releases heat on the side away from the electronic device. Because the semiconductor refrigeration plate can fit with the heat sink, it can transfer heat to the heat sink. The heat sink ultimately dissipates heat through its own heat dissipation and the blowing of the cooling fan to achieve a cooling effect on the electronic device set on the radiator. The lifting assembly that can slide relative to the shell in the above-mentioned setting can better fit the specific position of the electronic device by pressing down the electronic device, so that the semiconductor refrigeration plate in the lifting assembly can better contact the electronic device, making the adaptability of the radiator higher, thereby increasing the heat dissipation effect of the semiconductor refrigeration plate, and making the heat dissipation and cooling effect of the radiator more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0018] Figure 1is a schematic diagram of a radiator provided by an embodiment of the present utility model;

[0019] Figure 2 This is one of the schematic diagrams of the support panel provided by an embodiment of the present utility model;

[0020] Figure 3 is a schematic diagram of a radiator provided by an embodiment of the present utility model;

[0021] Figure 4 It is a schematic diagram of a lifting assembly provided by an embodiment of the present utility model;

[0022] Figure 5 Schematic diagram of a support base provided by an embodiment of the present utility model;

[0023] Figure 6 This is a second schematic diagram of a support panel provided by an embodiment of the present utility model;

[0024] Figure 7 Schematic diagram of a heat sink provided by an embodiment of the present utility model;

[0025] Figure 8 is a schematic diagram of a support plate and a support panel provided by an embodiment of the present utility model;

[0026] Figure 9 Schematic diagram of a support base plate and a support assembly provided by an embodiment of the present utility model;

[0027] Figure 10 It is a schematic diagram of a vertical stand provided by an embodiment of the utility model.

[0028] The reference numerals in the figures are:

[0029] 1000, radiator; 100, housing; 110, support panel; 111, first accommodating groove; 1111, first rotating groove; 120, support bottom plate; 121, connecting groove; 122, second rotating groove; 123, second vent; 101, protective mesh; 1011, first vent; 1012, connecting plate; 10121, first through hole; 10122, guide sleeve; 10123, second avoidance groove; 10124, second sinking groove; 1013, support rib; 200, heat dissipation module; 201, cooling fan; 202, heat dissipation element; 2021, connection Part; 20211, connecting hole; 2022, fin; 20221, first avoidance groove; 203, lifting assembly; 2031, second through hole; 2032, semiconductor refrigeration plate; 2033, lifting platform; 20331, first sinking groove; 20332, guide column; 20333, elastic member; 20334, connecting column; 2034, heat conducting plate; 300, support plate; 400, support assembly; 401, support frame; 4011, slot; 4012, rotating shaft; 402, auxiliary rod; 403, vertical frame; 4031, third rotating groove, 4032, limiting groove. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, a detailed description of the preferred embodiments of the present utility model will be given.

[0031] The present invention provides a heat sink 1000, referring to Figure 1-3 As shown, the radiator 1000 includes: a shell 100 and a heat dissipation module 200, a protective mesh cover 101 is set on one side of the shell 100, the protective mesh cover 101 includes a connecting plate 1012 and a plurality of supporting ribs 1013, the supporting ribs 1013 are set on the outer ring of the connecting plate 1012, and the protective mesh cover 101 is connected to the shell 100 through the supporting ribs 1013, a first vent 1011 is formed between adjacent supporting ribs 1013, and a first through hole 10121 is set on the connecting plate 1012; the heat dissipation module 200 includes a radiator A hot fan 201, a heat sink 202 and a lifting assembly 203, the heat sink fan 201 is arranged in the shell 100 and corresponds to the first vent 1011, the lifting assembly 203 is slidingly connected to the connecting plate 1012 through the first through hole 10121, the lifting assembly 203 is provided with a semiconductor cooling plate 2032 corresponding to the electronic device, the heat sink 202 is connected to the lifting assembly 203, and is located between the heat sink 201 and the lifting assembly 203, and the heat sink 202 is in contact with the semiconductor cooling plate 2032.

[0032] The housing 100 is provided with a protective mesh 101. The protective mesh 101 not only provides ventilation and heat dissipation, but also protects the user from being harmed by the cooling fan within the housing 100. The protective mesh 101 includes a connecting plate 1012 and support ribs 1013. The support ribs 1013 are used to connect the connecting plate 1012 to the housing 100. A first vent 1011 is formed between two adjacent support ribs 1013 to ensure air circulation within the radiator 1000. A lifting assembly 203 is provided on the connecting plate 1012. The lifting assembly 203 is slidably connected to the first through hole 10121, allowing the lifting assembly 203 to move relative to the first through hole 10121. A heat sink 202 is provided between the lifting assembly 203 and the cooling fan 201. The heat sink 202 is connected to the lifting assembly 203, allowing the heat sink 202 to move relative to the housing 100 along with the lifting assembly 203. A semiconductor cooling sheet 2032 is provided within the lifting assembly 203, and the semiconductor cooling sheet 2032 is in contact with the heat sink 202. This allows the electronic device to transfer its own heat to the semiconductor cooling sheet 2032, which in turn transfers the heat to the heat sink 202. The heat sink 202 is then cooled by the heat dissipation structure of the heat sink 202 itself, as well as by a cooling fan 201 located on one side of the heat sink 202. This effectively and rapidly cools and dissipates heat for the electronic device connected to the radiator 1000. In actual use, the electronic device is placed on the surface of the radiator 1000, and the electronic device uses its own weight to press down on the lifting assembly 203, bringing the heat sink 202 connected to the lifting assembly 203 closer to the cooling fan 201. At this time, the heat generated by the electronic device during use is transferred to the semiconductor cooling plate 2032 through the lifting assembly 203. Due to its own characteristics, the semiconductor cooling plate 2032 absorbs the heat from the electronic device on the side close to the electronic device to cool the electronic device, and releases the heat on the side away from the electronic device. Because the semiconductor cooling plate 2032 can fit the heat sink 202, it can transfer the heat to the heat sink 202. The heat sink 202 ultimately dissipates heat through its own heat dissipation and the blowing of the cooling fan 201, thereby achieving a cooling effect on the electronic device installed on the heat sink 1000. In the above-mentioned configuration, the lifting assembly 203 that can slide relative to the housing 100 can better fit the specific position of the electronic device by pressing down on the electronic device, allowing the semiconductor cooling plate 2032 in the lifting assembly 203 to better contact the electronic device, making the adaptability of the heat sink 1000 higher, and increasing the heat dissipation effect of the semiconductor cooling plate 2032, thereby making the heat dissipation and cooling effect of the heat sink 1000 more efficient.

[0033] Specifically, the connecting plate 1012 is provided with a first through-hole 10121 extending therethrough, and the lifting assembly 203 is slidably connected to the first through-hole 10121. Simultaneously, a semiconductor cooling sheet 2032 disposed within a second through-hole 2031 abuts against the heat sink 202, allowing the semiconductor cooling sheet 2032 to absorb heat from the electronic device and conduct heat to the heat sink 202, ultimately achieving a cooling effect for the electronic device.

[0034] It should be noted that semiconductor refrigeration chip 2032 is a device that uses the Peltier effect of semiconductor materials to achieve cooling or heating. The Peltier effect refers to the phenomenon that when an electric current passes through the interface of two materials with different conductivity, heat is absorbed or released at the interface. Semiconductor refrigeration chip 2032 can achieve the effect of absorbing heat on one side and releasing heat on the other side. This cooling principle can be widely used in small refrigeration radiators, such as micro-refrigerators and electronic equipment heat dissipation.

[0035] Specifically, the cooling fan 201 can blow the heat sink 202 that absorbs the heat of the semiconductor refrigeration plate 2032, so that the heat can be more effectively dissipated from the radiator 1000 through the first ventilation port 1011, thereby improving the heat dissipation effect of the radiator 1000 and helping to maintain the normal operating temperature of the radiator 1000.

[0036] Specifically, the arrangement of the connecting plate 1012 and the supporting ribs 1013 can help optimize the structure of the first vent 1011. The supporting ribs 1013 arranged along the outer circumference of the connecting plate 1012 can guide the inflow and outflow of air, thereby ensuring smooth air flow, improving the ventilation performance of the radiator 1000, and helping to reduce the temperature of the radiator 1000 during operation.

[0037] It should be noted that at least one first vent 1011 is provided on the housing 100, and the first through hole 10121 is provided corresponding to the first vent 1011. Two protective mesh covers 101 and two first through holes 10121 corresponding to the protective mesh covers 101 may be provided on the housing 100. Alternatively, only one protective mesh cover 101 and a corresponding first through hole 10121 may be provided on the housing 100.

[0038] refer to Figure 1 、 Figure 2 and Figure 5 The housing 100 includes a supporting panel 110 and a supporting base plate 120 that are interlocked with each other. The protective mesh cover 101 is provided on the supporting panel 110 , and a second vent 123 corresponding to the protective mesh cover 101 is provided on the supporting base plate 120 .

[0039] The housing 100 is assembled by fastening a support panel 110 and a support base 120, which facilitates assembly and disassembly of the housing 100 and reduces production costs. A second vent 123 is provided on the support base 120, corresponding to the protective mesh 101. The second vent 123 facilitates air circulation within the radiator 1000, enhancing ventilation. This helps maintain air flow within the radiator 1000, reducing its operating temperature and improving the heat dissipation efficiency of the radiator 1000 itself and the electronic device it provides.

[0040] Specifically, the design of the support panel 110 and the support base 120 interlocking with each other makes it easier to disassemble and maintain the housing 100. Users can more easily disassemble the radiator 1000 to clean, repair or replace parts inside, improving the maintainability of the radiator 1000.

[0041] refer to Figure 3 and Figure 4 The lifting component 203 also includes a lifting platform 2033 and a heat conducting plate 2034. A first sinking groove 20331 is provided on one side of the lifting platform 2033. A second through hole 2031 is provided at the bottom of the first sinking groove 20331. The heat conducting plate 2034 is arranged in the first sinking groove 20331. The semiconductor cooling plate 2032 is arranged in the second through hole 2031, and the heat conducting plate 2034 is arranged in the first sinking groove 20331 and is in contact with the side of the semiconductor cooling plate 2032 away from the heat sink 202. The lifting component 203 is slidably connected to the first through hole 10121 through the lifting platform 2033.

[0042] A semiconductor cooling sheet 2032 is disposed within the second through hole 2031, and a heat conducting sheet 2034 is disposed within the first sunken groove 20331. Since the second through hole 2031 is disposed at the bottom of the first sunken groove 20331, the semiconductor cooling sheet 2032 disposed within the second through hole 2031 can fit snugly with the heat conducting sheet 2034 disposed within the first sunken groove 20331. In actual use, the heat conducting sheet 2034 can effectively enhance the heat conduction effect of the electronic device to the lifting assembly 203. Therefore, the semiconductor cooling sheet 2032 can better absorb the heat transferred from the electronic device through the heat conducting sheet 2034, thereby enabling the radiator 1000 to more effectively cool and dissipate heat from the electronic device, thereby improving heat dissipation efficiency.

[0043] Specifically, by setting a heat conducting plate 2034 in the first sinking groove 20331 of the lifting platform 2033 and setting a semiconductor cooling plate 2032 in the second through hole 2031, the internal space of the radiator 1000 can be effectively utilized, making the layout of the lifting module more compact and effective, and improving the overall performance of the radiator 1000.

[0044] refer to Figures 2 to 4 A plurality of guide columns 20332 are provided on the side of the lifting platform 2033 facing the supporting panel 110, and a guide sleeve 10122 corresponding to the guide column 20332 is provided on the connecting plate 1012. The guide column 20332 is slidably connected with the guide sleeve 10122. An elastic member 20333 is sleeved on the guide column 20332, and a stop platform is provided in the guide sleeve 10122. The opposite ends of the elastic member 20333 respectively abut against the lifting platform 2033 and the stop platform.

[0045] The guide post 20332 provided on the lifting platform 2033 is used to be slidably connected to the guide sleeve 10122 provided on the connecting plate 1012, so that the lifting platform 2033 can slide vertically relative to the connecting plate 1012. An elastic member 20333 is provided on the guide post 20332, and opposite ends of the elastic member respectively abut against the lifting platform 2033 and a stopper provided in the guide sleeve 10122. In actual use, when the lifting platform 2033 is pressed downward by the gravity of the electronic device, the lifting platform 2033 slides relative to the guide sleeve 10122, and the guide post 20332 can move relative to the guide sleeve 10122 and slide out through the opening on the other side of the guide sleeve 10122, but the elastic member 20333 provided on the guide post is stopped by the stopper 10221. Pressing the elastic member 20333 causes it to deform elastically, generating elastic potential energy. When the electronic device is removed from the heat sink 1000, the elastic member 20333 recovers its deformation, thereby using the elastic force to drive the lifting platform 2033 to slide back to its initial position relative to the guide sleeve 10122. This arrangement allows the lifting platform 2033 to automatically return to its original position when the electronic device is removed, driven by the elastic member 20333, eliminating the need for manual operation by the user, making operation of the heat sink 1000 simple and convenient.

[0046] Specifically, the sliding connection between the guide post 20332 and the guide sleeve 10122 enables smooth movement of the lifting platform 2033 during the lifting process. This sliding connection between the guide post 20332 and the guide sleeve 10122 helps ensure accurate positioning of the lifting platform 2033 during the lifting process, maintaining vertical stability and preventing the guide post 20332 from deflecting or shaking relative to the guide sleeve 10122 during movement. The elastic member 20333 mounted on the guide post 20332 helps the lifting platform 2033 return to its original position when no electronic device is pressing down, thereby improving the stability and convenience of the heat sink 1000.

[0047] Specifically, the stopping of the elastic member 20333 by the stopper can prevent the elastic member 20333 from separating from the guide sleeve 10122 during the squeezing process of the lifting platform 2033, thereby ensuring that the elastic member 20333 can normally perform the elastic supporting function on the guide column 20332 and the lifting platform 2033.

[0048] refer to Figure 7 The heat sink 202 includes a connecting portion 2021 and a plurality of fins 2022 circumferentially arranged around the connecting portion 2021. The semiconductor refrigeration plate 2032 is fitted with the connecting portion 2021. The fins 2022 are arranged corresponding to the support ribs 1013. A first avoidance groove 20221 is formed between two adjacent fins 2022 for avoiding the guide sleeve 10122.

[0049] The heat sink 202 includes a plurality of fins 2022 circumferentially arranged around the connection portion 2021 . The fins 2022 can increase the contact surface between the heat sink 202 and the air, help accelerate the conduction and dissipation of heat, increase the heat exchange efficiency of the heat sink 202 , and thus improve the heat dissipation efficiency of the heat sink 202 .

[0050] Specifically, the contact between the semiconductor cooling fin 2032 and the connecting portion 2021 increases the contact area between the semiconductor cooling fin 2032 and the heat sink 202, helping the semiconductor cooling fin 2032 transfer more heat to the heat sink 202. This improves the heat dissipation efficiency of the heat sink 202 to the semiconductor cooler, helps the semiconductor cooler quickly absorb and release heat, and improves the heat dissipation effect of the heat sink 1000. The fins 2022 are arranged corresponding to the support ribs 1013 to prevent the fins 2022 from blocking the first vent 1011, thereby preventing the ventilation effect of the first vent 1011 from being affected.

[0051] Specifically, the first avoidance groove 20221 formed between two adjacent fins 2022 can be used to avoid the guide sleeve 10122, ensuring sufficient space between the heat sink 202 and the support panel 110 to avoid mutual interference or collision. This helps to protect the integrity of the support panel 110 and the guide sleeve 10122, while ensuring the normal operation of the heat sink 202.

[0052] refer to Figure 2 A second sinking groove 10124 is provided on the side surface of the connecting plate 1012 facing away from the heat sink 202 , the first through hole 10121 is located at the bottom of the second sinking groove 10124 , and the lifting platform 2033 is provided corresponding to the second sinking groove 10124 .

[0053] A second sinking groove 10124 is provided on one side of the connecting plate 1012, and the second sinking groove 10124 is provided corresponding to the lifting platform 2033. Therefore, in actual use, when the lifting platform 2033 is subjected to pressure and slides toward one side of the connecting portion 2021, the lifting platform 2033 can eventually completely correspond to the second sinking groove 10124, so that the lifting platform 2033 can be kept as level as possible with the second sinking groove 10124, avoiding the protrusion of the lifting platform 2033 on the connecting plate 1012, so as to ensure a better fit between the lifting platform 2033 and the electronic equipment arranged on the radiator 1000, thereby improving the cooling and heat dissipation effect of the radiator 1000.

[0054] Specifically, a second sunken groove 10124 is provided on the connecting plate 1012, corresponding to the lifting platform 2033. This ensures that after the lifting platform 2033 is fully pressed downward, the lifting platform 2033 itself and the lifting platform 2033 are firmly connected to the connecting plate 1012. This helps prevent the lifting platform 2033 from loosening or vibrating during use, thereby improving the stability and safety of the heat sink 1000.

[0055] refer to Figures 2 to 4 A connecting column 20334 is provided on the lifting platform 2033, and a second avoidance groove 10123 for avoiding the connecting column 20334 is provided on the edge of the first through hole 10121. A connecting hole 20211 corresponding to the connecting column 20334 is provided on the connecting portion 2021, and the heat sink 202 is connected to the lifting platform 2033 through the corresponding connection between the connecting hole 20211 and the connecting column 20334.

[0056] It should be noted that in this embodiment, the connecting column 20334 is a hollow column structure to facilitate the corresponding connection between the connecting column 20334 and the connecting hole 20211. The connecting column 20334 and the connecting hole 20211 can be connected by screws or pins.

[0057] The lifting platform 2033 is provided with a connecting post 20334. The connecting portion 2021 is provided with a connecting hole 20211 corresponding to the connecting post 20334. The heat sink 202 is connected to the lifting platform 2033 through the connecting hole 20211 and the connecting post 20334. This allows the semiconductor cooling fins 2032 on the lifting platform 2033 to fit closely with the heat sink 202, thereby allowing the heat sink 202 to dissipate heat for the semiconductor cooling fins 2032. Furthermore, the heat sink 202 can slide relative to the supporting panel 110 along with the lifting platform 2033, allowing the lifting platform 2033 to move closer to the cooling fan 201, thereby helping the heat sink 202 to dissipate heat and cool itself.

[0058] Specifically, a second avoidance groove 10123 is provided on the edge of the first through hole 10121 for avoiding the connecting column 20334. This is to avoid the connection between the lifting platform 2033 and the connecting plate 1012 to ensure that the lifting platform 2033 can slide relative to the connecting plate 1012.

[0059] Specifically, the corresponding connection between the connecting column 20334 and the connecting hole 20211 can enhance the stability of the connection between the heat sink 202 and the lifting platform 2033, ensure that the heat sink 202 can continue to maintain contact with the semiconductor heat sink 202, and help improve the stability of heat dissipation of the radiator 1000.

[0060] refer to Figure 5 and Figure 9 The radiator 1000 also includes a support assembly 400, which includes a support frame 401 and an auxiliary rod 402. Two connecting grooves 121 and two second rotation grooves 122 are provided on the side of the support base plate 120 away from the support panel 110. The support frame 401 is rotatably connected to the support base plate 120 through the connecting grooves 121, and the opposite ends of the auxiliary rod 402 are rotatably connected to the second rotation grooves 122 respectively. A plurality of card slots 4011 are provided on the support frame 401, and the auxiliary rod 402 can be offset against the support frame 401 through the card slots 4011.

[0061] The support assembly 400 includes a support frame 401 and an auxiliary rod 402. The opposite ends of the support frame 401 are rotatably connected to the support base 120 through connecting grooves 121, and the auxiliary rod 402 is rotatably connected to the support base 120 through a second rotation groove 122. Therefore, the support frame 401 and the auxiliary rod 402 can both rotate relative to the support base 120, and a plurality of card slots 4011 are provided on the support frame 401, so that the auxiliary rod 402 can be rotated relative to the support base 120 to a certain angle and then counteracted with one of the card slots 4011 on the support frame 401, so that the stable support structure between the support frame 401 and the auxiliary rod 402 can lift and support the radiator 1000 to a certain angle, so that the radiator 1000 can be more adapted to electronic devices and make electronic devices more convenient for users to use, thereby enhancing the adaptability and flexibility of the radiator 1000.

[0062] Specifically, the support frame 401 is provided with a plurality of slots 4011, through which the auxiliary rod 402 can be abutted against the support frame 401. On the one hand, the slots 4011 form a firm connection between the auxiliary rod 402 and the support frame 401, thereby enhancing the overall stability of the support assembly 400 and preventing it from loosening or falling off during operation. On the other hand, the multiple slots 4011 provided on the support frame 401 can facilitate the user to control the lifting height and lifting angle of the radiator 1000 by abutting the auxiliary rod 402 against the slots 4011 at different positions on the support frame 401, thereby further enhancing the flexibility and movable range of the radiator 1000 and facilitating the use of the user.

[0063] refer to Figure 8 At least one first accommodating groove 111 is provided on the supporting panel 110. The radiator 1000 also includes a supporting plate 300. The supporting plate 300 is located in the first accommodating groove 111. First rotation grooves 1111 are opened on the inner walls on both sides of the opposite sides of the first accommodating groove 111. The supporting plate 300 is rotatably connected to the first rotation groove 1111.

[0064] The support panel 110 is provided with a first receiving groove 111 and a support plate 300 mounted within the first receiving groove 111. First rotation grooves 1111 are formed on the inner walls of the first receiving groove 111 on opposite sides. The support plate 300 is rotatably connected to the first rotation grooves 1111, so that the support plate 300 can rotate relative to the support panel 110 via the first rotation grooves 1111. During actual use, the radiator 1000 and the electronic equipment mounted thereon may be raised to a certain angle and height by the support assembly 400. Therefore, after the support plate 300 is rotated relative to the support panel 110, the support plate 300 can stop and limit the electronic equipment placed on the radiator 1000. This prevents the electronic equipment from shifting or shaking relative to the radiator 1000, ensures the heat dissipation effect of the radiator 1000, and improves the safety of the electronic equipment during use.

[0065] Specifically, the support plate 300 is rotatably connected to the first rotation groove 1111, allowing the support plate 300 to rotate around the first rotation groove 1111, thereby achieving flexible adjustment and positioning of the support plate 300. This helps optimize the position and angle of the electronic device installed on the heat sink 1000, thereby improving the heat sink 1000's ability to stop and limit the electronic device, and enhancing the protection of the heat sink 1000.

[0066] It should be noted that only one first receiving groove 111 may be provided on the support panel 110 , so only one support plate 300 is provided accordingly. Alternatively, multiple first receiving grooves 111 may be provided on the support panel 110 , so multiple support plates 300 are provided accordingly.

[0067] refer to Figure 9 and Figure 10 The support assembly 400 also includes a vertical frame 403, which is arranged on one side of the support frame 401. The support frame 401 is provided with a rotating shaft 4012, and the vertical frame 403 is provided with a third rotating groove 4031. The rotating shaft 4012 is rotatably connected to the third rotating groove 4031. The vertical frame 403 is provided with a limiting groove 4032, which is used to place a mobile phone.

[0068] Vertical stand 403 is used to assist in placing other electronic devices. For example, when a laptop is placed on radiator 1000, a mobile phone or tablet computer can be placed in a retaining groove 4032 provided on vertical stand 403 for auxiliary use. Vertical stand 403, as part of support assembly 400, is provided on one side of support frame 401. Vertical stand 403 is rotatably connected to a rotating shaft 4012 on support frame 401 via a third rotation groove 4031. This helps users adjust vertical stand 403 to a desired angle for use, thereby increasing the applicability and flexibility of radiator 1000.

[0069] Specifically, the vertical stand 403 is provided with a third rotation slot 4031, which is rotatably connected to the rotation shaft 4012 on the support frame 401. This rotational connection allows the vertical stand 403 to rotate about the rotation shaft 4012, thereby adjusting the angle of the vertical stand 403. By adjusting the angle of the vertical stand 403, the user can more easily use the vertical stand 403, making it more adaptable to different usage requirements.

[0070] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Those skilled in the art may modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A radiator, characterized in that: include: A housing, wherein a protective mesh cover is provided on one side of the housing, the protective mesh cover comprising a connecting plate and a plurality of supporting ribs, the supporting ribs being provided on an outer ring of the connecting plate, the protective mesh cover being connected to the housing via the supporting ribs, a first vent being formed between adjacent supporting ribs, and a first through hole being provided on the connecting plate; The heat dissipation module includes a heat dissipation fan, a heat dissipation element and a lifting assembly. The heat dissipation fan is arranged in the shell and corresponds to the first vent. The lifting assembly is slidably connected to the connecting plate through the first through hole. The lifting assembly is provided with a semiconductor refrigeration sheet corresponding to the electronic device. The heat dissipation element is connected to the lifting assembly and is located between the heat dissipation fan and the lifting assembly. The heat dissipation element is in contact with the semiconductor refrigeration sheet.

2. The radiator according to claim 1, characterized in that The shell includes a supporting panel and a supporting bottom plate that are buckled with each other, the protective mesh cover is arranged on the supporting panel, and the supporting bottom plate is provided with a second ventilation hole corresponding to the protective mesh cover.

3. The radiator according to claim 2, characterized in that The lifting assembly also includes a lifting platform and a heat conducting plate. A first sinking groove is provided on one side of the lifting platform. A second through hole is provided at the bottom of the first sinking groove. The heat conducting plate is provided in the first sinking groove. The semiconductor refrigeration plate is provided in the second through hole. The heat conducting plate is in contact with the side of the semiconductor refrigeration plate facing away from the heat sink. The lifting assembly is slidably connected to the first through hole through the lifting platform.

4. The radiator according to claim 3, characterized in that A plurality of guide posts are provided on the side of the lifting platform facing the support panel, and a guide sleeve corresponding to the guide post is provided on the connecting plate. The guide post is slidably connected to the guide sleeve, and an elastic member is sleeved on the guide post. A stop platform is provided in the guide sleeve, and the opposite ends of the elastic member respectively abut against the lifting platform and the stop platform.

5. The radiator according to claim 4, characterized in that The heat sink includes a connecting portion and a plurality of fins circumferentially arranged around the connecting portion. The semiconductor refrigeration plate is fitted with the connecting portion. The fins are arranged corresponding to the supporting ribs. A first avoidance groove for avoiding the guide sleeve is formed between two adjacent fins.

6. The radiator according to claim 5, characterized in that A second sinking groove is provided on a side surface of the connecting plate facing away from the heat sink, the first through hole is located at the bottom of the second sinking groove, and the lifting platform is provided corresponding to the second sinking groove.

7. The radiator according to claim 5, characterized in that A connecting column is provided on the lifting platform, and a second avoidance groove is provided on the edge of the first through hole for avoiding the connecting column. A connecting hole corresponding to the connecting column is provided on the connecting part, and the heat sink is connected to the lifting platform through the corresponding connection between the connecting hole and the connecting column.

8. The radiator according to claim 2, characterized in that The radiator also includes a support assembly, which includes a support frame and an auxiliary rod. Two connecting grooves and two second rotation grooves are provided on the side of the support base plate facing away from the support panel. The support frame is rotatably connected to the support base plate through the connecting grooves, and the opposite ends of the auxiliary rod are respectively rotatably connected to the second rotation grooves. A plurality of card slots are provided on the support frame, and the auxiliary rod can be pressed against the support frame through the card slots.

9. The radiator according to claim 8, characterized in that The support panel is provided with at least one first accommodating groove, and the radiator further includes a support plate, which is located in the first accommodating groove. First rotation grooves are opened on the inner walls on opposite sides of the first accommodating groove, and the support plate is rotatably connected to the first rotation groove.

10. The radiator according to claim 9, characterized in that The support assembly also includes a vertical frame, which is arranged on one side of the support frame. The support frame is provided with a rotating shaft, and the vertical frame is provided with a third rotating groove. The rotating shaft is rotatably connected to the third rotating groove. The vertical frame is provided with a limiting groove, and the limiting groove is used to place a mobile phone.

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