Immersed vapor chamber structure

Abstract

The utility model discloses an immersed uniform temperature plate structure, which comprises a heat dissipation surface copper plate in contact with a heat dissipation medium, a contact surface copper plate in contact with a chip or other heat sources, an inner cavity, a first capillary structure and a heat dissipation reinforcing assembly. The contact area of the vapor chamber and liquid is increased by adopting the heat dissipation shovel teeth with the concave-convex structures while the size of a product is not changed, and the heat dissipation efficiency of the vapor chamber is greatly improved by arranging the capillary structures on the heat dissipation shovel teeth.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to an immersion type temperature equalizing plate structure. Background Art

[0002] With the advancement of technology, the public's demand for electronic products is gradually becoming thinner, more fashionable, and more multifunctional. As the performance of electronic products becomes more and more powerful, the integration and assembly density of the products themselves will continue to increase, resulting in a sharp increase in power consumption and heat generation.

[0003] In recent years, water cooling, particularly immersion cooling, has garnered increasing attention. The heat dissipation area of ​​a heat sink (vapor chamber) within a fluorinated liquid or other cooling medium is a crucial factor influencing heat dissipation effectiveness. However, existing heat sink structures typically utilize only two smooth copper plates welded together, resulting in a limited heat dissipation area. This results in heat dissipation performance that fails to meet expectations and support industry development. Utility Model Content

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is:

[0005] Provided is an immersion-type heat spreader structure, comprising: a heat dissipation surface copper plate in contact with a heat dissipation medium, a contact surface copper plate in contact with a chip or other heat source, an inner cavity, a first capillary structure, and a heat dissipation reinforcement component. The heat dissipation surface copper plate and the contact surface copper plate are connected to form a heat spreader body. The heat spreader body is provided with an inner cavity, the inner wall of the inner cavity is provided with the first capillary structure, and one or more heat dissipation reinforcement components are provided on the top of the heat dissipation surface copper plate.

[0006] The heat dissipation enhancement component includes a heat dissipation groove, a heat dissipation shovel tooth, and a second capillary structure. The heat dissipation groove is arranged on the heat dissipation surface copper plate. A plurality of heat dissipation shovel teeth are arranged in parallel in the heat dissipation groove. The ends of the heat dissipation shovel teeth are connected to the inner wall of the heat dissipation groove, and the top surface of the heat dissipation shovel tooth is lower than the top surface of the heat dissipation surface copper plate. A heat dissipation gap is provided between two adjacent heat dissipation shovel teeth. The heat dissipation shovel teeth include a shovel tooth lower part and a shovel tooth upper part. The top of the shovel tooth upper part with an arc-shaped cross-section is provided with a heat dissipation positioning protrusion.

[0007] The second capillary structure includes a capillary structure body and a capillary positioning groove which is an integral structure with the capillary structure body. The capillary structure body covers the heat dissipation shovel teeth. The heat dissipation positioning protrusion is connected and contacted with the capillary positioning groove, so that the second capillary structure fits the heat dissipation shovel teeth.

[0008] In a preferred embodiment of the present invention, the heat dissipation surface copper plate and the contact surface copper plate are welded, and a copper column is provided in the inner cavity.

[0009] In a preferred embodiment of the present invention, the cross-section of the lower portion of the shovel teeth is a rectangular, trapezoidal or arc-shaped structure.

[0010] In a preferred embodiment of the present invention, the upper portion of the shovel teeth and the lower portion of the shovel teeth are an integrated structure.

[0011] In a preferred embodiment of the present invention, the heat dissipation positioning protrusion and the upper portion of the skiving teeth are an integrated structure.

[0012] In a preferred embodiment of the present invention, the width of the heat dissipation shovel teeth is not less than 1 mm.

[0013] In a preferred embodiment of the present invention, the cross-section of the heat dissipation positioning protrusion is an arc, triangle, trapezoid or irregular shape.

[0014] In a preferred embodiment of the present invention, the distance between two adjacent capillary structure bodies 531 is not less than 1.5 mm.

[0015] The beneficial effects of the present invention are: without changing the size of the product, the heat dissipation shovel teeth with a concave-convex structure are used to increase the contact area between the temperature equalizing plate and the liquid, and a capillary structure is provided on the heat dissipation shovel teeth, which greatly improves the heat dissipation efficiency of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:

[0017] Figure 1 This is a schematic diagram of the exploded structure of a preferred embodiment of an immersion type temperature equalizing plate structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the assembly structure of a preferred embodiment of an immersion type temperature equalizing plate structure of the present invention;

[0019] Figure 3 This is a schematic cross-sectional view of a preferred embodiment of an immersion-type temperature-equalizing plate structure of the present invention;

[0020] Figure 4 This is a partially enlarged structural diagram of a preferred embodiment of an immersion type temperature equalizing plate structure of the present invention. DETAILED DESCRIPTION

[0021] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] See also Figure 1-4 , the embodiments of the present utility model include:

[0023] An immersion-type temperature equalizing plate structure includes: a heat dissipation surface copper plate 1 in contact with a heat dissipation medium, a contact surface copper plate 2 in contact with a chip or other heat source, an inner cavity 3, a first capillary structure 4, and a heat dissipation reinforcement component 5.

[0024] The heat dissipation surface copper plate 1 and the contact surface copper plate 2 are connected by welding to form the temperature equalizing plate body. The upper part of the heat dissipation surface copper plate 1 and the lower part of the contact surface copper plate 2 are provided with grooves so that the two grooves form an inner cavity 3 after the heat dissipation surface copper plate and the contact surface copper plate are connected. A first capillary structure 4 is provided on the inner wall of the inner cavity 3.

[0025] Further preferably, a copper column 6 is provided in the inner cavity 3, and both ends of the copper column 6 are respectively connected to the heat dissipation surface copper plate 1 and the contact surface copper plate 2 to play a supporting and water return role, so as to help improve the heat dissipation capacity of the radiator.

[0026] One or more heat dissipation enhancement components 5 are provided on the upper part of the heat dissipation surface copper plate 1. The specific shape and size of the heat dissipation enhancement components 5 can be adjusted according to actual usage requirements, the design of the inner cavity of the temperature equalizing plate, and the size of the reserved steam channel.

[0027] The heat dissipation enhancement component 5 includes a heat dissipation groove 51, a heat dissipation shovel tooth 52, and a second capillary structure 53. The heat dissipation groove 51 is placed on the heat dissipation surface copper plate 1, and multiple heat dissipation shovel teeth 52 are evenly arranged in the heat dissipation groove 51, and the top surface of the heat dissipation shovel tooth 52 is lower than the top surface of the heat dissipation surface copper plate 1. The end and side of the heat dissipation shovel tooth 52 are respectively connected to the inner wall of the heat dissipation groove 51, and a heat dissipation gap 54 is set between two adjacent heat dissipation shovel teeth 52.

[0028] The heat dissipation skiving teeth 52 include a skiving tooth lower portion 521 with a rectangular or trapezoidal cross section and a skiving tooth upper portion 522 with an arc-shaped cross section. A heat dissipation positioning protrusion 523 is provided on the top surface of the skiving tooth upper portion 522 .

[0029] Further preferably, the skiving tooth upper portion 522 and the skiving tooth lower portion 521 are an integrated structure.

[0030] More preferably, the width of the heat dissipation scraper teeth 52 is not less than 1 mm.

[0031] Further preferably, the heat dissipation positioning protrusion 523 and the skiving tooth upper portion 522 are an integrated structure.

[0032] More preferably, the cross section of the heat dissipation positioning protrusion 523 is arc-shaped, triangular, trapezoidal or irregular.

[0033] The second capillary structure 53 includes a capillary structure body 531 and a capillary positioning groove 532 integral with the capillary structure body 531 . The capillary structure body 531 covers the heat dissipation shovel teeth, and the heat dissipation positioning protrusion 523 is connected to the capillary positioning groove 532 .

[0034] The cooperation between the heat dissipation shovel teeth 52 and the second capillary structure 53 can effectively increase the contact area between the heat dissipation surface of the temperature homogenizer (heat dissipation copper plate) and the heat dissipation medium, so as to remove more heat energy per unit time and improve the heat dissipation capacity and efficiency.

[0035] Further preferably, the second capillary structure 53 is fixedly connected to the heat dissipation groove 51 .

[0036] Further preferably, the distance between two adjacent capillary structure bodies 531 is not less than 1.5 mm.

[0037] The beneficial effects of the immersed heat absorbing plate structure of the utility model are: without changing the size of the product, the heat absorbing plate and the liquid contact area are increased by using the heat absorbing shovel teeth with a concave and convex structure, and a capillary structure is provided on the heat absorbing shovel teeth, which greatly improves the heat dissipation efficiency of the heat absorbing plate.

[0038] This solution is suitable for all immersion-type VC designs. The above description is only an embodiment of the present invention and does not limit the scope of the patent. Any equivalent structure or equivalent process transformation made by utilizing the contents of the present invention specification, or directly or indirectly applied in other related technical fields, is also included in the scope of patent protection of the present invention.

Claims

1. An immersion type heat plate structure, characterized in that: include: A heat dissipation surface copper plate in contact with a heat dissipation medium, a contact surface copper plate in contact with a chip or other heat source, an inner cavity, a first capillary structure, and a heat dissipation enhancement component. The heat dissipation surface copper plate and the contact surface copper plate are connected to form a temperature equalizing plate body. An inner cavity is provided in the temperature equalizing plate body. The first capillary structure is provided on the inner wall of the inner cavity. One or more groups of heat dissipation enhancement components are provided on the top of the heat dissipation surface copper plate. The heat dissipation enhancement component includes a heat dissipation groove, a heat dissipation shovel tooth, and a second capillary structure. The heat dissipation groove is arranged on the heat dissipation surface copper plate. A plurality of heat dissipation shovel teeth are arranged in parallel in the heat dissipation groove. The ends of the heat dissipation shovel teeth are connected to the inner wall of the heat dissipation groove, and the top surface of the heat dissipation shovel tooth is lower than the top surface of the heat dissipation surface copper plate. A heat dissipation gap is provided between two adjacent heat dissipation shovel teeth. The heat dissipation shovel teeth include a shovel tooth lower part and a shovel tooth upper part. The top of the shovel tooth upper part with an arc-shaped cross-section is provided with a heat dissipation positioning protrusion. The second capillary structure includes a capillary structure body and a capillary positioning groove which is an integral structure with the capillary structure body. The capillary structure body covers the heat dissipation shovel teeth. The heat dissipation positioning protrusion is connected and contacted with the capillary positioning groove, so that the second capillary structure fits the heat dissipation shovel teeth.

2. The immersion type heat sink structure according to claim 1, characterized in that: The heat dissipation surface copper plate is welded to the contact surface copper plate, and a copper column is arranged in the inner cavity.

3. The immersion type heat sink structure according to claim 1, characterized in that: The cross section of the lower portion of the shovel teeth is a rectangular, trapezoidal or arc-shaped structure.

4. The immersion type heat sink structure according to claim 1, characterized in that: The upper portion of the shovel teeth and the lower portion of the shovel teeth are an integrated structure.

5. The immersion type heat sink structure according to claim 1, characterized in that: The heat dissipation positioning protrusion and the upper part of the skiving teeth are an integrated structure.

6. The immersion type heat sink structure according to claim 1, characterized in that: The width of the heat dissipation shovel teeth is not less than 1 mm.

7. The immersion type heat sink structure according to claim 1, characterized in that: The cross section of the heat dissipation positioning protrusion is an arc, triangle, trapezoid or irregular shape.

8. The immersion type heat sink structure according to claim 1, characterized in that: The distance between two adjacent capillary structure bodies is not less than 1.5 mm.

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