Voltage probe of power semiconductor device

Abstract

The utility model relates to the field of voltage probes, in particular to a voltage probe of a power semiconductor device. Comprising a probe body, a handle is installed at the lower end of the probe body, a connecting wire is fixedly connected to the lower end of the handle, a connector is installed at the end, away from the handle, of the connecting wire, a wire bunching structure is arranged on the surface of the connecting wire, the wire bunching structure comprises two limiting rings, and the limiting rings are arranged on the surface of the connecting wire. Two telescopic pipes are fixedly connected to the ends, close to each other, of the two limiting rings, sleeves are installed at the ends, close to each other, of the two telescopic pipes, springs are arranged in the sleeves and the telescopic pipes, the two ends of the springs are connected with the sleeves and the telescopic pipes correspondingly, and notches are formed in the two ends of the limiting rings correspondingly. The power semiconductor device voltage probe provided by the utility model has the advantage that the length of the connecting line can be reserved according to the distance between an instrument and a semiconductor.

Description

Technical Field

[0001] The utility model relates to the field of voltage probes, in particular to a voltage probe for a power semiconductor device. Background Art

[0002] A voltage probe consists of a probe body, a connector, a handle, and a connecting wire. It is a device used to test the voltage of semiconductors and is quite common in daily life.

[0003] Prior art includes utility model patent publication number CN201662590U, which discloses a semiconductor probe and a non-invasive voltage measurement device including the probe. This patent utilizes a semiconductor probe structure that integrates a sensing component and a sampling component on the same semiconductor substrate, effectively reducing the volume and weight of the semiconductor probe and facilitating mass production. The sampling component utilizes a parallel plate capacitor structure of "oxide layer-metal electrode-insulating layer-metal electrode," which features a large electrode area, high sensitivity, a wide range, and good linearity, making it suitable for collecting the induced charge generated by the sensing component. Because the epitaxial layer of the sensing component is directly fabricated on the semiconductor substrate, the charge in the epitaxial layer undergoes only a rearrangement process, resulting in a fast response time. This solves the problem of traditional voltage sensors, which are all iron core coil structures. These sensors utilize the principle of electromagnetic induction to achieve non-invasive voltage measurement, but this method has the following drawbacks: low accuracy, requiring very precise coil winding and high signal processing requirements; slow response time, limited measurement range, and susceptibility to electromagnetic interference; and large volume and weight.

[0004] In daily use, it is found that in the existing technology, the connector is connected to the instrument and then the probe is used for pressure testing. However, the line between the connector and the probe body is long, which causes the excess line to easily interfere with the operator's use of the handle when using the probe for pressure testing. If the connecting line is hung down, it is easy for the connecting line to be contaminated with dust or cause wear.

[0005] Therefore, it is necessary to provide a new power semiconductor device voltage probe to solve the above technical problems. Utility Model Content

[0006] The utility model aims to solve the shortcomings in the prior art and proposes a power semiconductor device voltage probe.

[0007] In order to solve the above technical problems, the utility model provides a power semiconductor device voltage probe, comprising: a probe body, a handle is installed at the lower end of the probe body, a connecting wire is fixedly connected to the lower end of the handle, a connector is installed at the end of the connecting wire away from the handle, a wire binding structure is provided on the surface of the connecting wire, and the wire binding structure includes two limiting rings, the limiting rings are arranged on the surface of the connecting wire, and the ends of the two limiting rings close to each other are fixedly connected to two telescopic tubes, and the ends of the two telescopic tubes close to each other are installed with sleeves, and springs are arranged inside the sleeves and the telescopic tubes, and the two ends of the spring are respectively connected to the sleeve and the telescopic tube, and slots are provided at both ends of the limiting rings.

[0008] The effect achieved by the above components is: when the connecting wires need to be bundled, the two limit rings are pulled to separate them, and then the limit rings drive the telescopic tube to move, the telescopic tube slides on the inner wall of the sleeve, and the telescopic tube changes to another sleeve to drive the spring to stretch. After the two limit rings are separated to the appropriate position, the connecting wire is placed between the connecting rings, and then the connecting ring spring is loosened to contract, driving the telescopic tube and sleeve to contract, and then the sleeve is retracted into the two slots, and the limit rings limit the connecting wire.

[0009] Preferably, a protective pad is fixedly connected to the inner wall of the limiting ring, and the protective pad is a rubber pad.

[0010] The effects achieved by the above components are: the protective pad can protect the connecting wires and avoid wear and tear when protecting the connecting wires.

[0011] Preferably, a telescopic rod is provided inside the sleeve and the telescopic tube, two ends of the telescopic rod are fixedly connected to the sleeve and the telescopic tube respectively, and the spring is sleeved on the arc surface of the telescopic rod.

[0012] The effect achieved by the above components is that the telescopic rod can limit the spring, thereby preventing the spring from being deformed during use and increasing the service life of the spring.

[0013] Preferably, the size of the notch is the same as that of the sleeve.

[0014] Preferably, an iron block is fixedly connected to the inside of the notch, and magnetic blocks are fixedly connected to both ends of the sleeve, and the sizes of the magnetic blocks are adapted to the iron block.

[0015] The effect achieved by the above components is that after the spring is contracted and fixed, the magnetic block and the iron block are adsorbed and fixed, making the cable bundle more stable.

[0016] Preferably, a protective structure is provided at the upper end of the handle, and the protective structure includes a connecting ring, which is fixedly connected to the handle, and the inner wall of the connecting ring is slidably connected to a protective shell, and the arc surface of the protective shell is fixedly connected to a plurality of friction pads, and a plurality of slots are opened inside the connecting ring, and the slots are snap-connected to the friction pads.

[0017] The effect achieved by the above components is: when the probe body needs to be protected, pull the protective shell to move, then align the protective shell with the connecting ring, then insert the protective shell into the connecting ring, and then the connecting ring squeezes and shrinks the friction pad. After moving to the appropriate position, the friction pad is snapped into the slot for fixation, and the protection can protect the probe body.

[0018] Preferably, a protective sleeve is fixedly connected to the interior of the protective shell, and the protective sleeve is a rubber sleeve.

[0019] The effects achieved by the above components are: the protective cover can protect the probe body and avoid friction when protecting the probe body.

[0020] Compared with related technologies, the power semiconductor device voltage probe provided by the present invention has the following beneficial effects:

[0021] The utility model provides a voltage probe for a power semiconductor device. By setting a wire harness structure, in the prior art, a connector is connected to an instrument and then the probe is used for voltage testing. However, the wire between the connector and the probe body is long, resulting in the redundant wire easily interfering with the operator's use of the grip when the probe is used for voltage testing. If the connecting wire is hung down, it is easy for the connecting wire to be contaminated with dust or caused to wear. The present device achieves the effect of reserving the length of the connecting wire according to the distance between the instrument and the semiconductor.

[0022] By providing a protective structure, the probe body can be easily protected, thereby avoiding excessive wear of the probe body during use, which may lead to the need to replace the probe body. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic structural diagram of a voltage probe for a power semiconductor device provided by the utility model;

[0024] Figure 2 for Figure 1 Schematic diagram of part of the structure shown;

[0025] Figure 3 for Figure 1 Schematic diagram of the wiring harness structure shown;

[0026] Figure 4 for Figure 3Schematic diagram of the internal structure shown;

[0027] Figure 5 for Figure 4 An enlarged view of point A is shown;

[0028] Figure 6 for Figure 4 The enlarged view of point B is shown;

[0029] Figure 7 for Figure 1 Schematic diagram of the protection structure shown;

[0030] Figure 8 for Figure 7 An enlarged view of point C is shown.

[0031] Numbers in the figure: 1. Probe body; 2. Connector; 3. Handle; 4. Connecting wire; 5. Wiring structure; 51. Limiting ring; 52. Protective pad; 53. Sleeve; 54. Telescopic tube; 55. Notch; 56. Telescopic rod; 57. Spring; 58. Magnetic block; 59. Iron block; 6. Protective structure; 61. Connecting ring; 62. Protective shell; 63. Protective cover; 64. Friction pad; 65. Slot. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0033] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0034] See also Figures 1 to 8 A power semiconductor device voltage probe provided by an embodiment of the present invention includes: a probe body 1, a handle 3 is installed at the lower end of the probe body 1, a connecting wire 4 is fixedly connected to the lower end of the handle 3, a connector 2 is installed at the end of the connecting wire 4 away from the handle 3, a wire bundling structure 5 is provided on the surface of the connecting wire 4, and a protective structure 6 is provided at the upper end of the handle 3.

[0035] In the embodiments of the present invention, please refer to Figures 1 to 6The wiring harness structure 5 includes two limiting rings 51, which are arranged on the surface of the connecting line 4. The ends of the two limiting rings 51 that are close to each other are fixedly connected to two telescopic tubes 54. The ends of the two telescopic tubes 54 that are close to each other are installed with sleeves 53. Springs 57 are arranged inside the sleeves 53 and the telescopic tubes 54. The two ends of the spring 57 are respectively connected to the sleeves 53 and the telescopic tubes 54. Notches 55 are provided at both ends of the limiting rings 51. When the connecting wire 4 needs to be bundled, the two limiting rings 51 are pulled apart, and then the limiting rings 51 drive the telescopic tube 54 to move. The telescopic tube 54 slides on the inner wall of the sleeve 53. The telescopic tube 54 changes to another sleeve 53 to drive the spring 57 to stretch. After the two limiting rings 51 are separated to the appropriate position, the connecting wire 4 is placed between the connecting rings 61, and then the connecting ring 61 is released. The spring 57 contracts and drives the telescopic tube 54 and the sleeve 53 to contract. The sleeve 53 is then retracted into the two notches 55. The limiting rings 51 limit the position of the connecting wire 4. The inner wall of the limiting ring 51 is fixedly connected to a protective pad 52, which is a rubber pad. The protective pad 52 can protect the connecting wire 4 and prevent wear when protecting the connecting wire 4. A telescopic rod 56 is provided inside the sleeve 53 and the telescopic tube 54. The two ends of the telescopic rod 56 are fixedly connected to the sleeve 53 and the telescopic tube 54 respectively. The spring 57 is sleeved on the arc surface of the telescopic rod 56. The telescopic rod 56 can limit the spring 57, preventing the spring 57 from deforming during use and increasing the service life of the spring 57. The size of the notch 55 is the same as that of the sleeve 53. An iron block 59 is fixedly connected to the inside of the notch 55. Both ends of the sleeve 53 are fixedly connected to magnetic blocks 58, and the size of the magnetic blocks 58 and the iron blocks 59 are adapted. After the spring 57 is retracted and fixed, the magnetic blocks 58 and the iron blocks 59 are adsorbed and fixed, making the cable harness more stable.

[0036] In the embodiments of the present invention, please refer to Figure 7 and Figure 8 The protective structure 6 includes a connecting ring 61, which is fixedly connected to the handle 3. The inner wall of the connecting ring 61 is slidably connected to a protective shell 62. The arc surface of the protective shell 62 is fixedly connected to a number of friction pads 64. The interior of the connecting ring 61 is provided with a number of card slots 65, which are engaged with the friction pads 64. When it is necessary to protect the probe body 1, the protective shell 62 is pulled to move, and then the protective shell 62 is aligned with the connecting ring 61, and then the protective shell 62 is inserted into the connecting ring 61. Then the connecting ring 61 squeezes and contracts the friction pad 64. After moving to the appropriate position, the friction pad 64 is fixed in the card slot 65. The protection can protect the probe body 1. The interior of the protective shell 62 is fixedly connected to a protective sleeve 63, which is a rubber sleeve. The protective sleeve 63 can protect the probe body 1 and avoid friction when protecting the probe body 1;

[0037] The working principle of a power semiconductor device voltage probe provided by the present invention is as follows: when it is necessary to bundle the connecting wire 4, the two limiting rings 51 are pulled to separate, and then the limiting ring 51 drives the telescopic tube 54 to move, and the telescopic tube 54 slides on the inner wall of the sleeve 53, and the telescopic tube 54 changes to another sleeve 53 to drive the spring 57 to stretch. After the two limiting rings 51 are separated to the appropriate position, the connecting wire 4 is placed between the connecting rings 61, and then the connecting ring 61 is loosened, and the spring 57 contracts to drive the telescopic tube 54 and the sleeve 53 to contract, and then the sleeve 53 is retracted into the two notches 55. The limiting ring 51 limits the connecting wire 4, and the protective pad 52 can protect the connecting wire 4 to avoid wear when protecting the connecting wire 4. The telescopic rod 56 can limit the spring 57 to avoid deformation of the spring 57 during use, thereby increasing the service life of the spring 57. After the spring 57 is contracted and fixed, the magnetic block 58 and the iron block 59 are adsorbed and fixed to make the bundle more stable.

[0038] When the probe body 1 needs to be protected, the protective shell 62 is pulled to move, and then the protective shell 62 is aligned with the connecting ring 61, and then the protective shell 62 is inserted into the connecting ring 61, and then the connecting ring 61 squeezes and contracts the friction pad 64. After moving to the appropriate position, the friction pad 64 is snapped into the card slot 65 for fixation. The protection can protect the probe body 1, and the protective cover 63 can protect the probe body 1 to avoid friction when protecting the probe body 1.

[0039] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0040] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A power semiconductor device voltage probe, characterized in that: include: A probe body (1) is provided, wherein a handle (3) is installed at the lower end of the probe body (1), a connecting wire (4) is fixedly connected to the lower end of the handle (3), a connector (2) is installed at the end of the connecting wire (4) away from the handle (3), a wire binding structure (5) is provided on the surface of the connecting wire (4), and the wire binding structure (5) comprises two limiting rings (51), the limiting rings (51) are arranged on the surface of the connecting wire (4), two telescopic tubes (54) are fixedly connected to the ends of the two limiting rings (51) close to each other, a sleeve (53) is installed at the ends of the two telescopic tubes (54) close to each other, a spring (57) is provided inside the sleeve (53) and the telescopic tube (54), and the two ends of the spring (57) are respectively connected to the sleeve (53) and the telescopic tube (54), and a notch (55) is provided at both ends of the limiting ring (51).

2. A power semiconductor device voltage probe according to claim 1, characterized in that: The inner wall of the limiting ring (51) is fixedly connected with a protective pad (52), and the protective pad (52) is a rubber pad.

3. The power semiconductor device voltage probe according to claim 1, characterized in that: A telescopic rod (56) is provided inside the sleeve (53) and the telescopic tube (54). The two ends of the telescopic rod (56) are fixedly connected to the sleeve (53) and the telescopic tube (54) respectively. The spring (57) is sleeved on the arc surface of the telescopic rod (56).

4. The power semiconductor device voltage probe according to claim 1, characterized in that: The size of the notch (55) is the same as that of the sleeve (53).

5. The power semiconductor device voltage probe according to claim 1, characterized in that: An iron block (59) is fixedly connected to the interior of the notch (55), and magnetic blocks (58) are fixedly connected to both ends of the sleeve (53), and the sizes of the magnetic blocks (58) and the iron block (59) are adapted.

6. The power semiconductor device voltage probe according to claim 1, characterized in that: The upper end of the handle (3) is provided with a protective structure (6), and the protective structure (6) includes a connecting ring (61), the connecting ring (61) is fixedly connected to the handle (3), the inner wall of the connecting ring (61) is slidably connected to a protective shell (62), the arc surface of the protective shell (62) is fixedly connected to a plurality of friction pads (64), and the interior of the connecting ring (61) is provided with a plurality of slots (65), and the slots (65) are engaged with the friction pads (64).

7. The power semiconductor device voltage probe according to claim 6, characterized in that: A protective sleeve (63) is fixedly connected to the interior of the protective shell (62), and the protective sleeve (63) is a rubber sleeve.

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