Capacitor without packaging shell

Abstract

The utility model discloses a capacitor without a packaging shell, which comprises a capacitor inner core and a leading-out electrode terminal of the capacitor inner core, and is characterized in that a capacitor packaging structure at the root part of the capacitor inner core and the leading-out electrode terminal of the capacitor inner core adopts a capacitor packaging structure without a packaging shell, which is formed by de-molding after epoxy pouring and curing; and a silicone oil covering layer is arranged on the outer peripheral surface of the de-molded packaging structure of the capacitor without the packaging shell. The overall size of a capacitor product can be reduced, the reasonable distribution of the use space of the capacitor product is effectively improved, the working heat dissipation performance of the capacitor is improved, the product cost is reduced, and the competitiveness of the capacitor product is improved.

Description

Technical Field

[0001] The utility model relates to a capacitor, in particular to a capacitor used in capacitor product packaging technology. Background Art

[0002] Typically, before a capacitor is put into use, its core and its lead electrodes need to be encapsulated and cured in a plastic shell, or encapsulated in a ceramic shell or polyester outer covering before it can be truly put into use in the final product. However, such packaging solutions increase the volume occupied by the capacitor after packaging, which is not conducive to the proper spatial distribution of the capacitor product during installation and use. It also reduces the effective air circulation and heat dissipation in the space after installation and use, which is not conducive to improving and ensuring the performance of the capacitor. On the other hand, due to the increased investment cost of the packaging shell or polyester outer covering, the overall cost of the capacitor product is ultimately higher, making it difficult to improve the competitiveness of the capacitor product. Utility Model Content

[0003] In order to solve the above-mentioned defects of existing capacitors such as increased volume after packaging, poor spatial distribution, poor heat dissipation, and high cost, the utility model provides a capacitor without a packaged shell, which can reduce the overall size of the capacitor product, effectively improve the reasonable distribution of the use space of the capacitor product, improve the working heat dissipation of the capacitor, reduce product costs, and enhance the competitiveness of the capacitor product.

[0004] The specific technical solution adopted by the present invention to solve the above-mentioned technical problems is: a non-encapsulated shell capacitor, including a capacitor core and its lead electrode terminals, characterized in that the capacitor core and the base of the lead electrode terminals are encapsulated by epoxy casting and curing followed by demolding to form a non-encapsulated shell capacitor encapsulation structure, and a silicone oil coating is provided on the outer peripheral surface of the demolded non-encapsulated shell capacitor encapsulation structure. The non-encapsulated shell capacitor encapsulation structure, formed by epoxy casting and curing followed by demolding, has a simple structure, and the silicone oil coating effectively improves the surface cleanliness and overall quality of the non-encapsulated shell capacitor encapsulation structure, thereby reducing the overall size of the capacitor product, effectively improving the reasonable distribution of the capacitor product's use space, improving the capacitor's working heat dissipation, reducing product costs, and enhancing the competitiveness of the capacitor product.

[0005] Preferably, the package structure of the capacitor without the package shell after demoulding has a curved surface structure at the edge of the finished product, thereby improving the arc transition of each corner area of ​​the formed capacitor product and avoiding the possibility of damage and scratches.

[0006] Preferably, the overall packaging structure of the unpackaged capacitor is a square or cylindrical structure. The cylindrical structure improves the efficiency of the installation space for the unpackaged capacitor product and improves the effectiveness of air circulation and heat dissipation in the installation space of the unpackaged capacitor product; the square structure improves the stability, reliability and effectiveness of the epoxy encapsulation molding of the unpackaged capacitor product.

[0007] Preferably, when the capacitor core comprises a plurality of cores, an insulating plate is provided between the plurality of capacitor cores, and a plurality of epoxy through-holes are distributed on the insulating plate. The epoxy through-holes not only enhance the overall strength of the capacitor product after epoxy encapsulation and curing, but also improve the efficiency and uniformity of epoxy flow before curing.

[0008] Preferably, the insulating plate is made of epoxy plate material to improve the insulation stability, reliability and effectiveness between capacitor core groups.

[0009] Preferably, the packaging structure of the capacitor without a packaging shell has a plurality of raised platform portions arranged in a row on two side surfaces.

[0010] The beneficial effects of the utility model are as follows: the packaging structure of the capacitor without an encapsulated shell is formed by demolding after epoxy pouring and curing, the structure is simple, the silicone oil covering layer effectively improves and ensures the surface neatness and overall quality level of the product of the packaging structure of the capacitor without an encapsulated shell, the overall size of the capacitor product can be reduced, the reasonable distribution of the use space of the capacitor product is effectively improved, the working heat dissipation of the capacitor is improved, the product cost is reduced, and the competitiveness of the capacitor product is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention will be described in further detail below with reference to the accompanying drawings and specific implementations.

[0012] Figure 1 This is a schematic diagram of the main structure of a capacitor without a packaging shell according to the present invention.

[0013] Figure 2 It is a three-dimensional structural diagram of a capacitor without a packaging shell according to the present invention.

[0014] Figure 3 It is a schematic structural diagram of a three-dimensional view of the capacitor without a packaging shell according to the utility model when viewed from another direction. DETAILED DESCRIPTION

[0015] Figure 1 、 Figure 2 、 Figure 3In the illustrated embodiment, a non-encapsulated capacitor includes a capacitor core 30 and its lead electrode terminal 20. The capacitor core 30 and the base portion 21 of the lead electrode terminal are encapsulated by epoxy casting and curing 10 followed by demolding. A silicone oil coating layer (not shown separately) is applied to the outer circumference of the demolded non-encapsulated capacitor encapsulation structure. The demolded non-encapsulated capacitor encapsulation structure has a curved edge. The overall non-encapsulated capacitor encapsulation structure is a square or cylindrical structure. The cylindrical structure improves the installation space efficiency and air circulation and heat dissipation within the installation space of the non-encapsulated capacitor. When the capacitor core 30 is a core assembly consisting of multiple cores, an insulating plate is installed between the multiple cores. The insulating plate is provided with a plurality of epoxy casting through-holes. These epoxy casting through-holes not only enhance the overall strength of the capacitor product after epoxy encapsulation and curing, but also ensure efficient and uniform epoxy circulation before curing. The insulating plate is made of epoxy board material. The distance between the outer surface of the epoxy encapsulation and the outer surface of the capacitor core is sufficient to ensure the firmness and safety of the epoxy-encapsulated capacitor. Generally, a safe thickness distance of 3 to 10 mm can be considered. The lead-out electrode terminal 20 can adopt a lead-out electrode screw structure. In combination with the installation of nuts, washers, spring washers and other fasteners that are not epoxy-encapsulated on the lead-out electrode screw (drawn in the figure, but not individually marked with number information), the capacitor product can be effectively installed and used. The packaging structure of the capacitor without an encapsulated shell has a number of raised platform portions 11 arranged in a row on both sides.

[0016] In the description of positional relationships in the present invention, terms such as "inside", "outside", "up", "down", "left", "right", etc. that indicate directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0017] The above content and structure describe the basic principles, main features, and advantages of the present invention, which should be understood by those skilled in the art. The above examples and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements are intended to be within the scope of the invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A capacitor without a package shell, comprising a capacitor core and its lead electrode terminals, characterized in that: The capacitor packaging structure of the capacitor core and the root of the lead-out electrode terminal adopts a non-encapsulated shell capacitor packaging structure formed by demoulding after epoxy pouring and curing, and a silicone oil covering layer is provided on the outer peripheral surface of the non-encapsulated shell capacitor packaging structure after demoulding.

2. The capacitor without a packaged housing according to claim 1, wherein: The packaging structure of the capacitor without the packaging shell after demoulding has a finished product edge arc surface structure.

3. The capacitor without a packaged housing according to claim 1, wherein: The packaging structure of the capacitor without a packaging shell is a square body structure or a cylindrical body structure as a whole.

4. The capacitor without a packaged housing according to claim 1, wherein: When the capacitor inner core adopts an inner core group composed of multiple inner cores, an insulating plate is provided between the multiple capacitor inner cores, and a plurality of epoxy casting through holes are distributed on the insulating plate.

5. The capacitor without a packaged case according to claim 4, wherein: The insulating board is made of epoxy board material.

6. The capacitor without a packaged case according to claim 1, wherein: The packaging structure of the capacitor without a packaging shell has a plurality of raised platform parts arranged in a row on two side surfaces.

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