Wafer expanding device and die bonding and packaging equipment

Abstract

The utility model relates to a wafer expanding device and wafer fixing and packaging equipment. The wafer expanding device comprises a wafer ring and a workbench, and the workbench drives the wafer ring to move in a horizontal plane; the crystal ring comprises a ring expanding fixing seat rotationally mounted on the workbench, the blue film is adhered to a loading jig, and the loading jig is placed at the upper end of the ring expanding fixing seat; the rotary correction unit is used for driving the expanded ring fixing seat to rotate so as to adjust the angle of the loading jig; the ring expanding pressing plate is installed on the periphery of the ring expanding fixing base to press the edge of the loading jig. The lifting unit is used for lifting the ring expanding pressing plate so as to link unfolding of the blue film, the positioning assembly is detachably arranged on the ring expanding fixing base and used for positioning the loading jig, and the positioning assembly used for positioning the loading jig is detachably installed on the ring expanding fixing base. And the positioning assembly is adjusted or replaced, so that the production and use requirements of wafers with different sizes can be met, and the adaptability of the whole equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a crystal expansion device and crystal bonding packaging equipment. Background Art

[0002] Die bonding, also known as chip mounting, uses colloid to bond the chip to the designated area of ​​the bracket to form a thermal or electrical path, providing conditions for subsequent wire bonding. It is mainly used for lead cabinet pressure plates of various gold wire ultrasonic welding equipment and various suction nozzles, ejectors, dispensing heads, porcelain nozzles, through needles, motors, carbon brushes, encoders, transmission belts and various spare parts and instruments of automated robots for various chip mounting equipment.

[0003] The crystal bonding equipment includes a crystal ring for film expansion. The crystal ring of the existing crystal bonding equipment is a fixed size. During actual production, it is necessary to expand the blue film with the chip pasted on the crystal ring of fixed size to ensure that the subsequent equipment can accurately identify the chip. For example, 8-inch wafers are commonly used. With the improvement of chip production technology, the size has also increased from the original 8 inches to 12-inch wafers. The existing crystal bonding equipment is not compatible with 8-inch and 12-inch wafers, and has limitations and cannot meet the production and use requirements of crystal rings of different sizes. Utility Model Content

[0004] The purpose of this utility model is to provide a crystal expansion device and a crystal solid packaging device, aiming to solve the problems of wafer size incompatibility, low efficiency and limitations in the above-mentioned technical problems, so as to improve the adaptability of fixed packaging equipment and improve fixed packaging efficiency.

[0005] The following technical solutions are used to solve the technical problems in this utility model:

[0006] A crystal expansion device, comprising:

[0007] Crystal ring, used to implement the expansion operation of the blue film;

[0008] A workbench, driving the crystal ring to move in a horizontal plane;

[0009] The crystal ring includes an expansion ring fixing seat, which is rotatably mounted on the workbench;

[0010] A loading jig, to which the blue film is adhered, and the loading jig is placed at the upper end of the ring expansion holder;

[0011] A rotation correction unit, used for driving the ring expansion holder to rotate and adjusting the angle of the loading fixture;

[0012] An expansion ring pressing plate is installed around the expansion ring fixing seat and presses the edge of the loading jig;

[0013] A lifting unit, used for lifting and lowering the ring expansion plate to link the expansion of the blue film;

[0014] Wherein, a positioning component is detachably provided on the expansion ring fixing seat, and the positioning component is used to implement positioning of the loading fixture.

[0015] The utility model also has the following technical features:

[0016] In one embodiment of the present invention, a lift pin is further included, which is arranged on the workbench and below the loading fixture to lift the chip on the blue film.

[0017] In one embodiment of the present invention, the positioning assembly includes at least two groups of positioning bars, which are arranged in parallel and spaced apart and are detachably connected to the upper end surface of the expansion ring fixing seat. The positioning bars are used to position both sides of the loading fixture.

[0018] In one embodiment of the present invention, the positioning assembly further comprises a positioning rod, the lower end of the positioning rod is detachably connected to the upper end surface of the expansion ring fixing seat, and the positioning rod is used to position one end of the loading fixture.

[0019] In one embodiment of the present invention, the expanding ring fixing seat is of tubular structure as a whole, a flange is provided on the lower end edge of the expanding ring fixing seat, and a plurality of groups of support bearings are provided at circumferential intervals at the lower end of the flange. The expanding ring fixing seat is rotatably mounted on the workbench through the plurality of groups of support bearings.

[0020] In one embodiment of the present invention, the ring expansion pressure plate and the ring expansion fixing seat tube end are arranged at intervals, and the gap between the ring expansion pressure plate and the ring expansion fixing seat tube end constitutes a gap for installing the loading fixture, and the positioning rod and the positioning bar are installed in the gap.

[0021] In one embodiment of the present invention, the rotation correction unit includes a correction gear ring arranged at the lower end pipe mouth of the expansion ring fixing seat, and a correction belt is arranged on the periphery of the correction gear ring. The power unit drives the correction gear ring to rotate and links the expansion ring fixing seat located on the workbench to rotate.

[0022] In one embodiment of the present invention, the lifting unit includes a lifting screw arranged on the lower plate surface of the ring expansion pressure plate, and multiple groups of the lifting screws are arranged at intervals along the circumferential direction of the ring expansion pressure plate. The upper end of the lifting screw is rotatably engaged with the lower plate surface of the ring expansion pressure plate, and the lower end of the lifting screw is engaged with the threaded hole on the ring expansion fixing seat, and the power unit drives the multiple groups of the lifting screws to rotate synchronously.

[0023] In one embodiment of the present invention, multiple groups of lifting screws are provided with pulleys, and multiple groups of pulleys cooperate with drive belts. The power unit includes a drive pulley, and the drive pulley is rotatably mounted on the expansion ring fixing seat. The drive pulley is provided with a driven gear, and the driven gear is combined with or separated from the driving structure, and the driving structure drives the driven gear to rotate.

[0024] Another object of the present invention is to provide a die-bonding packaging device, which includes the above-mentioned die-expanding device.

[0025] Compared with the existing technology, the beneficial effects of the present invention are reflected in: the blue film is pre-adhered to the loading jig, the loading jig is introduced into the crystal ring of the crystal expansion device by an automated manipulator, the expansion ring pressure plate of the crystal ring presses the edge of the loading jig, and the rotation correction unit is started to correct the angle of the loading jig in the horizontal plane, so that the chip to be installed on the blue film is in the set position, and by starting the lifting unit, the edge of the blue film is expanded downward, thereby facilitating the precise positioning of the chip to ensure the precise installation of the chip and the PCB board. The above-mentioned positioning component for the loading jig can be detachably installed on the expansion ring fixing seat. The positioning component can be adjusted or replaced according to wafers of different sizes. It is compatible with the production and use requirements of wafers of different sizes, thereby improving the adaptability of the entire equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the overall structure of a die-bonding packaging device in one embodiment of the present invention;

[0027] Figure 2 This is a schematic structural diagram of a crystal expansion device in one embodiment of the present invention;

[0028] Figure 3 This is a partial structural diagram of a crystal expansion device in one embodiment of the present invention;

[0029] Figure 4 and Figure 5 They are schematic diagrams of two perspectives of a partial structure of a crystal expansion device in one embodiment of the present invention;

[0030] Figure 6 This is a schematic structural diagram of a lifting device in one embodiment of the present invention;

[0031] Figure 7 This is a schematic structural diagram of a correction lens barrel in one embodiment of the present invention;

[0032] Figure 8 This is a schematic structural diagram of a crystal extraction lens barrel in one embodiment of the present invention;

[0033] Description of Figure Numbers:

[0034] 10. Crystal Ring;

[0035] 11. Expanding ring fixing seat; 111. Positioning strip parallel; 112. Positioning rod; 113. Support bearing; 114. Correction gear ring; 115. Correction belt;

[0036] 12. Ring expansion plate; 121. Lifting screw; 122. Pulley; 123. Drive belt; 124. Drive pulley; 125. Driven gear; 1251. Drive gear; 1252. Drive motor; 1253. Horizontal cylinder;

[0037] 13. Ejector; 131. Adjustment seat; 132. Ejector motor seat; 133. Ejector motor; 134. Sensor; 135. Eccentric shaft; 136. Ejector cap; 137. Air joint;

[0038] 20. Workbench; 21. Locking cylinder;

[0039] 30. Loading fixture;

[0040] 40. Correction lens barrel;

[0041] 50. Crystal extraction tube. DETAILED DESCRIPTION

[0042] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0043] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0044] It should be noted that the die bonding process is a key step in the semiconductor packaging process. Its main purpose is to precisely place the chip in the designated area of ​​the bracket and bond it with a colloid to form a thermal or electrical path, facilitating subsequent wire bonding. This process is crucial for fields such as LED packaging, chip semiconductor packaging, and precision camera mounting. Taking chip semiconductor packaging as an example, after the wafer is produced through the previous cutting process, there will be chips arranged in an array on the blue film. The chips are attached to the blue film, and the spacing between the chips is small. To ensure that the fixing equipment can accurately position the individual chips, it is necessary to increase the spacing between the chips on the blue film. This has led to the development of a process for expanding the blue film using a crystal ring. Because the blue film has a certain degree of deformation, the crystal expansion process causes the blue film to stretch and deform, thereby increasing the spacing between the chips, making it easier to scan the chips on the blue film through the positioning lens, thereby facilitating the positioning of the chips to be mounted. Since existing crystal expansion equipment can only expand the wafers of one type and has low adaptability, the present invention proposes a crystal expansion device, including: a crystal ring 10 for performing the expansion operation on the blue film. work; a workbench 20, driving the crystal ring 10 to move in a horizontal plane; the crystal ring 10 includes an expansion ring fixing seat 11, which is rotatably mounted on the workbench 20; a loading jig 30, to which the blue film is adhered, and the loading jig 30 is placed at the upper end of the expansion ring fixing seat 11; a rotation correction unit, for driving the expansion ring fixing seat 11 to rotate, and for adjusting the angle of the loading jig 30; an expansion ring pressure plate 12, mounted around the expansion ring fixing seat 11, and for pressing the edge of the loading jig 30; a lifting unit, for lifting and lowering the expansion ring pressure plate 12 to link the deformation and expansion of the blue film; wherein, a positioning component is detachably provided on the expansion ring fixing seat 11, and the positioning component is used to position the loading jig 30.

[0045] In one embodiment, see Figure 2 The arrow in the figure shows the translation direction of the loading jig 30. The blue film is pre-pasted on the loading jig 30. The loading jig 30 is in the shape of an elliptical sheet or other suitable shapes. There is a circular opening in the middle of the loading jig 30. After the blue film is pasted on the loading jig 30, the chip on the blue film is exposed at the circular opening position, which is convenient for the subsequent lifting device to lift the chip that needs to be mounted on the blue film.

[0046] In one embodiment, see Figure 3 、 Figure 4 and Figure 5The loading jig 30 with the blue film is stacked on the material rack. The single blue film can be horizontally transferred to the expansion ring fixing seat 11 by an automated manipulator, and the lifting unit is started to make the expansion ring pressure plate 12 descend. During the descent of the expansion ring pressure plate 12, the expansion ring fixing seat 11 is in a high position. In the process of the expansion ring pressure plate 12 pressing the loading jig 30, the expansion ring fixing seat 11 and the blue film are lifted, and then the blue film is unfolded, thereby increasing the distance between the chips, making it easier for the positioning lens to position the chip to be installed.

[0047] In one embodiment, since the loading jig 30 needs to be positioned by a positioning component when it is introduced above the expansion ring fixing seat 11, the sizes of the wafers are different, and the loading jigs 30 used to load the wafers are different in size. The positioning component can be replaced to position the loading jigs 30 of different sizes, thereby significantly enhancing the adaptability of the entire die-bonding packaging equipment, improving the production efficiency of the die-bonding packaging equipment, and reducing production costs.

[0048] In one embodiment, the expansion ring holder 11 included in the crystal ring 10 is rotatably mounted on the workbench 20. Since there is a positional error in the blue film of the loading jig 30 introduced into the expansion ring holder 11, the expansion ring holder 11 can be driven to rotate by a rotation correction unit, thereby fine-tuning the position of the blue film of the loading jig 30 in the horizontal plane, facilitating the scanning and positioning of the position of the chip to be installed by the positioning lens, and ensuring the installation accuracy of the chip and the PCB board.

[0049] In one embodiment, see Figure 2 In order to move the entire crystal ring 10 in the horizontal plane to ensure that the chip to be installed is always in the receiving position of the installation robot, the workbench 20 can drive the crystal ring 10 to move in the horizontal plane, and the crystal ring 10 can move in the X-axis direction and the Y-axis direction.

[0050] In a specific embodiment, the workbench 20 is composed of two groups of cross-shaped screw rods and nut webs, and the screw rods of the two groups of screw rods and nut webs are respectively connected to their respective drive motors. The workbench 20 is installed on a group of sliders above. The position of the chip to be installed is scanned and positioned by a positioning lens, thereby controlling the start and stop of the two groups of screw rods and nut webs so that the chip to be installed stays at the set robot receiving position.

[0051] In one embodiment, see Figure 7 and Figure 8 The positioning lens can be a correction lens barrel 40 and a crystal retrieval lens barrel 50 installed above the crystal ring 10, wherein the correction lens barrel 40 includes a correction lens barrel adjustment seat, a correction lens barrel, a correction CCD and a light source; the crystal retrieval lens barrel 50 includes a crystal retrieval adjustment seat, a crystal retrieval lens barrel, a crystal retrieval CCD and a light source.

[0052] In one embodiment, see Figure 1 A lifting device for lifting the chip to be mounted on the blue film is also provided inside the expansion ring fixing seat 11 of the crystal ring 10. The lifting device includes a lifting pin 13. The lifting pin 13 is provided on the workbench 20 and is located below the loading fixture 30 to lift the chip on the blue film.

[0053] In one embodiment, see Figure 6 The lifting device also includes an adjusting seat 131, a pin motor seat 132 is installed on the top of the adjusting seat 131, a pin motor 133 is installed on the left side of the pin motor seat 132, and a sensor 134 is installed on the right side. An eccentric shaft 135 is installed on the top of the pin motor 133, a pin cap 136 is installed on the top of the eccentric shaft 135, and an air joint 137 is installed at the lower rear part of the pin cap. The pin 13 is used to separate the chip from the crystal ring blue film.

[0054] In one embodiment, in order to ensure the positioning of both sides of the loading jig 30 so that the loading jig 30 is within the area defined by the positioning assembly, the positioning assembly includes at least two groups of positioning bars 111, and the positioning bars 111 are arranged in parallel and spaced apart and are detachably connected to the upper end surface of the expansion ring fixing seat 11. The positioning bars 111 are used to implement the positioning of both sides of the loading jig 30.

[0055] An automated manipulator can be used to extract a single loading jig 30 from a feed box stacked with loading jigs 30 and horizontally transfer it to the ring-expanding fixture 11. Flat surfaces are provided on both sides of the loading jig 30, and two sets of positioning bars 111 are used to clamp the flat surfaces on both sides of the loading jig 30, thereby performing preliminary positioning of the loading jig 30. The position of the positioning bar 111 on the upper end surface of the ring-expanding fixture 11 can be adjusted according to the different sizes of loading jigs 30, thereby adjusting the distance between the two sets of positioning bars 111 to adapt to the preliminary positioning of loading jigs 30 of different sizes.

[0056] In one embodiment, see Figure 4 and Figure 5 The positioning assembly further includes a positioning rod 112 , the lower end of which is detachably connected to the upper end surface of the expansion ring fixing seat 11 , and the positioning rod 112 is used to position one end of the loading fixture 30 .

[0057] See Figure 4The end face of the loading jig 30 is provided with a positioning plane. When the automated manipulator horizontally transfers the single-wafer loading jig 30 to the expansion ring fixing seat 11, the positioning plane of the end face of the loading jig 30 abuts against the positioning rod 112, thereby achieving further positioning of the loading jig 30 to ensure that the blue film on the entire loading jig 30 is located at a set position on the crystal ring 10. In a specific embodiment, the positioning rod 112 can be a threaded rod, and the positioning rod 112 is detachably connected to the expansion ring fixing seat 11. At least two groups of positioning rods 112 are arranged at intervals on the plane to ensure precise positioning of the loading jig 30.

[0058] In one embodiment, in order to ensure that the expansion ring fixing seat 11 can be rotatably connected to the workbench 20, the expansion ring fixing seat 11 is generally tubular in structure, and a flange is provided on the lower end edge of the expansion ring fixing seat 11. A plurality of groups of support bearings 113 are circumferentially spaced at the lower end of the flange. The expansion ring fixing seat 11 is rotatably mounted on the workbench 20 through the plurality of groups of support bearings 113.

[0059] In one embodiment, the support bearings 113 may be end bearings and are spaced apart along the circumferential direction of the lower end surface of the expansion ring fixing seat 11 . The number of the support bearings 113 may be 4 groups or 6 groups.

[0060] In one embodiment, the ring expansion pressure plate 12 and the pipe end of the ring expansion fixing seat 11 are arranged at intervals, and the gap between the ring expansion pressure plate 12 and the pipe end of the ring expansion fixing seat 11 constitutes a gap for installing the loading fixture 30, and the positioning rod 112 and the positioning bar 111 are installed in the gap.

[0061] In one embodiment, before the automated manipulator horizontally transfers the single-wafer loading jig 30 to the expanding ring fixing seat 11, the expanding ring pressure plate 12 is in a high position, and then the automated manipulator horizontally transfers the single-wafer loading jig 30 to the gap between the expanding ring pressure plate 12 and the tube end of the expanding ring fixing seat 11, and positions the single-wafer loading jig 30 through the positioning component, and the lower end surface of the single-wafer loading jig 30 abuts against the tube mouth position of the expanding ring fixing seat 11 for subsequent angle adjustment, and then starts the lifting unit to lower the expanding ring pressure plate 12, thereby linking the loading jig 30 to lower. Since the expanding ring fixing seat 11 remains stationary in the vertical plane, the expanding ring pressure plate 12 links the loading jig 30 to lower, which can cause the blue film on the loading jig 30 to deform and expand, thereby expanding the distance between the chips within the tube cavity range of the expanding ring fixing seat 11, facilitating the correction and position identification of the chips by the above-mentioned correction lens barrel 40 and the crystal retrieval lens barrel 50, and timely adjusting the position of the chips.

[0062] In one embodiment, see Figure 4 and Figure 5In order to implement the rotational drive of the ring expansion fixing seat 11 on the workbench 20, the rotation correction unit includes a correction gear ring 114 arranged at the lower end pipe mouth of the ring expansion fixing seat 11, and a correction belt 115 is arranged on the periphery of the correction gear ring 114. The power unit drives the correction gear ring 114 to rotate and links the ring expansion fixing seat 11 on the workbench 20 to rotate.

[0063] In one embodiment, the correction gear ring 114 is coaxially arranged with the ring expansion fixing seat 11, the correction belt 115 is a rubber synchronous belt, the power unit includes a power pulley arranged on the workbench 20, and a group of driven pulleys can be coaxially installed on the power pulley. The driven pulley is connected to the output shaft of the power motor through a synchronous belt. By starting the power motor, the synchronous rotation fine-tuning of the ring expansion fixing seat 11 can be implemented.

[0064] In one embodiment, see Figure 5 The lifting unit includes a lifting screw 121 arranged on the lower plate surface of the ring expansion pressure plate 12. The lifting screw 121 is arranged in multiple groups at intervals along the circumferential direction of the ring expansion pressure plate 12. The upper end of the lifting screw 121 rotates with the lower plate surface of the ring expansion pressure plate 12, and the lower end of the lifting screw 121 cooperates with the threaded hole on the ring expansion fixing seat 11. The power unit drives the multiple groups of lifting screws 121 to rotate synchronously.

[0065] In one embodiment, at least four groups of lifting screws 121 are provided in the circumferential direction of the lower plate surface of the ring expansion pressure plate 12. The four groups of lifting screws 121 are rotatably connected with the lower plate surface of the ring expansion pressure plate 12 through bearings. By starting the power unit, the multiple groups of lifting screws 121 rotate synchronously, and then the lifting screws 121 are extended into the threaded holes on the ring expansion fixing seat 11, so that the entire ring expansion pressure plate 12 is lowered to implement the crystal expansion operation of the blue film.

[0066] In one embodiment, see Figure 4 and Figure 5 , multiple groups of lifting screws 121 are each provided with a pulley 122, and multiple groups of pulleys 122 cooperate with a driving belt 123. The power unit includes a driving pulley 124, and the driving pulley 124 is rotatably mounted on the expansion ring fixing seat 11. A driven gear 125 is provided on the driving pulley 124, and the driven gear 125 is combined with or separated from the driving structure, and the driving structure drives the driven gear 125 to rotate.

[0067] In one embodiment, see Figure 4 and Figure 5The driving structure includes a driving gear 1251 engaged with the driven gear 125, and the driving gear 1251 is connected to the output shaft of the driving motor 1252. The driving motor 1252 is installed on the piston rod of the horizontal cylinder 1253. When the rotation correction unit needs to be started, the horizontal cylinder 1253 drives the driving gear 1251 away from the driven gear 125 to avoid the driving gear 1251 interfering with the rotation fine-tuning of the entire expansion ring fixing seat 11. When the expansion ring fixing seat 11 is corrected, the horizontal cylinder 1253 is started, so that the driving gear 1251 is engaged with the driven gear 125, and the driving motor 1252 is started, so that the lifting screw 121 is extended into the threaded hole on the expansion ring fixing seat 11, so that the entire expansion ring pressure plate 12 is lowered to implement the crystal expansion operation of the blue film.

[0068] In one embodiment, in order to prevent the entire ring expansion fixing seat 11 from rotating when the driving motor 1252 drives the lifting screw 121 to rotate, a locking cylinder 21 is provided on the workbench 20. The locking cylinder 21 is arranged horizontally. By starting the locking cylinder 21, the piston rod end of the locking cylinder 21 is plugged into the notch on the ring expansion fixing seat 11, thereby implementing the clamping and positioning of the ring expansion fixing seat 11 to prevent the ring expansion fixing seat 11 from rotating unnecessarily.

[0069] The present invention also proposes a solid crystal packaging device, which includes a crystal expansion device. The solid crystal packaging device can realize full automation of the solid crystal process by integrating the crystal expansion device, thereby improving production efficiency and reducing labor costs. By starting the lifting unit, the edge of the blue film is expanded downward, thereby facilitating accurate positioning of the chip to ensure accurate installation of the chip and the PCB board. The positioning component for implementing the loading fixture 30 is detachably mounted on the expansion ring fixing seat 11. The positioning component can be adjusted or replaced according to wafers of different sizes, and can be compatible with the production and use requirements of wafers of different sizes, thereby improving the adaptability of the entire device. The specific structure of the crystal expansion device refers to the above-mentioned embodiment. Since the present solid crystal packaging device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0070] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0071] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A crystal expansion device, characterized in that: include: Crystal ring, used to implement the expansion operation of the blue film; A workbench, driving the crystal ring to move in a horizontal plane; The crystal ring includes an expansion ring fixing seat, which is rotatably mounted on the workbench; A loading jig, to which the blue film is adhered, and the loading jig is placed at the upper end of the ring expansion holder; A rotation correction unit, used for driving the ring expansion holder to rotate and adjusting the angle of the loading fixture; An expansion ring pressing plate is installed around the expansion ring fixing seat and presses the edge of the loading jig; A lifting unit, used for lifting and lowering the ring expansion plate to link the expansion of the blue film; Wherein, a positioning component is detachably provided on the expansion ring fixing seat, and the positioning component is used to implement positioning of the loading fixture.

2. The crystal expansion device according to claim 1, wherein: It also includes a lift pin, which is arranged on the workbench and below the loading fixture to lift the chip on the blue film.

3. The crystal expansion device according to claim 1, wherein: The positioning assembly includes at least two groups of positioning bars, which are arranged in parallel and spaced apart and are detachably connected to the upper end surface of the expansion ring fixing seat. The positioning bars are used to position both sides of the loading fixture.

4. The crystal expansion device according to claim 3, wherein: The positioning assembly further includes a positioning rod, the lower end of which is detachably connected to the upper end surface of the expansion ring fixing seat, and the positioning rod is used to position one end of the loading fixture.

5. The crystal expansion device according to claim 4, characterized in that: The expanding ring fixing seat is generally tubular in structure, with a flange provided on the lower end edge of the expanding ring fixing seat, and multiple sets of support bearings are circumferentially spaced at the lower end of the flange. The expanding ring fixing seat is rotatably mounted on the workbench through the multiple sets of support bearings.

6. The crystal expansion device according to claim 5, characterized in that: The ring expansion pressure plate and the ring expansion fixing seat tube end are arranged at intervals, and the gap between the ring expansion pressure plate and the ring expansion fixing seat tube end constitutes a gap for installing the loading fixture, and the positioning rod and the positioning bar are installed in the gap.

7. The crystal expansion device according to claim 1, wherein: The rotation correction unit includes a correction gear ring arranged at the lower end pipe mouth of the expansion ring fixing seat, and a correction belt is arranged on the periphery of the correction gear ring. The power unit drives the correction gear ring to rotate and links the expansion ring fixing seat on the workbench to rotate.

8. The crystal expansion device according to claim 1, wherein: The lifting unit includes a lifting screw arranged on the lower plate surface of the ring expansion pressure plate. The lifting screws are arranged in multiple groups at intervals along the circumferential direction of the ring expansion pressure plate. The upper end of the lifting screw is rotatably engaged with the lower plate surface of the ring expansion pressure plate, and the lower end of the lifting screw is engaged with the threaded hole on the ring expansion fixing seat. The power unit drives the multiple groups of lifting screws to rotate synchronously.

9. The crystal expansion device according to claim 8, characterized in that: Multiple groups of lifting screws are provided with pulleys, and multiple groups of pulleys cooperate with drive belts. The power unit includes a drive pulley, and the drive pulley is rotatably mounted on the expansion ring fixing seat. The drive pulley is provided with a driven gear, and the driven gear is combined with or separated from the driving structure, and the driving structure drives the driven gear to rotate.

10. Die bonding packaging equipment, characterized by: The die-bonding packaging equipment includes the die-expanding device according to any one of claims 1 to 9.

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