Laser pump module heat dissipation device and laser
By introducing a two-stage cooling structure consisting of a water-cooled plate and a semiconductor refrigeration sheet into the laser pump module, the problem of limited heat dissipation in the water-cooled mode is solved, and the laser power density is increased and the chip temperature is stabilized without increasing the volume, thereby improving the stability of the equipment.
Patent Information
- Application Number
- CN202422374960.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The water cooling mode of existing lasers has limited heat dissipation, which leads to an increase in the size of the laser and cannot effectively prevent excessive fluctuations in the chip junction temperature, affecting the stability of the equipment.
A laser pump module heat dissipation device is used, including a water-cooling plate, a pump module and a semiconductor refrigeration plate. By setting grooves on the water-cooling plate and the pump module, heat is transferred on both sides of the semiconductor refrigeration plate to achieve two-stage cooling. The temperature difference is used to increase the cooling capacity and keep the chip junction temperature constant.
Without increasing the volume of the laser, the power density of the pump module is increased, and the chip temperature is effectively stabilized to prevent junction temperature fluctuations and improve the performance of the equipment.
Smart Images
Figure CN223309400U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device for a laser pump module and a laser. Background Art
[0002] As laser power increases, the heat generated by laser chips also increases. Water cooling is the most common cooling method in the current laser market, and this method often uses an external water chiller. However, water cooling has its limitations. To further increase the power of a laser, the only way is to increase the number of laser pumps, rather than increasing the power density of a single pump. To improve the heat dissipation effect, the only way is to increase the water cooling area, which results in an increasingly larger laser. Furthermore, water cooling alone cannot prevent excessive temperature fluctuations in the chip junction within the pump module. Utility Model Content
[0003] Therefore, it is necessary to provide a laser pump module heat dissipation device and laser to address the technical problem that existing water cooling methods have limited heat dissipation. To improve heat dissipation, the only way is to increase the water cooling area, resulting in an increasingly large laser. Water cooling alone cannot prevent excessive temperature fluctuations in the chip junction of the pump module.
[0004] In a first aspect, the present invention provides a laser pump module heat dissipation device, the laser pump module heat dissipation device comprising:
[0005] The water cooling plate is provided with a first groove;
[0006] The pump module is provided with a second groove;
[0007] The semiconductor refrigeration plate includes a first surface and a second surface, wherein the first surface is in contact with the groove surface of the first groove, and the second surface is in contact with the groove surface of the second groove, so that the heat generated by the pump module is transferred from the second surface to the first surface, and the heat of the first surface is transferred to the water cooling plate.
[0008] In one embodiment, the depth of the first groove is 30% to 70% of the thickness of the semiconductor refrigeration plate.
[0009] In one embodiment, the laser pump module heat dissipation device further includes a first heat conducting layer and a second heat conducting layer, the first surface is coated with the first heat conducting layer, and the second surface is coated with the second heat conducting layer.
[0010] In one embodiment, the sum of the depths of the first groove and the second groove is equal to the thickness of the semiconductor refrigeration plate.
[0011] In one embodiment, the size of the first groove is equal to or greater than the size of the semiconductor refrigeration plate.
[0012] In one embodiment, the size of the second groove is equal to or greater than the size of the semiconductor refrigeration plate.
[0013] In one embodiment, the body of the pump module is a structural component made of copper or aluminum alloy.
[0014] In one embodiment, the pump module includes a housing and a chip, and the chip is installed in the housing.
[0015] In one embodiment, the water-cooling plate includes a plate body, a water inlet and a water outlet. The plate body is provided with a water channel, one end of the water channel is connected to the water inlet, and the other end is connected to the water outlet.
[0016] In a second aspect, the present invention further provides a laser, which includes the laser pump module heat dissipation device of any of the above embodiments.
[0017] The implementation of the present invention will have the following beneficial effects:
[0018] The laser pump module heat dissipation device and laser of the present invention are adopted. The water-cooling plate of the laser pump module heat dissipation device is provided with a first groove, the pump module is provided with a second groove, and the semiconductor refrigeration plate includes a first surface and a second surface. The first surface is in contact with the groove surface of the first groove, and the second surface is in contact with the groove surface of the second groove, so that the heat generated by the pump module is transferred from the second surface to the first surface, and the heat of the first surface is transferred to the water-cooling plate, thereby realizing two-stage refrigeration. Since the cooling capacity of the semiconductor refrigeration plate changes according to the temperature difference between the first surface and the second surface, the greater the temperature difference, the greater the cooling capacity. Therefore, the greater the power of the pump module, the greater the cooling capacity of the semiconductor refrigeration plate, so that the power density of a single pump module is increased without changing the volume of the laser, so that the chip junction temperature of the pump module is maintained at a constant temperature to improve the use effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0020] in:
[0021] Figure 1 Schematic diagram of an axonometric view of a heat dissipation device for a laser pump module in one embodiment.
[0022] Figure 2 for Figure 1 Exploded view of the heat sink for the laser pump module shown.
[0023] Reference numerals:
[0024] 1. Water-cooled plate; 11. First groove; 12. Plate body; 13. Water inlet; 14. Water outlet;
[0025] 2. Pump module; 21. Second groove; 22. Housing; 23. Chip;
[0026] 3. Semiconductor cooling plate; 31. First surface; 32. Second surface. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.
[0029] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.
[0030] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.
[0031] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention can be combined with each other.
[0032] Please combine Figures 1 to 2 Now, the heat dissipation device of the laser pump module 2 provided by the present invention is described. The heat dissipation device of the laser pump module 2 is used in the laser.
[0033] The heat dissipation device of the laser pump module 2 includes a water-cooling plate 1, a pump module 2 and a semiconductor refrigeration plate 3. The water-cooling plate 1 is provided with a first groove 11, the pump module 2 is provided with a second groove 21, and the semiconductor refrigeration plate 3 includes a first surface 31 and a second surface 32. The first surface 31 is in contact with the groove surface of the first groove 11, and the second surface 32 is in contact with the groove surface of the second groove 21, so that the heat generated by the pump module 2 is transferred from the second surface 32 to the first surface 31, and the heat of the first surface 31 is transferred to the water-cooling plate 1.
[0034] It can be understood that the water-cooling plate 1 of the heat dissipation device of the laser pump module 2 is provided with a first groove 11, the pump module 2 is provided with a second groove 21, and the semiconductor refrigeration plate 3 includes a first surface 31 and a second surface 32. The first surface 31 is in contact with the groove surface of the first groove 11, and the second surface 32 is in contact with the groove surface of the second groove 21, so that the heat generated by the pump module 2 is transferred from the second surface 32 to the first surface 31, and the heat of the first surface 31 is transferred to the water-cooling plate 1, thereby realizing two-stage refrigeration. Since the cooling capacity of the semiconductor refrigeration plate 3 changes according to the temperature difference between the first surface 31 and the second surface 32, the greater the temperature difference, the greater the cooling capacity. Therefore, the greater the power of the pump module 2, the greater the cooling capacity of the semiconductor refrigeration plate 3, so that the power density of the single pump module 2 is increased without changing the volume of the laser, so that the junction temperature of the chip 23 of the pump module 2 is maintained at a constant temperature to improve the use effect.
[0035] In addition, due to the two-stage cooling achieved by setting up the semiconductor refrigeration plate 3 and the water-cooled plate 1, the cooling capacity of the water-cooled machine can be reduced, and the cooling capacity of the water-cooled machine can be maximized, thereby avoiding waste caused by selecting an overly large water-cooled machine.
[0036] Since the junction temperature of the chip 23 of the pump module 2 is maintained at a constant temperature, damage to the laser device and unstable light output caused by excessive fluctuations in the junction temperature of the chip 23 in the pump module 2 are prevented.
[0037] In this embodiment, the depth of the first groove 11 is 30% to 70% of the thickness of the semiconductor cooling chip 3. In some embodiments, the depth of the first groove 11 is 30%, 40%, 50%, 60%, or 70% of the thickness of the semiconductor cooling chip 3. Preferably, the depth of the first groove 11 is 50% of the thickness of the semiconductor cooling chip 3. This allows the semiconductor cooling chip 3 to be installed in the first groove 11, with the half structure being the best fixed and the force applied evenly on both sides, so that the first surface 31 can fit the groove surface of the first groove 11.
[0038] During implementation, the depth of the second groove 21 is fifty percent of the thickness of the semiconductor refrigeration plate 3, so that half of the semiconductor refrigeration plate 3 can be set in the first groove 11 and the other half can be set in the second groove 21, so that the first surface 31 can be in contact with the groove surface of the first groove 11, and the second surface 32 can be in contact with the groove surface of the second groove 21.
[0039] Furthermore, the heat dissipation device for the laser pump module 2 also includes a first thermally conductive layer and a second thermally conductive layer. The first surface 31 is coated with the first thermally conductive layer, and the second surface 32 is coated with the second thermally conductive layer. The first and second thermally conductive layers can be made of TIM materials (thermal interface materials), which can increase thermal conductivity and thus improve the heat dissipation of the pump module 2. This allows the heat from the chip 23 of the pump module 2 to be better transferred from the second surface 32 to the first surface 31. The heat from the first surface 31 is then transferred to the water cooling plate 1, thereby reducing the temperature of the chip 23.
[0040] Furthermore, the combined depth of the first groove 11 and the second groove 21 is equal to the thickness of the semiconductor cooling plate 3. This allows the semiconductor cooling plate 3 to be mounted on the water-cooling plate 1 and positions the pump module 2. Furthermore, this ensures that the pump module 2 fits tightly against the water-cooling plate 1.
[0041] Specifically, the size of the first groove 11 is equal to or larger than that of the semiconductor cooling chip 3. This allows the semiconductor cooling chip 3 to fit into the first groove 11. A slight gap is left between the first groove 11 and the semiconductor cooling chip 3 to facilitate installation. However, the gap should not be too large, as it may cause the semiconductor cooling chip 3 to shift. In practice, the gap size is generally less than or equal to 0.3 mm.
[0042] The size of the second groove 21 is equal to or larger than that of the semiconductor cooling chip 3. This allows the semiconductor cooling chip 3 to fit into the second groove 21. A slight gap is left between the second groove 21 and the semiconductor cooling chip 3 to facilitate installation. However, the gap should not be too large, as it may cause the semiconductor cooling chip 3 to shift. In practice, the gap size is generally less than or equal to 0.3 mm.
[0043] In one embodiment, if Figure 2 As shown, the body of the pump module 2 is a structural member made of copper or aluminum alloy. Compared with the prior art which mostly uses copper, the body of the pump module 2 is made of aluminum alloy, which can reduce production costs.
[0044] In one embodiment, if Figure 1As shown, the pump module 2 includes a housing 22 and a chip 23, with the chip 23 mounted in the housing 22. The housing 22 protects the chip 23. The heat of the chip 23 is transferred to the second surface 32 through the housing 22. The heat from the second surface 32 is transferred to the first surface 31, and the heat from the first surface 31 is transferred to the water-cooling plate 1, thereby dissipating the heat of the chip 23 and maintaining the chip 23 at a constant temperature.
[0045] In one embodiment, if Figure 2 As shown, the water-cooled plate 1 includes a plate body 12, a water inlet 13, and a water outlet 14. The plate body 12 is provided with a water channel, one end of which is connected to the water inlet 13 and the other end is connected to the water outlet 14. Thus, cooling water entering the water inlet 13 flows out of the water channel through the water outlet 14, so that the cooling water in the water channel is kept circulating, thereby continuously cooling the first surface 31.
[0046] The utility model further provides a laser, which includes the heat dissipation device of the laser pump module 2 according to any one of the above embodiments.
[0047] It can be understood that the laser of the present invention uses the above-mentioned laser pump module 2 heat dissipation device, the water-cooling plate 1 of the laser pump module 2 heat dissipation device is provided with a first groove 11, the pump module 2 is provided with a second groove 21, and the semiconductor refrigeration plate 3 includes a first surface 31 and a second surface 32, the first surface 31 is attached to the groove surface of the first groove 11, and the second surface 32 is attached to the groove surface of the second groove 21, so that the heat generated by the pump module 2 is transferred from the second surface 32 to the first surface 31, and the heat of the first surface 31 is transferred to the water-cooling plate 1, thereby realizing two-stage refrigeration. Since the cooling capacity of the semiconductor refrigeration plate 3 changes according to the temperature difference between the first surface 31 and the second surface 32, the greater the temperature difference, the greater the cooling capacity. Therefore, the greater the power of the pump module 2, the greater the cooling capacity of the semiconductor refrigeration plate 3, so that the power density of the single pump module 2 is increased without changing the volume of the laser, so that the junction temperature of the chip 23 of the pump module 2 is maintained at a constant temperature to improve the use effect.
[0048] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0049] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope covered by the present invention.
Claims
1. A laser pump module heat dissipation device, characterized in that: The laser pump module heat dissipation device comprises: The water cooling plate is provided with a first groove; The pump module is provided with a second groove; The semiconductor refrigeration plate includes a first surface and a second surface, wherein the first surface is in contact with the groove surface of the first groove, and the second surface is in contact with the groove surface of the second groove, so that the heat generated by the pump module is transferred from the second surface to the first surface, and the heat of the first surface is transferred to the water cooling plate.
2. The laser pump module heat dissipation device according to claim 1, characterized in that: The depth of the first groove is 30% to 70% of the thickness of the semiconductor refrigeration plate.
3. The laser pump module heat dissipation device according to claim 1 or 2, characterized in that: The laser pump module heat dissipation device further includes a first heat conducting layer and a second heat conducting layer. The first surface is coated with the first heat conducting layer, and the second surface is coated with the second heat conducting layer.
4. The laser pump module heat dissipation device according to claim 1, characterized in that: The sum of the depths of the first groove and the second groove is equal to the thickness of the semiconductor refrigeration plate.
5. The laser pump module heat dissipation device according to claim 1, characterized in that: The size of the first groove is equal to or larger than the size of the semiconductor refrigeration plate.
6. The laser pump module heat dissipation device according to claim 1, characterized in that: The size of the second groove is equal to or larger than the size of the semiconductor refrigeration plate.
7. The laser pump module heat dissipation device according to claim 1, characterized in that: The body of the pump module is a structural component made of copper or aluminum alloy.
8. The laser pump module heat dissipation device according to claim 1, characterized in that: The pump module includes a housing and a chip, wherein the chip is installed in the housing.
9. The laser pump module heat dissipation device according to claim 1, characterized in that: The water cooling plate includes a plate body, a water inlet and a water outlet. The plate body is provided with a water channel, one end of the water channel is connected to the water inlet, and the other end is connected to the water outlet.
10. A laser, characterized in that: The laser comprises the laser pump module heat dissipation device according to any one of claims 1 to 9.