Wafer chopper mechanism and splitting equipment

Abstract

The utility model provides a wafer chopper mechanism and splitting equipment, the chopper mechanism comprises a driving assembly, a bearing part, a first chopper and a second chopper, the bearing part is in driving connection with the driving assembly, and the driving assembly is defined to drive the bearing part to move along a first direction; the first chopper is arranged at the free end of the bearing part in the first direction, and the blade of the first chopper protrudes out of the bearing part towards the first direction; the second chopper is movably connected to the bearing part and has a first state and a second state; when the second chopper is in the first state, the cutting edge of the second chopper and the cutting edge of the first chopper are collinear; when the second chopper is in the second state, the cutting edge of the second chopper returns to the position not protruding out of the cutting edge of the first chopper in the first direction. When the length of the to-be-split part of the wafer is within a certain numerical value, the first chopper is independently used for splitting; if the numerical value is exceeded, the first chopper and the second chopper are controlled to be used cooperatively.

Description

Technical Field

[0001] The present application belongs to the field of wafer splitting technology, and more specifically, relates to a wafer splitting knife mechanism and a wafer splitting device. Background Art

[0002] With the development of the chip manufacturing field, reducing costs and increasing efficiency have always been pursued by chip manufacturers. Currently, chip manufacturers want to use the splitting equipment that processes smaller wafers to split larger wafers, so as to increase production capacity without the need to customize new splitting equipment.

[0003] In the single-blade and single-motion axis splitting equipment solution disclosed in the related technology, since the iron ring that carries smaller-sized wafers is used to carry larger-sized wafers, the working range of the splitting knife mechanism in the splitting equipment will be expanded during the splitting process. When splitting the part of the wafer close to the iron ring, the splitting knife and the iron ring will interfere with each other, affecting the splitting process.

[0004] In the multi-blade and multi-motion axis splitting equipment solution disclosed in the related technology, a large space must be left in the horizontal direction of the splitting knife mechanism of the splitting device to switch the motion axes of different splitting knives. The upper half of the equipment structure occupies a larger space, while the lower half occupies a smaller space. The large space difference between the upper and lower halves leads to waste, and the multi-blade and multi-motion axis splitting knife mechanism setting has a high structural cost and usage.

[0005] In summary, how to improve the versatility of splits at a lower cost is an urgent problem to be solved. Utility Model Content

[0006] The present application provides a wafer splitting knife mechanism that can improve wafer splitting versatility at a lower cost.

[0007] The technical solution adopted in this application is: to provide a wafer splitting knife mechanism, including a driving assembly, a carrier, a first splitting knife and a second splitting knife, the carrier being drivably connected to the driving assembly, and defining that the driving assembly can drive the carrier to move along a first direction; the first splitting knife is arranged at the free end of the carrier along the first direction, and the blade of the first splitting knife protrudes from the carrier in the first direction; the second splitting knife can be movably connected to the carrier and has a first state and a second state; when the second splitting knife is in the first state, the blade of the second splitting knife is collinear with the blade of the first splitting knife; when the second splitting knife is in the second state, the blade of the second splitting knife retracts along the first direction to a point where it does not protrude from the blade of the first splitting knife.

[0008] Furthermore, when the second cleaver is in the first state, a distance between the blade of the second cleaver and the blade of the first cleaver along the blade length direction is less than or equal to 5 microns.

[0009] Furthermore, the blade length of the second riving knife is less than or equal to the blade length of the first riving knife.

[0010] Furthermore, a second direction is defined, the second direction forms an angle with the first direction, the blade of the second cleaver and the blade of the first cleaver are oriented in the same direction, and the second cleaver is movably arranged along the second direction; during the process of the second cleaver moving from the first state to the second state along the second direction, the second cleaver moves simultaneously along the first direction and along the blade length direction of the first cleaver, and moves away from the first cleaver.

[0011] Furthermore, the cleaving knife mechanism also includes a driving member and a carrier, the driving member is arranged on the carrier, the driving member is drivably connected to the carrier, the second cleaving knife is connected to the carrier, and the driving member drives the carrier to synchronously drive the second cleaving knife to move; wherein, the carrier and the driving member are movably and adjustably connected.

[0012] Furthermore, the carrier is provided with a movable and adjustable supporting member, which can be movably supported on the driving member. Controlling the supporting member to move and support the driving member can adjust the distance between the corresponding parts of the carrier and the driving member, thereby correspondingly adjusting the position of the second cleaver relative to the first cleaver.

[0013] Furthermore, the cleaving knife mechanism also includes a third cleaving knife, which is movably connected to the supporting member and has a third state and a fourth state. When the third cleaving knife is in the third state, the blade of the third cleaving knife is collinear with the blade of the first cleaving knife. When the third cleaving knife is in the fourth state, the blade of the third cleaving knife retracts along the first direction until it does not protrude beyond the blade of the first cleaving knife.

[0014] Furthermore, the blade length of the third riving knife is less than or equal to the blade length of the first riving knife, and greater than or equal to the blade length of the second riving knife.

[0015] Furthermore, the blade length of the first cleaver is set to 150 mm, the blade length of the second cleaver is set to 50 mm, and the blade length of the third cleaver is set to 110 mm.

[0016] The present application also provides a splitting device, which includes a frame, a carrier and the splitting knife mechanism of any of the above embodiments, the carrier is arranged on the frame, the splitting knife mechanism is suspended above the carrier, and is movably arranged on the frame; when the splitting knife mechanism is moved to a splitting position corresponding to the carrier, the driving component is controlled to drive the carrier to move along the first direction close to the carrier, so that the first splitting knife or the first splitting knife cooperates with the second splitting knife to split the wafer carried by the carrier.

[0017] In the splitting knife mechanism provided in the present application, the first splitting knife can be understood as a necessary splitting knife for splitting. When the length of the part to be split of the wafer is within a certain value, the first splitting knife can be used alone for splitting, and the second splitting knife can be switched to the second state. The second splitting knife in the second state can also be understood as the second splitting knife being in a retracted state relative to the first splitting knife. If the length of the part to be split of the wafer exceeds the splitting length of the first splitting knife, the second splitting knife is controlled to switch to the first state so that the blades of the first splitting knife and the second splitting knife cooperate in a collinear manner, which is equivalent to extending the length of the blade of the first splitting knife, thereby increasing the length of the splitting effect.

[0018] The carrier primarily serves to structurally integrate the first and second blades, enabling them to be used in sync with each other. The drive assembly drives the carrier to simultaneously control the first and second blades for cleaving. The first blade is positioned at the free end of the carrier along a first direction, which can be understood as the end of the carrier closest to the wafer to be cleaved, ensuring minimal movement to achieve the desired cleaving operation. The blade of the first blade protrudes from the carrier in the first direction, ensuring that the first blade, rather than the carrier, acts on the wafer.

[0019] Therefore, compared with the splitting knife mechanism scheme of the single-blade and single-motion axis splitting device disclosed in the related art, the splitting knife mechanism of the present application adds a second splitting knife, and the second splitting knife and the first splitting knife can be driven and controlled by the driving component at the same time. It can also be understood as a multi-blade single-motion axis setting. Compared with the splitting knife mechanism scheme of the related art, the splitting knife mechanism of the present application has a small improvement and low cost. According to needs, the blade length of the first splitting knife can be set to a size that does not interfere with the iron ring that supports the wafer, and the splitting versatility is high during actual use.

[0020] Compared with the splitting knife mechanism scheme of the multi-blade multi-motion axis splitting machine disclosed in the related art, it is obvious that the structural cost of the splitting knife mechanism of the present application is lower; and in actual use, when multiple splitting knives are used in conjunction, the present application only needs to control the corresponding splitting knife to switch to the corresponding state, which is convenient and fast; while the multi-blade multi-motion axis splitting knife mechanism needs to control the movement and switching of the motion axis of the corresponding splitting knife, which is time-consuming and requires a large space. That is, the splitting knife mechanism of the present application has a lower use cost and higher operating efficiency than the splitting knife mechanism of the multi-blade multi-motion axis splitting machine disclosed in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 A schematic diagram of the three-dimensional structure of the cleaver mechanism provided in an embodiment of the present application;

[0023] Figure 2 A front view of a riving knife mechanism provided in an embodiment of the present application;

[0024] Figure 3 A schematic diagram of an alternative structural scheme for cooperation between riving knives provided in an embodiment of the present application.

[0025] Among them, the reference numerals in the figures are:

[0026] 10. Chopping knife mechanism; 101. Driving assembly; 102. Carrying member; 103. First cleaver; 104. Second cleaver; 105. Driving member; 106. Carrying member; 107. Supporting member; 108. Third cleaver. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0028] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0029] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0031] See also Figure 1 and Figure 2 The wafer splitting knife mechanism 10 provided in the embodiment of the present application is now described. The wafer splitting knife mechanism 10 provided in the embodiment of the present application includes a driving component 101, a carrier 102, a first splitting knife 103 and a second splitting knife 104. The carrier 102 is connected to the driving component 101 in a driving manner. The driving component 101 is defined to be able to drive the carrier 102 to move along a first direction, which is denoted as Z1. The first splitting knife 103 is provided at the free end of the carrier 102 along the first direction, and the blade of the first splitting knife 103 protrudes from the carrier 102 in the first direction. The second splitting knife 104 is movably connected to the driving component 101. The second riving knife 104 is mounted on the carrier 102 and has a first state and a second state. The second riving knife 104 is movable between the first state and the second state. When the second riving knife 104 is switched to the first state, the blade of the second riving knife 104 is collinear with the blade of the first riving knife 103. When the second riving knife 104 is switched to the second state, the blade of the second riving knife 104 retracts along the first direction until it no longer protrudes beyond the blade of the first riving knife 103. In other words, the blade of the second riving knife 104 is located on the side of the blade of the first riving knife 103 closer to the carrier 102.

[0032] In the splitting knife mechanism 10 provided in the embodiment of the present application, the first splitting knife 103 can be understood as a necessary splitting knife for splitting. Taking the first splitting knife 103 as an example of being detachably connected to the carrier 102 so as to be detachable and replaceable, the first splitting knife 103 is fixed relative to the carrier 102 after being connected to the carrier 102. When the length of the portion to be split of the wafer is within a certain value, the first splitting knife 103 can be used alone for splitting, and the second splitting knife 104 is switched to the second state. The second splitting knife 104 being in the second state can also be understood as the second splitting knife 104 being in a retracted state relative to the first splitting knife 103. If the length of the portion to be split of the wafer exceeds the splitting length of the first splitting knife 103, the second splitting knife 104 is controlled to switch to the first state so that the blades of the first splitting knife 103 and the second splitting knife 104 cooperate in a collinear manner, which is equivalent to extending the blade length of the first splitting knife 103, thereby increasing the length of the splitting effect.

[0033] The carrier 102 is primarily used to structurally integrate the first and second cleavers 103, 104. This allows them to be used in sync with each other by driving the carrier 102 via the drive assembly 101. The drive assembly 101 can be any suitable drive configuration that meets the requirements, without limitation. The first cleaver 103 is positioned at the free end of the carrier 102 along a first direction, which can be understood as the end of the carrier 102 closest to the wafer to be cleaved, allowing for minimal movement to achieve the desired wafer splitting operation. The blade of the first cleaver 103 protrudes from the carrier 102 in the first direction, ensuring that the first cleaver 103, rather than the carrier 102, acts upon the wafer.

[0034] Therefore, compared with the splitting knife mechanism 10 scheme of the single-blade and single-motion axis splitting device disclosed in the related art, the splitting knife mechanism 10 of the embodiment of the present application adds a second splitting knife 104, and the second splitting knife 104 and the first splitting knife 103 can be driven and controlled by the driving component 101 at the same time, which can be understood as a multi-blade single-motion axis setting. Compared with the splitting knife mechanism 10 scheme of the related art, the splitting knife mechanism 10 of the embodiment of the present application has a small improvement and low cost. According to needs, the blade length of the first splitting knife 103 can be set to a size that does not interfere with the iron ring that supports the wafer, and the splitting versatility is high during actual use.

[0035] Compared with the multi-blade multi-motion axis splitting machine's splitting knife mechanism 10 scheme disclosed in the related art, the splitting knife mechanism 10 of the embodiment of the present application obviously has lower structural cost; and in actual use, when multiple splitting knives are used together, the embodiment of the present application only needs to control the corresponding splitting knife to switch to the corresponding state, which is convenient and fast; while the multi-blade multi-motion axis splitting knife mechanism 10 needs to control the movement and switching of the motion axis of the corresponding splitting knife, which takes a long time and requires a large space. That is, the splitting knife mechanism 10 of the embodiment of the present application has lower use cost and higher operation efficiency than the multi-blade multi-motion axis splitting machine's splitting knife mechanism 10 disclosed in the related art.

[0036] It should be noted that the second cleaver 104 can be movably connected to the carrier 102, specifically, it can be set to be movable, it can also be set to be rotated, or it can be set in other movable modes, which can satisfy the switching of the second cleaver 104 between the first state and the second state; and the second cleaver 104 can be set to be manually movable or automatically movable by drive control, depending on actual needs and is not limited.

[0037] The cleaving knife mechanism 10 of the above embodiment may further include a driving member 105 and a carrier 106. The driving member 105 is disposed on the carrier 102. The driving member 105 is drivably connected to the carrier 106. The second cleaving knife 104 is connected to the carrier 106. The driving member 105 drives the carrier 106 to synchronously drive the second cleaving knife 104 to move. The carrier 106 and the driving member 105 are movably and adjustably connected.

[0038] In the embodiment of the present application, the driving member 105 is used to drive and control the carrier 106, thereby synchronously driving the second riving knife 104 to switch between the first state and the second state. Specifically, the driving member 105 and the second riving knife 104 are connected by the carrier 106 as an intermediate member. Of course, the second riving knife 104 and the carrier 106 can also be an integrated structure. In the embodiment of the present application, the second riving knife 104 and the carrier 106 are detachably connected as an example to facilitate disassembly, assembly, replacement, etc. Of course, the second riving knife 104 and the carrier 106 can also be detachably and adjustable. Therefore, on the basis of the replaceable tool, the installation position accuracy of the second riving knife 104 can also be adjusted.

[0039] The specific detachable connection method and the detachable and adjustable connection method are determined according to needs and are not limited. For example, the detachable connection method can be a screw connection or a snap connection, and the detachable and adjustable connection method can be a connection with screws and bar holes, etc. Any connection method that meets the corresponding functional requirements is acceptable.

[0040] In the embodiment of the present application, a movable and adjustable connection is used between the carrier 106 and the driver 105. After the carrier 106 and the second riving knife 104 are connected, the carrier 106 and the driver 105 are relatively fixed. The movable and adjustable connection allows the installation position of the carrier 106 and the driver 105 to be adjusted, thereby achieving the effect of adjusting the position of the second riving knife 104. The specific movable and adjustable connection method is determined according to the actual adjustment direction and range required for the second riving knife 104. The driver 105 can be any device that meets the driving requirements, such as a drive cylinder, a motor, or a drive module.

[0041] Furthermore, in the above embodiment, the carrier 106 is provided with a movable and adjustable supporting member 107, and the supporting member 107 is movable and supported on the driving member 105. By controlling the supporting member 107 to move and support the driving member 105, the distance between the corresponding parts of the carrier 106 and the driving member 105 can be adjusted, thereby correspondingly adjusting the position of the second cleaver 104 relative to the first cleaver 103.

[0042] The holding member 107 can be moved in any manner, including translational or rotational movement, as long as it provides both movement and adjustment. In this embodiment, the holding member is a rotatable screw, which is controlled to rotate and hold the driving member 105, thereby correspondingly adjusting the position of the second riving knife 104 relative to the first riving knife 103.

[0043] The number and location of the top screws are determined according to the adjustment requirements. In the embodiment of the present application, a plurality of top screws are provided at dispersed intervals as an example. This allows for adjustment of the distance between the carrier 106 and the driver 105 at different positions by adjusting different top screws against the driver 105. This, in turn, allows for adjustment of the distance between the second cleaver 104 and the carrier 102 at different positions. This can also be understood as adjusting the position of the second cleaver 104 relative to the first cleaver 103, thereby facilitating adjustment of the precision of fit between the second cleaver 104 and the first cleaver 103 in the first state.

[0044] Furthermore, a second direction is defined, denoted as Z2. The second direction forms an angle with the first direction. The blade of the second cleaver 104 and the blade of the first cleaver 103 are oriented in the same direction. In the above embodiment, the second cleaver 104 is movably arranged relative to the carrier 102 in the second direction. That is, the driving member 105 drives the carrier 106 to move in the second direction. Of course, the blade of the second cleaver 104 and the blade of the first cleaver 103 are always oriented in the same direction. Therefore, when the second cleaver 104 is switched to the first state, the blade of the second cleaver 104 and the blade of the first cleaver 103 can be collinear.

[0045] The second direction in the embodiment of the present application satisfies the following condition: during the movement of the second cleaver 104 from the first state to the second state along the second direction, the second cleaver 104 moves simultaneously along the first direction and the blade length direction of the first cleaver 103, and moves away from the first cleaver 103. In other words, the second direction can be considered the combined direction of the first direction and the blade length direction of the first cleaver 103, and can be understood as the second direction being oblique to the first direction. In this manner, the second cleaver 104 does not come into sliding contact with the first cleaver 103 during the switching movement, thereby preventing damage to the second cleaver 104 and the first cleaver 103 due to friction, which could result in a shortened lifespan.

[0046] See also Figure 3 Alternatively, in one embodiment, the second direction can be parallel to the first direction. Instead, the second blade 104 and the first blade 103 are each provided with an inclined edge that can be joined along the first direction. This prevents sliding contact between the second blade 104 and the first blade 103 during switching, thus preventing frictional damage to the second blade 104 and the first blade 103, which could shorten their lifespan. Depending on the direction of movement of the second blade 104 and the structural configurations of the first and second blades 103 and 104, several other equivalent modifications are possible, which are not listed here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application are intended to be included within the scope of protection of this application.

[0047] It should be noted that when the second blade 104 of the present embodiment is switched to the first state, the second blade 104 and the first blade 103 must be sufficiently close to each other along the blade direction. If the distance between the second blade 104 and the first blade 103 is too large, it may easily lead to irregular cleaving paths and other abnormalities during cleaving, affecting the quality of the cleaved pieces. In the present embodiment, the distance between the blades of the second blade 104 and the first blade 103 along the blade length direction is set to be less than or equal to 5 microns. This ensures that the second blade 104 and the first blade 103 can cooperate properly in cleaving. Of course, the above-mentioned direct or indirect adjustable setting of the second blade 104 can achieve precise adjustment of the position of the second blade 104 relative to the first blade 103.

[0048] See also Figure 1 and Figure 2Furthermore, the riving knife mechanism 10 in the above embodiment may further include a third riving knife 108, which is movably connected to the carrier 102 and has a third state and a fourth state. The third riving knife 108 is movably switchable between the third state and the fourth state. When the third riving knife 108 is switched to the third state, the blade of the third riving knife 108 is collinear with the blade of the first riving knife 103. When the third riving knife 108 is switched to the fourth state, the blade of the third riving knife 108 retracts along the first direction until it does not protrude beyond the blade of the first riving knife 103, that is, the blade of the third riving knife 108 is located on the side of the blade of the first riving knife 103 closer to the carrier 102.

[0049] The third blade 108 in the embodiment of the present application can be understood as being equivalent to the second blade 104 described above. If the length of the portion of the wafer to be cleaved exceeds the combined blade length of the first and second blades 103, 104, then the third blade 108 is added so that the blades of the first, second, and third blades 103, 104, and 108 are aligned, which is equivalent to extending the combined blade length of the first and second blades 103, 104, thereby further increasing the length of the cleaving operation. Based on this principle, the specific number of blades is determined based on needs and is not limited. Of course, the first and third blades 103, 108 can also be used separately, with the second blade 104 in the second state, so as to achieve a suitable cleaving operation on the wafer portion to be cleaved. In this case, it should be noted that when the third blade 108 is switched to the third state, the third blade 108 is adjacent to the first blade 103.

[0050] The third cleaver 108 switching to the third state is equivalent to the second cleaver 104 switching to the first state, both of which cooperate with the first cleaver 103 to extend the blade of the first cleaver 103. Similarly, the third cleaver 108 switching to the fourth state is equivalent to the second cleaver 104 switching to the second state, both of which are retracted relative to the first cleaver 103. For details on the state switching configuration of the third cleaver 108, please refer to the state switching configuration of the second cleaver 104 described above and will not be repeated here.

[0051] When the third blade 108 is switched to the third position, the spacing between the blade of the third blade 108 and the blade of the first blade 103 along the blade length is also set to be less than or equal to 5 microns. Of course, this applies to the case where the third blade 108 is positioned adjacent to the first blade 103. If the third blade 108 is positioned adjacent to the second blade 104, the spacing between the blade of the third blade 108 and the blade of the second blade 104 along the blade length is set to be less than or equal to 5 microns. This ensures that the different blades work together properly to produce cleavage. It will be appreciated that the third blade 108 can also achieve precise adjustment of its position relative to the first blade 103 or the second blade 104 by adopting a direct or indirect adjustable configuration similar to that of the second blade 104.

[0052] See also Figure 1 and Figure 2 In the embodiment of the present application, the second riving knife 104 and the third riving knife 108 are respectively located at two ends of the blade direction of the first riving knife 103. That is, the second riving knife 104 is located at one end of the blade direction of the first riving knife 103, and the third riving knife 108 is located at the other end of the blade direction of the first riving knife 103. This allows the first riving knife 103 to cooperate with the second riving knife 104 and the third riving knife 108 separately or simultaneously, which helps to avoid interference between the second riving knife 104 and the third riving knife 108 during operation.

[0053] In the above embodiment, the blade length of the third riving knife 108 is set to be less than or equal to the blade length of the first riving knife 103 , and the blade length of the third riving knife 108 is set to be greater than or equal to the blade length of the second riving knife 104 . When the blade lengths of the first cleaver 103, the second cleaver 104, and the third cleaver 108 are respectively equal, the cleaving mechanism 10 of the embodiment of the present application can be used for three cleaving length ranges, namely, the cleaving length range of the first cleaver 103, the cleaving length range of the first cleaver 103 combined with the second cleaver 104 or the first cleaver 103 combined with the third cleaver 108, and the cleaving length range of the first cleaver 103 combined with the second cleaver 104 and the third cleaver 108. When the blade length of the third cleaver 108 is greater than the blade length of the second cleaver 104, the cleaving length range of the cleaving mechanism 10 of the embodiment of the present application can be used for four cleaving length ranges, namely, the cleaving length range of the first cleaver 103, the cleaving length range of the first cleaver 103 combined with the second cleaver 104, the cleaving length range of the first cleaver 103 combined with the third cleaver 108, and the cleaving length range of the first cleaver 103 combined with the second cleaver 104 and the third cleaver 108.

[0054] In the embodiment of the present application, the blade length of the first riving knife 103 is greater than the blade length of the third riving knife 108, and the blade length of the third riving knife 108 is greater than the blade length of the second riving knife 104. This can meet the requirements of rifts of four different length ranges, has higher versatility, and is flexible in combination and use.

[0055] Specifically, in the embodiment of the present application, taking the wafer size to be split as 12 inches as an example, the blade length of the first cleaver 103 is set to 150 mm, the blade length of the second cleaver 104 is set to 50 mm, and the blade length of the third cleaver 108 is set to 110 mm.

[0056] The first cleaver 103 has a cleavage length range of 0 to 150 mm. The second cleaver 104, in combination with the first cleaver 103, has a cleavage length range of 150 to 200 mm. The third cleaver 108, in combination with the first cleaver 103, can cleave a length range of 200 to 260 mm. The combined cleavage length of the first, second, and third cleavers 103, 104, and 108 can reach a cleavage length range of 200 to 310 mm. When the wafer support ring is 12 inches, the 150 mm blade length of the first cleaver 103 satisfies the cleavage length range of 0 to 150 mm without interfering with the ring.

[0057] Of course, corresponding to wafers of different sizes, the specifications of each splitting knife can be appropriately changed. The above-mentioned embodiment scheme of the present application can be used to effectively solve the problem that chip manufacturers want to use the splitting equipment that processes smaller wafers to split larger wafers, thereby increasing production capacity without the need for additional customization of new splitting equipment.

[0058] An embodiment of the present application also provides a splitting device (not shown in the figure), including a frame (not shown in the figure), a carrier (not shown in the figure) and a splitting knife mechanism 10 in any of the above embodiments, the carrier (not shown in the figure) is arranged on the frame (not shown in the figure), the splitting knife mechanism 10 is suspended above the carrier (not shown in the figure), and is movably arranged on the frame (not shown in the figure); when the splitting knife mechanism 10 is moved to a splitting position corresponding to the carrier (not shown in the figure), the driving component 101 is controlled to drive the carrier 102 to move along the first direction close to the carrier (not shown in the figure), so that the first splitting knife 103 or the first splitting knife 103 cooperates with the second splitting knife 104 or the first splitting knife 103 cooperates with the third splitting knife 108 or the first splitting knife 103 cooperates with the second splitting knife 104 and the third splitting knife 108 to split the wafer carried by the processing carrier (not shown in the figure).

[0059] The splitting device (not shown in the figure) of the embodiment of the present application includes the cleaving knife mechanism 10 in any of the above embodiments, and thus has the beneficial effects brought by the cleaving knife mechanism 10 in any of the above embodiments, which will not be described in detail here.

[0060] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A wafer splitting mechanism, characterized in that: include: Drive components; A carrier, drivingly connected to the driving assembly, wherein the driving assembly is capable of driving the carrier to move along a first direction; a first riving knife, disposed at a free end of the carrier along the first direction, wherein a blade of the first riving knife protrudes from the carrier in the first direction; as well as a second riving knife, the second riving knife being movably connected to the carrier and having a first state and a second state; When the second riving knife is in the first state, the blade of the second riving knife is collinear with the blade of the first riving knife; When the second riving knife is in the second state, the blade of the second riving knife retracts along the first direction until it does not protrude beyond the blade of the first riving knife.

2. The riving knife mechanism according to claim 1, characterized in that: When the second cleaver is in the first state, a distance between the blade of the second cleaver and the blade of the first cleaver along the blade length direction is less than or equal to 5 microns.

3. The riving knife mechanism according to claim 1, characterized in that: The blade length of the second riving knife is less than or equal to the blade length of the first riving knife.

4. The riving knife mechanism according to claim 1, characterized in that: defining a second direction, the second direction having an angle with the first direction, the blade of the second riving knife and the blade of the first riving knife facing the same direction, and the second riving knife being movable along the second direction; When the second riving knife moves from the first state to the second state along the second direction, the second riving knife moves simultaneously along the first direction and the blade length direction of the first riving knife and moves away from the first riving knife.

5. The riving knife mechanism according to claim 1, characterized in that: The cleaving knife mechanism further includes a driving member and a carrier, wherein the driving member is disposed on the carrier, the driving member is drivingly connected to the carrier, the second cleaving knife is connected to the carrier, and the driving member drives the carrier to synchronously drive the second cleaving knife to move; Wherein, the carrier is movably and adjustably connected to the driving member.

6. The riving knife mechanism according to claim 5, characterized in that: The carrier is provided with a movable and adjustable supporting member, which can be movably supported on the driving member. By controlling the supporting member to move and support the driving member, the distance between the corresponding parts of the carrier and the driving member can be adjusted, thereby correspondingly adjusting the position of the second riving knife relative to the first riving knife.

7. The riving knife mechanism according to any one of claims 1 to 6, characterized in that: The cleaving knife mechanism further includes a third cleaving knife, which is movably connected to the carrier and has a third state and a fourth state; When the third riving knife is in the third state, the blade of the third riving knife is collinear with the blade of the first riving knife; When the third riving knife is in the fourth state, the blade of the third riving knife retracts along the first direction until it does not protrude beyond the blade of the first riving knife.

8. The riving knife mechanism according to claim 7, characterized in that: The blade length of the third riving knife is less than or equal to the blade length of the first riving knife, and greater than or equal to the blade length of the second riving knife.

9. The riving knife mechanism according to claim 8, characterized in that: The blade length of the first riving knife is set to 150 mm, the blade length of the second riving knife is set to 50 mm, and the blade length of the third riving knife is set to 110 mm.

10. A splitting device, characterized in that: The splitting device comprises a frame, a platform, and a cleaver mechanism according to any one of claims 1 to 9, wherein the platform is arranged on the frame, and the cleaver mechanism is suspended above the platform and movably arranged on the frame; When the splitting knife mechanism is moved to a splitting position corresponding to the carrier, the driving assembly is controlled to drive the carrier to move along the first direction close to the carrier, so that the first splitting knife or the first splitting knife cooperates with the second splitting knife to split the wafer carried by the carrier.

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