High-precision automatic feeding equipment for flexible circuit board

Abstract

The utility model discloses high-precision automatic feeding equipment for a flexible circuit board, which comprises a rack, and a streamline, a jacking uncovering mechanism, an upper cover grabbing mechanism, a charging tray mechanism, a secondary positioning mechanism, a transfer mechanism, a suction mechanism and a visual positioning mechanism which are arranged on the rack, the transfer mechanism drives the suction mechanism to move among the working section, the tray working area and the secondary positioning platform, the suction mechanism comprises a plurality of suction modules which move independently, and each suction module comprises a suction driving unit and a profiling suction part. According to the scheme, it is guaranteed that the flexible circuit board is located at the correct position of the carrier, the flexible circuit board is in a correct posture before being put into the double-layer carrier, the flexible circuit board can be conveniently and correctly put into the double-layer carrier, the production quality of the flexible circuit board is improved, the yield is increased, and the production efficiency of products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automated production of flexible circuit boards, in particular to a high-precision automatic feeding device for flexible circuit boards used in the SMT industry. Background Art

[0002] FPC, the full name of which is Flexible Printed Circuit, or FPC for short, is a circuit board made of a flexible substrate that can be bent, rolled, and folded freely. It can meet the design needs of smaller and higher-density installations, and also helps reduce assembly processes and enhance reliability.

[0003] The use of flexible circuit boards can make circuits more miniaturized and flexible. One of the advantages of flexible circuit boards is their flexibility. At the same time, this feature also makes it more difficult to load flexible circuit boards. When loading flexible circuit boards, their shape will change irregularly, resulting in the inability to confirm the status of the flexible circuit boards during loading and unable to be accurately placed in the carrier. During the production process, it is necessary to ensure that the flexible circuit boards are in the correct position on the carrier.

[0004] During the research on how to achieve automated loading of existing flexible circuit boards, the applicant found that the existing technology has at least the following problems:

[0005] 1. Due to its flexible nature, flexible circuit boards are prone to deformation after being sucked up by ordinary suction cups, which will cause deviations during visual positioning, resulting in incorrect positioning during loading.

[0006] 2. When loading the flexible circuit board, the incoming material is a tray. The posture of the flexible circuit board is not exactly the shape desired by the loading process. The flexible circuit board after suction cannot be directly placed into the carrier, making the loading process not smooth.

[0007] In view of this, how to solve the problems of deformation of the existing flexible circuit board during automatic loading, resulting in position deviation and incorrect posture of the flexible circuit board, has become the subject to be studied and solved by the present utility model. Utility Model Content

[0008] The utility model provides a high-precision automatic feeding device for flexible circuit boards, which aims to solve the problems of deformation of existing flexible circuit boards during automatic feeding, resulting in position deviation and incorrect posture of the flexible circuit boards.

[0009] To achieve the above objectives, the present invention proposes a high-precision automatic loading device for flexible circuit boards, which is used to accurately load flexible circuit boards into a double-layer carrier with a carrier cover. The innovative features of the device are:

[0010] The automatic loading equipment includes a frame and a streamline installed on the frame, a lifting and opening cover mechanism, an upper cover grabbing mechanism, a material tray mechanism, a secondary positioning mechanism, a transfer mechanism, a suction mechanism, and a visual positioning mechanism.

[0011] The streamline is used for transferring double-layer carriers, and the streamline has a working section and a buffer section.

[0012] The lifting and opening cover mechanism is arranged on the working section of the streamline, and the lifting and opening cover mechanism includes a lifting module for lifting the double-layer carrier located on the working section and a opening cover module for separating the carrier cover of the lifted double-layer carrier.

[0013] The upper cover grabbing mechanism is arranged above the working section of the streamline, and the upper cover grabbing mechanism includes a clamping claw for grabbing and placing the separated carrier upper cover.

[0014] The material tray mechanism is arranged on one side of the streamline, and the material tray mechanism is provided with a material tray working area for placing the material tray.

[0015] The secondary positioning mechanism includes a secondary positioning platform and an adsorption head. The secondary positioning platform is provided with a positioning groove matching the shape of the flexible circuit board, and the adsorption head is connected to the positioning groove.

[0016] The transfer mechanism is arranged across the working section, the tray working area and above the secondary positioning platform, and the transfer mechanism includes a motion module and an execution end.

[0017] The visual positioning mechanism includes a lower visual detection module arranged below the moving path of the execution end.

[0018] The suction mechanism is arranged on the execution end of the transfer mechanism, and is driven by the transfer mechanism to move the suction mechanism between the working section, the material tray working area and the secondary positioning platform. The suction mechanism includes multiple independently moving adsorption modules, and each adsorption module includes an adsorption drive unit and a contoured adsorption part.

[0019] The relevant contents of this utility model are explained as follows:

[0020] 1. In the above technical solution of the present invention, in order to solve the problems of deformation of existing flexible circuit boards during automatic loading, resulting in position deviation and incorrect posture of flexible circuit boards, the present invention has innovatively designed a high-precision automatic loading equipment for flexible circuit boards. The frame of the high-precision automatic loading equipment for flexible circuit boards is provided with a streamline for transferring double-layer carriers, a lifting and opening mechanism for lifting the double-layer carrier and separating the carrier cover of the double-layer carrier, a cover grabbing mechanism for grabbing and placing the separated carrier cover, a tray mechanism for placing and replacing the tray, a secondary positioning mechanism for performing secondary precise positioning of the flexible circuit board, and a mechanism for removing the flexible circuit board from the tray. The automatic loading equipment includes a transfer mechanism for transferring the flexible circuit board from one area to a secondary positioning platform and then to a double-layer carrier, a suction mechanism for adsorbing and adjusting the flexible circuit board, and a visual positioning mechanism for visually positioning the posture of the flexible circuit board. In view of the flexible characteristics of the flexible circuit board, an adsorption module including an adsorption drive unit and a contoured adsorption part is produced to ensure that the shape of the flexible circuit board does not deform during adsorption. In view of the fact that the posture of the flexible circuit board is not exactly the shape desired in the loading process, a secondary positioning mechanism is designed. The positioning groove on the secondary positioning mechanism is used to first position the posture of the flexible circuit board. Before the visual positioning of the flexible circuit board, secondary positioning is performed to correct the shape of the flexible circuit board. Through the above design, it is ensured that the flexible circuit board is in the correct position of the carrier, so that the flexible circuit board is in the correct posture before being placed in the double-layer carrier, so that the flexible circuit board can be correctly placed in the double-layer carrier, thereby improving the production quality of the flexible circuit board, improving the yield rate, and improving product production efficiency.

[0021] 2. In the above technical solution, the double-layer carrier is transferred from the outside in the X direction through the streamline to the working section and buffer section. The motion module of the transfer mechanism includes a first motion module that drives the suction mechanism to move in the X direction, a second motion module that moves in the Y direction, a third motion module that moves in the Z direction, and a fourth motion module that rotates about the Z axis. This enables the suction mechanism that absorbs the flexible circuit board to translate in the X, Y, and Z directions and rotate about the Z axis, allowing the suction mechanism to move between the working section, the tray work area, and the secondary positioning platform. The suction module on the suction mechanism can also adjust the position of the flexible circuit board, making the loading of the flexible circuit board faster and more accurate.

[0022] 3. In the above technical solution, the visual positioning mechanism also includes an upper visual re-inspection module arranged on the second motion module of the transfer mechanism. The upper visual re-inspection module includes an industrial camera. The upper visual re-inspection module re-inspects the flexible circuit board to further improve the accuracy of material cutting.

[0023] 4. In the above technical solution, the jacking module includes jacking cylinders arranged on both sides of the working section of the streamline, the telescopic ends of the jacking cylinders facing the Z direction are connected to the jacking plate, and the cover opening module includes a bottom clamping assembly and an upper cover jacking assembly arranged on the jacking plate, so as to better lift the double-layer carrier, separate the carrier cover of the double-layer carrier, and improve the unloading speed.

[0024] 5. In the above technical solution, the upper cover grasping mechanism includes a fifth motion module that drives the clamping claw to move along the Z direction and a sixth motion module that drives the fifth motion module to move along the X direction. The structural setting is more reasonable, avoiding interference with other components, so that the spatial volume of the overall device can be made smaller.

[0025] 6. In the above technical solution, the tray mechanism also includes a tray buffer area, and a tray handling module is provided on the tray working area and the tray buffer area, so that the trays in the tray mechanism can be replaced in real time, thereby realizing non-stop operation.

[0026] 7. In the above technical solution, the secondary positioning mechanism includes two supporting uprights arranged on the frame, the secondary positioning platform is fixed across the two supporting uprights, and the adsorption head adopts a vacuum quick connector to better arrange the position of the secondary positioning mechanism to avoid interference and at the same time achieve better secondary positioning effect.

[0027] 8. In the above technical solution, the contoured suction unit includes a suction bracket, multiple planar support blocks mounted on the bracket, and contoured suction cups. Contour suction cups are positioned between the multiple planar support blocks. The contoured suction cups include a product body suction cup and a product antenna suction cup. This ensures that the contoured suction unit adheres more closely to the flexible circuit board and prevents deformation of the flexible circuit board.

[0028] 9. In the above technical solution, multiple adsorption drive units are arranged on the execution end of the transfer mechanism, and each adsorption drive unit is individually connected to the contour adsorption part, so as to fine-tune the flexible circuit board adsorbed by each contour adsorption part, so that the blanking positioning accuracy and posture control of the flexible circuit board are more precise.

[0029] 10. In the above technical solution, four adsorption modules are provided on the execution end of the transfer mechanism.

[0030] 11. In this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," and the like are to be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] 12. In the description of this application, it should be noted that the terms "upper", "lower", "inner", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the protection content of this application.

[0032] 13. In the description of this application, it should be noted that if words such as "first" and "second" are used in this document to limit components, those skilled in the art should know that the use of words such as "first" and "second" is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, the above words have no special meaning.

[0033] Due to the application of the above scheme, the utility model has the following advantages and effects compared with the prior art:

[0034] 1. The above-mentioned scheme of the present invention is to solve the problems of existing flexible circuit boards that cause position deviation and incorrect posture of flexible circuit boards due to deformation during automatic loading, and innovatively design the high-precision automatic loading equipment for flexible circuit boards of the present invention. The frame of the high-precision automatic loading equipment for flexible circuit boards is provided with a streamline for transferring double-layer carriers, a lifting and opening mechanism for lifting the double-layer carrier and separating the carrier cover of the double-layer carrier, a cover grabbing mechanism for grabbing and placing the separated carrier cover, a tray mechanism for placing and replacing the tray, a secondary positioning mechanism for performing secondary precise positioning of the flexible circuit board, a transferring mechanism for transferring the flexible circuit board from the tray working area to the secondary positioning platform and then to the double-layer carrier, a suction mechanism for adsorbing and adjusting the flexible circuit board, and a visual positioning mechanism for visually locating the posture of the flexible circuit board.

[0035] 2. In the above-mentioned solution of the present invention, in the automatic loading equipment, an adsorption module including an adsorption drive unit and a contoured adsorption part is manufactured in view of the flexible characteristics of the flexible circuit board. While adsorbing, the shape of the flexible circuit board is ensured not to be deformed. In view of the characteristic that the posture of the flexible circuit board is not completely the shape desired in the loading process, a secondary positioning mechanism is designed. The positioning groove on the secondary positioning mechanism is used to first position the posture of the flexible circuit board. Before the visual positioning of the flexible circuit board, the secondary positioning is performed to correct the shape of the flexible circuit board. Through the above design, it is ensured that the flexible circuit board is in the correct position of the carrier, so that the flexible circuit board is in the correct posture before being placed in the double-layer carrier, so that the flexible circuit board can be correctly placed in the double-layer carrier, thereby improving the production quality of the flexible circuit board, improving the yield rate, and improving product production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a three-dimensional schematic diagram of a high-precision automatic feeding device for flexible circuit boards according to an embodiment of the present utility model (viewing angle 1);

[0037] Figure 2 This is a three-dimensional schematic diagram of the high-precision automatic feeding equipment for flexible circuit boards according to an embodiment of the utility model (viewpoint 2);

[0038] Figure 3 This is a top view of the high-precision automatic feeding equipment for flexible circuit boards according to an embodiment of the utility model;

[0039] Figure 4 This is a front view of the high-precision automatic feeding equipment for flexible circuit boards according to an embodiment of the utility model;

[0040] Figure 5 This is a three-dimensional schematic diagram of the streamline and lifting cover opening mechanism in the embodiment of the utility model;

[0041] Figure 6 This is a top view of the streamline and lifting cover opening mechanism in the embodiment of the utility model;

[0042] Figure 7 This is a side view of the streamline and lifting cover opening mechanism in the embodiment of the utility model;

[0043] Figure 8 This is a three-dimensional schematic diagram of the secondary positioning mechanism in the embodiment of the utility model;

[0044] Figure 9 This is a top view of the secondary positioning mechanism in an embodiment of the present utility model;

[0045] Figure 10 This is a front view of the secondary positioning mechanism in the embodiment of the utility model;

[0046] Figure 11This is a three-dimensional schematic diagram of the upper cover grabbing mechanism in an embodiment of the present utility model;

[0047] Figure 12 This is a three-dimensional schematic diagram of the adsorption module in an embodiment of the present utility model;

[0048] Figure 13 This is a bottom view of the adsorption module in the embodiment of the present utility model;

[0049] Figure 14 It is a three-dimensional schematic diagram of the cooperation between the adsorption module and the transfer mechanism in an embodiment of the present utility model.

[0050] The various parts of the above drawings are shown as follows:

[0051] 1. Frame;

[0052] 2. Streamline; 21. Working section; 22. Cache section;

[0053] 3. Lifting and opening mechanism;

[0054] 31. Lifting module; 311. Lifting cylinder; 312. Lifting plate;

[0055] 32. Cover opening module; 321. Bottom clamping assembly; 322. Upper cover lifting assembly;

[0056] 4. Upper cover grabbing mechanism;

[0057] 41. Gripper; 42. Fifth motion module; 43. Sixth motion module;

[0058] 5. Material tray mechanism;

[0059] 51. Tray working area; 52. Tray buffer area; 53. Tray handling module;

[0060] 6. Secondary positioning mechanism;

[0061] 61. Secondary positioning platform; 611. Positioning slot; 62. Adsorption head; 63. Supporting vertical plate;

[0062] 7. Transfer mechanism;

[0063] 71, motion module; 711, first motion module; 712, second motion module; 713, third motion module; 714, fourth motion module;

[0064] 72. Execution end;

[0065] 8. Visual positioning mechanism; 81. Lower visual inspection module; 82. Upper visual re-inspection module;

[0066] 9. Absorption mechanism;

[0067] 91. Adsorption module;

[0068] 92. Adsorption drive unit;

[0069] 93. Contour adsorption unit; 931. Plane support block; 932. Contour suction cup; 9321. Product body suction cup; 9322. Product antenna suction cup;

[0070] 10. Double-layer carrier; 101. Carrier cover;

[0071] 11. Flexible circuit board. DETAILED DESCRIPTION

[0072] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0073] The present invention aims to solve the problems of deformation of the existing flexible circuit board 11 during automatic loading, resulting in position deviation and incorrect posture of the flexible circuit board 11. The present invention innovatively designs a flexible circuit board (high-precision automatic loading equipment) to ensure that the flexible circuit board 11 is correctly positioned on the double-layer carrier 10.

[0074] like Figures 1 to 14 As shown, the embodiment of the present invention provides a high-precision automatic loading device for flexible circuit boards, which is used to accurately load flexible circuit boards 11 into a double-layer carrier 10 with a carrier cover 101. The automatic loading device includes a frame 1 and a streamline 2 installed on the frame 1, a lifting and opening cover mechanism 3, an upper cover grasping mechanism 4, a tray mechanism 5, a secondary positioning mechanism 6, a transfer mechanism 7, a suction mechanism 9, and a visual positioning mechanism 8.

[0075] The streamline 2 is used to transfer the double-layer carrier 10 , and the streamline 2 has a working section 21 and a buffer section 22 .

[0076] The lifting and opening cover mechanism 3 is arranged on the working section 21 of the streamline 2, and the lifting and opening cover mechanism 3 includes a lifting module 31 for lifting the double-layer carrier 10 located on the working section 21 and a cover opening module 32 for separating the carrier upper cover 101 of the lifted double-layer carrier 10.

[0077] The upper cover grabbing mechanism 4 is disposed above the working section 21 of the streamline 2 . The upper cover grabbing mechanism 4 includes a clamping claw 41 for grabbing and placing the separated carrier upper cover 101 .

[0078] The tray mechanism 5 is arranged on one side of the flow line 2 , and has a tray working area 51 for placing trays.

[0079] The secondary positioning mechanism 6 includes a secondary positioning platform 61 and an adsorption head 62 . A positioning groove 611 matching the shape of the flexible circuit board 11 is formed on the secondary positioning platform 61 , and the adsorption head 62 is connected to the positioning groove 611 .

[0080] The transfer mechanism 7 is disposed across the working section 21 , the tray working area 51 and the secondary positioning platform 61 . The transfer mechanism 7 includes a motion module 71 and an execution end 72 .

[0081] The visual positioning mechanism 8 includes a lower visual detection module 81 disposed below the moving path of the execution end 72 .

[0082] The suction mechanism 9 is arranged on the execution end 72 of the transfer mechanism 7, and is driven by the transfer mechanism 7 to move the suction mechanism 9 between the working section 21, the material tray working area 51 and the secondary positioning platform 61. The suction mechanism 9 includes a plurality of independently moving adsorption modules 91, and each adsorption module 91 includes an adsorption drive unit 92 and a contoured adsorption part 93.

[0083] Through the implementation of the above-mentioned embodiments of the present invention, the frame 1 of the flexible circuit board (high-precision automatic loading equipment is provided with a streamline 2 for transferring the double-layer carrier 10, a lifting and opening cover mechanism 3 for lifting the double-layer carrier 10 and separating the carrier cover 101 of the double-layer carrier 10, a cover grabbing mechanism 4 for grabbing and placing the separated carrier cover 101, a tray mechanism 5 for placing and replacing the tray, a secondary positioning mechanism 6 for performing secondary precise positioning of the flexible circuit board 11, a transferring mechanism 7 for transferring the flexible circuit board 11 from the tray working area 51 to the secondary positioning platform 61 and then to the double-layer carrier 10, a suction mechanism 9 for adsorbing and adjusting the flexible circuit board 11, and a visual positioning mechanism 8 for visually positioning the posture of the flexible circuit board 11. The automatic loading device In the preparation, in view of the flexible characteristics of the flexible circuit board 11, an adsorption module 91 including an adsorption drive unit 92 and a contoured adsorption portion 93 is manufactured. This ensures that the shape of the flexible circuit board 11 does not deform during adsorption. In view of the characteristic that the posture of the flexible circuit board 11 is not completely the shape desired in the loading process, a secondary positioning mechanism 6 is designed. The positioning groove 611 on the secondary positioning mechanism 6 first positions the posture of the flexible circuit board 11. Before the visual positioning of the flexible circuit board 11, the secondary positioning is performed to correct the shape of the flexible circuit board 11. Through the above design, the flexible circuit board 11 is ensured to be in the correct position of the carrier, so that the flexible circuit board 11 is in the correct posture before being placed in the double-layer carrier 10, so that the flexible circuit board 11 can be correctly placed in the double-layer carrier 10.

[0084] like Figure 1 In one embodiment of the present invention, the double-layer carrier 10 is transferred from the outside in the X direction through the streamline 2 to the working section 21 and the buffer section 22. The motion module 71 of the transfer mechanism 7 includes a first motion module 711 that drives the suction mechanism 9 to move in the X direction, a second motion module 712 that moves in the Y direction, a third motion module 713 that moves in the Z direction, and a fourth motion module 714 that rotates about the Z axis. This allows the suction mechanism 9 to translate in the X, Y, and Z directions and rotate about the Z axis, thereby moving the suction mechanism 9 between the working section 21, the tray working area 51, and the secondary positioning platform 61. Furthermore, the suction module 91 on the suction mechanism 9 can adjust the position of the flexible circuit board 11, making the loading of the flexible circuit board 11 faster and more accurate.

[0085] In another embodiment of the present invention, the visual positioning mechanism 8 also includes an upper visual review module 82 provided on the second motion module 712 of the transfer mechanism 7. The upper visual review module 82 includes an industrial camera. The upper visual review module 82 reviews the flexible circuit board 11 to further improve the accuracy of blanking.

[0086] In another embodiment of the present invention, the jacking module 31 includes a jacking cylinder 311 provided on both sides of the working section 21 of the streamline 2, and the telescopic end of the jacking cylinder 311 toward the Z direction is connected to the jacking plate 312, and the cover opening module 32 includes a bottom clamping assembly 321 and an upper cover jacking assembly 322 provided on the jacking plate 312, so as to better lift the double-layer carrier 10 and separate the carrier upper cover 101 of the double-layer carrier 10, thereby improving the unloading speed.

[0087] In one embodiment of the present invention, the upper cover grasping mechanism 4 includes a fifth motion module 42 that drives the clamping claw 41 to move along the Z direction and a sixth motion module 43 that drives the fifth motion module 42 to move along the X direction. The structural setting is more reasonable, avoiding interference with other components, so that the spatial volume of the overall device can be made smaller.

[0088] In another embodiment of the present invention, the tray mechanism 5 also includes a tray buffer area 52, and a tray handling module 53 is provided on the tray working area 51 and the tray buffer area 52, so that the trays in the tray mechanism 5 can be replaced in real time, thereby realizing non-stop operation.

[0089] In another embodiment of the present invention, the secondary positioning mechanism 6 includes two supporting uprights 63 provided on the frame 1, the secondary positioning platform 61 is fixed across the two supporting uprights 63, and the adsorption head 62 adopts a vacuum quick connector to better arrange the position of the secondary positioning mechanism 6 to avoid interference and at the same time achieve a better effect of secondary positioning.

[0090] In one embodiment of the present invention, the contoured adsorption unit 93 includes an adsorption bracket, a plurality of planar support blocks 931 mounted on the adsorption bracket, and contoured suction cups 932. Contoured suction cups 932 are disposed between the plurality of planar support blocks 931. The contoured suction cups 932 include a product body suction cup 9321 and a product antenna suction cup 9322. This allows the contoured adsorption unit 93 to adhere more closely to the flexible circuit board 11, thereby preventing deformation of the flexible circuit board 11.

[0091] In another embodiment of the present invention, a plurality of the adsorption drive units 92 are arranged on the execution end 72 of the transfer mechanism 7, and each of the adsorption drive units 92 is individually connected to the contour adsorption part 93, so as to fine-tune the flexible circuit board 11 adsorbed by each contour adsorption part 93, so that the blanking positioning accuracy and posture control of the flexible circuit board 11 are more precise.

[0092] The solution of the utility model is described below with a detailed embodiment.

[0093] In this detailed embodiment, a flexible circuit board (flexible circuit board) high-precision automatic loading equipment is proposed, which is used to accurately load a flexible circuit board 11 into a double-layer carrier 10 with a carrier cover 101. The automatic loading equipment includes a frame 1 and a streamline 2 installed on the frame 1 for transferring the double-layer carrier 10, a lifting and opening cover mechanism 3 for lifting the double-layer carrier 10 and separating the carrier cover 101 of the double-layer carrier 10, a cover grabbing mechanism 4 for grabbing and placing the separated carrier cover 101, a tray mechanism 5 for placing and replacing a tray, a secondary positioning mechanism 6 for performing secondary precise positioning of the flexible circuit board 11, a transferring mechanism 7 for transferring the flexible circuit board 11 from the tray working area 51 to the secondary positioning platform 61 and then to the double-layer carrier 10, a suction mechanism 9 for adsorbing and adjusting the flexible circuit board 11, and a visual positioning mechanism 8 for visually positioning the posture of the flexible circuit board 11.

[0094] In this detailed embodiment, the streamline 2 is used to transfer the double-layer carrier 10, and the streamline 2 has a working section 21 and a buffer section 22; the double-layer carrier 10 is transferred from the outside in the X direction through the streamline 2 to the working section 21 and the buffer section 22.

[0095] In this detailed embodiment, the lifting and cover-opening mechanism 3 is arranged on the working section 21 of the streamline 2, and the lifting and cover-opening mechanism 3 includes a lifting module 31 for lifting the double-layer carrier 10 located on the working section 21 and a cover-opening module 32 for separating the carrier cover 101 of the lifted double-layer carrier 10; the lifting module 31 includes a lifting cylinder 311 arranged on both sides of the working section 21 of the streamline 2, and the lifting cylinder 311 is connected to the lifting plate 312 at the telescopic end toward the Z direction, and the cover-opening module 32 includes a bottom clamping assembly 321 and an upper cover lifting assembly 322 arranged on the lifting plate 312.

[0096] In this detailed embodiment, the upper cover grasping mechanism 4 is arranged above the working section 21 of the streamline 2, and the upper cover grasping mechanism 4 includes a clamping claw 41 for grasping and placing the separated carrier upper cover 101; the upper cover grasping mechanism 4 includes a fifth motion module 42 for driving the clamping claw 41 to move along the Z direction and a sixth motion module 43 for driving the fifth motion module 42 to move along the X direction.

[0097] In this detailed embodiment, the tray mechanism 5 is arranged on one side of the streamline 2, and the tray mechanism 5 has a tray working area 51 for placing trays; the tray mechanism 5 also includes a tray buffer area 52, and a tray handling module 53 is arranged on the tray working area 51 and the tray buffer area 52.

[0098] In this detailed embodiment, the secondary positioning mechanism 6 includes a secondary positioning platform 61 and an adsorption head 62. The secondary positioning platform 61 is provided with a positioning groove 611 that matches the shape of the flexible circuit board 11, and the adsorption head 62 is connected to the positioning groove 611; the secondary positioning mechanism 6 includes two supporting vertical plates 63 provided on the frame 1, and the secondary positioning platform 61 is fixed across the two supporting vertical plates 63, and the adsorption head 62 adopts a vacuum quick connector.

[0099] In this detailed embodiment, the transfer mechanism 7 is disposed across the working section 21, the tray work area 51, and the secondary positioning platform 61. The transfer mechanism 7 includes a motion module 71 and an actuator 72. The motion module 71 of the transfer mechanism 7 includes a first motion module 711 that drives the suction mechanism 9 in the X direction, a second motion module 712 that moves in the Y direction, a third motion module 713 that moves in the Z direction, and a fourth motion module 714 that rotates about the Z axis. This allows the suction mechanism 9 to move in the X, Y, and Z directions, as well as rotate about the Z axis, thereby moving the suction mechanism 9 between the working section 21, the tray work area 51, and the secondary positioning platform 61.

[0100] In this detailed embodiment, the visual positioning mechanism 8 includes a lower visual inspection module 81 arranged below the moving path of the execution end 72; the visual positioning mechanism 8 also includes an upper visual review module 82 arranged on the second motion module 712 of the transfer mechanism 7, and the upper visual review module 82 includes an industrial camera.

[0101] In this detailed embodiment, the suction mechanism 9 is located on the execution end 72 of the transfer mechanism 7. The transfer mechanism 7 drives the suction mechanism 9 to move between the working section 21, the tray working area 51, and the secondary positioning platform 61. The suction mechanism 9 includes multiple independently movable suction modules 91. Each suction module 91 includes a suction drive unit 92 and a contoured suction portion 93. The contoured suction portion 93 includes a suction bracket, multiple planar support blocks 931 mounted on the suction bracket, and contoured suction cups 932. Contoured suction cups 932 are located between the multiple planar support blocks 931. The contoured suction cups 932 include a product body suction cup 9321 and a product antenna suction cup 9322. Multiple suction drive units 92 are located on the execution end 72 of the transfer mechanism 7. Each suction drive unit 92 is independently connected to the contoured suction portion 93. Four suction modules 91 are located on the execution end 72 of the transfer mechanism 7.

[0102] The detailed working process of the present invention can be referred to as follows:

[0103] 1. The tray transport module 53 transports the full tray to the tray working area 51 of the tray mechanism 5 .

[0104] 2. The double-layer carrier 10 flows from the front station into the working section 21 of the streamline 2.

[0105] 3. The double-layer carrier 10 located on the working section 21 is lifted by the lifting module 31 , and then the cover opening module 32 separates the carrier cover 101 of the lifted double-layer carrier 10 .

[0106] 4. The fifth motion module 42 and the sixth motion module 43 of the upper cover grabbing mechanism 4 drive the clamping claw 41 to grab the carrier upper cover 101 and then move it aside.

[0107] 5. The first motion module 711 , the second motion module 712 , the third motion module 713 and the fourth motion module 714 of the transfer mechanism 7 drive the suction mechanism 9 to move. After the adsorption module 91 absorbs the flexible circuit board 11 , the flexible circuit board 11 is transferred to the secondary positioning platform 61 .

[0108] 6. The adsorption head 62 on the secondary positioning platform 61 works to complete the posture correction of the flexible circuit board 11.

[0109] 7. The transfer mechanism 7 moves the flexible circuit board 11 after secondary positioning to the lower visual inspection module 81 for visual positioning, and then each of the adsorption drive units 92 independently drives the respective contour adsorption parts 93 to adjust.

[0110] 8. The transfer mechanism 7 places the visually positioned and adjusted flexible circuit board 11 into the double-layer carrier 10 (the carrier cover 101 has been removed), and then the cover grabbing mechanism 4 puts the carrier cover 101 back.

[0111] 9. The lifting and opening cover mechanism 3 is reset, and the flexible circuit board 11 flows out to the next station along with the double-layer carrier 10.

[0112] It should also be noted that in the embodiments of the present invention, the control of each module and mechanism belongs to the existing technology, and those skilled in the art are aware of their principles and structures. These technologies are not the focus of the present invention, so this part will not be described in detail here.

[0113] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.

Claims

1. A high-precision automatic loading device for flexible circuit boards, used for accurately loading flexible circuit boards (11) into a double-layer carrier (10) having a carrier cover (101), characterized in that: The automatic loading equipment comprises a frame (1) and a streamline (2) mounted on the frame (1), a lifting and opening cover mechanism (3), a cover grabbing mechanism (4), a tray mechanism (5), a secondary positioning mechanism (6), a transfer mechanism (7), a visual positioning mechanism (8), and a suction mechanism (9); The streamline (2) is used for transferring a double-layer carrier (10), and the streamline (2) has a working section (21) and a buffer section (22); The lifting and opening cover mechanism (3) is arranged on the working section (21) of the streamline (2), and comprises a lifting module (31) for lifting the double-layer carrier (10) located on the working section (21) and a cover opening module (32) for separating the carrier upper cover (101) of the lifted double-layer carrier (10); The upper cover grabbing mechanism (4) is arranged above the working section (21) of the streamline (2), and the upper cover grabbing mechanism (4) comprises a clamping claw (41) for grabbing and placing the separated carrier upper cover (101); The tray mechanism (5) is arranged on one side of the flow line (2), and the tray mechanism (5) has a tray working area (51) for placing the tray; The secondary positioning mechanism (6) comprises a secondary positioning platform (61) and an adsorption head (62); the secondary positioning platform (61) is provided with a positioning groove (611) matching the shape of the flexible circuit board (11); the adsorption head (62) is connected to the positioning groove (611); The transfer mechanism (7) is arranged across the working section (21), the tray working area (51) and the secondary positioning platform (61), and the transfer mechanism (7) includes a motion module (71) and an execution end (72); The visual positioning mechanism (8) includes a lower visual detection module (81) disposed below the moving path of the execution end (72); The suction mechanism (9) is arranged on the execution end (72) of the transfer mechanism (7), and is driven by the transfer mechanism (7) to move the suction mechanism (9) between the working section (21), the material tray working area (51) and the secondary positioning platform (61). The suction mechanism (9) includes a plurality of independently movable suction modules (91), and each suction module (91) includes a suction drive unit (92) and a contoured suction part (93).

2. The high-precision automatic feeding equipment for flexible circuit boards according to claim 1, characterized in that: The double-layer carrier (10) is transferred from the outside in the X direction through the streamline (2) to the working section (21) and the buffer section (22); the motion module (71) of the transfer mechanism (7) includes a first motion module (711) that drives the suction mechanism (9) to move along the X direction, a second motion module (712) that moves along the Y direction, a third motion module (713) that moves along the Z direction, and a fourth motion module (714) that rotates around the Z axis.

3. The high-precision automatic feeding equipment for flexible circuit boards according to claim 2, characterized in that: The visual positioning mechanism (8) further includes an upper visual inspection module (82) provided on the second motion module (712) of the transfer mechanism (7), and the upper visual inspection module (82) includes an industrial camera.

4. The high-precision automatic feeding equipment for flexible circuit boards according to claim 1, characterized in that: The lifting module (31) includes lifting cylinders (311) arranged on both sides of the working section (21) of the streamline (2), and the telescopic ends of the lifting cylinders (311) facing the Z direction are connected to lifting plates (312). The cover opening module (32) includes a bottom clamping assembly (321) and an upper cover lifting assembly (322) arranged on the lifting plates (312).

5. The high-precision automatic feeding equipment for flexible circuit boards according to claim 4, characterized in that: The upper cover grabbing mechanism (4) comprises a fifth motion module (42) that drives the clamping claw (41) to move along the Z direction and a sixth motion module (43) that drives the fifth motion module (42) to move along the X direction.

6. The high-precision automatic feeding equipment for flexible circuit boards according to claim 1, characterized in that: The tray mechanism (5) further comprises a tray buffer area (52), and a tray transport module (53) is provided on the tray working area (51) and the tray buffer area (52).

7. The high-precision automatic feeding equipment for flexible circuit boards according to claim 1, characterized in that: The secondary positioning mechanism (6) comprises two supporting uprights (63) arranged on the frame (1); the secondary positioning platform (61) is fixed across the two supporting uprights (63); and the adsorption head (62) adopts a vacuum quick connector.

8. The high-precision automatic feeding equipment for flexible circuit boards according to claim 1, characterized in that: The contoured adsorption portion (93) includes an adsorption bracket and a plurality of planar support blocks (931) and a contoured suction cup (932) mounted on the adsorption bracket. The contoured suction cup (932) is arranged between the plurality of planar support blocks (931). The contoured suction cup (932) includes a product body suction cup (9321) and a product antenna suction cup (9322).

9. The high-precision automatic feeding equipment for flexible circuit boards according to claim 8, characterized in that: A plurality of the adsorption drive units (92) are arranged on the execution end (72) of the transfer mechanism (7), and each of the adsorption drive units (92) is independently connected to the contour adsorption portion (93) frame.

10. The high-precision automatic feeding equipment for flexible circuit boards according to claim 9, characterized in that: Four adsorption modules (91) are provided on the execution end (72) of the transfer mechanism (7).

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