TOF camera device

Abstract

The utility model provides a TOF camera device. The TOF camera device comprises a bottom shell; the first circuit board is installed on the inner bottom face of the bottom shell and connected to the inner bottom face through a heat conduction layer. The second circuit board is mounted on the top surface, back to the inner bottom surface, of the first circuit board through a heat-conducting supporting block; the laser and the image collector are connected to the top surface, opposite to the inner bottom surface, of the second circuit board at an interval and are respectively used for emitting emergent light to a target object and receiving reflected light of the target object; the top cover and the bottom shell are in butt joint up and down to form a device shell which wraps the first circuit board, the heat conduction layer, the second circuit board, the heat conduction supporting block, the laser and the image collector; the top cover is provided with a light-transmitting structure matched with the laser and the image collector, and the light-transmitting structure is used for transmitting emergent light and reflected light. The TOF camera device improves the alignment precision between the laser and the light-transmitting structure of the device shell, and the assembly precision, the assembly efficiency and the heat dissipation efficiency of the device shell and the functional module; sufficient emitted and received light is ensured, and the distance measurement precision and performance are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of camera photography, in particular to a TOF camera device. Background Art

[0002] The TOF camera device uses a laser to emit modulated infrared light to the object being photographed. The emitted infrared light is reflected after encountering the object. The image collector receives the infrared light reflected by the object and calculates the time difference or phase difference between the emission and reflection of the infrared light through the control unit to calculate the distance between the device and the object to generate the depth information of the object. Combined with the traditional camera, it uses different colors to represent different distances to present the three-dimensional outline of the object.

[0003] In order to solve the heat dissipation problem of the laser, the existing TOF camera device usually fixes the laser on a heat-conducting aluminum block, and then fixes the heat-conducting aluminum block together with the laser on another heat-dissipating aluminum block mounted on the circuit board. This assembly method increases the dimensional chain between the laser and the circuit board, and the positioning accuracy is easily affected by the tolerance between the thermally conductive aluminum block and the heat dissipation aluminum block, thereby affecting the alignment accuracy between the laser and the preset laser exit hole of the device housing, and further causing interference with the laser output light and energy loss; it causes a decrease in the assembly accuracy between the device housing and the internal functional module, resulting in inconvenience in assembling the housing and the internal module; in order to reduce the tolerance between the thermally conductive aluminum block and the heat dissipation aluminum block, it is necessary to correct and calibrate the relative position of the laser during the assembly process so that it remains precisely aligned with the laser exit hole, resulting in reduced assembly efficiency; since the laser is dissipated only by the heat dissipation aluminum block, it is easy for the laser to overheat due to insufficient heat dissipation effect, resulting in laser power loss affecting the ranging accuracy and even damaging the TOF camera device; in addition, existing TOF camera devices usually directly open a small exit hole and light-collecting hole in the housing that just matches the laser and image collector. The small exit hole and light-collecting hole are easy to interfere with the output light and reduce the reflected light obtained by the image collector, causing energy loss, which also affects the ranging performance of the TOF camera device. Utility Model Content

[0004] The utility model provides a TOF camera device to solve the technical problem in the prior art that the laser heat dissipation structure of the TOF camera device leads to low laser installation precision and inconvenient assembly.

[0005] In order to solve the above problems, the technical solution adopted by the present invention is:

[0006] The utility model provides a TOF camera device, comprising:

[0007] bottom shell;

[0008] A first circuit board is mounted on the inner bottom surface of the bottom shell and connected to the inner bottom surface via a heat conducting layer;

[0009] a second circuit board mounted on the top surface of the first circuit board facing away from the inner bottom surface via a heat-conducting support block;

[0010] The laser and the image collector are connected to the top surface of the second circuit board facing away from the inner bottom surface at intervals, and are respectively used to emit outgoing light to the target object and receive reflected light from the target object;

[0011] The top cover is connected to the bottom shell at the top and bottom to form a device shell that encloses the first circuit board, the heat-conducting layer, the second circuit board, the heat-conducting support block, the laser and the image collector; the top cover is provided with a light-transmitting structure that matches the laser and the image collector for allowing the outgoing light and the reflected light to pass through.

[0012] Preferably, the heat conducting layer comprises:

[0013] The heat-conducting material layer is connected between the first circuit board and the inner bottom surface.

[0014] Furthermore, the heat conducting layer further comprises:

[0015] The heat dissipation metal layer is connected between the thermal conductive material layer and the inner bottom surface.

[0016] Preferably, the light-transmitting structure includes:

[0017] The light-transmitting opening and the light-collecting opening are arranged at intervals on the top cover and cover the laser and the image collector respectively;

[0018] A lens frame is provided on the top surface of the top cover facing away from the inner bottom surface, surrounding the light-transmitting opening and the daylighting opening;

[0019] The light-emitting lens is embedded in the inner side of the lens frame and covers the light-transmitting opening. The light-emitting lens is provided with a mounting notch that matches the image collector;

[0020] The lighting lens is embedded in the inner side of the installation notch and covers the lighting opening.

[0021] Preferably, the first circuit board is a SOC chip board or a PCB board.

[0022] Preferably, the second circuit board is an optical sensor circuit board or a PCB board.

[0023] Preferably, the heat-conducting support block is a heat-conducting support column.

[0024] Preferably, the device housing is in the shape of a cuboid, and the first circuit board and the second circuit board are rectangular plates that match the cuboid internal accommodation space of the device housing;

[0025] There are four heat-conducting support columns, which are respectively connected between the corresponding four corners of the first circuit board and the second circuit board.

[0026] Furthermore, the TOF camera device further includes:

[0027] A data interface connected to the bottom edge of the first circuit board facing the inner bottom surface;

[0028] A recess matching the data interface is provided on one side of the bottom shell, so that the data interface can extend out of the bottom shell.

[0029] Furthermore, the TOF camera device further includes:

[0030] The hanging ear is arranged on the outer side surface of the bottom shell. The hanging ear is provided with a mounting hole for connecting the TOF camera device to the mounting structure.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] The TOF camera device provided by the present invention has an assembly method that reduces the dimensional chain between the laser, the image collector and the second circuit board, improves the alignment accuracy between the laser and the preset light-transmitting structure of the device housing, and avoids energy loss caused by interference with the emitted light; improves the assembly accuracy of the device housing and the internal functional modules, and improves the assembly efficiency of the TOF camera device; makes data transmission between the first circuit board and the second circuit board for the laser and the image collector more convenient; improves the heat dissipation efficiency of the device housing for the laser, the image collector, the first circuit board and the second circuit board, and increases the life of the device; its light-transmitting structure ensures that the light energy emitted by the laser to the target object and the light reflected by the target object back to the image collector is sufficient, thereby improving the ranging accuracy and performance stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solution proposed by the present invention, the present invention is described in detail below with reference to the embodiments and drawings. It should be understood that the embodiments and drawings described in the following specific embodiments and the drawings in the specification are merely some embodiments of the present invention, and those skilled in the art can modify these drawings under the concept of the present invention.

[0034] Figure 1 A schematic diagram of the assembly three-dimensional structure of an embodiment of the TOF camera device provided by the utility model;

[0035] Figure 2 for Figure 1 Schematic diagram of the exploded three-dimensional structure of the TOF camera device;

[0036] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure of the TOF camera device along the AA direction;

[0037] Figure 4 for Figure 1 Schematic diagram of the assembly main structure of the TOF camera device.

[0038] Among them, the main marks of the drawings are as follows:

[0039] 1. Bottom shell; 11. Notch for clearance; 12. Mounting ear; 121. Mounting hole; 13. Heat dissipation slot; 14. Connection hole; 141. Connection step; 15. Sealing pad; 16. Light outlet opening; 17. Lighting opening; 171. Mounting boss; 172. Mounting step; 18. Heat dissipation boss; 19. Card slot; 2. First circuit board; 21. Central control unit; 3. Heat conduction layer; 31. Heat conduction material layer; 32. Heat dissipation metal layer; 4. Second circuit board; 5. Laser; 6. Image collector; 7. Top cover; 71. Light-transmitting structure; 711. Lens frame; 712. Light-emitting lens; 7121. Mounting notch; 713. Lighting lens; 8. Heat-conducting support block; 81. Mounting via; 9. Data interface. DETAILED DESCRIPTION

[0040] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clear, the following is a summary of the technical problems, technical solutions and beneficial effects to be solved by the present invention. Figure 1-4 And embodiments, the utility model is further described in detail.

[0041] Please also refer to Figure 1-4 The TOF camera device provided by the present invention includes:

[0042] Bottom shell 1; a first circuit board 2, mounted on the inner bottom surface of the bottom shell 1 facing the inner side of the bottom shell 1 (set upward), and the bottom surface of the first circuit board 2 facing the inner bottom surface (set downward) is connected to the inner bottom surface of the bottom shell 1 through a heat-conducting layer 3; a second circuit board 4, the bottom surface of the second circuit board 4 facing the inner bottom surface (set downward) is mounted on the top surface of the first circuit board 2 facing away from the inner bottom surface through a heat-conducting support block 8, so that the second circuit board 4 is spaced apart above the inner bottom surface of the first circuit board 2 facing away from the bottom shell 1; a laser 5 and an image collector 6, spaced apart and connected to the top surface of the second circuit board 4 facing away from the inner bottom surface, the laser 5 is used to emit light to the target object, and the image collector 6 is used to receive the reflected light of the target object and use the time of flight method (Time of Flight) to obtain the reflected light of the target object. The TOF camera device is a device that can be used to measure the distance / depth information between the target object and the TOF camera device by calculating the time of flight of the outgoing light and the reflected light, thereby measuring the distance / depth information between the target object and the TOF camera device; the top cover 7 is connected to the bottom shell 1 up and down to form a device shell that encloses the first circuit board 2, the heat-conducting layer 3, the second circuit board 4, the heat-conducting support block 8, the laser 5 and the image collector 6; the top cover 7 is provided with a light-transmitting structure 71 that matches the outer dimensions and installation position of the laser 5 and the image collector 6, for allowing the outgoing light and the reflected light to pass through, so that the outgoing light is emitted and the reflected light is injected into the device shell.

[0043] In this embodiment, the first circuit board 2 is a SOC chip board or a PCB board.

[0044] See also Figure 2 、 3 As a preferred implementation scheme of this embodiment, the top surface of the first circuit board 2 facing away from the inner bottom surface of the bottom shell 1 is electrically connected to the bottom surface of the central control unit 21 facing the inner bottom surface, and the top surface of the central control unit 21 facing away from the inner bottom surface is electrically connected to the bottom surface of the second circuit board 4 facing the inner bottom surface of the bottom shell 1.

[0045] As a preferred implementation of this embodiment, the second circuit board 4 is an optical sensor circuit board or a PCB board.

[0046] See also Figure 2 、 3 In this embodiment, the laser 5 and the image collector 6 are connected to the top surface of the second circuit board 4 facing away from the inner bottom surface with spaced patches. This assembly method reduces the dimensional chain between the laser 5, the image collector 6, and the second circuit board 4, avoiding the tolerance between the heat-conducting aluminum block and the heat-dissipating aluminum block in the traditional assembly method affecting the positioning accuracy of the laser 5 assembled on the second circuit board 4, thereby improving the alignment accuracy between the laser 5 and the light-transmitting structure 71 preset in the device housing for emitting light from the device housing, avoiding interference with the emitted light of the laser 5 and causing energy loss; improving the assembly accuracy between the device housing and the internal functional module, facilitating the assembly of the housing and the internal module; avoiding the tolerance between the heat-conducting aluminum block and the heat-dissipating aluminum block, and eliminating the need to correct or calibrate the relative position of the laser 5 during the assembly process to keep it precisely aligned with the light-transmitting structure 71, thereby improving the assembly efficiency of the TOF camera device. At the same time, this assembly method makes the data transmission between the first circuit board 2 and the second circuit board 4 for the laser 5 and the image collector 6 more convenient overall.

[0047] See also Figure 2 、 3 In this embodiment, the heat conducting layer 3 includes:

[0048] The heat-conducting material layer 31 is connected between the first circuit board 2 and the inner bottom surface of the bottom case 1 .

[0049] See also Figure 2 、 3 As a preferred embodiment, the thermal conductive material layer 31 adopts a thermal conductive silicone grease layer, and the top end of the thermal conductive silicone grease layer facing away from the inner bottom surface of the bottom shell 1 is applied to the bottom surface of the first circuit board 2 facing the inner bottom surface.

[0050] In other embodiments, the thermal conductive material layer 31 may also be a thermal conductive adhesive layer.

[0051] See also Figure 2 、 3 In this embodiment, the heat conducting layer 3 further includes:

[0052] The heat dissipation metal layer 32 is connected between the thermal conductive material layer 31 and the inner bottom surface of the bottom case 1 .

[0053] See also Figure 2 、 3 As a preferred embodiment, a heat dissipation boss is provided on the inner bottom surface of the bottom shell 1 facing the heat conducting layer 3, and a plurality of heat dissipation grooves 13 are arranged at intervals on the outer bottom surface of the bottom shell 1 facing the heat dissipation boss; the heat dissipation metal layer 32 is made of copper foil, and the top end of the copper foil (heat dissipation metal layer 32) facing away from the inner bottom surface of the bottom shell 1 is connected to the bottom surface of the thermal grease layer (heat conducting material layer 31) facing the inner bottom surface, and the bottom end of the copper foil (heat dissipation metal layer 32) facing the inner bottom surface is connected to the top end surface of the heat dissipation boss away from the inner bottom surface. Through the heat dissipation boss, the bottom shell 1 and the multiple heat dissipation grooves 13 at the bottom of the heat dissipation boss, the heat emitted by the laser 5, the image collector 6, the first circuit board 2 and the second circuit board 4 is conducted to the external environment of the device shell, thereby achieving a heat dissipation effect for the TOF camera device.

[0054] In other embodiments, the heat dissipation metal layer 32 may also be made of aluminum foil.

[0055] The heat-conducting layer 3 composed of a heat-conducting material layer 31 and a heat-dissipating metal layer 32 improves the heat dissipation efficiency of the device housing to the laser 5, the image collector 6, the first circuit board 2 and the second circuit board 4, avoids the power loss of the laser 5 due to overheating of the laser 5, improves the ranging accuracy error caused by the temperature increase, ensures the performance stability of the TOF camera device and improves the service life of the TOF camera device.

[0056] See also Figure 2 、 3 In this embodiment, a plurality of heat-conducting support blocks 8 are connected between the bottom surface of the first circuit board 2 facing the inner bottom surface (set downward) and the inner bottom surface of the bottom shell 1 to further improve the heat dissipation efficiency of the device shell for the laser 5, the image collector 6, the first circuit board 2 and the second circuit board 4, and play an auxiliary supporting role for the laser 5, the image collector 6, the first circuit board 2 and the second circuit board 4.

[0057] See also Figure 2 、 3 As a preferred implementation of this embodiment, the thermal conductive support block 8 is cylindrical and is provided with a mounting hole 81 that passes through the thermal conductive support block 8 along its axial direction. The first circuit board 2, the second circuit board 4 and the bottom shell 1 are all provided with connecting holes 14 that match the mounting holes 81. Screws or bolts are passed through the corresponding connecting holes 14 and the mounting holes 81 to fasten and support the thermal conductive support block 8 between the bottom surface of the second circuit board 4 and the top surface of the first circuit board 2, and between the bottom surface of the first circuit board 2 and the inner bottom surface of the bottom shell 1.

[0058] See also Figure 2 、 3As a more preferred implementation of this embodiment, the connection hole 14 provided in the bottom shell 1 is respectively provided with a pair of connection steps 141 at the connection between it and the inner bottom surface and the outer bottom surface of the bottom shell 1 (i.e., the top and bottom ends of the connection hole 14). When the thermal conductive support block 8 is tightly connected and supported between the bottom surface of the second circuit board 4 and the top surface of the first circuit board 2, and the bottom surface of the first circuit board 2 and the inner bottom surface of the bottom shell 1, the bottom end of the thermal conductive support block 8 cooperates with the connection step 141 located on the inner bottom surface of the bottom shell 1, and the sealing gasket 51 is embedded and installed in the connection step 141 located on the outer bottom surface of the bottom shell 1 to seal the connection hole 14 on the bottom shell 1, thereby achieving watertight isolation and waterproof and moisture-proof effects for the internal accommodation space of the device shell.

[0059] Please also refer to Figure 1-4 In this embodiment, the light-transmitting structure 71 includes:

[0060] The light exit opening 16 and the daylighting opening 17 are arranged at intervals on the top cover 7, and the projection areas of the light exit opening 16 and the daylighting opening 17 respectively correspond to and cover the installation areas where the laser 5 and the image collector 6 are located below; the lens frame 711 is arranged on the top surface of the top cover 7 facing away from the inner bottom surface, surrounding the light exit opening 16 and the daylighting opening 17; the light exit lens 712 is embedded in the inner side of the lens frame 711, and the projection area of ​​the light exit lens 712 covers the light exit opening 16 below and the installation area where the laser 5 is located; the light exit lens 712 is provided with a mounting notch 7121 that matches the outer dimensions and installation position of the image collector 6; the daylighting lens 713 is embedded in the inner side of the mounting notch 7121, and the projection area of ​​the daylighting lens 713 covers the daylighting opening 17 below and the installation area where the image collector 6 is located.

[0061] See also Figure 2 、 3 As a preferred implementation of this embodiment, the light exit opening 16 is an inverted cone-shaped opening extending downward from the inner bottom surface of the top cover 7 near the bottom shell 1, and the laser 5 is located on the inner side of the end edge of the light exit opening 16 where the inner diameter is narrowest near the second circuit board 4.

[0062] Please also refer to Figure 1-3 As a preferred embodiment of this embodiment, the light opening 17 is provided with a pair of mounting bosses 171 at the connection points between the light opening 17 and the top surface and the bottom surface of the top cover 7 (i.e., the top and bottom ends of the light opening 17), and mounting steps 172 are formed on the inner sides of the mounting bosses 171. One mounting boss 171 at the connection point between the light opening 17 and the top surface of the top cover 7 is embedded in the inner side of the mounting notch 7121, and the light-collecting lens 713 is embedded in the mounting step 172 on the inner side of the mounting boss 171; the top end of the image collector 6 extends into the mounting step 172 on the inner side of the other mounting boss 171 at the connection point between the light opening 17 and the bottom surface of the top cover 7.

[0063] As a preferred implementation of this embodiment, the light-emitting lens preferably adopts a glass plane mirror with a transmittance of more than 90% for light with a wavelength of 940 nm.

[0064] The provision of the aforementioned light-transmitting structure 71 avoids energy loss caused by interference with the outgoing light and reduced reflected light captured by the image collector 6 due to the conventional smaller exit and light-collecting apertures. This ensures sufficient energy for both the light emitted by the laser 5 toward the target object and the light reflected by the target object back to the image collector 6. Furthermore, by focusing, the light energy captured by the image collector 6 is increased, thereby ensuring the ranging accuracy and performance stability of the TOF camera device. Furthermore, the light-transmitting structure 71 physically isolates the optical paths of the outgoing light emitted by the laser 5 from those of the reflected light captured by the image collector 6 through the lens frame 711, preventing crosstalk between the outgoing and reflected light that could affect normal imaging.

[0065] In this embodiment, the heat-conducting support block 8 is a heat-conducting support column.

[0066] Please also refer to Figure 1-4 As a preferred embodiment, the device housing is in the shape of a rectangular parallelepiped, and the first circuit board 2 and the second circuit board 4 are rectangular plates that match the rectangular internal accommodation space of the device housing; four thermal conductive support columns are provided, and the four thermal conductive support columns are respectively connected between the corresponding four corners of the first circuit board 2 and the second circuit board 4.

[0067] See also Figure 2 In this embodiment, a plurality of snap fasteners (not shown in the figure) are provided at intervals on the inner edge of the bottom end of the top cover 7, and a plurality of slots 19 matching the snap fastener structure are provided at intervals on the inner edge of the top end of the bottom shell 1. By engaging the corresponding snap fasteners and the slots 19, the top cover 7 and the bottom shell 1 are connected up and down to form the above-mentioned device shell.

[0068] As a preferred embodiment, after the top cover 7 and the bottom shell 1 are connected to each other up and down, they are fastened together by screws, bolts or adhesives to improve the firmness of the device shell.

[0069] Please also refer to Figure 1-3 In this embodiment, the TOF camera device further includes:

[0070] A data interface 9 is connected to the bottom edge of the first circuit board 2 facing the inner bottom surface;

[0071] One side of the bottom shell 1 is provided with a clearance notch 11 that matches the external dimensions and installation position of the data interface 9, so that the data interface 9 can extend out of the bottom shell 1 from the inside, making it convenient for the data cable to be plugged into the data interface 9.

[0072] As a preferred embodiment, the data interface 9 can adopt a USB, Type-C or Lightning interface.

[0073] Please also refer to Figure 1 、 2 4. In this embodiment, the TOF camera device further includes:

[0074] The hanging ear 12 is provided on the outer side surface of the bottom shell 1 . The hanging ear 12 is provided with a mounting hole 121 for connecting the TOF camera device to the mounting structure.

[0075] Please also refer to Figure 1 、 2 4. In this embodiment, the mounting structure is a component of the drive device of the depth camera system (not shown). The mounting structure is provided with a connection hole that matches the mounting hole 121 of the mounting ear 12. Screws or bolts are passed through the corresponding mounting hole 121 and the connection hole to fasten the TOF camera device to the drive device. The drive device of the depth camera system is used to drive the TOF camera device to rotate or swing, thereby changing the spatial position and angle of the outgoing light emitted by the laser 5, thereby changing the spatial area detected by the TOF camera device, so that the TOF camera device can detect target objects in different spatial areas.

[0076] Please also refer to Figure 1 、 2 4. As a preferred embodiment, there are four hanging ears 12, and the four hanging ears 12 are respectively arranged on the outer sides of the four corners of the bottom shell 1.

[0077] The working principle of the TOF camera device provided by the utility model is as follows:

[0078] The outgoing light emitted by the laser 5 to the target object passes through the light outlet opening 16 and the inner side of the lens frame 711 in turn, and then passes through the light outlet lens 712 to exit the device housing and toward the target object. After the target object reflects the outgoing light, the reflected light passes through the light-collecting lens 713, the lens frame 711 and the inner side of the light outlet opening 16 in turn to enter the device housing. The reflected light is received by the receiving end of the image collector 6, and the time difference or phase difference between the emission of the outgoing light and the reception of the reflected light is calculated by the control unit, thereby measuring the distance between the TOF camera device and the target object to generate the depth information of the object, and combining with the traditional camera to present the three-dimensional outline of the object with images representing different distances in different colors.

[0079] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art should understand that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A TOF camera device, characterized in that: include: bottom shell (1); A first circuit board (2) is mounted on the inner bottom surface of the bottom shell (1) and is connected to the inner bottom surface via a heat-conducting layer (3); A second circuit board (4) is mounted on the top surface of the first circuit board (2) facing away from the inner bottom surface via a heat-conducting support block (8); A laser (5) and an image collector (6) are connected to the top surface of the second circuit board (4) facing away from the inner bottom surface at intervals, and are respectively used to emit outgoing light toward a target object and receive reflected light from the target object; A top cover (7) is connected to the bottom shell (1) in a vertical connection to form a device housing that encloses the first circuit board (2), the heat-conducting layer (3), the second circuit board (4), the heat-conducting support block (8), the laser (5), and the image collector (6); the top cover (7) is provided with a light-transmitting structure (71) that matches the laser (5) and the image collector (6) and is used for allowing the emitted light and the reflected light to pass through.

2. The TOF camera device according to claim 1, wherein: The heat-conducting layer (3) comprises: A heat-conducting material layer (31) is connected between the first circuit board (2) and the inner bottom surface.

3. The TOF camera device according to claim 2, wherein: The heat-conducting layer (3) further comprises: A heat dissipation metal layer (32) is connected between the heat-conducting material layer (31) and the inner bottom surface.

4. The TOF camera device according to claim 1, wherein: The light-transmitting structure (71) comprises: A light exit opening (16) and a light collecting opening (17) are arranged at intervals on the top cover (7) and respectively cover the laser (5) and the image collector (6); A lens frame (711) surrounds the light outlet opening (16) and the daylight opening (17) and is provided on the top surface of the top cover (7) facing away from the inner bottom surface; A light-emitting lens (712) is embedded inside the lens frame (711) and covers the light-emitting opening (16); the light-emitting lens (712) is provided with a mounting notch (7121) that matches the image collector (6); The lighting lens (713) is embedded in the inner side of the installation notch (7121) and covers the lighting opening (17).

5. The TOF camera device according to any one of claims 1 to 4, wherein: The first circuit board (2) is a SOC chip board or a PCB board.

6. The TOF camera device according to any one of claims 1 to 4, wherein: The second circuit board (4) is an optical sensor circuit board or a PCB board.

7. The TOF camera device according to claim 6, wherein: The heat-conducting support block (8) is a heat-conducting support column.

8. The TOF imaging device according to claim 7, wherein: The device housing is in the shape of a cuboid, and the first circuit board (2) and the second circuit board (4) are rectangular plates that match the cuboid internal accommodation space of the device housing; There are four heat-conducting support columns, which are respectively connected between the corresponding four corners of the first circuit board (2) and the second circuit board (4).

9. The TOF camera device according to any one of claims 1 to 4, wherein: Also includes: A data interface (9) connected to the bottom edge of the first circuit board (2) facing the inner bottom surface; A clearance notch (11) matching the data interface (9) is provided on one side of the bottom shell (1) to allow the data interface (9) to extend out of the bottom shell (1).

10. The TOF camera device according to any one of claims 1 to 4, wherein: Also includes: A hanging ear (12) is provided on the outer side surface of the bottom shell (1); the hanging ear (12) is provided with a mounting hole (121) for connecting the TOF camera device to a mounting structure.

Images