Heat dissipation module

Abstract

The utility model discloses a heat dissipation module which comprises a cold plate, a liquid inlet pipe and a liquid outlet pipe. The cold plate is provided with an internal flow channel and a heat absorption surface, the internal flow channel is provided with a flow inlet and a flow outlet, and the heat absorption surface is used for thermally contacting the optical fiber transceiver module. One end of the liquid inlet pipe is connected to the flow inlet, and the other end of the liquid inlet pipe is used for being connected to cooling equipment. One end of the liquid outlet pipe is connected to the flow outlet, and the other end of the liquid outlet pipe is used for being connected to cooling equipment. The liquid outlet pipe is in fluid communication with the liquid inlet pipe through the internal flow channel and the cooling equipment, and the liquid inlet pipe, the liquid outlet pipe and the internal flow channel are used for forming a cooling circulation loop together with the cooling equipment. Wherein the cooling circulation loop is used for containing cooling liquid, the liquid inlet pipe is used for conveying the cooling liquid cooled by the cooling equipment to the internal flow channel so as to absorb heat of the cold plate, and the liquid outlet pipe is used for conveying the cooling liquid absorbing heat in the internal flow channel to the cooling equipment.

Description

Technical Field

[0001] The utility model relates to a heat dissipation module, in particular to a heat dissipation module in which an internal flow channel is formed in a cold plate to form a cooling circuit. Background Art

[0002] Today, optical fiber is widely adopted as the primary network transmission tool in many countries around the world. Because optical fiber transmits signals through total internal reflection of light, it offers the advantages of high-speed transmission and low transmission loss. When used as a transmission medium for network systems, optical fiber exhibits the characteristics of broadband, high capacity, and high speed. However, with the continuous growth of information transmission volume and users' increasingly stringent requirements for network speeds, optical fiber's transmission capacity is gradually facing challenges. To address the issue of insufficient data transmission, in addition to improving the transmission speed of the optical fiber itself, the receiving and transmitting performance of the optical fiber at both ends is equally critical. This includes core components such as optical receivers, optical transmitters, and optical transceivers.

[0003] As data transmission demands continue to rise, fiber optic transceiver modules shoulder a greater workload, increasing their cooling requirements. High data rates generate significant heat, and ineffective heat dissipation can lead to performance degradation or component damage. Therefore, to ensure stable operation, modern network equipment often requires advanced cooling technologies to address the heat dissipation requirements of these modules. Utility Model Content

[0004] The present invention provides a heat dissipation module to meet the heat dissipation requirements of an optical fiber transceiver module.

[0005] The heat dissipation module disclosed in one embodiment of the present invention is used to cool a fiber optic transceiver module. The heat dissipation module includes a cold plate, a liquid inlet pipe, and a liquid outlet pipe. The cold plate has an internal flow channel and a heat absorbing surface, the internal flow channel has an inlet and an outlet, and the heat absorbing surface is used to thermally contact the fiber optic transceiver module. One end of the liquid inlet pipe is connected to the inlet, and the other end of the liquid inlet pipe is used to connect to a cooling device. One end of the liquid outlet pipe is connected to the outlet, and the other end of the liquid outlet pipe is used to connect to the cooling device. The liquid outlet pipe is used to communicate with the liquid inlet pipe fluid through the internal flow channel and the cooling device, and the liquid inlet pipe, the liquid outlet pipe and the internal flow channel are used to form a cooling circulation loop together with the cooling device. The cooling circulation loop is used to accommodate a coolant, the liquid inlet pipe is used to transport the coolant cooled by the cooling device to the internal flow channel to absorb the heat of the cold plate, and the liquid outlet pipe is used to transport the coolant after absorbing heat in the internal flow channel to the cooling device.

[0006] In the above-mentioned heat dissipation module, the cold plate is made of red copper alloy.

[0007] In the above-mentioned heat dissipation module, the internal flow channel is a winding flow channel.

[0008] In the above heat dissipation module, the inlet and the outlet face the same side.

[0009] In the above-mentioned heat dissipation module, the internal flow channel is U-shaped.

[0010] In the above-mentioned heat dissipation module, the material of the liquid inlet pipe is metal, and the material of the liquid outlet pipe is metal.

[0011] The above-mentioned heat dissipation module, wherein the material of the liquid inlet pipe is red copper alloy, and the material of the liquid outlet pipe is red copper alloy. The heat dissipation module disclosed in another embodiment of the present invention is used to cool a fiber optic transceiver module. The heat dissipation module includes a cooling device, a cold plate, a liquid inlet pipe and a liquid outlet pipe. The cold plate has an internal flow channel and a heat absorbing surface, the internal flow channel has an inlet and an outlet, and the heat absorbing surface is used to thermally contact the fiber optic transceiver module. The two ends of the liquid inlet pipe are respectively connected to the inlet and the cooling device, and the two ends of the liquid outlet pipe are respectively connected to the outlet and the cooling device. The liquid outlet pipe is fluidically connected to the liquid inlet pipe through the internal flow channel and the cooling device, and the liquid inlet pipe, the liquid outlet pipe, the internal flow channel and the cooling device together form a cooling circulation loop. The cooling circulation loop is used to accommodate a coolant, the cooling device is used to pump and cool the coolant, the liquid inlet pipe is used to transport the cooled coolant to the internal flow channel to absorb the heat of the cold plate, and the liquid outlet pipe is used to transport the coolant after absorbing heat in the internal flow channel to the cooling device.

[0012] In the above-mentioned heat dissipation module, the cooling device has a pump and a heat dissipation element. The pump is used to pump the coolant, and the heat dissipation element is used to cool the coolant.

[0013] In the above-mentioned heat dissipation module, the heat dissipation element is a heat dissipation fin, a fan, a liquid cooling radiator or a heat conducting plate.

[0014] According to the heat dissipation module disclosed in the above embodiment, an internal flow channel is formed in the cold plate for cooling liquid to flow to absorb and remove heat from the cold plate, thereby dissipating heat from the optical fiber transceiver module and meeting the heat dissipation requirements of the optical fiber transceiver module.

[0015] The above description of the content of the present invention and the following description of the implementation methods are used to demonstrate and explain the principles of the present invention and provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of a heat dissipation module and a heating element according to an embodiment of the present invention.

[0017] Figure 2 for Figure 1 Partial and exploded schematic diagram of the heat dissipation module and heating elements.

[0018] Figure 3 for Figure 1 Partial and cross-sectional schematic diagram of the heat dissipation module and heating elements.

[0019] Wherein, the reference numerals:

[0020] 9: Heating element, optical fiber transceiver module

[0021] 1: Heat dissipation module

[0022] 10: Cold plate

[0023] 11: Liquid inlet pipe

[0024] 12: Liquid outlet pipe

[0025] C1: Internal flow channel

[0026] D1: Circulation direction

[0027] P1: Inlet

[0028] P2: Outlet

[0029] S1: heat absorbing surface DETAILED DESCRIPTION

[0030] The following detailed description of the features and advantages of the embodiments of the present invention is sufficient to enable anyone skilled in the art to understand the technical content of the embodiments of the present invention and implement them accordingly. Furthermore, based on the disclosure of this specification, the scope of the claims, and the accompanying drawings, anyone skilled in the art can easily understand the relevant objectives and advantages of the present invention. The following examples further illustrate the concepts of the present invention but are not intended to limit the scope of the present invention in any way.

[0031] See also Figures 1 to 3 , Figure 1 FIG. 1 is a perspective diagram of a heat dissipation module and a heating element according to an embodiment of the present invention. Figure 2 for Figure 1 A partial and exploded schematic diagram of the heat dissipation module and heating elements, and Figure 3 for Figure 1 Partial and cross-sectional schematic diagram of the heat dissipation module and heating elements.

[0032] The heat dissipation module 1 of this embodiment is used to cool a heating element 9, wherein the heating element 9 can be, for example, a fiber optic transceiver module such as a Quad Small Form-factor Pluggable (QSFP) transceiver module 9. The structure and shape of the heating element are simplified in the figure, but the present invention is not limited to the shape of the heating element.

[0033] The heat dissipation module 1 includes a cold plate 10, a liquid inlet pipe 11, a liquid outlet pipe 12, and a cooling device (not shown). The cold plate 10 has an internal flow channel C1 and a heat absorbing surface S1. The internal flow channel C1 has an inlet P1 and an outlet P2. The heat absorbing surface S1 is used for thermal contact with the optical fiber transceiver module 9.

[0034] The two ends of the liquid inlet pipe 11 are respectively connected to the inlet port P1 and the cooling device, and the two ends of the liquid outlet pipe 12 are respectively connected to the outlet port P2 and the cooling device. The liquid outlet pipe 12 is in fluid communication with the liquid inlet pipe 11 through the internal flow channel C1 and the cooling device, and the liquid inlet pipe 11, the liquid outlet pipe 12, the internal flow channel C1 and the cooling device together form a cooling circulation loop. The cooling circulation loop is used to accommodate a coolant, and the cooling device is used to cool the coolant. The liquid inlet pipe 11 is used to transport the cooled coolant along a circulation direction D1 to the internal flow channel C1 to absorb heat absorbed by the optical fiber transceiver module 9 of the cold plate 10, and the liquid outlet pipe 12 is used to transport the coolant that has absorbed heat in the internal flow channel C1 to the cooling device along the circulation direction D1. Thus, by forming the internal flow channel C1 in the cold plate 10, the coolant is allowed to circulate, absorbing and removing heat from the cold plate 10, thereby cooling and dissipating heat from the optical fiber transceiver module 9. The coolant may be water or organic fluids such as propane and pentane, but the present invention is not limited to the type of coolant.

[0035] The cooling device may include, for example, a pump (not shown) and a heat sink (not shown), wherein the pump can be used to pump the coolant and the heat sink can be used to cool the coolant. In addition, the heat sink may be, for example, a heat sink fin, a fan, a liquid cooling radiator, or a heat conducting plate, but the present invention is not limited thereto.

[0036] like Figure 3 As shown, the internal flow channel C1 of the cold plate 10 can be U-shaped, with the inlet P1 and outlet P2 of the internal flow channel C1 facing the same side. Thus, by distributing the internal flow channel C1 over a large area within the cold plate 10, the contact area between the coolant and the cold plate 10 can be increased, thereby improving heat transfer efficiency. However, the present invention is not limited to the shape of the internal flow channel C1. In other embodiments, the internal flow channel C1 can be a serpentine flow channel of other shapes, for example, an S-shaped flow channel or an M-shaped flow channel.

[0037] In this embodiment, the cold plate 10 is made of copper alloy (Cu1100), the liquid inlet pipe 11 is made of copper alloy, and the liquid outlet pipe 12 is made of copper alloy. However, the present invention is not limited to this. In other embodiments, the cold plate 10, the liquid inlet pipe 11, and the liquid outlet pipe 12 may be made of other metal materials, such as aluminum alloy, stainless steel, nickel alloy, or titanium alloy.

[0038] According to the heat dissipation module of the above embodiment, an internal flow channel is formed in the cold plate for the circulation of cooling liquid to absorb and remove the heat of the cold plate, thereby dissipating heat for the optical fiber transceiver module and meeting the heat dissipation requirements of the optical fiber transceiver module.

[0039] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the claims attached to this application.

Claims

1. A heat dissipation module, characterized in that: Used to cool an optical fiber transceiver module, and the heat dissipation module includes: a cold plate having an internal flow channel and a heat absorbing surface, wherein the internal flow channel has an inlet and an outlet, and the heat absorbing surface is used for thermally contacting the optical fiber transceiver module; a liquid inlet pipe, one end of which is connected to the inlet port, and the other end of which is connected to a cooling device; as well as a liquid outlet pipe, one end of the liquid outlet pipe being connected to the outlet port, the other end of the liquid outlet pipe being connected to the cooling device, the liquid outlet pipe being in fluid communication with the liquid inlet pipe through the internal flow channel and the cooling device, and the liquid inlet pipe, the liquid outlet pipe, the internal flow channel, and the cooling device forming a cooling circulation loop; The cooling circulation loop is used to accommodate a coolant, the liquid inlet pipe is used to transport the coolant cooled by the cooling device to the internal flow channel to absorb the heat of the cold plate, and the liquid outlet pipe is used to transport the coolant after absorbing heat in the internal flow channel to the cooling device.

2. The heat dissipation module according to claim 1, wherein: The material of the cold plate is red copper alloy.

3. The heat dissipation module according to claim 1, wherein: The internal flow channel is a winding flow channel.

4. The heat dissipation module according to claim 1, wherein: The inlet and the outlet face the same side.

5. The heat dissipation module according to claim 1, wherein: The internal flow channel is U-shaped.

6. The heat dissipation module according to claim 1, wherein: The material of the liquid inlet pipe is metal, and the material of the liquid outlet pipe is metal.

7. The heat dissipation module according to claim 6, wherein: The material of the liquid inlet pipe is red copper alloy, and the material of the liquid outlet pipe is red copper alloy.

8. A heat dissipation module, characterized in that: Used to cool an optical fiber transceiver module, and the heat dissipation module includes: - cooling equipment; a cold plate having an internal flow channel and a heat absorbing surface, wherein the internal flow channel has an inlet and an outlet, and the heat absorbing surface is used for thermally contacting the optical fiber transceiver module; a liquid inlet pipe, with two ends of the liquid inlet pipe connected to the inlet and the cooling device respectively; as well as a liquid outlet pipe, the two ends of the liquid outlet pipe being connected to the outlet and the cooling device respectively, the liquid outlet pipe being in fluid communication with the liquid inlet pipe through the internal flow channel and the cooling device, and the liquid inlet pipe, the liquid outlet pipe, the internal flow channel and the cooling device together forming a cooling circulation loop; The cooling circulation loop is used to accommodate a coolant, the cooling device is used to pump and cool the coolant, the liquid inlet pipe is used to transport the cooled coolant to the internal flow channel to absorb heat from the cold plate, and the liquid outlet pipe is used to transport the coolant after absorbing heat in the internal flow channel to the cooling device.

9. The heat dissipation module according to claim 8, wherein: The cooling device has a pump and a heat sink. The pump is used for pumping the coolant, and the heat sink is used for cooling the coolant.

10. The heat dissipation module according to claim 9, wherein: The heat sink is a heat sink fin, a fan, a liquid cooling radiator or a heat conducting plate.

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