Internal memory heat dissipation structure

Abstract

The utility model discloses a memory heat dissipation structure, which comprises a first heat dissipation sheet, a second heat dissipation sheet and a fixing clamp, the first heat dissipation sheet and the second heat dissipation sheet are respectively contacted with a plurality of memory particles on two sides of a memory bank, and the fixing clamp is used for providing an elastic force to clamp the first heat dissipation sheet and the second heat dissipation sheet on a memory. According to the memory heat dissipation structure, heat of the memory particles is evenly guided into the cooling fins, the temperature difference between the memory particles is reduced, the memory heat dissipation effect is improved, and the temperature of the memory is prevented from exceeding a target value.

Description

Technical Field

[0001] The utility model relates to the field of computer accessories, in particular to a memory heat dissipation structure. Background Art

[0002] Servers are often equipped with a large amount of memory, and the gaps between memory are often very small. Traditional memory cooling mostly exposes the memory particles, and the gaps between memory are often very small. The heat of the memory particles is removed by the air flow of the fan in the system. This method can easily cause a large temperature difference between different particles due to uneven airflow. Although it can solve the cooling problem of low-power memory, as the memory power consumption increases, it is easy to cause the memory temperature to exceed the target value. Therefore, this method often no longer meets the memory cooling requirements. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, the utility model provides a memory heat dissipation structure, which evenly introduces the heat of the memory particles into the heat sink, reduces the temperature difference between the memory particles, improves the memory heat dissipation effect, and prevents the memory temperature from exceeding the target value.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A memory heat dissipation structure includes a first heat sink, a second heat sink, and a fixing clip. The first heat sink and the second heat sink are respectively in contact with a plurality of memory chips on both sides of a memory bar. The fixing clip is used to provide an elastic force to clamp the first and second heat sinks to the memory.

[0006] As a further improvement of the above technical solution, a first thermal pad is arranged between the first heat sink and the memory stick, one side of the first thermal pad is in contact with several memory particles on the front side of the memory stick, and the other side of the first thermal pad is connected to the first heat sink.

[0007] As a further improvement of the above technical solution, a first mounting groove is provided on the side of the first heat sink facing the first thermal pad, a first heat pipe is fixedly connected in the first mounting groove, and the first heat pipe is connected to the first thermal pad.

[0008] As a further improvement of the above technical solution, a second thermal pad is arranged between the second heat sink and the memory stick, one side of the second thermal pad is in contact with several memory particles on the back side of the memory stick, and the other side of the second thermal pad is connected to the second heat sink.

[0009] As a further improvement of the above technical solution, a second mounting groove is provided on the side of the second heat sink facing the second thermal pad, a second heat pipe is fixedly connected in the second mounting groove, and the second heat pipe is connected to the second thermal pad.

[0010] As a further improvement of the above technical solution, the fixing clip is a U-shaped structure, including a first elastic sheet, a second elastic sheet and a connecting sheet connected between the first elastic sheet and the second elastic sheet. The first elastic sheet abuts against the outer side of the first heat sink, and the second elastic sheet abuts against the outer side of the second heat sink.

[0011] As a further improvement of the above technical solution, both the first elastic piece and the second elastic piece are U-shaped structures.

[0012] As a further improvement of the above technical solution, the first heat sink and the second heat sink are respectively provided with a first scratch buckle and a second scratch buckle, and the first elastic sheet and the second elastic sheet are respectively engaged with the first scratch buckle and the second scratch buckle.

[0013] As a further improvement of the above technical solution, both the first heat sink and the second heat sink are provided with grooves, and the connecting piece is snapped into the grooves.

[0014] As a further improvement of the above technical solution, the first heat sink and the second heat sink are provided with at least two fixing clips along their length directions.

[0015] The beneficial effects of this utility model are as follows: the first and second heat sinks are in close contact with the memory chips, absorbing the memory heat, thereby reducing the temperature difference between the memory chips and improving the memory heat dissipation effect, thereby preventing the memory temperature from exceeding the target value. In addition, the first and second heat sinks are installed and removed using a fixing clip. The elasticity of the fixing clip tightly secures the first and second heat sinks to the memory chips. After breaking open and removing the fixing clip, the first and second heat sinks can be removed, making operation convenient and easy to disassemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is a schematic diagram of the assembly of a memory heat dissipation structure according to an embodiment of the present utility model;

[0018] Figure 2 This is a structural breakdown diagram of a memory heat dissipation structure according to an embodiment of the present utility model;

[0019] Figure 3 This is a top view of a memory heat dissipation structure according to an embodiment of the present invention;

[0020] Figure 4 It is a structural schematic diagram of a fixing clip in a memory heat dissipation structure according to an embodiment of the present utility model.

[0021] Figure numerals: 1. memory stick; 11. memory chip; 2. first heat sink; 21. first mounting slot; 3. second heat sink; 31. second mounting slot; 4. fixing clip; 41. first elastic sheet; 42. second elastic sheet; 43. connecting sheet; 44. buckle edge; 5. first heat pipe; 6. first thermal pad; 7. second heat pipe; 8. second thermal pad; 9. buckle; 10. groove. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.

[0023] Reference Figure 1-Figure 3 An embodiment of the present invention provides a memory heat dissipation structure, including a first heat sink 2, a second heat sink 3 and a fixing clip 4. The first heat sink 2 and the second heat sink 3 are respectively in contact with a plurality of memory particles 11 on both sides of the memory bar 1, thereby absorbing the heat of the memory particles 11 at the same time to reduce the temperature difference between the memory particles 11. In this way, when the memory power consumption increases, the memory temperature can be prevented from exceeding the target value, thereby meeting the memory heat dissipation requirements. The fixing clip 4 is a U-shaped structure, including a first elastic piece 41, a second elastic piece 42 and a connecting piece 43 connected between the first elastic piece 41 and the second elastic piece 42. The first elastic piece 41 abuts against the outer side of the first heat sink 2, and the second elastic piece 42 abuts against the outer side of the second heat sink 3. In this way, under the elastic force of the first elastic piece 41 and the second elastic piece 42, the first heat sink 2 and the second heat sink 3 are clamped on the memory, so that the first heat sink 2, the second heat sink 3 and the memory particles 11 are tightly fixed together, thereby improving the heat dissipation effect of the memory. In addition, by prying apart the first elastic piece 41 and the second elastic piece 42 and removing the fixing clip 4, the first heat sink 2 and the second heat sink 3 can be removed, which is convenient to operate and easy to disassemble.

[0024] In a preferred embodiment, a first thermal pad 6 and a first heat pipe 5 are disposed between the first heat sink 2 and the memory stick 1. A first mounting slot 21 is provided on the side of the first heat sink 2 facing the memory stick 1. A first heat pipe 5 is welded into the first mounting slot 21 and arranged in accordance with the arrangement of the memory chips 11. One side of the first thermal pad 6 contacts several memory chips 11 on the front side of the memory stick 1, while the other side of the first thermal pad 6 is connected to the first heat pipe 5. The first thermal pad 6 absorbs heat from the memory chips 11 through contact with the memory chips 11. The first heat pipe 5 evenly distributes the heat from the memory chips 11 to the first heat sink 2. The server system fan then removes the heat from the first heat sink 2, thereby dissipating heat from the server memory. Furthermore, the larger heat sink structure increases air flow with the outside world, improving memory cooling.

[0025] It is understood that the back side of the memory stick 1 is provided with the same structure, namely, a second thermal pad 8 and a second heat pipe 7 are provided between the second heat sink 3 and the memory stick 1. A second mounting slot 31 is provided on the side of the second heat sink 3 facing the memory stick 1. A second heat pipe 7 is welded into the second mounting slot 31 and arranged in the direction of the second heat pipe 7 according to the arrangement of the memory chips 11. One side of the second thermal pad 8 contacts several memory chips 11 on the back side of the memory stick 1, and the other side of the second thermal pad 8 is connected to the second heat pipe 7. The second thermal pad 8 contacts the memory chips 11 and absorbs the heat from the memory chips 11. The second heat pipe 7 evenly distributes the heat from the memory chips 11 to the second heat sink 3. The server system fan then removes the heat from the second heat sink 3, achieving heat dissipation of the server memory.

[0026] In this embodiment, the memory heat dissipation structure is provided with two fixing clips 4 along the length direction of the memory bar 1 , thereby increasing the stability of fixing the first heat sink 2 and the second heat sink 3 on the memory bar 1 .

[0027] Furthermore, the first elastic piece 41 and the second elastic piece 42 in the fixing clip 4 are both U-shaped structures, and the connecting piece 43 has two pieces connected to the two corresponding ends of the first elastic piece 41 and the second elastic piece 42 respectively. The first elastic piece 41 and the second elastic piece 42 with a U-shaped structure have a higher elastic deformation amount, which is convenient for operation.

[0028] Among them, the first elastic piece 41 and the second elastic piece 42 are located at the inner bottom of the U-shaped structure as a buckle edge 44, and the first heat sink 2 is provided with a first buckle 9, the buckle edge 44 of the first elastic piece 41 abuts against the first buckle 9, and the second heat sink 3 is provided with a second buckle 9, and the buckle edge 44 of the second elastic piece 42 abuts against the second buckle 9. In this way, without prying open the fixing clip 4, the fixing clip 4 can be prevented from moving up and down on the first heat sink 2 and the second heat sink 3, thereby preventing the fixing clip 4 from detaching from the first heat sink 2 and the second heat sink 3.

[0029] Furthermore, the first heat sink 2 and the second heat sink 3 are both provided with grooves 10 , and the connecting piece 43 is engaged in the grooves 10 , so as to prevent the fixing clip 4 from moving left and right, and avoid the fixing clip 4 from being separated from the first heat sink 2 and the second heat sink 3 .

[0030] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A memory heat dissipation structure, characterized by: It includes a first heat sink, a second heat sink and a fixing clip. The first heat sink and the second heat sink are respectively in contact with a number of memory particles on both sides of the memory bar. The fixing clip is used to provide an elastic force to clamp the first heat sink and the second heat sink on the memory.

2. The memory heat dissipation structure according to claim 1, wherein: A first thermal pad is provided between the first heat sink and the memory bar. One side of the first thermal pad contacts a plurality of memory chips on the front side of the memory bar, and the other side of the first thermal pad is connected to the first heat sink.

3. The memory heat dissipation structure according to claim 2, wherein: A first mounting groove is provided on a side of the first heat sink facing the first thermal pad. A first heat pipe is fixedly connected in the first mounting groove, and the first heat pipe is connected to the first thermal pad.

4. The memory heat dissipation structure according to claim 1, wherein: A second thermal pad is provided between the second heat sink and the memory bar. One side of the second thermal pad contacts a plurality of memory chips on the back side of the memory bar, and the other side of the second thermal pad is connected to the second heat sink.

5. The memory heat dissipation structure according to claim 4, characterized in that: A second mounting groove is provided on a side of the second heat sink facing the second thermal pad. A second heat pipe is fixedly connected in the second mounting groove. The second heat pipe is connected to the second thermal pad.

6. The memory heat dissipation structure according to claim 1, characterized in that: The fixing clip is a U-shaped structure, including a first elastic piece, a second elastic piece and a connecting piece connected between the first elastic piece and the second elastic piece. The first elastic piece abuts against the outer side of the first heat sink, and the second elastic piece abuts against the outer side of the second heat sink.

7. The memory heat dissipation structure according to claim 6, characterized in that: The first elastic piece and the second elastic piece are both U-shaped structures.

8. The memory heat dissipation structure according to claim 7, characterized in that: A first scratch buckle and a second scratch buckle are respectively provided on the first heat sink and the second heat sink, and the first elastic piece and the second elastic piece are respectively engaged with the first scratch buckle and the second scratch buckle.

9. The memory heat dissipation structure according to claim 8, characterized in that: The first heat sink and the second heat sink are both provided with grooves, and the connecting piece is clamped in the grooves.

10. A memory heat dissipation structure according to any one of claims 6 to 9, characterized in that: The first heat sink and the second heat sink are provided with at least two fixing clips along the length direction thereof.

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