Thermocompression bonding device for flexible circuit board and gum

Abstract

The utility model relates to the technical field of production equipment of flexible printed circuit boards, in particular to a thermocompression bonding device for a flexible printed circuit board and gum, which comprises an upper module, a lower module and a heat source assembly, the upper module is provided with a heat conduction piece and a plurality of pressure heads, and materials to be processed are fed on the lower module; the upper module and the heat source assembly move to a preheating station and are attached, so that the heat conduction piece and the pressing head are heated through heat conduction; and the preheated upper module moves to the pressing station and is matched with the lower module to perform hot pressing on the to-be-processed material. The heating part is integrated on the heating plate outside the thermocompression bonding area, and after the pressing head and the heat conduction part in the upper module are attached to the heating plate and are subjected to heat conduction to certain stability, the pressing head and the heat conduction part are matched with the lower module to perform thermocompression bonding on the to-be-processed material. The pressing head area in the limited space of the upper die set is kept clean and tidy, when faults occur, heating parts and circuits outside the heating area can be independently overhauled, connection operation is more convenient, and the die is kept tidy and tidy.

Description

Technical Field

[0001] The utility model relates to the technical field of production equipment for flexible printed circuit boards, in particular to a hot pressing device for flexible printed circuit boards and adhesive backing. Background Art

[0002] Flexible printed circuit board (FPCB) is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the substrate. It is referred to as soft board or FPCB and has the characteristics of high wiring density, light weight and thin thickness.

[0003] In the current production process for reinforcing sheets used in flexographic boards, adhesive lamination is typically performed before stamping. During the laminating process, the flexographic board is typically placed on a jig, where it is pressed together with a die to securely bond the board to the adhesive. Single-piece flexographic boards are compact and lightweight. Multiple flexographic boards, coated with adhesive, are then placed on a jig for pressing. However, cold pressing does not stimulate the adhesive's adhesion, resulting in poor adhesive adhesion and potentially causing functional problems in the flexographic board, leading to scrapping.

[0004] In the existing technology, a heating head or heating tube is set on each pressing head with pressed adhesive backing, and an air path and heating line are used to supply air and electricity to the heating head or heating tube. Each pressing head needs to be heated by pipes. Several arrays of pressing heads are crowded together and the space is limited, resulting in the lines of several heating heads being intertwined and complicated in the limited space, and the lines are difficult to connect and maintain.

[0005] Based on the problems in the prior art, the utility model provides a thermal compression bonding device for a flexible circuit board and an adhesive backing. Utility Model Content

[0006] The utility model aims to provide a hot pressing device for flexible circuit boards and adhesive backing, so as to solve the technical problems in the prior art of complex heating circuits on the pressure head in a limited space, and difficult operation, connection and maintenance.

[0007] The technical solution of the utility model is: a hot pressing device for a flexible circuit board and a backing adhesive, comprising:

[0008] The upper die assembly includes a heat conducting member and a pressing head. When the upper die assembly is not performing a pressing action or a preheating action, it is reset to the standby position A.

[0009] The heat source assembly includes a heating plate, which is reset to a standby position B when not heating the upper die assembly.

[0010] A lower die set, on which the material to be processed is loaded, and the material to be processed is lifted and lowered by a linear drive assembly;

[0011] The upper die set and the heat source assembly are both moved to the preheating station and attached at the preheating station, thereby at least conducting heat to heat the heat conductive part; the preheated upper die set is moved to the pressing station and cooperates with the lower die set to hot-press the material to be processed.

[0012] Preferably, the heat source assembly includes a pushing unit, which drives the heating plate to move back and forth between the standby station B and the preheating station;

[0013] A groove matching the contour of the heat conducting member is provided on the surface of the heating plate. When conducting heat, the pressure head is correspondingly inserted into the groove.

[0014] Preferably, a material receiving plate is provided on the lower die assembly, and a plurality of bumps are provided on the surface of the material receiving plate. The material to be processed is placed on the surface area of ​​the material receiving plate, and the preheated pressing heads cooperate with the plurality of bumps to press the material.

[0015] Preferably, the pressure head is fixedly mounted on the heat conducting member, the heat conducting member is connected to the support plate via a heat insulating block, the top of the support plate is connected to a telescopic rod, and the telescopic rod is hoisted on the upper plate via a mounting guard plate;

[0016] The upper plate is subjected to force to drive the pressure head at the bottom to move, and when the pressure head is docked with the groove, the telescopic rod allows the pressure head and the heat conducting member to fit into the groove and be evenly heated.

[0017] Preferably, the heat conducting member is made of a brass block, and the receiving plate and the protrusion are both made of brass.

[0018] Preferably, the heating plate is made of brass, and a heating tube, a thermocouple, and a heating connection line are arranged inside the heating plate.

[0019] Preferably, when the upper module and the heat source assembly are fitted together at the preheating station, the lower module lifts and moves the material receiving plate to fit together with the heating plate, so that the heating plate heats the heat conducting part of the upper module and the material receiving plate of the lower module simultaneously, and the heated heat conducting part and the material receiving plate are hot pressed together for the material to be processed.

[0020] Compared with the prior art, the advantages of the present invention are:

[0021] This application integrates the heating components on the heating plate outside the hot pressing area, and after the pressure head and heat conductor in the upper module are attached to the heating plate and heat is conducted to a certain temperature, it cooperates with the lower module to achieve hot pressing of the material to be processed. The heating source is moved outward, and when a fault occurs, it is more convenient to repair and connect the heating components and circuits outside the heating area separately, and the mold pressure head is kept compact, neat and tidy during the entire mold operation process. The materials to be processed are not limited to the scenario of flexible circuit boards with adhesive backing. The size and shape of the pressure head can be adaptively changed according to the size of the product to be pressed. This application can be used to achieve this in other scenarios where intensive products require hot pressing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0023] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the heat pressing device of the present invention;

[0024] Figure 2 This is a schematic diagram of the upper mold assembly and the heat source assembly of the present invention heating and conducting heat in the preheating station;

[0025] Figure 3 This is a schematic diagram of the upper die set and the lower die set of the present invention hot pressing materials at the pressing station;

[0026] Figure 4 This is a partial structural diagram of the upper material receiving plate of the lower die assembly of the utility model;

[0027] Figure 5 This is a schematic diagram of the partial structure of the upper die assembly of the present invention;

[0028] Figure 6 This is a schematic diagram of the partial structure of the heating plate of the present invention;

[0029] Among them: 1. Upper die set;

[0030] 11. Heat conducting element, 12. Pressure head, 13. Heat insulation block, 14. Support plate, 15. Telescopic rod, 16. Upper plate; 17. Install guard plate;

[0031] 2. Heat source component;

[0032] 21. Heating plate, 22. Pushing unit, 23. Groove; 24. Heat insulation plate, 25. Carrier plate;

[0033] 3. Lower die assembly; 31. Material receiving plate; 32. Bump;

[0034] 4. Preheating station; 5. Pressing station. DETAILED DESCRIPTION

[0035] The following is a further detailed description of the present invention in conjunction with specific embodiments:

[0036] To facilitate understanding, let's first explain the application scenario of this application. Typically, a flexible printed circuit board (flexible printed circuit board, typically in sheet form) is loaded onto a jig and firmly bonded to the adhesive backing through a process of top-down and bottom-out molding. However, cold pressing makes it difficult to activate the adhesive backing, resulting in poor adhesive quality and easily causing functional problems in the flexible board, leading to scrapping. The pressure head is small, the layout is dense within a limited space, and the heating lines are complex, making line connection and maintenance difficult.

[0037] like Figure 1 As shown, the present application provides a thermal compression bonding device for a flexible circuit board and adhesive backing, comprising an upper module 1 and a lower module 3 that cooperate with each other, and a heat source component 2 is provided on one side of the upper module 1 and the lower module 3.

[0038] The heat source assembly 2 includes a heating plate 21, which is a brass plate with integrated heating tubes, thermocouples, heating circuits and other components. The heating tube is connected to a power supply through a power supply line to heat the brass plate. The thermocouple is used to detect the heating temperature so that the heating temperature can be controlled within an appropriate temperature range.

[0039] Refer to the attached Figure 5 The upper mold assembly 1 includes a heat conductor 11 and a pressure head 12. The heat conductor 11 is made of a brass block, and the pressure head 12 is made of silicone. The pressure head 12 is fixedly installed below the heat conductor 11. The top of the heat conductor 11 is connected to the support plate 14 via an insulation block 13. The top of the support plate 14 is connected to a telescopic rod 15, which is hoisted onto the upper plate 16 via a mounting guard 17. The upper plate 16 is subjected to force to drive the bottom pressure head 12 to move. When the pressure head 12 docks with the groove 23, the telescopic rod 15 ensures that the pressure head 12 and the heat conductor 11 are evenly heated in the groove 23. When the upper mold assembly 1 is not performing a pressing action or preheating action, it returns to the standby position A.

[0040] As attached Figure 6 As shown, a groove 23 matching the contour of the heat conductor 11 is provided on the surface of the heating plate 21. During heat conduction, the pressure head 12 is correspondingly inserted into the groove 23, and the heating plate 21 is driven to move back and forth between the standby station B and the preheating station 4 by the pushing unit 22; when the heating plate 21 does not perform the heating action of the upper mold assembly 1, it returns to the standby station B.

[0041] The power mechanism of the pushing unit 22 adopts a motor or a linear cylinder. The bottom of the heating plate 21 is mounted on a carrier plate 25 through a heat insulation plate 24. The carrier plate 25 is fixed on the telescopic end of the cylinder or on the slider of the linear module. Figure 1As shown, the upper module 1 and the lower module 3 are vertically arranged up and down, the heat source component 2 is arranged on one side of the upper and lower modules, and the pushing unit 22 adopts a combination of a cylinder (not shown in the drawings) and a linear module.

[0042] The lower die set 3 includes a support plate, on which a material receiving plate 31 is mounted. Figure 4 As shown, the surface of the support plate 31 has several protrusions 32. Both the support plate 31 and the protrusions 32 are made of brass and can be integrated or separate. The material to be processed is placed on the surface of the support plate 31. A lifting component (not shown in the figure) is installed at the bottom of the support plate. The lifting component uses a linear cylinder or module to drive the support plate and the support plate 31 to rise and fall vertically.

[0043] In one embodiment or other embodiments, based on the above device structure, the process of hot pressing the material to be processed after being heated by the upper mold 1 through the adjacent heat source assembly 2 is as follows:

[0044] The upper die set 1 and the heat source assembly 2 are moved to the preheating station 4 according to their respective preset trajectories. Figure 2 At the preheating station 4, the upper mold 1 and the heat source assembly 2 are fitted together so that the heat conductor 11 corresponds to the groove 23 one by one, and the pressure head 12 is inserted into the groove 23 accordingly, which increases the contact area, ensures sufficient contact and heat conduction, and heats evenly, so that the preset temperature is reached quickly.

[0045] The preheating station 4 is located in the straight area between the upper mold 1 and the lower mold 3. When the heat source component 2 heats the upper mold 1 by heat conduction, the lower mold 3 lifts and moves the material receiving plate 31 to contact the heating plate 21, so that the heating plate 21 simultaneously heats the material receiving plate 31, the protrusion 32, the heat conducting member 11 and the pressure head 12.

[0046] After preheating (heat conduction) is completed, the upper module 1 is lifted back to the standby position A, and the heat source component 2 is reset to the standby position B.

[0047] The material receiving plate 31 is lowered to load the material to be processed (such as a flexible circuit board with several adhesive blocks). After the material is loaded, the material receiving plate 31 is lifted and the upper die set 1 is driven down synchronously. Both are moved to the pressing station 5. Figure 3 As shown, the heated pressing head 12 and the bump 32 cooperate with the hot pressing adhesive to stimulate the adhesive viscosity, so that the adhesive and the material are bonded. The upper and lower modules of the material are both heated, and the pressing effect is better.

[0048] In another embodiment or other embodiments, based on the above device structure, the process of hot pressing the material to be processed after being heated by the heat source assembly 2 next to the upper mold 1 is as follows:

[0049] The preheating station 4 is set at any appropriate position, and the upper mold 1 and the heat source component 2 are moved to the preheating station 4 according to their respective preset trajectories. At the preheating station 4, the upper mold 1 and the heat source component 2 are fitted together so that the heat conductor 11 corresponds to the groove 23 one by one, and the pressure head 12 is inserted into the groove 23 accordingly, thereby increasing the contact area, ensuring sufficient contact and heat conduction, uniform heating, and quickly reaching the preset temperature.

[0050] The heat conduction is maintained for a period of time (e.g., 3 seconds), transferring heat from the lower heating plate 21 to the upper heat conductor 11, thereby raising the temperature of the press head 12 to the specified temperature. After preheating (heat conduction) is completed, the upper mold assembly 1 is raised back to the standby position A, and the heat source assembly 2 is returned to the standby position B.

[0051] The material to be processed (such as a flexible circuit board with several adhesive blocks attached) is placed on the lowered material receiving plate 31. After the material is loaded, the material receiving plate 31 is lifted and the upper mold assembly 1 is driven down synchronously. Both are moved to the pressing station 5. The heated pressure head 12 and the bump 32 cooperate with the hot pressing adhesive to stimulate the adhesive viscosity, so that the adhesive is bonded to the material.

[0052] This application integrates the heating components onto the heating plate outside the hot pressing area. After the pressure head and heat conductor in the upper mold are attached to the heating plate and heated to a certain temperature, they are then combined with the lower mold to achieve hot pressing of the material to be processed. By moving the heating source outward, in the event of a malfunction, the heating components and circuits outside the heating area can be inspected and connected separately, making it more convenient. This also keeps the mold neat and tidy throughout the entire operation process.

[0053] The materials to be processed are not limited to the scenario of flexible circuit board adhesive bonding. Other scenarios requiring hot pressing can be achieved through this application. Moreover, the size and shape of the pressing head 12 can be adaptively changed according to the size of the product to be pressed.

[0054] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they are not intended to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A thermal compression device for a flexible circuit board and adhesive, characterized in that: include: The upper die assembly includes a heat conducting member and a pressing head. When the upper die assembly is not performing a pressing action or a preheating action, it is reset to the standby position A. The heat source assembly includes a heating plate, which is reset to a standby position B when not heating the upper die assembly. A lower die set, on which the material to be processed is loaded, and the material to be processed is lifted and lowered by a linear drive assembly; The upper die set and the heat source assembly are both moved to the preheating station and attached at the preheating station, thereby at least conducting heat to heat the heat conductive part; the preheated upper die set is moved to the pressing station and cooperates with the lower die set to hot-press the material to be processed.

2. The thermal compression bonding device for a flexible circuit board and adhesive according to claim 1, characterized in that: The heat source assembly includes a pushing unit, which drives the heating plate to move back and forth between the standby station B and the preheating station; A groove matching the contour of the heat conducting member is provided on the surface of the heating plate. When conducting heat, the pressure head is correspondingly inserted into the groove.

3. The thermal compression bonding device for a flexible circuit board and adhesive according to claim 2, characterized in that: A material receiving plate is provided on the lower die assembly, and a plurality of protrusions are provided on the surface of the material receiving plate. The material to be processed is placed on the surface area of ​​the material receiving plate, and the preheated pressing heads cooperate with the plurality of protrusions to press the material.

4. The thermal compression bonding device for a flexible circuit board and adhesive according to claim 2, characterized in that: The pressure head is fixedly mounted on the heat conducting member, the heat conducting member is connected to the support plate via a heat insulating block, the top of the support plate is connected to a telescopic rod, and the telescopic rod is hoisted on the upper plate via a mounting guard plate; The upper plate is subjected to force to drive the pressure head at the bottom to move, and when the pressure head is docked with the groove, the telescopic rod allows the pressure head and the heat conducting member to fit into the groove and be evenly heated.

5. The thermal compression bonding device for flexible circuit boards and adhesives according to claim 3, characterized in that: The heat conducting member is made of a brass block, and the supporting plate and the protrusion are both made of brass.

6. The thermal compression bonding device for a flexible circuit board and adhesive according to claim 1, characterized in that: The heating plate is made of brass, and a heating tube, a thermocouple, and a heating connection line are arranged inside the heating plate.

7. The thermal compression bonding device for a flexible circuit board and adhesive according to claim 3, characterized in that: When the upper mold group and the heat source component are fitted together at the preheating station, the lower mold group lifts and moves the material receiving plate to fit together with the heating plate, so that the heating plate heats the heat conducting part of the upper mold group and the material receiving plate of the lower mold group simultaneously. After heating, the heat conducting part and the material receiving plate are hot pressed together with the material to be processed.

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