Continuous grinding device for automatic loading and unloading of SiC wafers

Abstract

The utility model relates to a continuous grinding device for automatic loading and unloading of a silicon carbide (SiC) wafer, which comprises a working table, a rotating column is arranged in the center of the working table, three working positions are arranged on the working table on the outer ring of the rotating column, and the three working positions are arranged in an equilateral triangle shape by taking the rotating column as the center. The outer side of the rotating column is connected with a rotating arm corresponding to the direction of each working position, the tail end of each rotating arm is provided with a clamp, the three working positions are respectively provided with a feeding mechanism, a grinding mechanism and a discharging mechanism which can be matched with the clamps, the feeding mechanism can be matched with the clamps at the working positions to feed the SiC wafer into the clamps, and the grinding mechanism can be matched with the discharging mechanism. The grinding mechanism can be matched with the clamp to grind the top surface of the SiC wafer, and the blanking mechanism can be matched with the clamp to realize blanking of the SiC wafer. According to the continuous grinding device, continuous automatic feeding, grinding and discharging of the SiC wafer can be achieved, a circuit on the front face of the wafer is not prone to being damaged, effective grinding of the back face can be achieved, and high production efficiency is achieved.

Description

Technical Field

[0001] The utility model relates to the field of SIC wafer production, in particular to a continuous grinding device for automatically loading and unloading SIC wafers. Background Art

[0002] SIC materials, with their unique characteristics such as large bandgap, high critical breakdown field strength, high electron mobility, and high thermal conductivity, have become ideal materials for making high-temperature, high-frequency, high-power, radiation-resistant, short-wavelength luminescent and optoelectronic integrated devices, and have played a unique role in the fields of microelectronics, optoelectronics, etc.

[0003] SIC wafers refer to silicon carbide wafers used in the manufacture of silicon semiconductor integrated circuits. Due to their circular shape, they are called wafers. Generally, before integrated circuit packaging, it is necessary to remove a certain thickness of excess substrate material from the back of the wafer. This is called the wafer back thinning process. Specifically, a grinding device is used to achieve rapid thinning. However, most existing grinding devices cannot achieve continuous grinding when grinding wafers, resulting in low production efficiency. Patent CN218364021U discloses a grinding and polishing device for silicon carbide wafers. Although it achieves continuous grinding production of wafers, the following problems still exist: First, during the process of transferring the wafer to the grinding position, there is a long grinding distance between the front of the bottom wafer in the barrel and the surface of the turntable, which risks damaging the circuit on the front of the wafer; second, the wafer is clamped and positioned by the grinding head body and ground by the grinding plate, which leads to the problem of poor material discharge after grinding. Utility Model Content

[0004] In order to make up for the deficiencies of the prior art, the utility model provides a continuous grinding device for automatic loading and unloading of SIC wafers, which can not only realize continuous automatic loading, grinding and smooth unloading of SIC wafers, but also is not easy to damage the front side circuit of the wafer, and can realize effective grinding of the back side, thereby achieving higher production efficiency.

[0005] The technical solution adopted by the present invention to solve the above technical problems is:

[0006] A continuous grinding device for automatic loading and unloading of SIC wafers comprises a workbench, a rotating column is provided at the center of the workbench, three working positions are provided on the workbench on the outer ring of the rotating column, and the three working positions are arranged in an equilateral triangle with the rotating column as the center, a rotating arm is connected to the outside of the rotating column corresponding to the direction of each working position, a clamp is provided at the end of each rotating arm, and a loading mechanism, a grinding mechanism and a unloading mechanism that can cooperate with the clamp are respectively provided at the three working positions, wherein the loading mechanism can cooperate with the clamp at the work position to realize loading of SIC wafers into the clamp, the grinding mechanism can cooperate with the clamp at the work position to realize grinding of the top surface of SIC wafers, and the unloading mechanism can cooperate with the clamp to realize unloading of SIC wafers, and the rotating column can be driven by a first driving member to rotate the three rotating arms between the three working positions.

[0007] Furthermore, the clamp includes a left clamping part and a right clamping part with the same structure, and a supporting protrusion is provided on the lower inner side of the left clamping part. The distance from the supporting protrusion to the top of the left clamping part is less than the thickness of the SIC wafer.

[0008] Furthermore, the loading mechanism includes a loading rack fixed on the workbench, the loading rack is connected to a barrel, the barrel is filled with SIC wafers, and a rotating cover is provided at the bottom of the barrel. The rotating cover can be driven by a second driving member to cooperate with the clamp rotated to the working position to realize the unloading of a single SIC wafer into the clamp.

[0009] Furthermore, the grinding mechanism includes a grinding frame fixed on a workbench, a telescopic cylinder is inverted on the grinding frame, the output end of the telescopic cylinder is connected to a motor, the output end of the motor is connected to a grinding part, and a pad for supporting the clamp is provided at the working position below the grinding part.

[0010] Furthermore, the pad is driven to rise and fall by a third driving member.

[0011] Furthermore, the blanking mechanism includes a blanking port opened on the workbench, and a material receiving piece is provided below the blanking port.

[0012] Furthermore, the material receiving member is a conveyor belt or a material receiving frame.

[0013] Furthermore, the first driving component adopts a stepping motor.

[0014] The utility model adopts the above technical solution, and has the advantages that the continuous grinding device for automatic loading and unloading of SIC wafers can not only realize continuous automatic loading, grinding and smooth unloading of SIC wafers, but also is not easy to damage the front side circuit of the wafer, and can realize effective grinding of the back side, thereby achieving higher production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1This is a schematic structural diagram of one embodiment of the present invention;

[0016] Figure 2 for Figure 1 Top view of .

[0017] In the figure, 1, workbench, 2, rotating column, 3, rotating arm, 4, clamp, 5, loading mechanism, 6, grinding mechanism, 7, unloading mechanism, 8, SIC wafer;

[0018] 401, left clamping portion, 402, supporting protrusion 402;

[0019] 501, loading rack, 502, barrel, 503, rotary cover, 504, second driving member;

[0020] 601, grinding frame, 602, telescopic cylinder, 603, motor, 604, grinding unit, 605, pad;

[0021] 701, feeding port, 702, receiving piece. DETAILED DESCRIPTION

[0022] In order to clearly illustrate the technical features of this solution, the present invention is described in detail below through specific implementation methods and in conjunction with the accompanying drawings.

[0023] like Figure 1-2 As shown, in this embodiment, the continuous polishing device for automatic loading and unloading of SIC wafers includes a workbench 1, a rotating column 2 is provided at the center of the workbench 1, and three working positions are provided on the workbench of the outer ring of the rotating column 2. The three working positions are arranged in an equilateral triangle with the rotating column 2 as the center. A rotating arm 3 is connected to the outside of the rotating column 2 in the direction of each working position. A clamp 4 is provided at the end of each rotating arm 3. A loading mechanism 5, a grinding mechanism 6 and a unloading mechanism 7 that can cooperate with the clamp 4 are respectively provided at the three working positions. The loading mechanism 5 can cooperate with the clamp 4 at the working position to load the SIC wafer 8 into the clamp 4, the grinding mechanism 6 can cooperate with the clamp at the working position to grind the top surface of the SIC wafer, and the unloading mechanism 7 can cooperate with the clamp to unload the SIC wafer. The rotating column 2 can be driven by a first driving member to rotate the three rotating arms 3 between the three working positions to realize automatic continuous loading, grinding and unloading. Among them, the first driving member can specifically be a stepping motor.

[0024] Regarding the feeding mechanism, one of the following two structures can be adopted.

[0025] The first one: Figure 1As shown, the loading mechanism 5 includes a loading rack 501 fixed on the workbench 1, and a barrel 502 is connected to the loading rack 501. The barrel 502 is filled with SIC wafers 8. A rotating cover 503 is provided at the bottom of the barrel 502. The rotating cover 503 can be driven by a second driving member 504 to cooperate with the clamp 4 rotated to the working position to realize the unloading of a single SIC wafer 8 into the clamp.

[0026] The second method involves installing a barrel beneath the fixture, extending through worktable 1. SIC wafers are placed inside the barrel, and a telescopic cylinder is installed at the bottom of the barrel. The cylinder pushes out the wafers one at a time, allowing the fixture to remove them. In this case, a standard fixture can be used. Compared to the second method, the first structure allows for timely replenishment of wafers without stopping the machine.

[0027] Based on the first loading mechanism, a clamp with the following structure is adopted. The clamp 4 specifically includes a left clamping part 401 and a right clamping part with the same structure. A supporting protrusion 402 is provided on the lower inner part of the left clamping part 401. The distance from the supporting protrusion to the top of the left clamping part is less than the thickness of the SIC wafer. During the loading process, the SIC wafer first falls onto the supporting protrusion and is then clamped by the left clamping part 401 and the right clamping part, thereby better completing the loading process.

[0028] The grinding mechanism 6 can be directly adapted from an existing one. Specifically, it may include a grinding frame 601 fixed to the workbench 1, with a telescopic cylinder 602 inverted on the grinding frame 601. The output end of the telescopic cylinder 602 is connected to a motor 603, and the output end of the motor 603 is connected to a grinding unit 604. A pad 605 for supporting the fixture is provided at the working position below the grinding unit 604. The pad arrangement makes grinding more stable. Furthermore, to improve support stability, the pad 605 can be driven up and down by a third drive member, which can be a telescopic cylinder such as a pneumatic cylinder.

[0029] The material unloading mechanism 7 may specifically include a material unloading port 701 provided on the workbench 1, and a material receiving member 702 is provided below the material unloading port 701. The material receiving member is a conveyor belt or a material receiving frame.

[0030] Working Principle: When one of the rotating arms 3 drives the clamp 4 to the loading mechanism 5, the rotating cover 503, driven by a second drive element 504, which can be a servo motor, rotates open. The clamp 4 then moves below the barrel 502, dropping a SIC wafer 8 onto the support protrusion 402 before being clamped by the left and right clamping parts. As the clamp rotates away, the rotating cover 503 rotates approximately one full revolution and moves from the other side of the clamp, closing the barrel 502. When the clamp 4 moves below the grinding mechanism 6, the telescopic cylinder 602 and motor 603 cooperate to grind the SIC wafer. The support platform 605 supports the clamp during the grinding process, ensuring a more stable grinding process. After grinding, the clamp moves to the unloading mechanism 7, where the clamp 4 releases the wafer and drops it onto the receiving element 702. The three rotating arms work together to achieve continuous loading, grinding, and unloading, improving grinding efficiency and preventing wear on the front surface of the wafer.

[0031] The above specific implementation methods cannot be used as a limitation on the protection scope of the present utility model. For those skilled in the art, any replacement, improvement or transformation made to the implementation methods of the present utility model falls within the protection scope of the present utility model.

[0032] Anything not described in detail in the present invention is well known to those skilled in the art.

Claims

1. A continuous polishing device for automatic loading and unloading of SIC wafers, characterized in that: The invention comprises a workbench, a rotating column is provided at the center of the workbench, three work positions are provided on the workbench of the outer ring of the rotating column, and the three work positions are arranged in an equilateral triangle with the rotating column as the center, a rotating arm is connected to the outside of the rotating column corresponding to the direction of each work position, a clamp is provided at the end of each rotating arm, and a loading mechanism, a grinding mechanism and a unloading mechanism that can cooperate with the clamp are respectively provided at the three work positions, wherein the loading mechanism can cooperate with the clamp at the work position to realize the loading of SIC wafers into the clamp, the grinding mechanism can cooperate with the clamp at the work position to realize the grinding of the top surface of SIC wafers, and the unloading mechanism can cooperate with the clamp to realize the unloading of SIC wafers, and the rotating column can be driven by a first driving member to make the three rotating arms rotate between the three work positions.

2. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 1 is characterized in that: The clamp includes a left clamping part and a right clamping part with the same structure. A supporting protrusion is provided on the lower inner side of the left clamping part. The distance from the supporting protrusion to the top of the left clamping part is less than the thickness of the SIC wafer.

3. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 1 is characterized in that: The loading mechanism includes a loading rack fixed on the workbench, the loading rack is connected to a barrel, the barrel is filled with SIC wafers, and a rotating cover is provided at the bottom of the barrel. The rotating cover can be driven by a second driving member to cooperate with the clamp rotated to the working position to realize the unloading of a single SIC wafer into the clamp.

4. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 1 is characterized in that: The grinding mechanism includes a grinding frame fixed on a workbench, a telescopic cylinder is inverted on the grinding frame, the output end of the telescopic cylinder is connected to a motor, the output end of the motor is connected to a grinding part, and a pad for supporting a clamp is provided at the working position below the grinding part.

5. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 4 is characterized in that: The support platform is driven to rise and fall by a third driving member.

6. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 1 is characterized in that: The material discharge mechanism comprises a material discharge port opened on the workbench, and a material receiving piece is provided below the material discharge port.

7. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 6 is characterized in that: The material receiving member is a conveyor belt or a material receiving frame.

8. The continuous polishing device for automatic loading and unloading of SIC wafers according to claim 6, characterized in that: The first driving component is a stepping motor.

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