IC (Integrated Circuit) taking and positioning mechanism

Abstract

The utility model discloses an IC (integrated circuit) taking and positioning mechanism which comprises a mounting plate, a feeding track arranged on the mounting plate and used for conveying an inverted IC and a cover plate arranged on the feeding track, a positioning strip is arranged on a bottom plate of the cover plate, a movable plate is arranged at the discharging end of the feeding track, a limiting column is arranged above the movable plate, and the positioning strip is arranged on the movable plate. According to the IC taking and positioning mechanism, by installing the positioning strips, the movable plate, the limiting columns and the air cylinders, accurate positioning and stable conveying of inverted ICs are achieved, and the production efficiency and the positioning accuracy are remarkably improved.

Description

Technical Field

[0001] The utility model relates to the technical field of locking machines, in particular to an IC material taking and positioning mechanism. Background Art

[0002] The retrieving and positioning of IC chips is crucial in the manufacturing and packaging of integrated circuits (ICs). With the continuous advancement of technology, IC chip specifications are becoming increasingly diverse, ranging from tiny surface-mount components to large packaged assemblies. These varying IC chip sizes place increasingly stringent requirements on retrieving and positioning mechanisms. Traditional IC retrieving and positioning mechanisms often utilize a single clamping method or positioning structure, making them difficult to adapt to the diverse specifications of IC chips. This can lead to issues such as pin damage and inaccurate positioning during the production process, severely impacting production efficiency and product quality.

[0003] Specifically, traditional pick-up and positioning mechanisms often require complex adjustments or replacement of clamping components when handling IC chips of varying sizes. This not only increases operational difficulty and time costs, but can also easily lead to damage to the equipment or IC chip pins due to human error. Furthermore, some precision IC chips, due to their large number of pins and close spacing, require extremely high positioning accuracy, which traditional mechanisms often struggle to achieve. This leads to errors during the pick-up and positioning process, impacting subsequent packaging and testing processes. Summary of the Invention

[0004] In order to overcome the deficiencies of the existing technical solutions, the present invention provides an IC material taking and positioning mechanism, which can effectively solve the problems of pin damage and material throwing that are prone to occur during the production process as mentioned in the background technology.

[0005] The technical solution adopted by the utility model to solve the technical problem is: an IC material picking and positioning mechanism includes a mounting plate, a feeding track arranged on the mounting plate for conveying inverted ICs, and a cover plate arranged on the feeding track, the bottom plate of the cover plate is installed with a positioning bar, a movable plate for adsorbing IC chips is provided at one end of the feeding track for discharging, a limiting column is provided above the movable plate, and a cylinder is installed below the movable plate, and the movable end of the cylinder is fixed to the bottom surface of the movable plate;

[0006] The movable plate is provided with communicating vents on the top and the side. The vents on the side are connected to a vacuum pumping mechanism. The vents on the side are vacuumed to generate negative pressure at the vents on the top to adsorb the IC chip.

[0007] Furthermore, mounting columns are provided on both sides of the feeding track.

[0008] Furthermore, the limiting column is a detachable structure.

[0009] Furthermore, a plurality of vertical plates are provided at the bottom of the mounting plate, a bottom plate is provided below the vertical plates, and the vertical plates are vertically installed above the bottom plate.

[0010] Furthermore, the positioning bar is a detachable structure.

[0011] Furthermore, a sensor is provided on the feeding track for detecting the position of the IC chip on the feeding track to control the start and stop of the cylinder to ensure that the IC chip reaches the positioning position accurately.

[0012] Furthermore, the movable end of the cylinder is fixed to the bottom surface of the movable plate via a connector, and the connector includes a bolt and a nut with adjustable length to facilitate adjustment of the height of the movable plate to accommodate IC chips of different sizes.

[0013] Compared with the existing technology, the beneficial effect of the present invention is that through the coordinated use of positioning strips and limiting columns, precise positioning of IC chip pins can be achieved, ensuring the position accuracy of IC chips during transportation and placement, and avoiding quality problems caused by pin misalignment.

[0014] The design of the feeding track and cover ensures the stability of the IC chip during the transportation process. The cover can protect the IC chip from external interference, while the feeding track can ensure that the IC chip passes in an orderly manner according to the predetermined path.

[0015] The telescopic movement of the cylinder can drive the movable plate to move up and down, thereby realizing the automated pick-and-place operation of IC chips, which helps to improve production efficiency, reduce manual intervention and lower production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural stereogram of the utility model;

[0017] Figure 2 This is an exploded view of the structure of the present utility model;

[0018] Figure 3 This is a schematic diagram of the connector structure of the present invention.

[0019] Numbers in the figure:

[0020] 1-Mounting plate, 2-Feeding track, 3-Cover plate, 4-Positioning bar, 5-Mounting column, 6-Vertical plate, 7-Base plate, 8-Cylinder, 9-Movable plate, 10-Limiting column, 11-Connector, 12-Bolt, 13-Nut, 14-IC chip. DETAILED DESCRIPTION

[0021] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0022] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure. Example

[0023] like Figure 1-3 As shown, the utility model provides an IC material picking and positioning mechanism, comprising a mounting plate 1, a feed track 2 arranged on the mounting plate 1 for conveying inverted ICs, and a cover plate 3 arranged on the feed track 2. A bottom plate 7 of the cover plate 3 is mounted with a positioning bar 4. A movable plate 9 for adsorbing IC chips is disposed at one end of the feed track 2. A limiting column 10 is disposed above the movable plate 9. A cylinder 8 is mounted below the movable plate 9. The movable end of the cylinder 8 is fixed to the bottom surface of the movable plate 9.

[0024] The movable plate 9 is provided with communicating vent holes on the top and the side. The vent holes on the side are connected to a vacuum pumping mechanism. The vent holes on the side are vacuumed to generate negative pressure at the vent holes on the top to adsorb the IC chip.

[0025] The mounting plate 1 is used to install and fix other components.

[0026] The feeding track 2 is provided on the mounting plate 1 and is used to convey the inverted IC chips, thereby ensuring that the IC chips can pass through stably and orderly.

[0027] The cover plate 3 is arranged above the feeding track 2 to protect the IC chip from external interference during the transportation process. The bottom plate 7 of the cover plate 3 is installed with a positioning bar 4.

[0028] The positioning strips 4 are mounted on the bottom plate 7 of the cover plate 3 and are used to limit the pins of the IC chip to ensure that the pins of the IC chip are accurately positioned during transportation without offset or misalignment.

[0029] The movable plate 9 is arranged at the discharge end of the feeding track 2 and is used for further positioning and fixing the IC chip during the material removal process.

[0030] The cylinder 8 is installed below the movable plate 9, and its movable end is fixed to the bottom surface of the movable plate 9. The cylinder 8 drives the movable plate 9 to move up and down through telescopic motion to achieve the pick-and-place operation of the IC chip.

[0031] By connecting the vacuum mechanism through the side vents, negative pressure can be generated at the vents above the movable plate 9, which can firmly adsorb the IC chip that slides out from the discharge end of the feeding track 2. During the material retrieval process, the cylinder 8 will push up the movable plate 9 to ensure that the IC chip will not slip or be misplaced during the material retrieval process, thereby improving the accuracy and stability of the material retrieval.

[0032] By using the positioning strip 4 and the limiting column 10 in conjunction with each other, the pins of the IC chip can be precisely limited, ensuring the position accuracy of the IC chip during transportation and placement, and avoiding quality problems caused by pin misalignment.

[0033] The design of the feeding track 2 and the cover plate 3 ensures the stability of the IC chip during the transportation process. The cover plate 3 can protect the IC chip from external interference, while the feeding track 2 can ensure that the IC chip passes in an orderly manner along the predetermined path.

[0034] The telescopic movement of the cylinder 8 can drive the movable plate 9 to move up and down, thereby realizing the automatic pick-and-place operation of the IC chip, which helps to improve production efficiency, reduce manual intervention, and reduce production costs.

[0035] See also Figure 1 and Figure 2 , mounting columns 5 are provided on both sides of the feeding track 2.

[0036] The mounting post 5 provides a stable support for the feed track 2, ensuring that the feed track 2 can maintain a horizontal position or a predetermined tilt angle on the mounting plate 1, thereby stably conveying IC chips. By fixing the feed track 2 on the mounting post 5, it is ensured that the position of the feed track 2 will not be offset or shaken due to external forces, thereby ensuring the stability and accuracy of the conveying process.

[0037] By arranging mounting posts 5 on both sides of the feeding track 2, the structural strength of the entire material picking and positioning mechanism can be enhanced, which helps to resist the vibration and impact force generated during the transportation of IC chips and ensure the stability and durability of the mechanism.

[0038] The limiting post 10 is a detachable structure, and the limiting post 10 of corresponding size can be replaced according to IC specifications.

[0039] Since the size and pin layout of IC chips vary from model to model, the detachable limit pin 10 allows the user to replace it according to the current IC specifications of production, and can flexibly adapt to IC chips of different sizes, ensuring that the IC chip can be stably positioned in the predetermined position during the placement process.

[0040] By replacing the limit column 10, the production line can be quickly adjusted to adapt to different types of IC chips without replacing the entire material positioning mechanism, thereby improving the flexibility and response speed of the production line and reducing the cost and time waste caused by replacing equipment.

[0041] The detachable limiting pins 10 allow precise adjustment according to the pin spacing and size of the IC chip, thereby ensuring the accuracy of the IC chip during transportation and positioning, and helping to reduce quality problems and production losses caused by inaccurate positioning.

[0042] See also Figure 1 and Figure 2 A plurality of vertical plates 6 are provided at the bottom of the mounting plate 1 , and the vertical plates 6 are used to raise the entire mechanism. A bottom plate 7 is provided below the vertical plates 6 , and the vertical plates 6 are vertically installed above the bottom plate 7 .

[0043] The function of the vertical plate 6 is to raise the entire material retrieving and positioning mechanism so that the mechanism reaches a suitable working height, which helps the operator to observe and operate the mechanism more conveniently, and also helps the mechanism to connect with other production equipment or assembly lines.

[0044] By providing a plurality of vertical plates 6, the support points at the bottom of the mechanism can be increased, thereby improving the stability and rigidity of the entire mechanism, helping to resist the vibration and impact force generated during the transportation of IC chips, and ensuring the stable operation of the mechanism.

[0045] The bottom plate 7 is located below the vertical plate 6 and provides a stable foundation, ensuring that the vertical plate 6 can be stably installed thereon and bear all weight and loads generated by the mechanism during operation.

[0046] The positioning bar 4 is a detachable structure.

[0047] Since the size, pin layout and pin spacing of IC chips vary from model to model, the detachable positioning bar 4 allows the user to replace it according to the specifications of the IC chip currently being produced. The mechanism can flexibly adapt to different types of IC chips, ensuring that the IC chips can be accurately aligned and positioned during the pick-and-place process.

[0048] By simply replacing the positioning bar 4, the production line can quickly switch between different types of IC chips without replacing the entire material picking and positioning mechanism, thereby improving the flexibility and response speed of the production line and reducing the downtime and cost caused by equipment replacement.

[0049] The detachable positioning bar 4 allows precise adjustment according to the pin spacing and layout of the IC chip, thereby ensuring high precision of the IC chip during transportation and positioning, and helping to reduce quality problems and production losses caused by inaccurate positioning.

[0050] Among them, a sensor is provided on the feeding track 2 for detecting the position of the IC chip on the feeding track 2 to control the start and stop of the cylinder 8 to ensure that the IC chip reaches the positioning position accurately.

[0051] The sensor can monitor the position of the IC chip on the feeding track 2 in real time. By sensing the presence or movement of the IC chip, the sensor can accurately determine the position information of the chip.

[0052] Based on the IC chip's position information detected by the sensor, the control system can precisely control the start and stop of cylinder 8. When the sensor detects that the chip has reached a predetermined position, it sends a signal to the control system, which then activates cylinder 8 to pick up or put down the material. Similarly, when the sensor detects that the chip has left that position or reached the next target position, it sends a stop signal to the control system, causing cylinder 8 to stop.

[0053] By precisely controlling the start and stop of the air cylinder 8, the sensor can ensure that the IC chip reaches the positioning position accurately, which helps to avoid the chip from being offset or misaligned during the conveying process, thereby improving the accuracy and stability of the material removal.

[0054] The use of sensors enables automatic detection and positioning of IC chips on the feeding track 2, reduces the need for human intervention and manual adjustment, and improves production efficiency and automation level.

[0055] See also Figure 3 The movable end of the cylinder 8 is fixed to the bottom surface of the movable plate 9 by a connecting piece 11. The connecting piece 11 includes a bolt 12 and a nut 13 with adjustable length to facilitate adjusting the height of the movable plate 9 to adapt to IC chips of different sizes.

[0056] The height of the movable plate 9 can be easily adjusted by adjusting the length of the bolt 12 and the nut 13. This adjustment function allows the mechanism to adapt to IC chips of different sizes, ensuring that the chip can be stably placed on the movable plate 9 and accurately aligned with the positioning device during the pick-and-place process.

[0057] The adjustable connector 11 allows the production line to quickly switch between different types of IC chips without having to replace the entire material removal and positioning mechanism. This improves the flexibility and responsiveness of the production line and helps reduce the downtime and cost caused by equipment replacement.

[0058] In actual application, the operator can rotate the bolt 12 as needed to adjust the length through the threaded fit between the bolt 12 and the nut 13. When the desired height is reached, the length of the bolt 12 can be fixed by tightening the nut 13, thereby ensuring that the height of the movable plate 9 remains stable.

[0059] In the description of the present invention, it should be understood that the terms "middle", "length", "upper", "lower", "front", "back", "vertical", "horizontal", "inner", "outer", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0060] In the present invention, unless otherwise expressly specified or limited, a first feature "on" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. "Multiple" means at least two, such as two or three, unless otherwise expressly specified or limited.

[0061] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0062] The above is only for explaining the implementation mode of the present invention and is not intended to limit the present invention. For those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present invention without creative work should be included in the scope of protection of the present invention.

Claims

1. An IC picking and positioning mechanism, comprising a mounting plate, a feeding track arranged on the mounting plate for conveying inverted ICs, and a cover plate arranged on the feeding track, characterized in that: The bottom plate of the cover plate is installed with a positioning strip, and a movable plate for adsorbing IC chips is provided at the discharge end of the feeding track. A limiting column is provided above the movable plate, and a cylinder is installed below the movable plate. The movable end of the cylinder is fixed to the bottom surface of the movable plate. The movable plate is provided with communicating vents on the top and the side. The vents on the side are connected to a vacuum pumping mechanism. The vents on the side are vacuumed to generate negative pressure at the vents on the top to adsorb the IC chip.

2. The IC material picking and positioning mechanism according to claim 1, characterized in that: Mounting columns are provided on both sides of the feeding track.

3. The IC material picking and positioning mechanism according to claim 1, characterized in that: The limiting column is a detachable structure.

4. The IC material picking and positioning mechanism according to claim 1, characterized in that: A plurality of vertical plates are arranged at the bottom of the mounting plate, a bottom plate is arranged below the vertical plates, and the vertical plates are vertically arranged above the bottom plate.

5. The IC material picking and positioning mechanism according to claim 1, characterized in that: The positioning bar is a detachable structure.

6. The IC material picking and positioning mechanism according to any one of claims 1 to 5, characterized in that: The feeding track is provided with a sensor for detecting the position of the IC chip on the feeding track to control the start and stop of the cylinder to ensure that the IC chip reaches the positioning position accurately.

7. The IC material picking and positioning mechanism according to any one of claims 1 to 5, characterized in that: The movable end of the cylinder is fixed to the bottom surface of the movable plate through a connecting piece. The connecting piece includes a bolt and a nut with adjustable length to facilitate adjusting the height of the movable plate to adapt to IC chips of different sizes.

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