Protective film

Abstract

The utility model discloses a protective film which comprises a protective layer, a base material layer and a bonding layer, the protective layer is arranged on one side of the base material layer, and the bonding layer is arranged on the other side of the base material layer; the bonding layer comprises a plurality of microstructures which are distributed on the other side of the base material layer; the protective layer comprises a first bearing sub-layer and a first antistatic sub-layer, the first bearing sub-layer is arranged on the side, away from the microstructure, of the base material layer, and the first antistatic sub-layer is arranged on the side, away from the base material layer, of the first bearing sub-layer. The bonding layer makes contact with the optical film material, so that the protective film is attached to the surface of the optical film material, the contact area between the protective film and the optical film material is reduced through the multiple microstructures of the bonding layer, static electricity generated between the bonding layer and the optical film material is reduced, then the frequency of manual cleaning is reduced, the later assembling efficiency is improved, and the production cost is reduced. And the qualified rate of later-stage products is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of film material protection, in particular to a protective film. Background Art

[0002] After production and processing, both sides of the optical film must be affixed with a PE (polyethylene) protective film to prevent contact contamination and scratches. During the various steps of optical film application, roll separation, stripping, and transportation, static electricity is easily generated and accumulated due to friction between the polyethylene PE protective films. This static electricity is difficult to dissipate. Especially when the PE protective film is removed during backlight module assembly, extremely strong static electricity is generated, making the optical film susceptible to dust absorption and requiring manual cleaning. This not only greatly reduces assembly efficiency but also affects the quality rate of subsequent products. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a protective film.

[0004] The utility model discloses a protective film, comprising: a protective layer, a substrate layer and an adhesive layer, wherein the protective layer is arranged on one side of the substrate layer, and the adhesive layer is arranged on the other side of the substrate layer; the adhesive layer includes multiple microstructures, and the multiple microstructures are distributed on the other side of the substrate layer; the protective layer includes a first carrying sublayer and a first anti-static electron layer, wherein the first carrying sublayer is arranged on the side of the substrate layer away from the microstructure, and the first anti-static electron layer is arranged on the side of the first carrying sublayer away from the substrate layer.

[0005] According to one embodiment of the present invention, the longitudinal section of the microstructure is an isosceles trapezoid, a semicircle, a triangle or a pentagon.

[0006] According to one embodiment of the present invention, the height of the microstructure is 6-10 μm.

[0007] According to one embodiment of the present invention, the microstructure is made of acrylic glue material.

[0008] According to one embodiment of the present invention, the height of the protective layer is 6-10 μm.

[0009] According to one embodiment of the present invention, the protective layer further includes a second carrier sublayer and a second anti-static electron layer. One side of the second carrier sublayer is arranged on the first anti-static electron layer, and the second anti-static electron layer is arranged on the other side of the second carrier sublayer.

[0010] According to one embodiment of the present invention, the first antistatic electron layer is made of antistatic masterbatch material.

[0011] According to one embodiment of the present invention, the second anti-static electron layer is made of frosted particle material.

[0012] According to one embodiment of the present invention, the first load-bearing sublayer and / or the second load-bearing sublayer is made of polyethylene resin material.

[0013] The beneficial effect of the present invention is that the adhesive layer contacts the optical film material, so that the protective film is applied to the surface of the optical film material. Through the multiple microstructures of the adhesive layer, the contact area between the protective film and the optical film material is reduced, thereby reducing the static electricity generated between the adhesive layer and the optical film material, thereby reducing the frequency of manual cleaning, which not only improves the later assembly efficiency, but also improves the qualified rate of later products. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0015] Figure 1 One of the cross-sectional schematic diagrams of the protective film;

[0016] Figure 2 This is the second cross-sectional schematic diagram of the protective film;

[0017] Figure 3 This is the second cross-sectional schematic diagram of the protective film;

[0018] Figure 4 The fourth cross-sectional diagram of the protective film;

[0019] Figure 5 The fifth cross-sectional diagram of the protective film;

[0020] Figure 6 The sixth cross-sectional diagram of the protective film;

[0021] Figure 7 The seventh cross-sectional diagram of the protective film;

[0022] Figure 8 This is the eighth cross-sectional schematic diagram of the protective film.

[0023] Description of Reference Numerals

[0024] 1. Protective layer; 11. First load-bearing sublayer; 12. First anti-static electron layer; 13. Second load-bearing sublayer; 14. Second anti-static electron layer;

[0025] 2. Base material layer;

[0026] 3. Adhesive layer; 31. Microstructure. DETAILED DESCRIPTION

[0027] The following diagrams illustrate various embodiments of the present invention. For clarity, many practical details will be included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, in some embodiments of the present invention, these practical details are not essential. Furthermore, to simplify the drawings, some commonly used structures and components are depicted in simplified schematic form.

[0028] In addition, in the present invention, descriptions such as "first" and "second" are only used for descriptive purposes and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] Example 1

[0030] like Figure 1 As shown, Figure 1 This is a schematic cross-sectional view of a protective film. This embodiment of the protective film comprises a protective layer 1, a substrate layer 2, and an adhesive layer 3. The substrate layer 2 has two opposing sides, with the protective layer 1 disposed on one side and the adhesive layer 3 on the other side. That is, along the longitudinal direction Y, the protective layer 1, substrate layer 2, and adhesive layer 3 are disposed in this order. During use, the adhesive layer 3 adheres to the surface of one side of the optical film, allowing the protective film to be applied entirely to the surface. Similarly, the protective film is also applied to the other side of the optical film.

[0031] In this embodiment, the protective layer 1 includes a first carrier sublayer 11 and a first anti-static electron layer 12. The first carrier sublayer 11 is arranged on one side of the substrate layer 2, and the first anti-static electron layer 12 is arranged on the side of the first carrier sublayer 11 away from the substrate layer 2. Specifically, the first carrier sublayer 11 will be made of polyethylene resin material, and the first anti-static electron layer 12 is made of anti-static masterbatch material. The provision of the first anti-static electron layer 12 can effectively reduce the accumulation of static electricity on the first carrier sublayer 11, thereby reducing the accumulation of static electricity on the surface of the protective film. Since the optical film material is later wound and stored in a winding or stacking manner, whether it is a winding or stacking method, the first anti-static electron layer 12 can reduce the accumulation of static electricity between adjacent optical film materials, thereby avoiding damage to the optical film material caused by static electricity. Furthermore, the height of the protective layer 1 is L, where L = 6-10μm. In other words, the height formed by the first carrier sublayer 11 and the first anti-static electron layer 12 is 6-10μm.

[0032] The adhesive layer 3 includes a plurality of microstructures 31, which are distributed on the side of the substrate layer 2 away from the first carrier sublayer 11. When in use, the plurality of microstructures 31 will adhere to the surface of the optical film material. Since there are gaps between adjacent microstructures 31, the contact area between the adhesive layer 3 and the optical film material will be reduced. By reducing the contact area, the effect of reducing the static electricity generation area is achieved, and ultimately, the static electricity generated when the protective film is separated from the optical film material is reduced. In this embodiment, the longitudinal section of the microstructure 31 is an isosceles trapezoid. Furthermore, the height of the microstructure 31 is S, where S = 6-10 μm. If the value of S is too small, it will lead to an increase in static electricity. Conversely, if the value of S is too large, although the static electricity is reduced, the protective film will easily detach from the optical film material and cannot protect the optical film material. Specifically, the microstructure 31 is made of acrylic glue material, which has a certain viscosity. In addition, the microstructure 31 can be attached to the substrate layer 2 by an existing melt extrusion process. It should be noted that the distribution and specific number of the microstructures 31 can be adjusted according to demand. For example, when the optical film material is larger in size, more microstructures 31 can be selected; otherwise, the number of microstructures 31 can be reduced.

[0033] The substrate layer 2 of this embodiment is made of polyethylene material, which plays a protective role for the optical film material.

[0034] To sum up, the adhesive layer 3 contacts the optical film material, so that the protective film is applied to the surface of the optical film material. Through the multiple microstructures 31 of the adhesive layer 3, the contact area between the protective film and the optical film material is reduced, so as to reduce the static electricity generated between the adhesive layer 3 and the optical film material, thereby reducing the frequency of manual cleaning, which not only improves the later assembly efficiency, but also improves the qualified rate of later products.

[0035] Example 2

[0036] like Figure 2 As shown, Figure 2 This is a second cross-sectional diagram of the protective film. The difference between this embodiment and the first embodiment is that the longitudinal cross-section of the microstructure 31 is semicircular, and the semicircular structure has a relatively smooth side. When the semicircular microstructure 31 contacts the optical film material, it can effectively reduce damage to the optical film material.

[0037] Example 3

[0038] like Figure 3 As shown, Figure 3 This is a third cross-sectional diagram of the protective film. The difference between this embodiment and the first embodiment is that the longitudinal cross-section of the microstructure 31 is triangular. This triangular structure further reduces the contact area between the microstructure 31 and the optical film. In other words, it increases the roughness of the protective film, which helps reduce the generation of static electricity when the protective film is torn from the optical film.

[0039] Example 4

[0040] like Figure 4 As shown, Figure 4 This is a fourth cross-sectional diagram of the protective film. The difference between this embodiment and the first embodiment is that the longitudinal cross-section of the microstructure 31 is pentagonal, so as to reduce the contact area between the adhesive layer 3 and the optical film material, which helps to reduce the generation of static electricity when the protective film is torn off the optical film material.

[0041] Example 5

[0042] like Figure 5 As shown, Figure 5 This is the fifth cross-sectional schematic diagram of the protective film. The difference between this embodiment and the first embodiment is that the protective layer 1 also includes a second carrier sublayer 13 and a second anti-static electron layer 14. The second carrier sublayer 13 is arranged on the side of the first anti-static electron layer 12 away from the first carrier sublayer 11, and the second anti-static electron layer 14 is arranged on the side of the second carrier sublayer 13 away from the first anti-static electron layer 12, that is, along the Y direction, the second anti-static electron layer 14, the second carrier sublayer 13, the first anti-static electron layer 12 and the first carrier sublayer 11 are arranged in sequence. Specifically, the second carrier sublayer 13 is made of a polyethylene resin material, which is the same material as the first carrier sublayer 11. The second anti-static electron layer 14 is made of a frosted particle material, which is conducive to increasing the surface roughness of the protection angle. At the same time, it is used together with the first anti-static electron layer 12 to further reduce the accumulation of static electricity. It is further explained that the superimposed height of the first carrier sublayer 11, the first anti-static electron layer 12, the second carrier sublayer 13 and the second anti-static electron layer 14 is 6-10μm.

[0043] Example 6

[0044] like Figure 6 As shown, Figure 6 This is the sixth cross-sectional diagram of the protective film. The difference between this embodiment and the fifth embodiment is that the longitudinal cross-section of the microstructure 31 is semicircular, and the semicircular structure has a relatively smooth side. When the semicircular microstructure 31 contacts the optical film material, it can effectively reduce damage to the optical film material.

[0045] Example 7

[0046] like Figure 7 As shown, Figure 7 This is the seventh cross-sectional diagram of the protective film. The difference between this embodiment and the fifth embodiment is that the longitudinal cross-section of the microstructure 31 is triangular. This triangular structure further reduces the contact area between the microstructure 31 and the optical film. In other words, it increases the roughness of the protective film, which helps reduce the generation of static electricity when the protective film is torn from the optical film.

[0047] Example 8

[0048] like Figure 8 As shown, Figure 8 This is the eighth cross-sectional diagram of the protective film. The difference between this embodiment and the fifth embodiment is that the longitudinal cross-section of the microstructure 31 is pentagonal, so as to reduce the contact area between the adhesive layer 3 and the optical film material, which helps to reduce the generation of static electricity when the protective film is torn off the optical film material.

[0049] It should also be noted that although the above embodiments 1 to 8 describe different shapes of the microstructure 31, in actual use, the microstructure 31 can be configured as other structures, such as diamond, hexagonal, or other shapes, as required. The above content is merely illustrative and does not specifically limit the shape of the microstructure 31.

[0050] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be included within the scope of the claims of the present invention.

Claims

1. A protective film, characterized in that: include: A protective layer (1), a substrate layer (2) and an adhesive layer (3), wherein the protective layer (1) is arranged on one side of the substrate layer (2), and the adhesive layer (3) is arranged on the other side of the substrate layer (2); the adhesive layer (3) comprises a plurality of microstructures (31), and the plurality of microstructures (31) are distributed on the other side of the substrate layer (2); the protective layer (1) comprises a first carrier sublayer (11) and a first anti-static electron layer (12), wherein the first carrier sublayer (11) is arranged on a side of the substrate layer (2) away from the microstructure (31), and the first anti-static electron layer (12) is arranged on a side of the first carrier sublayer (11) away from the substrate layer (2).

2. The protective film according to claim 1, wherein The longitudinal section of the microstructure is in the shape of an isosceles trapezoid, a semicircle, a triangle or a pentagon.

3. The protective film according to claim 1, wherein The height of the microstructure (31) is 6-10 μm.

4. The protective film according to claim 1, wherein The microstructure (31) is made of acrylic glue material.

5. The protective film according to claim 1, wherein The height of the protective layer (1) is 6-10 μm.

6. The protective film according to claim 1, wherein The protective layer (1) further comprises a second carrier sublayer (13) and a second anti-static electron layer (14), wherein one side of the second carrier sublayer (13) is arranged on the first anti-static electron layer (12), and the second anti-static electron layer (14) is arranged on the other side of the second carrier sublayer (13).

7. The protective film according to claim 1, wherein The first antistatic electron layer (12) is made of antistatic masterbatch material.

8. The protective film according to claim 6, characterized in that The second anti-static electron layer (14) is made of frosted particle material.

9. The protective film according to claim 6, characterized in that The first load-bearing sublayer (11) and / or the second load-bearing sublayer (13) are made of polyethylene resin material.

Images